JP2002185281A - Oscillation circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillation circuit which enables invalidating the oscillation circuit by invalidating processing using high-powered electric field application and to prevent the oscillation ability from being restored after invalidating it. SOLUTION: This oscillation circuit contains a coil and a capacitor that is provided with a first electroconductive layer 11, a dielectric layer 10 that is formed on a first electroconductive layer, and a second electroconductive layer 12 that is formed on the dielectric layer. The dielectric layer is made of adhesive resin 14 containing scattered dielectric grains 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a resonance circuit. The resonance circuit according to the present invention can be used for a resonance label or a resonance tag.

[0002]

2. Description of the Related Art In a retail business where products are sold directly to consumers, such as department stores, rental video stores, game software stores, discount stores, and CD shops, resonance is one method of preventing shoplifting of expensive products. Labels and resonance tags are used. This resonance label or resonance tag
It has an LC (coil-capacitor) circuit or an LCR (coil-capacitor-resistance) circuit that resonates with a radio wave of a specific frequency, and is attached to a product so that consumers do not notice it. If a product with a resonance label or tag attached is sold to consumers, the resonance label or tag may be removed from the product, or the resonance circuit may be destroyed, for example, at the time of payment at a cash register. After performing the revocation processing such as, etc., it is passed to the consumer. On the other hand, if a product whose resonance label or tag has not been revoked has been illegally removed from the sales floor due to shoplifting, the buzzer and warning lamp of the detection device installed at the entrance of the sales floor will be activated, and the fraudulent removal will be performed. Can be easily found.
As a method of invalidating such a resonance label or a resonance tag, there are a method of cutting a circuit with scissors, a method of attaching a metal foil to a surface, and blocking a radio wave. However, these methods require the clerk to perform a special operation at the same time as the payment of the product, which may be inconvenient and confuse the cash register. On the other hand, as an easy method,
A method using a revoking device that generates a high output electric field has been proposed. In this method, a current is generated in an attached resonance circuit by holding a product over a revocation machine,
The dielectric layer of the capacitor is melted by Joule heat caused by electric current,
In this case, the conductive layers sandwiching the dielectric layer are short-circuited, and the resonance frequency of the resonance circuit is largely shifted, thereby invalidating the circuit. This method is similar to the operation of reading a barcode, and the operation at a cash register is extremely simple.

[0003]

However, in the conventional resonance circuit which has performed the resonance revocation processing using such a method, the resonance performance may be restored after the revocation processing. . When the resonance performance is restored, a buzzer and a warning lamp will be activated even when a legitimate purchaser passes by a detection device installed at the entrance of the counter,
It will cause discomfort. The reason why the resonance performance is restored is that the two metal foils that have come into contact with each other are separated again due to a change in external conditions such as heat and pressure after the revocation process, and the resonance performance is restored. Conceivable.
Therefore, an object of the present invention is to provide a resonance circuit that can effectively prevent the resurrection of the resonance performance after performing an operation of revoking the resonance performance in the resonance circuit that can perform the revocation processing by applying a high output electric field. It is in.

[0004]

The object of the present invention is to provide a first conductive layer according to the present invention, a dielectric layer formed on the first conductive layer, and a second conductive layer formed on the dielectric layer. Wherein the dielectric layer is made of an adhesive resin containing conductive particles in a dispersed state. Can be. In a preferred aspect of the present invention, the electric conductivity of the dielectric layer is 1 × 10 ⁻⁴ S · m.
It is less than ^-1 .

