JP2002158052A - Pressure contact holding type connector and its connecting structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure contact holding type connector and its connecting structure in which the positioning precision and assembly performance are improved and conductive routing is shortened by lowering the height dimension, and which is capable of connection by low load. SOLUTION: The connector comprises a long and narrow insulating housing 20, plural penetrating holes 23 punched in the top and bottom vertical direction of the housing 20, a conductive toe pin 28 of cap-shape that is inserted capable of sliding in each penetrating hole 23 from the bottom side of the housing 20, a conductive pin 30 that is engaged in the toe pin 28 from the top side of the housing 20 by being inserted capable of sliding in each penetrating hole 23, and a coil spring 31 that is supported by contacting at the top end part of the opening of the conductive toe pin 28 by being engaged in each penetrating hole 23 and is penetrated by the conductive pin 30. And by the pressing energy of the coil spring 31, the conductive toe pin 28 and the conductive pin 30 are respectively elastically protruded from the both top and bottom faces of the housing 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board and a liquid crystal module, an electronic circuit board and an electronic circuit board, an electronic circuit board and various IC packages, an electronic circuit board and a microphone and a speaker for a portable telephone. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press-connecting type connector used for various connections and a connection structure thereof.

[0002]

2. Description of the Related Art Conventionally, when electrically connecting an electronic circuit board for a portable telephone to a liquid crystal module, a curved surface of an elastic elastomer having a substantially semi-oval cross section or a substantially U-shaped cross section is provided, though not shown. Or a press-contact type connector provided with a plurality of thin metal wires arranged in a line.
The connector pin for electrical connection disclosed in Japanese Patent No. 161401 is used.

[0003]

However, the conventional press-clamp type connector and the connector pin for electrical connection are simply interposed between the electronic circuit board and the liquid crystal module in a state where the holder is omitted. It cannot be mounted on itself, and the positioning accuracy and assembly (a
There is a small possibility that the deterioration of the ssembly property will be caused.
In addition, as mobile phones have become thinner, lighter, and smaller in recent years, it is necessary to reduce the height of press-clamping connectors and connector pins for electrical connection, but the height (currently about 5 mm) must be reduced. It is very difficult to reduce the size without hindrance, and it is not possible to shorten the conduction path. Further, there is a problem that it is extremely difficult to connect with a low load.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a pressure contact pinch which improves positioning accuracy and assemblability, reduces a height dimension to shorten a conduction path, and enables connection with a low load. It is an object of the present invention to provide a mold connector and its connection structure.

[0005]

According to the present invention, in order to achieve the above object, an insulating housing, a plurality of through holes provided in a thickness direction of the housing, and a plurality of through holes are provided. A substantially cap-shaped conductive toe pin slidably fitted from one side of the housing, a conductive pin fitted slidably from the other side of the housing into the respective through-hole and fitted into the conductive toe pin; A spring fitted into the hole and in contact with the open end of the conductive toe pin, and penetrated by the conductive pin, wherein the biasing force of the spring causes the conductive toe pin and the conductive pin to protrude from the housing, respectively. It is characterized by doing.

A reduced diameter hole located on one side of the housing is formed at an end of each through hole, and the outer peripheral surface of the conductive toe pin is caught by a step between the through hole and the reduced diameter hole. Preferably, a flange is formed. According to a second aspect of the present invention, in order to achieve the above object, the electrical connection is provided by interposing the press-contact pinching type connector according to the first aspect between the opposing electrodes.

Here, the housing in the claims can be formed in a square, polygon, ellipse, circle, oval, or the like. The number and arrangement of the plurality of through holes may be one row, but may be two or more rows, and in this case, two to four parallel rows, preferably one to four rows per row, preferably two to one row per row. About two are desirable in terms of cost. Of course, it can be increased or decreased as needed. In addition, the end of the conductive pin may be appropriately formed in a shape having a pointed shape at a predetermined angle, a semicircular cross section, a semielliptical cross section, a semi-oval cross section, a plurality of pins, a crown, a substantially dowel stud, or the like. It is possible. In particular,
If the end of the conductive pin is formed in a sharp shape such as a cone or a pyramid, it is possible to break the oxide film of the solder of the electrode and obtain good conduction. Further, at least various circuit boards, inspection circuit boards, BGA
Etc. are included.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. A press-clamp type connector and a connection structure thereof according to the present embodiment are, as shown in FIGS. An elongated insulating housing 20, a plurality of through holes 23 pierced in the vertical thickness direction of the housing 20, Cap-shaped conductive toe pins 28 slidably fitted from the lower surface side of the housing 20 into the holes 23, and fit into the conductive toe pins 28 slidably fitted from the upper surface side of the housing 20 into the respective through holes 23. It comprises a conductive pin 30 and a coil spring 31 fitted into each through-hole 23 and supported in contact with the upper end of the opening of the conductive toe pin 28 and penetrated by the conductive pin 30. Yl is a conductive Topin 28 and the conductive pin 30 in repression biasing force of the spring 31 so as to respectively resiliently to protrude from the upper and lower surfaces of the housing 20.

