JP2002023860A - Temperature control system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature control system capable of suppressing energy consumption related with the heating/cooling of a temperature control target as much as possible. SOLUTION: At the time of cooling a semiconductor wafer (temperature control target) W, cooling liquid in a prescribed temperature range heated through a temperature control plate 2A of a treating part 2 is supplied through a switching valve 7A to a heat storage tank 5, and the heat energy of the cooling liquid, that is, the cooling liquid itself is stored in the heat storage tank 5. At the time of heating the semiconductor wafer W, the cooling liquid in the prescribed temperature range heated by the heat energy stored in the heat storage tank 5 is supplied through a switching 7B to the temperature control plate 2A of the treating part 2, and the temperature control plate 2A is heated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a processing unit for heating and cooling an object to be temperature-controlled, comprising a temperature adjusting plate to which a fluid is circulated and supplied and heating means provided on the temperature adjusting plate. A cooling unit that cools the fluid circulated and supplied to the temperature adjustment plate to a predetermined temperature,
The present invention relates to a temperature adjustment system that includes a fluid circulation circuit that connects the processing unit and the cooling unit and circulates and supplies the fluid to the temperature adjustment plate, and that alternately repeats heating and cooling of the temperature control target.

[0002]

2. Description of the Related Art For example, a semiconductor wafer manufacturing process includes a baking process for heating a substrate to remove a solvent remaining on a photoresist film (photosensitive film) applied to the surface of the substrate, To a room temperature level.

FIG. 33 shows a semiconductor wafer (temperature control object).
1 shows a conventional temperature adjustment system for heating / cooling the semiconductor wafer in a predetermined temperature range in the manufacturing process of FIG. 1. This temperature adjustment system A includes a processing section B and a cooling section C, and a processing section A fluid circulation circuit D connecting B and the cooling unit C is provided.

The processing section B is a section for heating and cooling the semiconductor wafer W, and has a cooling liquid inside.
It has a temperature adjusting plate Ba to which (fluid) is circulated and supplied, and a film-shaped electric heater (heating means) Bb provided on the surface of the temperature adjusting plate Ba.

On the other hand, the cooling section C is a section for cooling the cooling liquid circulated and supplied to the temperature adjusting plate Ba of the processing section B to a predetermined temperature, and a heat for cooling the cooling liquid circulated from the processing section B. It has an exchanger Ca and a coolant tank Cb for storing coolant cooled by the heat exchanger Ca.

The fluid circulation circuit D includes a cooling unit C and a processing unit B.
Supply line D for supplying the cooling liquid to the temperature adjustment plate Ba
i, and a circulation pipe Do for circulating the coolant from the temperature adjustment plate Ba of the processing section B to the cooling section C, and a pump P for pumping the coolant is interposed in the supply pipe Di. ing.

In the temperature control system A having the above configuration,
The semiconductor wafer W placed on the temperature adjustment plate Ba of the processing unit B is heated to a predetermined temperature by the operation of the electric heater Bb provided on the temperature adjustment plate Ba, while the temperature adjustment of the processing unit B is performed from the cooling unit C. By supplying the cooling liquid to the plate Ba, it is cooled to a predetermined temperature.

[0008]

In the above-described conventional temperature control system A, when the heated semiconductor wafer W is cooled, the temperature control plate Ba, which is at a high temperature, is supplied from the cooling unit C. The cooling liquid is cooled by the temperature adjusting plate Ba at this time.
Is recovered through the heat exchanger Ca of the cooling section C, which causes considerable energy loss.

Further, in the above-described temperature adjusting system A, when heating the semiconductor wafer W, the temperature adjusting plate Ba cooled to a predetermined temperature on the low temperature side is connected to the electric heater Bb provided on the temperature adjusting plate Ba. In operation, heating must be performed to a predetermined temperature on the high temperature side, and the heating of the semiconductor wafer W is repeatedly performed each time a new semiconductor wafer W is loaded into the processing unit B. There was a problem that a large amount of energy (electric power) was required for operation.