[0005]

FIG. 1 shows a resonance circuit 1 according to the present invention.
FIG. 4 is an exploded perspective view schematically showing a layered structure of the resonance tag 20 and the resonance label 30 including the above. The resonance circuit 1 according to the present invention includes a dielectric layer 10 and a first conductive layer 11 formed on one surface of the dielectric layer 10, similarly to a conventionally known resonance circuit.
And a second conductive layer 12 formed on the other surface of the dielectric layer 10. First conductive layer 11 and second conductive layer 11
The conductive layer 12 forms a coil circuit also serving as an electrode plate of a capacitor or a capacitor. However, FIG. 1 does not illustrate these circuits because the purpose is to schematically show a layered structure. . Further, in the resonance circuit 1 of the present invention, similarly to the conventionally known resonance circuit, the first conductive layer 11 is formed.
The second conductive layer 12 and the second conductive layer 12 conduct a part of them to form the resonance circuit 1, but the conductive parts thereof are not shown in FIG. 1. A specific example of the circuit of the first conductive layer 11 and the second conductive layer 12 and a specific example of the conductive portion will be described in Examples described later.

The resonance circuit 1 of the present invention has a first conductive layer 11 and a second conductive layer 12 as shown in a schematic partial sectional view of FIG.
Is characterized in that the dielectric layer 10 sandwiched between the first and second layers is made of an adhesive resin 14 containing conductive particles 13 in a dispersed state. That is, the dielectric layer 10 contains the adhesive resin 14 and the conductive particles 13 dispersed throughout the adhesive resin 14. The dielectric layer 10 contains the conductive particles 13, but before the resonance circuit is deactivated,
It is insulative as a whole and acts as a dielectric existing between the circuit of the first conductive layer 11 and the circuit of the second conductive layer 12. Therefore, the first conductive layer 11, the dielectric layer 10, and the second conductive layer 12 form a capacitor. Also, a coil is formed by forming the first conductive layer 11 and the second conductive layer 12 into a coil shape. By these, L
A C circuit or an LCR circuit is formed, and a circuit that resonates with a radio wave of a specific frequency, that is, a resonance circuit is formed.

[0007] In the resonance circuit of the present invention, the dielectric layer contains a thermoplastic resin having an insulating property and an adhesive property, and conductive particles. The thermoplastic resin has an adhesive force capable of bonding and fixing the first conductive layer and the second conductive layer, and is not particularly limited as long as it has insulating properties, and a general-purpose organic polymer material is used. be able to. Representative examples include polyolefins such as polyethylene and polypropylene, ethylene copolymers such as ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, and ethylene- (meth) acrylic acid acrylic ester copolymer. , Ionomer, polyester, polyamide, polyurethane or synthetic rubber.

[0008] The conductive particles contained in the dielectric layer are not particularly limited. For example, a metal (for example, gold,
Silver, copper, aluminum, or nickel) or an alloy thereof, carbon, an organic conductive substance (for example, polypyrrole or polythiophene), a metal oxide (for example, tin oxide or antimony oxide), or an organic material on the surface of the conductive fine particles. Use of particles coated with a film, or particles of inorganic fine particles (eg, silicon dioxide, calcium carbonate, or titanium dioxide) or organic fine particles (eg, polystyrene, polyethylene, or phenolic resin) coated with a conductive material. Can be. The layer thickness of the dielectric layer of the present invention is preferably about 0.5 μm to 100 μm. If the thickness of the dielectric layer is less than 0.5 μm, the conductive layers are likely to be short-circuited, and may be deactivated when the deactivation process is not performed. If the thickness of the dielectric layer exceeds 100 μm, the capacitance of the capacitor becomes too small, and it is necessary to increase the area of the capacitor (the area of the conductive layer) in order to obtain a desired resonance frequency, which is not preferable. .

Although the shape of the conductive particles is not particularly limited, it is preferable to use spherical particles because the dielectric layer before the lapse operation is easily maintained insulative. In order to ensure that the entire resonance circuit before the revocation processing is insulative, the resonance circuit is preferably substantially spherical. The average particle size of the conductive particles is preferably 0.1 nm to 10,000 nm,
In addition, it is not more than 1/3 of the thickness of the dielectric layer. If the average particle size of the conductive particles is too large or too large with respect to the thickness of the dielectric layer, the dielectric layer tends to become conductive and may be unintentionally lost.

