JP2002156387A - Contact pin form semiconductor measuring device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact pin for a highly reliable semiconductor measuring device preventing wear of a side face part of a connection pin terminal and improving contact stability. SOLUTION: A body of the contact pin 10 has a conductive spring 12 built-in a cylindrical case 11. In the connection pin terminal 13, one end part is in the case 11 and electrically connected to the spring 12, and another end part is protruded outside the case 11. An insulating member 14 is fixed between the rim part of the case 11 and the connection pin terminal 13. The insulating member 14 is fixed in a form with its inner rim portion 141 fitting inside the case 11. The insulating member 14 acts as a guide, so as to control a movement of the connection terminal pin 13 by pressing force of the spring 12 in a prescribed direction (arrow A) with almost no inclination.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin of a semiconductor measuring device provided in a signal transmission system in a semiconductor measuring device with a tester for inspecting an IC device.

[0002]

2. Description of the Related Art There are various types of semiconductor measuring devices.
For example, an IC handler that inspects a mass-produced product device such as an IC package at a desired temperature, measures the data, and classifies and stores the data according to the data is also one of the semiconductor measuring devices. Generally, an IC handler includes a loader section for supplying an IC, a preheating section for the IC, a measurement section having an IC inspection stage for performing data measurement, a housing section for loading the IC after the measurement, and an IC after the measurement. It is composed of an unloader section for sorting and storing.

In the measuring section, a socket for electrically connecting terminals of the product devices is provided on the inspection stage for sequentially inspecting a plurality of product devices. The socket is configured to transmit a signal to a tester via a socket board, a performance board, or the like. This allows the product device inserted in the socket to be
A series of predetermined tests are performed.

FIG. 5 is a schematic diagram showing an example of a measuring section in a semiconductor measuring device. The main part around the socket is shown. A socket 52 into which a product device (package product) 51 is inserted and electrically connected is connected to a socket board 53. The socket board 53 is connected to a performance board (not shown).

When the device 51 is a CSP (Chip Size Packag)
e) or an external terminal arrangement such as a BGA (Ball Grid Array) package, the socket 52 and the socket board 53
Are electrically connected via contact pins (pogo pins) 60. That is, the socket 52
Of the contact pin 60 is connected to a ball electrode terminal 511 such as a solder ball of the product device 51, and the other end of the contact pin 60 is connected to the socket board 5.
3 is connected to the substrate land portion 531.

FIG. 6 is a cross-sectional view showing a configuration of a contact pin of a conventional semiconductor measuring device, and shows a configuration of a contact pin used in the semiconductor measuring device of FIG.

The contact pin 60 has a case 61 in which a conductive spring 62 is provided, and a connection pin terminal 63.
1 632 is connected to the case 61 together with the bearing 64.
It is housed near the inner ends. The spring 62, the bearing 64 and the connecting pin terminals 631, 632 are
Both ends of the case 61 are squeezed so that they do not protrude outside (squeeze port 65). Connection pin terminals 631,632
A fringe portion 66 that is larger than the throttle port 65 and smaller than the inner diameter of the case 61 is provided at one end of the case 61 so as to be fixed by the throttle port 65 of the case 61.

When the product device 51 as shown in FIG. 5 is set in the socket 52, one end of each of the connection pin terminals 631 and 632 of the contact pin 60 is connected to the ball electrode terminal 511 of the product device 51 and the socket board 53.
Are respectively pressed against the substrate land portions 531 and retreat into the case 61 with the pressing force of the spring 62. This achieves good electrical contact. When the product device 51 is released from the socket 52, the load on the spring 62 is reduced, and the protrusion of each of the connection pin terminals 631, 632 is maximized.

[0009]

However, when the desired connection and disconnection are repeated tens of thousands of times, the contact pin 60 of the conventional contact pin 60 is connected to the connection pin terminal 6 at the case aperture 65.
Wear powder 67 is likely to be generated by rubbing against the side surface of 31 or 632. In addition, there are many problems that the diameter of the aperture 65 becomes large and the connection pin terminal 631 or 632 moves while tilting (broken arrow 68), causing a displacement. These cause connection failure.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a contact pin of a highly reliable semiconductor measuring device which prevents abrasion of a side surface of a connecting pin terminal and improves contact stability. It is assumed that.

[0011]

A contact pin of a semiconductor measuring apparatus according to the present invention is an electrical connecting part for transmitting a signal relating to a test on a device under test, and includes a cylindrical case and a case. A built-in conductive spring, a connection pin terminal having one end inside the case and electrically connected to the spring, and the other end protruding outside the case, and an edge of the case. An insulating member fixed between the connection pin terminals and controlling movement of the connection pin terminals by the pressing force of the spring.

According to the contact pin of the semiconductor measuring device according to the present invention, the insulating member is interposed between the edge of the case and the connection pin terminal. Thereby, abrasion of the case is prevented. Further, the insulating member plays a role of guiding the movement of the connection pin terminal so as to keep the movement properly.