The present invention has been made in view of the above circumstances, and has as its object to provide a temperature control system capable of minimizing energy consumption related to heating / cooling of a temperature controlled object.

[0011]

According to a first aspect of the present invention, there is provided a temperature control system for heating and cooling an object to be temperature controlled, comprising: a temperature control plate to which a fluid is circulated and supplied; A cooling unit for cooling the fluid circulated and supplied to the temperature adjustment plate to a predetermined temperature, and a processing unit and a cooling unit connected to the temperature adjustment plate to circulate and supply the fluid to the temperature adjustment plate. A temperature control system comprising a fluid circulation circuit and alternately repeating heating and cooling of the temperature controlled object, wherein the heat storage means is connected in parallel to the fluid circulation circuit and stores thermal energy of the supplied fluid And a flow path switching means for switching a fluid flow path between the fluid circulation circuit and the heat storage means.

According to the temperature control system having the above-described configuration, when cooling the temperature control target, the fluid in the predetermined temperature range, which has been heated by passing through the temperature control plate of the processing section, is stored through the flow switching means. The heat storage means stores the heat energy of the fluid in the heat storage means, and when heating the temperature controlled object, the fluid in a predetermined temperature range heated by the heat energy stored in the heat storage means is supplied to the flow path switching means. The temperature control plate can be supplied to the temperature control plate of the processing unit via the, and the temperature control plate is heated.

According to the above configuration, when cooling the temperature control object, the thermal energy of the fluid stored in the heat storage means is
By using the temperature control target as a heat source when heating the object, the energy for operating the heating means when the temperature adjustment plate of the processing unit is heated to the predetermined temperature can be reduced. Further, according to the above configuration, the heat energy recovered from the temperature adjustment plate at the time of cooling, which has been exhausted in the conventional temperature adjustment system, is used to heat the temperature adjustment plate at the time of heating. The loss will be greatly reduced. Therefore, according to the temperature adjustment system according to the present invention, it is possible to minimize energy consumption related to heating / cooling of the temperature control target.

According to a second aspect of the present invention, there is provided a temperature adjusting system according to the first aspect, wherein the heat storage means is heated by passing through the temperature adjusting plate of the processing section when cooling the temperature controlled object. And a container for storing the fluid. According to the above configuration, when cooling the temperature control target, the thermal energy of the fluid stored in the container as the heat storage means is used as a heat source when heating the temperature control target, thereby reducing the temperature of the processing unit. When the adjustment plate is heated to the predetermined temperature, less energy is required to operate the heating means. Further, according to the above configuration, heat was exhausted in the conventional temperature adjustment system,
By using the thermal energy recovered from the temperature adjustment plate during cooling to heat the temperature adjustment plate during heating, energy loss is significantly reduced. Therefore, according to the temperature adjustment system according to the present invention, it is possible to minimize energy consumption related to heating / cooling of the temperature control target.

According to a third aspect of the present invention, there is provided a temperature control system according to the first aspect, wherein the heat storage means is heated by passing through a temperature control plate of the processing section when cooling the temperature control target. It consists of a heat storage body that stores the heat absorbed from the fluid. According to the above configuration, when cooling the temperature control target, by using the heat energy of the fluid stored in the heat storage unit as the heat storage means as a heat source when heating the temperature control target, the processing unit When heating the temperature adjustment plate to a predetermined temperature, less energy is required to operate the heating means.
Further, according to the above configuration, the heat energy recovered from the temperature adjustment plate at the time of cooling, which has been exhausted in the conventional temperature adjustment system, is used to heat the temperature adjustment plate at the time of heating. The loss will be greatly reduced. Therefore, according to the temperature adjustment system according to the present invention, it is possible to minimize energy consumption related to heating / cooling of the temperature control target.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings showing embodiments. FIGS. 1 and 2 show a first temperature control system in which the temperature control system according to the present invention is applied to a temperature control system for heating / cooling the semiconductor wafer (temperature control target) in a predetermined temperature range in a semiconductor wafer manufacturing process. An example is shown.