Although the content of the conductive particles in the dielectric layer is not particularly limited, it is preferably 0.01 to 70% by weight, more preferably 0.1 to 30% by weight, based on the weight of the entire dielectric layer. % By weight. When the content of the conductive particles is less than 0.01% by weight, the occurrence rate of the resonance performance after the deactivation treatment increases, and when the content exceeds 70% by weight, the dielectric layer becomes conductive and the resonance circuit is formed. May be impossible.

The electric conductivity of the dielectric layer of the present invention is preferably 1 × 10 ⁻⁴ S · m ⁻¹ or less, more preferably 1 × 10 ⁻⁴ S · m ^−1.
10 ⁻⁸ S · m ⁻¹ or less. If the electric conductivity of the dielectric layer is too high, the insulating property is lost, and the function of the capacitor is lost.

In the resonance circuit according to the present invention, the first conductive layer and the second conductive layer are made of a material similar to a known material for forming a resonance circuit, for example, a metal foil (for example, an aluminum foil or a copper foil) or a conductive material. Or a combination thereof. The materials of the first conductive layer and the second conductive layer may be formed from the same material or different materials.

In the resonance circuit according to the present invention, the first conductive layer and / or the second conductive layer can be formed on the dielectric layer in the same manner as a known resonance circuit. For example, when a circuit is formed from a metal foil, it can be formed by punching the metal foil into a circuit having a predetermined shape. Specifically, a coating material for the dielectric layer (a thermoplastic resin containing conductive particles) is applied to the entire surface of the metal foil for the second conductive layer, and is punched into a predetermined shape. The foil can also be punched into a predetermined shape and adhered to the dielectric layer on the second conductive layer by heating and pressing to form a resonance circuit. In the dielectric layer of the present invention, the adhesion to the conductive layer may be insufficient. In such a case, the first conductive layer and the second conductive layer
A resonance circuit can be manufactured by providing a dielectric layer on both surfaces of the metal foil for the conductive layer and bonding the dielectric layers together.

In the resonance circuit according to the present invention, the first conductive layer and / or the second conductive layer may be formed from a conductive ink. In this case, it can be formed by printing a circuit having a predetermined shape with conductive ink on the surface of the conductive particle-containing dielectric layer. Alternatively, after printing the first conductive layer and / or the second conductive layer with a conductive ink on a surface layer 23 or a support layer 24 described below with or without the adhesive layers 21 and 22, the conductive layer It can also be formed by bonding to a particle-containing dielectric layer. A combination of a first conductive layer and / or a second conductive layer made of a metal foil and a second conductive layer and / or a first conductive layer made of a conductive ink can also be used.

The connection between a part of the first conductive layer and a part of the second conductive layer can be formed by a method similar to a known resonance circuit. For example, a pressing tool having one or a plurality of needle-like projections is pressed from above the first conductive layer toward the second conductive layer,
The first conductive layer can be brought into contact with the second conductive layer by breaking the dielectric layer.

A resonance tag and a resonance label can be formed using the resonance circuit according to the present invention. For example, as shown in FIG. 1, a resonance circuit 1 of the present invention includes an adhesive layer 21 provided on a first conductive layer 11 similarly to a conventionally known resonance circuit.
Surface layer 2 made of paper, plastic film, etc.
3, and a support layer 24 made of paper or a plastic film via an adhesive layer 22 provided on the second conductive layer 12 to form the resonance tag 20. Further, when a pressure-sensitive adhesive layer 31 is provided on the surface of the support layer 24 and a release material 32 is provided thereon, the resonance label 30 can be obtained.

The surface layer 23 is a layer serving as a surface of a resonance tag or a resonance label, and is preferably made of a material on which necessary display items such as a product name, a manufacturer name, and a bar code can be printed. . The support layer 24 is a layer serving as a support when a resonance tag is formed, and is made of a material capable of supporting the resonance circuit according to the present invention. Further, in the case of manufacturing a resonance label, a release material 32 is provided on the support layer 24 with an adhesive layer 31 interposed therebetween.
When they are stacked, they also serve as a support for supporting the resonance circuit.