[0013] Preferably, the connection pin terminal is provided with a fringe portion at one end thereof, and the fringe portion is pressed against an insulating member by the pressing force of the spring. And

[0014]

FIG. 1 is a sectional view showing a main part of a contact pin of a semiconductor measuring device according to an embodiment of the present invention. FIG. 3 shows a movable portion at the tip of a pin of a so-called pogo pin contact, which is responsible for signal transmission related to a test on a device under test.

The body of the contact pin 10 includes a cylindrical case 11 and a conductive spring 12 built therein.
The connection pin terminal 13 has one end in the case 11 and is electrically connected to the spring 12, and the other end protrudes out of the case 11. The shape of the pin tip at the other end is not particularly limited. Hereinafter, a characteristic configuration surrounded by a broken line S will be described.

In this embodiment, an insulating member 14 is fixed between the edge of the case 11 and the connection pin terminal 13. The insulating member 14 has an inner edge portion 141 whose case 1
1 and is fixed so as to be fitted into the inside. Case 11
If the material is, for example, a nickel alloy, the insulating member 14
Is made of, for example, a lubricating heat-resistant resin.

The opening diameter of the insulating member 14 is slightly larger than the diameter of the connecting pin terminal 13. Thereby, the insulating member 1
4 is a connection pin terminal 1 by a pressing force of a spring 12.
3 is controlled in a predetermined direction (arrow A) with almost no inclination.

The connection pin terminal 13 has a fringe portion 131 at one end (inside of the case 11) that fits the inner edge portion 141 of the insulating member 14. The fringe portion 131 is pressed by the spring 12 so that the insulating member 1
4 is pressed against the inner edge portion 141 of the base. Of course, if a force that pushes back the spring 12 is applied to the other end of the connection pin terminal 13, the connection pin terminal 13
Recedes into the case 11.

According to the configuration of the above embodiment, the insulating member 14 is interposed between the edge of the case 11 and the connection pin terminal. Thereby, abrasion of the case is prevented. The insulating member 14 is configured to control the movement of the connection pin terminal 13. For this reason, the case 11 may have a simple cylindrical shape, and it is possible to eliminate a configuration that tends to vary, such as the conventional aperture 65 in FIG.

If the depth D of the insulating member 14 fitted into the inside of the case 11 is somewhat large, the insulating member 14 can maintain a proper movement in which the inclination of the connecting pin terminal 13 is suppressed, and
Fixing to the case 11 is firm. Thereby, not only the durability is enhanced, but also the contact position shift is reduced, and an improvement in the contact stability can be expected.

FIG. 2 is a schematic view showing an example of a contact pin of a semiconductor measuring device using the configuration of FIG. The same parts as in the first embodiment are denoted by the same reference numerals as in FIG. A conductive spring (not shown) is housed in a mere cylindrical case 11 of the contact pin 20, and connection pin terminals 231 and 232 of a predetermined shape protrude from both ends. Insulating members 14 are fixed to both edges of the case 11. That is, the broken lines S1 and S2 have the same configuration as the broken line S in FIG. As a result, the connection pin terminal 2 is pressed by the pressing force of the spring inside the case 11.
The movements of 31 and 232 are controlled in a predetermined direction with little inclination (arrows A1 and A2).

FIGS. 3A to 3C are partial schematic views of a semiconductor measuring device in which the configuration of the contact pin 20 of FIG. 2 is used. The same parts as in the first embodiment are denoted by the same reference numerals as in FIG.

As shown in FIG. 3A, for example, a measuring unit of an IC handler is used to inspect a plurality of product devices (package products) 31 on an inspection stage.
A socket 32 for electrically connecting terminals (ball electrode terminals) 311 of the product device is provided. The socket 32 is configured to transmit a signal to a tester via a socket board 33, a performance board (not shown), or the like. As a result, a series of predetermined tests are performed on the product device 31 inserted into the socket 32.

As shown in FIGS. 3B and 3C, the contact pin 20 carries out signal transmission when the product device 31 is set in the socket 32. One end of each of the connection pin terminals 231 and 232 of the contact pin 20 is connected to the ball electrode terminal 311 of the product device 31 and the socket board 3.
3 are pressed against the substrate land portions 331, respectively, and retreat into the case with the pressing force of the spring 12 inside the case 11. This achieves good electrical contact. When the product device 31 is released from the socket 32, the load on the spring 12 is reduced, and the protrusion of the connection pin terminal is maximized.

According to the configuration of the above embodiment, the insulating member 14 prevents the case 11 from being worn, suppresses the generation of wear powder, and improves the durability. Further, the insulating member 14 keeps proper movement with respect to the connection pin terminals 231 and 232 with the inclination suppressed. Thereby, the contact position shift is reduced, and the contact stability is improved. Also, the insulating member 1
4 has a depth D when it is fitted into the case 11, so that the spring 12 can be shortened accordingly. As a result, a decrease in the contact resistance value is expected, which contributes to an improvement in measurement performance.