The temperature control system 1 includes a processing unit 2 and a cooling unit 3, a fluid circulation circuit 4 connecting the processing unit 2 and the cooling unit 3, and further includes a heat storage tank (container) 5 as a heat storage unit. And a bypass circuit 6 connecting the fluid circulation circuit 4 and the heat storage tank 5.

The processing section 2 is a section for heating / cooling the semiconductor wafer W, and has a cooling liquid (fluid) therein.
And a film-shaped electric heater (heating means) 2B provided on the surface of the temperature adjustment plate 2A.

On the other hand, the cooling section 3 is a section for cooling the cooling liquid circulated and supplied to the temperature adjusting plate 2A of the processing section 2 to a predetermined temperature, and a heat for cooling the cooling liquid circulated from the processing section 2. It has an exchanger 3A and a coolant tank 3B for storing coolant cooled by the heat exchanger 3A.

The fluid circulation circuit 4 includes a cooling unit 3 and a processing unit 2.
Supply line 4 for supplying the cooling liquid to the temperature adjustment plate 2A
i, and a return line 4o for circulating the coolant from the temperature adjustment plate 2A of the processing unit 2 to the cooling unit 3, and a first pump for pumping the coolant through the supply line 4i. p1 is interposed.

The supply line 4i of the fluid circulation circuit 4
Is connected to the fluid inlet 2Ai of the temperature adjustment plate 2A, while the reflux line 4o of the fluid circulation circuit 4 is
It is connected to the fluid outlet 2Ao of the temperature adjustment plate 2A.

A heat storage tank 5 as heat storage means is connected to the above-mentioned fluid circulation circuit 4 via a bypass circuit 6, and the heat storage tank 5 holds the temperature of the cooling liquid contained therein. This is a heat-insulating container which is formed in a size (volume) sufficient to contain a predetermined amount of cooling liquid described in detail later.

The heat storage tank 5 may be provided with a heating means such as a heater in order to compensate for a decrease in the temperature of the cooling liquid contained therein.

The bypass circuit 6 connects the heat storage tank 5 to the fluid circulation circuit 4 in parallel. The bypass circuit 6 connects the reflux line 4o of the fluid circulation circuit 4 to the heat storage tank 5 and the introduction line 6i. And a discharge line 6o connecting the heat storage tank 5 and the supply line 4i of the fluid circulation circuit 4. A second pump p2 for pumping the coolant is interposed in the discharge line 6o. I have.

The branch / merge of the recirculation line 4o of the fluid circulation circuit 4 and the introduction line 6i of the bypass circuit 6, and the supply line 4i of the fluid circulation circuit 4 and the discharge line 6o of the bypass circuit 6 A switching valve 7A and a switching valve 7B as flow path switching means are respectively installed at the branching / merging portions.

These switching valves 7A and 7B are means for switching the flow path of the cooling liquid between the fluid circulation circuit 4 and the heat storage tank 5, and their operation is controlled by control means (not shown) in a manner described later. Is done.

The temperature control system 1 having the above-described configuration heats / cools the semiconductor wafer W mounted on the temperature control plate 2A of the processing section 2 in a range of, for example, 23 ° C. to 150 ° C.

That is, the semiconductor wafer W placed on the temperature adjusting plate 2A maintained at a low set temperature (23 ° C.)
First, by operating the electric heater 2B, the temperature is raised to a high set temperature (150 ° C.) together with the temperature adjustment plate 2A,
Next, it is maintained at a high set temperature (150 ° C.) for a certain period of time.

Thereafter, the semiconductor wafer W is supplied to the temperature adjustment plate 2A by circulating the cooling liquid from the cooling unit 3 so that the semiconductor wafer W and the temperature adjustment plate 2A are set at the low temperature (2).
The temperature is lowered to 3 ° C.) and then kept at a low set temperature (23 ° C.) for a certain period of time, and then taken out of the temperature adjustment plate 2A.

Here, in the temperature control system 1 having the above-described configuration, when the semiconductor wafer W maintained at the high set temperature is cooled, the switching valves 7A and 7 are started when the temperature is lowered.
3B, the supply line 4i and the discharge line 6o are cut off, while the reflux line 4o and the introduction line 6i are connected, as shown in FIG. To work. Incidentally, at this time, the second pump p2 has stopped.