When the resonance tag 20 or the resonance label 30 of the embodiment shown in FIG. 1 is formed, paper (for example, high quality paper or high quality paper) is used as the surface layer 23 and the support layer 24 in the same manner as the conventional resonance tag and the resonance label. Coated paper), plastic films (eg, polyethylene, polypropylene or polyethylene terephthalate), synthetic papers, or fabrics (eg, woven, knitted, or nonwoven) can be used. When printing is performed on the surface layer 23 or the support layer 24, it is preferable to use a colored material such as white or provide a colored ground color coat layer in order to make the printed portion stand out.

For the adhesive layer 21 and the adhesive layer 22 for providing the surface layer 23 and the support layer 24, the adhesive thermoplastic resin used for the dielectric layer may be used as it is (that is, the conductive particles may be used). Need not be included), and a thermosetting adhesive or pressure-sensitive adhesive may be used. Alternatively, the resonance label 30 may be provided by sequentially providing an adhesive layer and a release material on the support layer 24 side. Each of the above-mentioned materials used when forming a resonance tag or a resonance label must not block radio waves for operating the resonance circuit. Further, in a case where the consumer does not want to recognize the existence of the resonance circuit, the surface layer 23, the support layer 24, the adhesive layers 21 and 22, the adhesive layer 3
For 1, it is preferable to select a material having a hiding property.

The resonance circuit of the present invention can be used alone, but as described above, it is preferable to use it in the form of a resonance tag or a resonance label. For example, a resonance tag or a resonance label can be attached to a product after being formed, and a resonance tag or a resonance label including the resonance circuit is mounted on a product at the entrance of a sales floor without performing the revocation processing of the resonance circuit. When passing by the provided detection device, in response to a signal in a specific frequency range transmitted from the detection device,
Since a reply signal is transmitted to the detection device, illegal removal such as shoplifting can be detected.

In order to invalidate the resonance performance of the resonance circuit of the present invention, a high output electric field can be applied to the resonance circuit as in the case of the conventional resonance circuit. As shown in Examples and Comparative Examples to be described later, in the conventional resonance circuit, the resonance performance may be restored after the invalidation processing, whereas the resonance circuit of the present invention has the resonance performance after the invalidation processing. Revival can be effectively prevented. The reason is not necessarily elucidated, but can be presumed as follows. The present invention is not limited by the following inference.

When a high output electric field is applied to the resonance circuit of the present invention, high Joule heat due to a high-energy pulse wave is generated in the resonance circuit as in the conventional resonance circuit, and the resin constituting the dielectric layer is melted. The first conductive layer 11 and the second conductive layer 12 provided on both sides of the dielectric layer are connected at a plurality of portions other than the connection terminal portion, and the resonance circuit is broken. The phenomena so far seem to be the same for the resonance circuit of the present invention as for the conventional resonance circuit. However, in the conventional resonance circuit, the resonance performance may be restored after the invalidation processing. This is because if the pressure is applied to the resonance circuit after the expiration processing or the ambient temperature changes, the resonance circuit will be deformed, so the two conductive layers that have come into contact will separate again and return to the state before the expiration processing. It is thought that there is. On the other hand, in the resonance circuit of the present invention,
Since conductive particles are present in the resin constituting the dielectric layer,
Even if the resonance circuit is deformed, the short-circuit state is still maintained in many parts, and the revival of the resonance performance can be effectively prevented even if the two conductive layers are electrically connected in more parts. I think it is.

[0023]

EXAMPLES The present invention will be described below in more detail with reference to examples, but these examples do not limit the scope of the present invention. In each of the following examples and comparative examples, the resonance circuit including the first conductive layer 11, the dielectric layer 10, and the second conductive layer 12 in the layered structure shown in FIG. The adhesive layer 22 was provided on the two conductive layers 12, and the support layer 24 was attached on the adhesive layer 22, thereby producing a test resonance circuit laminate sample. Therefore, in each of the following Examples and Comparative Examples, description of each layer is made by referring to FIG.
Are attached.