The contact pin having the features of the present invention can be used for a test in a wafer state before an assembling process of LSI manufacturing, that is, a so-called probe test.
That is, it is used for a semiconductor measuring device having a prober and a test head used together with a tester.

FIG. 4 is a schematic diagram showing an example of another semiconductor measuring device using the contact pin structure according to the present invention. A movement control stage 411 on which the semiconductor wafer WF is mounted and a probe card 41 are provided in the prober 41.
2. A circuit board 413 for signal relay including the performance board PB is provided.

Wafer WF by movement control stage 411
The probe card 412 is controlled by the movement control of the wafer WF.
Of the LSI chip area to be measured. As a result, the probe card 412 becomes a probe (not shown).
Is brought into contact with a predetermined pad on the chip area, a test signal or a test pattern is input, and a resultant output signal is obtained.

The signal (test signal or test pattern) to the LSI chip sent to the prober 41 is transmitted from the tester 43 via the test head 42. The signal result from the LSI chip obtained by the prober 41 is transmitted to the tester 43 via the test head 42. The tester 43 compares the measured LS with the expected value.
It determines whether the function of the I-chip is good or not, and measures and analyzes analog values such as input / output signals, voltage and current of a power supply, and the like. Only LSI chips selected as non-defective products by such a wafer probing test are sent to the assembly process.

In the configuration shown in FIG.
The signal transmission between the circuit substrate 413 and the circuit substrate 413 and the signal transmission between the circuit substrate 413 and the test head 42 are performed by a contact pin unit CNT provided with a plurality of contact pins.
Done by U. Also, the contact pin unit CNTU is responsible for signal transmission for the performance board PB.

A predetermined contact pin provided in the contact pin unit CNTU is provided with a broken line S in FIG.
It is preferable to adopt the structure of the movable portion at the tip of the pin of the pogo pin contact shown in FIG. As a result, proper movement with the inclination of the connection pin terminal suppressed can be maintained, durability can be enhanced, and contact displacement can be reduced, and improvement in contact stability can be expected. Although not shown, the structure of the present invention can be used for any pogo pin contact type contact pin, and the same effects as described above can be expected.

[0032]

As described above, according to the present invention, the insulating member is interposed between the edge of the case and the connecting pin terminal. Thereby, abrasion of the case is prevented. Thereby, the durability is improved. Further, the insulating member plays a role of guiding the movement of the connection pin terminal so as to keep the movement properly. Thereby, contact stability is improved. Further, the connecting pin terminal has a structure in which the fringe portion at one end is pressed against the insulating member by the pressing force of the spring, so that the spring can be shortened. This contributes to a reduction in contact resistance and an improvement in measurement performance.

From the above, according to the present invention,
It is possible to provide a highly reliable contact pin of a semiconductor measuring device in which the side surface of the connecting pin terminal is prevented from being worn, the durability of the movable portion is improved, and the contact stability and the measuring performance are improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a main part of a contact pin of a semiconductor measuring device according to an embodiment of the present invention.

2 is a schematic view showing an example of a contact pin of a semiconductor measuring device using the configuration of FIG.

3 (a) to 3 (c) are partial schematic diagrams of a semiconductor measuring device using the configuration of the contact pin of FIG. 2 respectively.

FIG. 4 is a schematic diagram showing an example of another semiconductor measuring device in which the configuration of a contact pin according to the present invention is used.

FIG. 5 is a schematic diagram illustrating an example of a measurement unit in the semiconductor measurement device.

FIG. 6 is a cross-sectional view showing a configuration of a contact pin of a conventional semiconductor measuring device.

[Explanation of symbols]

10, 20, 60 contact pin 11, 61 case 12, 62 spring 13, 231 232, 631, 632 connection pin terminal 131, 66 fringe portion 14 insulating member 141 inner edge portion 31, 51 ... Product devices (package products) 311,511 ... Ball electrode terminals 32,52 ... Sockets 33,53 ... Socket boards 331,531 ... Board land 41 ... Prober 411 ... Movement control stage 412 ... Probe card 413 ... Signal relay Circuit substrate 42 ... Test head 43 ... Tester body 64 ... Bearing 65 ... Case aperture 67 ... Abrasion powder CNTU ... Contact pin unit BC ... Performance board WF ... Wafer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01R 13/24 H01R 13/24

Claims (2)

[Claims] 1. An electrical connection part for transmitting a signal relating to a test for a device under test, comprising: a cylindrical case; a conductive spring built in the case; A connection pin terminal electrically connected to the spring and having the other end protruding out of the case, and fixed between an edge of the case and the connection pin terminal, and a pressing force of the spring. And an insulating member for controlling the movement of the connection pin terminal by the contact pin of the semiconductor measuring device. 2. The connecting pin terminal is provided with a fringe portion at one end thereof which is adapted to an inner edge portion of the insulating member, and the pressing force of the spring presses the fringe portion against the insulating member. The contact pin of the semiconductor measuring device according to claim 1, wherein the contact pin has a configuration.