As a result, as shown by arrows a and b, the cooling liquid flowing from the cooling section 3 into the temperature adjustment plate 2A through the supply pipe 4i flows from the temperature adjustment plate 2A to the arrows c and c.
As shown in FIG. 4D, the heat is introduced into the heat storage tank 5 through the reflux pipe 4o and the introduction pipe 6i.

Here, the coolant flowing into the temperature adjusting plate 2A absorbs heat when passing through a flow path (not shown) provided inside the temperature adjusting plate 2A, and the heated coolant is heated. Is introduced into the heat storage tank 5, the heat energy of the coolant is stored in the heat storage tank 5.

While continuing to introduce the coolant into the heat storage tank 5, the operation of the switching valves 7A and 7B is controlled when the temperature of the coolant flowing out of the temperature adjusting plate 2A drops to a predetermined temperature, for example, 23 ° C. As shown in FIG. 3 (b), the supply line 4i and the discharge line 6o are cut off, and the reflux line 4o and the introduction line 6i are cut off.

As a result, as shown by arrows a and b, the coolant flowing from the cooling unit 3 into the temperature adjustment plate 2A through the supply pipe 4i flows from the temperature adjustment plate 2A to the arrows c and c.
As shown in e, the water flows back to the cooling unit 3 via the reflux pipe 4o.

Thus, the introduction of the cooling liquid into the heat storage tank 5 is stopped, and thereafter, the temperature adjusting plate 2A
The semiconductor wafer W is maintained at a low set temperature by circulating and supplying the coolant.

It is needless to say that the heat storage tank 5 has a sufficient capacity to reliably contain the cooling liquid introduced from the temperature adjusting plate 2A as described above.
When the coolant is introduced into the heat storage tank 5 until the temperature drops to the low-temperature set temperature, the cooling capacity of the cooling unit 3 can be reduced by the amount of heat energy stored by the heat storage tank 5, so that energy consumption is reduced. And cost can be reduced.

From the temperature adjustment plate 2A to the semiconductor wafer W
When the semiconductor wafer W newly placed on the temperature adjustment plate 2A is heated after the removal, the operation of the switching valves 7A and 7B is controlled at the start of the temperature rise, and as shown in FIG. While connecting the supply line 6o and the supply line 4i, the circulation line 4o and the introduction line 6i are cut off, and the first pump p1 is stopped and the second pump p2 is operated.

As a result, as shown by arrows f and b, the high-temperature coolant stored in the heat storage tank 5 is cooled by the temperature adjusting plate 2A via the discharge pipe 6o and the supply pipe 4i.
And the temperature adjusting plate 2A is heated by the coolant having a high temperature.

By flowing through the temperature adjusting plate 2A, the cooling liquid whose temperature has been reduced due to the deprivation of heat energy is returned to the cooling section 3 through the reflux pipe 4o as shown by arrows c and e. You.

After a part or all of the cooling liquid stored in the heat storage tank 5 is introduced into the temperature adjustment plate 2A and flows, the second pump p2 is stopped. Thereafter, the temperature of the semiconductor wafer W is raised to a high set temperature together with the temperature adjustment plate 2A based on the operation of the electric heater 2B, and is then maintained at the high set temperature for a certain period of time.

As described above, in the temperature adjustment system 1, when cooling the semiconductor wafer W, the heat storage tank 5
By using the thermal energy of the cooling liquid stored in the heater as a heat source when heating the semiconductor wafer W, the energy (electric power) for operating the electric heater 2B when heating the temperature adjustment plate 2A to a predetermined temperature is reduced. Will be completed.

Further, according to the temperature control system 1 described above, heat was exhausted in the conventional temperature control system.
By using the heat energy recovered from the temperature adjustment plate 2A during cooling to heat the temperature adjustment plate 2A during heating, energy loss is greatly reduced.