As shown in FIG. 1, the electronic circuit board 1 is made of, for example, a printed wiring board, and has a plurality of electrodes 2 on its surface.
Are arranged flat, and a solder layer made of cream solder or ACF (anisotropic
c conductive film: an anisotropic conductive film) and the like are formed at the time of conductive connection. As shown in the figure, the electrical joint 10 is formed of a liquid crystal module of COG, for example.
It is closely opposed to the surface of the lower electronic circuit board 1. A plurality of electrodes 11 composed of ITO electrodes are arranged in parallel on the electric joint 10.

As shown in FIGS. 1 to 3, the housing 20 is formed in a flat rectangular plate shape by laminating a pair of upper and lower thin housing plates 21 and 22, and a through hole 23 having a small diameter in the longitudinal direction. A predetermined pitch (for example, 0.5
mm to 1.27 mm). Each of the housing plates 21 and 22 is molded using a general-purpose engineering plastic (for example, ABS resin, polycarbonate, polypropylene, PVC, polyethylene, or the like) having excellent heat resistance, dimensional stability, moldability, and the like. Among these materials, the ABS resin is most suitable as the material in consideration of workability, cost, and the like. Positioning pins 24 are respectively implanted downward at the lower ends of both ends of the housing 20, and are positioned and fixed by inserting the positioning pins 24 into positioning holes (not shown) of the electronic circuit board 1.

As shown in FIG. 1, each through hole 23 is formed in the lower housing plate 21 and has a first reduced-diameter hole 25 located on the electronic circuit board 1 side, and in the lower housing plate 21 is formed. A large-diameter hole continuously formed vertically at the upper end of the first diameter-reduced hole 25 via a step;
2 and is continuous with the upper end of the enlarged diameter hole 26 via a step, and is formed from a vertically elongated second reduced diameter hole 27 located on the electric joint 10 side.

As shown in FIG. 1, each conductive toe pin 28 is formed in a substantially U-shaped cross section using a gold-plated conductive material, for example, copper, brass, or aluminum. The conductive toe pin 28 has a closed end surface slightly projecting from the lower surface of the housing 20 (the amount of projection is 0.1 to 1.5 m).
m, preferably about 0.5 to 1.0 mm) is in contact with the electrode 2 of the electronic circuit board 1 or is appropriately fixed to the electrode 2 of the electronic circuit board 1 via a solder layer, an ACF, or the like to ensure conduction. . A ring-shaped flange 29 is formed on the upper part of the outer peripheral surface of the conductive toe pin 28 so as to protrude outward in a radial direction, and the flange 29 relates to a step between the first reduced diameter hole 25 and the enlarged diameter hole 26 forming the through hole 23. By stopping, the conductive toe pin 28
Is regulated.

As shown in FIGS. 1 and 3, each conductive pin 30 is made of, for example, gold-plated conductive copper, brass, aluminum, or a conductive elastomer. The upper end surface of the conductive pin 30 is curved to have a substantially semicircular arc shape in cross section, and the upper end surface contacts the electrode 11 of the electric joint 10. The conductive pins 30 slightly protrude from the upper surface of the housing 20, and the protruding amount is about 0.1 to 1.5 mm, preferably about 0.5 to 1.0 mm.

When the plurality of coil springs 31 are connected to the electronic circuit board 1, the inspection circuit board, the surface mount type IC package, and the liquid crystal module, the same number of the electrodes 2 and 11 are used. . Each coil spring 3
1 is, for example, 30 to 100 μm in diameter, preferably 30 to 100 μm.
A predetermined fine metal wire having a diameter of 80 μm is, for example, 50 μm.
m formed by being wound at an equal pitch of 0.5 m
A load of 30 g to 60 g is generated upon compression of mm. The reason why the diameter of the thin metal wire is set to 30 to 80 μm is that if this range is selected, low cost and low load connection can be easily realized. The load at the time of compression may be appropriately selected according to the connection status. Examples of the thin metal wires forming each coil spring 31 include metal wires such as phosphor bronze, copper, stainless steel, beryllium copper, and piano wires, or thin metal wires obtained by plating these metal wires with gold.