[0024]

Example 1 (1) Formation of Second Conductive Layer 12 Ethylene-methacrylic acid copolymer (weight average molecular weight = 1)
5,000) to 100 parts by weight of a thermoplastic resin, nickel powder as conductive particles (average particle size = 100 nm)
The mixture to which 0.5 part by weight was added was kneaded under vacuum and at 180 ° C. for 5 hours, and then applied to one surface of an aluminum foil (thickness = 40 μm) with a die coater to a thickness of 2 μm. Then, a laminate of a conductive particle-containing resin as (part of) the dielectric layer 10 and an aluminum foil serving as a base of the second conductive layer 12 (that is, an aluminum foil before being cut into a circuit) was prepared. . The electric conductivity of this dielectric layer is 4.73 × 10 ⁻¹⁵ S · m ⁻¹ and the relative dielectric constant is 2.5.
It was 2. On the other surface of the aluminum foil, an ethylene-methacrylic acid copolymer (average polymerization molecular weight = 15,000) was applied as an adhesive layer 22 to a thickness of 4 μm. Thus, a laminate (hereinafter, referred to as a “resin layer-carrying aluminum foil”) having (part of) the dielectric layer 10 and the adhesive layer 22 on the front and back surfaces of the aluminum foil serving as the base of the second conductive layer 12, respectively. ).

The obtained resin layer-carrying aluminum foil 41 was punched out with a Thomson blade into the shape shown in FIG. This circuit-shaped resin layer-carrying aluminum foil 41 includes a circuit-shaped second conductive layer 12 made of aluminum foil. This circuit-shaped resin layer-carrying aluminum foil 41 is brought into contact with the surface on which the conductive particle-free resin (that is, the adhesive layer 22) has been applied, and is used as a support layer 24 on high quality paper (basis weight = 80 g / m ² ). And the whole was sandwiched between two silicone rubber sheets, and then contacted with a heat press at a temperature of 120 ° C. and a pressure of 2 kg / cm ² for 30 seconds.
Each layer was adhered.

(2) Formation of First Conductive Layer 11 The mixture of the ethylene-methacrylic acid copolymer prepared in the preceding section (1) and the nickel powder is subjected to vacuum and 180 ° C. for 5 hours in the same manner as in the preceding section (1). After kneading, it is applied to one surface of an aluminum foil (thickness = 40 μm) by a die coater so as to have a thickness of 2 μm, and (part of) the dielectric layer 10.
Of the conductive particle-containing resin as above and an aluminum foil serving as a base of the first conductive layer 11 (that is, an aluminum foil before being cut into a circuit). The obtained laminate was punched into the shape shown in FIG.
A circuit-shaped resin layer-carrying aluminum foil 42 was obtained. The circuit-shaped resin layer-carrying aluminum foil 42 includes the circuit-shaped first conductive layer 11 made of aluminum foil.

(3) Formation of Resonant Circuit Subsequently, as shown in FIG. 5, the circuit-shaped resin layer-carrying aluminum foil 41 obtained in the preceding section (1) and the circuit-shaped resin layer obtained in the preceding section (2) The supporting aluminum foil 42 is connected to each conductive particle-containing resin layer (each part of the dielectric layer 10).
Are superposed so that they come into contact with each other, and the whole is sandwiched between two silicone rubber sheets, and then heated at a temperature of 120 ° C. under a pressure of 2 kg / cm ² using a heat press.
The layers were contacted for 0 seconds to adhere. Subsequently, in order to electrically connect the first conductive layer and the second conductive layer, the first conductive layer has a diameter of 1 mm.
The connection terminal portions 44a and 44
As shown in FIG. 5, a test resonance circuit laminate sample 43 including the resonance circuit 1 according to the present invention was obtained. FIG. 5 shows the circuit-shaped resin layer-carrying aluminum foil 42 obtained in the preceding section (2) as the upper surface, and the circuit-shaped resin layer-carrying aluminum foil 41 obtained in the preceding section (1) (a part of which is shown in FIG. 5). FIG. 6 is a plan view in a case in which (shown by hatching) is disposed on the lower surface.