In a semiconductor wafer manufacturing facility, a plurality of the above-mentioned temperature control systems 1 are installed as shown in FIG. 4A for the purpose of improving production efficiency and the like. It is also possible to use a single heat storage tank 5 in each temperature adjustment system 1 as shown in FIG. When a plurality of temperature control systems 1 are installed, as shown in FIG.
Needless to say, a configuration in which one cooling unit 3 is installed for a plurality of processing units 2 is fundamental.

FIGS. 5 and 6 show a second embodiment of the temperature control system according to the present invention. This temperature control system 1 'comprises a processing section 2', a cooling section 3 ', and a fluid circulation circuit 4. 'And a heat storage tank as heat storage means
(Container) 5 'and a bypass circuit 6'.

The introduction line 6 in the bypass circuit 6 '
The i 'and the discharge line 6o' are both connected to the reflux line 4o 'of the fluid circulation circuit 4', and branch from the reflux line 4o 'to the introduction line 6i' and the discharge line 6o '. A switching valve 7A 'and a switching valve 7B' as flow path switching means are respectively installed at the junction.

The supply line 4 is connected to the fluid circulation circuit 4 '.
A reversing line 4r 'is provided to connect the i' and the recirculation line 4o ', and a switching valve is provided at a branch / merge of the reversion line 4r' with the supply line 4i 'and the recirculation line 4o'. 4v 'is provided.

The above-mentioned bypass circuit 6 ', switching valves 7A' and 7B ', reversing line 4r', and switching valve 4v '
Other than the above, the temperature adjustment system 1 shown in FIGS.
And is basically the same as the above.
The cooling mode is basically the same as the above-described temperature control system 1.

Therefore, in the temperature control system 1 ',
Elements that perform the same function as the elements of the temperature control system 1
By adding a '(dash) to the same reference numerals as in FIGS. 1 to 3,
Detailed description of the configuration is omitted.

In the temperature control system 1 'having the above-described structure, at the start of the temperature drop, as shown by arrows a and b in FIG. 6A, the temperature control plate 2A' from the cooling unit 3 'via the supply pipe 4i'. Is introduced into the heat storage tank 5 'from the temperature adjustment plate 2A' through the reflux pipe 4o 'and the introduction pipe 6i' as shown by arrows c and d.

At the time when the temperature of the coolant flowing out of the temperature adjusting plate 2A 'has dropped to a predetermined temperature, FIG.
As shown by arrows a and b in FIG.
The coolant flowing into the temperature adjustment plate 2A 'through the
From the temperature adjusting plate 2A ', the refrigerant flows back to the cooling unit 3' via the circulation line 4o 'as shown by arrows c and e.

At the start of the temperature rise, the arrow f in FIG.
g, the high-temperature coolant stored in the heat storage tank 5 'is introduced into the temperature adjustment plate 2A' through the discharge pipe 6o 'and the reflux pipe 4o', and the temperature adjustment plate 2A ' ′ Passes through the supply line 4 i ′, the inversion line 4 r ′, and the reflux line 4, as shown by arrows h, i and e.
It is returned to the cooling unit 3 via o '.

As described above, the temperature control system 1 ′ controls the supply direction of the coolant to the temperature control plate 2 A ′ (the flow direction of the coolant inside the temperature control plate 2 A ′) when cooling the semiconductor wafer W. And during heating. It is needless to say that the above-described temperature adjustment system 1 'can provide the same operation and effects as those of the temperature adjustment system 1 described above.

FIGS. 7 and 8 show a third embodiment of the temperature control system according to the present invention. The temperature control system 10 includes a processing unit 12, a cooling unit 13, and a fluid circulation circuit 14, Heat storage tank as heat storage means
(Container) 15 and a bypass circuit 16.

The temperature control system 10 has a point that a pump p is provided downstream of the switching valve 17B in the supply line 14i of the fluid circulation circuit 14, and that the bypass circuit 1
Except that the pump is not provided in the discharge line 16o of No. 6, there is basically no difference from the temperature control system 1 of the first embodiment shown in FIGS.

Therefore, in the temperature adjustment system 10,
Elements that perform the same function as the elements of the temperature control system 1
By adding a number obtained by adding 10 to the reference numerals in FIGS.
Detailed description of the configuration is omitted.