The length of each coil spring 31 is as follows:
For example, 0.5 to 3.0 mm, preferably 1.0 to 1.5
mm is good. With such a range, adverse effects due to external noise can be avoided and elastic characteristics can be maintained. As shown in FIG. 1, each of the coil springs 31 is formed such that the lower end thereof has an enlarged diameter in contact with the upper end of the opening of the conductive toe pin 28. Is fitted near the boundary with the second diameter-reduced hole 27 to effectively restrict displacement and slippage.

In the above-described configuration, the press-clamp-type connector is positioned and fixed to the electronic circuit board 1, the press-clamp-type connector is positioned and clamped between the electronic circuit board 1 and the electric joint 10, and the electrodes 2 of the electronic circuit board 1 are connected to each other. The conductive toe pins 28 are brought into contact with each other, and the electrodes 11 of the electric joint 10 are brought into surface contact with the conductive pins 30. When the electric joint 10 is slightly pressurized and compressed against the electronic circuit board 1, each coil spring 31 is compressed and deformed, and the conductive toe pin 28 and the conductive pin 30 move up and down, respectively. The object 10 can be electrically and resiliently conductive through the conductive toe pin 28 and the conductive pin 30 (see FIG. 1).

According to the above configuration, the press-clamp-type connector is provided between the electronic circuit board 1 and the electric joint 10 in the housing 2.
Since it is interposed through the pin 0, the press-connecting type connector can be easily incorporated or mounted on the electronic circuit board 1 itself, and the positioning accuracy and the assemblability can be significantly improved. The conductive pin 30 and the coil spring 3
1 is integrated with the conductive pin 3 inside the conductive toe pin 28.
0 is inserted so as to be able to reciprocate, so that the height dimension of the press-contact pinching connector during pinching compression conduction can be reduced without any problem (1.
(About 50 mm to 2.00 mm).
Low-resistance, low-load connection of about 3 (for example, 30 g to 60 g)
/ Pin) can also be greatly expected.

Further, since the conductive toe pin 28 and the conductive pin 30 are always in direct contact with each other on the peripheral surface and form the shortest conductive path, unlike the case where only the long coil spring 31 wound spirally is used as the conductive path. By shortening the conduction path, it is possible to realize a remarkable reduction in inductance, that is, high-frequency characteristics. In addition, the total length of the conductive pin 30 can be shortened. In addition, since the upper end surface of the conductive pin 30 is formed in a hemispherical shape or a semi-elliptical shape, even if the coil spring 31 is slightly inclined in the front, rear, left and right directions, the stability of conduction can be ensured.

Furthermore, since the lower end of the coil spring 31 is substantially held between the second reduced diameter hole 27 and the conductive toe pin 28, the coil spring 31 can be prevented from coming off with a simple configuration. Furthermore, since the press-contact pinching connector is assembled so that the conductive portion is sandwiched between the pair of housing plates 21 and 22 from above and below, positional displacement, dropout, dropout, etc. of the conductive toe pin 28, the conductive pin 30, and the coil spring 31 can be performed with a simple configuration. The suppression can be prevented very effectively.

FIG. 4 shows a second embodiment of the present invention. In this case, small-diameter through-holes 23 are arranged in a plurality of rows of a matrix at a predetermined pitch in the longitudinal direction of a housing 20 and are pierced. Then, it is made to correspond to the electrodes 2 and 11 of the matrix. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

FIG. 5 shows a third embodiment of the present invention. In this case, small-diameter through-holes 23 are arranged in a plurality of rows at a predetermined pitch in the longitudinal direction of the housing 20 and are pierced. The plurality of through holes 23 are arranged in a staggered manner. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

FIG. 6 shows a fourth embodiment of the present invention. In this case, the upper end of each conductive pin 30 is formed in a conical shape, and the upper end is connected to the electrode of the electrical joint 10. 11 to break the solder oxide film of the electrode 11 to ensure good conduction. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

FIG. 7 shows a fifth embodiment of the present invention. In this case, the upper portion of each conductive pin 30 is formed with a reduced diameter, and the upper end of each conductive pin 30 is expanded. , And this portion is brought into contact with the electrode 11 of the electric joint 10 to break the solder oxide film of the electrode 11, and the upper end of the coil spring 31 is fitted to the upper part of each conductive pin 30. In such a case, slip-out or detachment is effectively prevented. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