(4) Measurement of Resonance Performance The measurement of resonance performance is performed using a network analyzer (trade name =
(MS4662A; manufactured by Anritsu Corporation) and a loop antenna having a diameter of 50 mm to obtain a resonance frequency. The resonance frequency of 100 test resonance circuit laminate samples including the resonance circuit according to the present invention obtained in (3) above was 8.15 MHz on average.

(5) Revocation processing The revocation processing of the test resonance circuit laminate sample including the resonance circuit according to the present invention obtained in the above (3) is performed by attaching a loop antenna having a diameter of 25 cm to a pulse generator having an output of 1 W. The test was performed by placing the test resonance circuit laminate sample at the center of the loop antenna and then performing pulse irradiation for 10 seconds. The presence / absence of revocation was evaluated by examining the resonance frequency of the test resonance circuit laminate sample subjected to the revocation treatment. Furthermore, the resonance frequency of the test resonance circuit laminate sample after being left at room temperature for 2 hours and 24 hours after the lapse treatment was measured, and the resonance performance of the test resonance circuit laminate sample subjected to the lapse treatment was restored. It was evaluated whether or not to do. After 100 samples of the test resonance circuit laminate including the resonance circuit according to the present invention obtained in (3) above were invalidated, the resonance frequency was measured. As a result, all 100 samples did not show resonance. Therefore, it was found that 100 sheets out of 100 sheets (hereinafter, 100 sheets / 100 sheets) had expired.
After being left at room temperature for 2 hours, it was examined whether or not it was restored. As a result, 100 sheets / 100 sheets were still expired. Further, after leaving at room temperature for 24 hours, it was examined whether or not the circuit was restored. As a result, 100 sheets / 100 sheets were still expired, and there was no restored circuit.

[0030]

Example 2 The conductive particles were obtained by converting the nickel powder having an average particle diameter of 100 nm used in Example 1 to an average particle diameter of 150 nm.
Indium tin oxide, and the amount of the conductive particles was set to 0.1.
A test resonance circuit laminate sample including the resonance circuit according to the present invention was manufactured by repeating the operation described in Example 1 except that the amount was changed to 8 parts by weight. The electrical conductivity of the dielectric layer of this sample was 4.64 × 10 ⁻¹⁵ S · m ⁻¹ , and the relative dielectric constant was 2.38. The resonance frequency of 100 test resonance circuit laminate samples according to Example 2 was 8.13 MHz on average, and 100
100 copies expired. Investigation was made as to whether or not to recover after 2 hours and 24 hours from the expiration processing. In each case, 100 sheets / 100 sheets remained expired.

[0031]

Example 3 The thermoplastic resin used for the dielectric layer 10 and the adhesive layer 22 was replaced with the weight average molecular weight of 15, used in Example 1.
000-ethylene-methacrylic acid copolymer was replaced with an ethylene-vinyl acetate copolymer having a weight-average molecular weight of 18,000, by repeating the operation described in Example 1 to obtain a resonance circuit according to the present invention. A test resonant circuit laminate sample including the same was manufactured. The electrical conductivity of the dielectric layer of this sample was 0.22 × 10 ⁻¹⁵ S · m ⁻¹ , and the relative dielectric constant was 2.71. The resonance frequency of the 100 test resonance circuit laminate samples according to the third embodiment is 8.2 on average.
The frequency was 1 MHz, and 100/100 sheets were invalidated by the invalidation processing. Investigation was made as to whether or not to recover after 2 hours and 24 hours from the expiration processing. In each case, 100 sheets / 100 sheets remained expired.