In the temperature control system 10, the manner of heating / cooling the semiconductor wafer W is not different from that of the temperature control system 1, and furthermore, FIGS. 8 (a), (b),
As shown in (c), the flow of the cooling liquid at the time of cooling and at the time of heating is the same as that of the temperature adjustment system 1 shown in FIGS.

That is, this temperature adjustment system 10
It is characterized in that the circulating supply of the coolant between the processing unit 12 and the cooling unit 13 and the pumping of the coolant from the heat storage tank 15 to the temperature adjustment plate 12A are performed by one pump p. . In the above-described temperature adjustment system 10, the temperature adjustment system 1 described above is also used.
Needless to say, the same operation and effect can be obtained.

FIGS. 9 and 10 show a fourth embodiment of the temperature control system according to the present invention. This temperature control system 10 'comprises a processing unit 12', a cooling unit 13 ', and a fluid circulation circuit 14. And a heat storage tank (container) 15 'as a heat storage means, and a bypass circuit 16'.

The temperature control system 10 'is provided with a supply line 14i' and a return line 14 in the middle of the fluid circulation circuit 14 '.
This is basically the same as the temperature control system 10 of the third embodiment shown in FIGS. 7 and 8 except that an inverting circuit 14R 'for exchanging a flow path between the temperature control system 10 and the o' is interposed.

Therefore, in the temperature control system 10 ', the elements having the same functions as those of the temperature control system 10 are denoted by the same reference numerals as those in FIGS. Detailed description is omitted.

The temperature control system 10 'having the above-described configuration.
The flow of the cooling liquid during cooling is shown in FIG.
As shown in (b), it is the same as the temperature adjustment system 10 shown in FIG. 7 and FIG.

At the start of heating, as shown by arrows f, g, and h in FIG. 10C, the high-temperature coolant stored in the heat storage tank 15 'is discharged to the discharge line 16o' and the supply line. Line 14i ', furthermore, inverting circuit 14R' and reflux line 14o '
Through the temperature adjustment plate 12A '.

On the other hand, as shown by arrows i and e in FIG. 10 (c), the coolant passing through the temperature adjusting plate 12A 'passes through the supply line 14i', the inverting circuit 14R ', and the reflux line 14o'. It is returned to the cooling unit 13.

As described above, this temperature control system 1
0 ′ is characterized in that the direction of supply of the coolant to the temperature adjustment plate 12A ′ (the direction of flow of the coolant inside the temperature adjustment plate 12A ′) is reversed between when the semiconductor wafer W is cooled and when the semiconductor wafer W is heated. Things. It is needless to say that the above-described temperature adjustment system 10 'can provide the same operation and effects as those of the temperature adjustment system 1 described above.

FIGS. 11 and 12 show a fifth embodiment of the temperature control system according to the present invention. This temperature control system 20 includes a processing unit 22, a cooling unit 23, and a fluid circulation circuit 24. Further, a heat storage tank (container) 25 as heat storage means and a bypass circuit 26 are provided.

The introduction line 2 in the bypass circuit 26
6i is branched into pipes 26a and 26b via a switching valve 26A, the pipe 26a is connected to a supply pipe 24i via a switching valve 27Ai, and the pipe 26b is connected to a switching valve 2a.
It is connected to the reflux line 24o via 7Ao.

The discharge line 26o in the bypass circuit 26 is connected to the lines 26c and 26c via the switching valve 26B.
d, and the pipe line 26c is connected to the switching valve 27Bi.
Is connected to the supply line 24i, and the line 26d is connected to the recirculation line 24o via the switching valve 27Bo.

Further, the supply line 24 of the fluid circulation circuit 24
In i, one pump p for pumping the coolant is provided upstream of the switching valve 27Bi.

The configuration except that the pump p is provided only in the bypass circuit 26 and the supply line 24i described above is basically the same as the temperature control system 1 shown in FIGS. The manner of heating / cooling the semiconductor wafer W is not different from that of the temperature adjustment system 1.