FIG. 8 shows a sixth embodiment of the present invention. In this case, the upper portion of each conductive pin 30 is formed with a reduced diameter, and the upper end of each conductive pin 30 is expanded. And a small pointed cone formed at the center of the upper end face of the upper end portion, and the conical portion is brought into contact with the electrode 11 of the electric joint 10 so that the solder oxide film of the electrode 11 is destroyed. The upper end of the spring 31 is fitted to the upper part of each conductive pin 30 to effectively prevent detachment and detachment. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

Next, FIG. 9 shows a seventh embodiment of the present invention. In this case, the upper part of each conductive pin 30 is formed to have a reduced diameter, and the upper end of each conductive pin 30 is enlarged in diameter. And the upper end thereof is brought into contact with the electrode 11 of the electric joint 10 (particularly effective for BGA electrode solder balls without any displacement). The oxide film of the solder can be broken, and the upper end of the coil spring 31 is fitted to the upper part of each conductive pin 30 to effectively prevent the detachment or detachment. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

In the above-described embodiment, the positioning pins 24 are planted at the lower portions on both ends of the housing 20 in a downward direction, however, these positioning pins 24 can be omitted. Further, a plurality of grooves may be formed on both side surfaces of the housing 20 in accordance with the number of the conductive pins 30 and the like, and the housing 20 may be divided at an arbitrary position using the grooves.

[0027]

As described above, according to the present invention, there is an effect that positioning accuracy and assemblability can be improved. In addition, the conductive path can be shortened by reducing the height dimension, and it becomes possible to connect an electric joint having electrodes with a low load.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view showing an embodiment of a press-clamp type connector and a connection structure thereof according to the present invention.

FIG. 2 is a plan view showing a housing in the embodiment of the press-connecting connector according to the present invention.

FIG. 3 is a partially sectional explanatory view showing an embodiment of a press-contact pinching connector according to the present invention.

FIG. 4 is a plan view showing a housing in a second embodiment of the press-contact pinching type connector according to the present invention.

FIG. 5 is a plan view showing a housing in a third embodiment of the press-contact pinching connector according to the present invention.

FIG. 6 is an explanatory sectional view showing a fourth embodiment of a press-contact and pinch type connector according to the present invention.

FIG. 7 is an explanatory sectional view showing a fifth embodiment of the press-contact pinching connector according to the present invention.

FIG. 8 is a sectional explanatory view showing a sixth embodiment of the press-contact and pinch type connector according to the present invention.

FIG. 9 is an explanatory cross-sectional view showing a seventh embodiment of the press-contact pinching connector according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic circuit board 2 electrode 10 electrical joint 11 electrode 20 housing 21 housing plate 22 housing plate 23 through hole 25 first reduced diameter hole (reduced diameter hole) 26 enlarged diameter hole 27 second reduced diameter hole 28 conductive toe pin 29 Flange 30 Conductive pin 31 Coil spring (spring)

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) // H01R 107: 00 H01R 23/02 EF term (reference) 2G003 AA07 AG03 AG08 AG12 AG20 AH07 2G011 AA14 AB01 AB06 AB07 AC14 AC21 AC31 AE01 AE22 AF07 5E023 AA04 AA16 AA18 AA22 BB17 BB22 CC02 CC22 DD26 EE14 FF07 GG02 GG07 HH01 HH05 HH08 HH16 HH18

Claims (3)

[Claims] An insulating housing; a plurality of through holes provided in a thickness direction of the housing; a substantially cap-shaped conductive toe pin slidably fitted into each of the through holes from one surface side of the housing; A conductive pin fitted slidably from the other surface side of the housing into each through hole and fitted into the conductive toe pin; and a conductive pin fitted into each through hole and brought into contact with an open end of the conductive toe pin to contact the conductive pin. A press-clamping connector comprising: a spring that is penetrated; wherein the conductive toe pin and the conductive pin are respectively protruded from the housing by the urging force of the spring. 2. A reduced diameter hole located on one side of the housing is formed at an end of each of the through holes, and the outer peripheral surface of the conductive toe pin is caught by a step between the through hole and the reduced diameter hole. The press-clamping connector according to claim 1, wherein a flange is formed. 3. The method according to claim 1, wherein the electrodes are opposed to each other.
A connection structure for a press-clamp type connector, wherein the connection is made by interposing the press-clamp type connector described above.