[0032]

Comparative Example 1 Instead of the dielectric layer 10 used in Example 1,
A dielectric layer (electric conductivity: 4.60 = 10 ^-15 S) using an ethylene-methacrylic acid copolymer containing no conductive particles.
· M ^{- 1;} dielectric constant: except for forming a 2.23),
By repeating the operation described in Example 1, a test resonance circuit laminate sample including a comparative resonance circuit was manufactured. The resonance frequency of 100 samples of the test resonance circuit laminate sample of Comparative Example 1 was 8.22 MHz on average, and 100/100 samples were invalidated by the invalidation process. 2 from revocation processing
After a lapse of 24 hours, a check was made to determine whether or not the car would be revived.
15 still expired, average 15 8.23M
Resonated at a resonance frequency of Hz. Also, after 24 hours, 62 out of 100 sheets remained expired,
38 sheets resonated at an average resonance frequency of 8.23 MHz.

[0033]

Comparative Example 2 The procedure described in Comparative Example 1 was repeated except that the ethylene-methacrylic acid copolymer forming the dielectric layer 10 was changed to an ethylene-vinyl acetate copolymer having a weight average molecular weight of 18,000. Thus, a test resonance circuit laminate sample including a comparative resonance circuit was manufactured. The samples of the electrical conductivity of the dielectric layer is 0.20 × 10 ^{-1 5}
S · m ⁻¹ , and the relative dielectric constant was 2.62. The average resonance frequency of 100 test resonance circuit laminate samples of Comparative Example 2 was 8.32 MHz, and 10
0 sheets / 100 sheets expired. After 2 hours and 24 hours from the expiration processing, it was examined whether or not it was restored. After 2 hours, 68 out of 100 sheets remained expired, but 32 sheets averaged 8 sheets. Resonated at a resonance frequency of .34 MHz. After 24 hours, 10
Of the zero cards, 25 remained dead, but 75 resonated at an average resonance frequency of 8.33 MHz.

[0034]

According to the present invention, it is possible to invalidate a resonance circuit by a revocation process by applying a high-output electric field, and to effectively prevent the resurrection of the resonance performance after revoking the resonance performance. A possible resonant circuit is provided.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view schematically illustrating a layered structure of a resonance tag or a resonance label including a resonance circuit according to the present invention.

FIG. 2 is a schematic partial sectional view of a resonance circuit according to the present invention.

FIG. 3 is a plan view of a circuit-shaped resin layer-carrying aluminum foil corresponding to a second conductive layer manufactured in Example 1.

FIG. 4 is a plan view of a circuit-form resin layer-carrying aluminum foil corresponding to a first conductive layer manufactured in Example 1.

FIG. 5 is a plan view of the resonance circuit according to the present invention manufactured in Example 1.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Resonant circuit; 10 ... Dielectric layer; 11 ... First
Conductive layer; 12 second conductive layer; 13 conductive particles; 14 adhesive resin; 20 resonance tag;
1, 22 ... adhesive layer; 23 ... surface layer; 24 ...
· Support layer · 30 · Resonance label · 31 · · · Adhesive layer · 32 · · · Release layer · 41 · · · Aluminum foil carrying a circuit-like resin layer corresponding to the second conductive layer · 42 · · · An aluminum foil supporting a circuit-like resin layer corresponding to one conductive layer; 43
... Resonance circuits; 44a, 44b.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H04B 5/02 H01G 4/40 321A F-term (Reference) 5B035 AA13 BA05 BB00 BB09 BC00 CA01 5E082 BC14 DD07 PP01 PP02 5J024 AA10 DA05 DA29 5K012 AA03 AA07 AB05 AC10 BA02

Claims (2)

[Claims] 1. A capacitor and a coil comprising a first conductive layer, a dielectric layer formed on the first conductive layer, and a second conductive layer formed on the dielectric layer. A resonance circuit, wherein the dielectric layer is made of an adhesive resin containing conductive particles in a dispersed state,
Resonant circuit. 2. The electric conductivity of the dielectric layer is 1 × 10 ⁻⁴ S
The resonance circuit according to claim 1, wherein the resonance circuit is equal to or less than m- ¹ .