Therefore, in the temperature control system 20,
Elements that perform the same function as the elements of the temperature control system 1
By adding a number obtained by adding 20 to the reference numerals in FIGS.
Detailed description of the configuration is omitted.

In the temperature control system 20 having the above-described configuration, at the start of the temperature drop, as shown by the arrows a and b in FIG. 12A, the cooling flow from the cooling unit 23 to the temperature control plate 22A via the supply pipe 24i. After absorbing the heat from the temperature adjusting plate 22A, the liquid is introduced into the heat storage tank 25 through the reflux pipe 24o, the pipe 26b, and the inlet pipe 26i as shown by arrows c, d, and e.

At this time, the cooling liquid already stored in the heat storage tank 25 is pushed out by the cooling liquid flowing from the temperature adjusting plate 22A, and is discharged from the heat storage tank 25 as shown by arrows f, g, h in the discharge line 26o. Then, the refrigerant flows back to the cooling unit 23 through the pipe 26d and the reflux pipe 24o.

At the time when the temperature of the cooling liquid flowing out of the temperature adjusting plate 22A drops to a predetermined temperature, FIG.
As shown by arrows a and b in FIG.
The coolant that has flowed into the temperature adjustment plate 22A via 4i flows back from the temperature adjustment plate 22A to the cooling unit 23 via the circulation pipe 24o as shown by arrows c and h.

It is needless to say that the heat storage tank 25 has a volume capable of reliably storing the cooling liquid introduced from the start of cooling down to the predetermined temperature.

At the start of the temperature rise, as shown by arrows a, i and j in FIG.
The coolant is supplied to the heat storage tank 25 through the pipe 26c and the discharge pipe 26o.

As a result, the high temperature coolant stored in the heat storage tank 25 is pushed out, and the heat storage tank 25
As shown by arrows k, l, and b, the temperature adjustment plate 2 is connected through the introduction line 26o, the line 26a, and the supply line 24i.
2A, and the temperature adjustment plate 22A is heated.

On the other hand, as shown by arrows c and h, the cooling liquid having passed through the temperature adjusting plate 22A is returned to the cooling section 23 through the reflux pipe 24o.

When the temperature of the coolant flowing out of the heat storage tank 25 drops to a predetermined temperature, the supply of the coolant from the cooling unit 23 is stopped.

It is needless to say that the temperature control system 20 having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 13 and 14 show a sixth embodiment of the temperature control system according to the present invention. This temperature control system 20 'includes a processing section 22', a cooling section 23 ', and a fluid circulation circuit 24. ′, A heat storage tank (container) 25 ′ as heat storage means, and a bypass circuit 26 ′.
Is provided.

Introducing line 26 in bypass circuit 26 '
i 'is connected to a recirculation line 24o' of a fluid circulation circuit 24 ', and a switching valve 27Ao' is provided at a branch / merge portion between the recirculation line 24o 'and the introduction line 26i'. I have.

The fluid circulation circuit 24 'has an inversion line 24r' connecting the supply line 24i 'and the reflux line 24o'.
A switching valve 24v 'is provided at a branch / merge portion between the reversing line 24r', the supply line 24i ', and the reflux line 24o'.

The temperature control system 20 'is connected to the introduction pipe 26i' connected to the heat storage tank 25 'by a switching valve 27A.
o 'to the recirculation line 24o', and to the fluid circulation circuit 24 ', the reversing line 24r' and the switching valve 2
It is basically the same as the temperature control system 20 of the fifth embodiment shown in FIGS. 11 and 12 except that 4v 'is installed.

Therefore, in the temperature control system 20 ', the elements having the same functions as those of the temperature control system 20 are denoted by the same reference numerals as those in FIGS.
, Detailed description of the configuration is omitted.

In the temperature control system 20 'having the above-described structure, when the temperature is lowered, as shown by arrows a and b in FIG. 14A, the cooling unit 23' supplies the temperature to the temperature control plate 22A 'via the supply pipe 24i'. The inflowing coolant absorbs heat from the temperature adjusting plate 22A ', and is then introduced into the heat storage tank 25' via the circulation line 24o 'and the introduction line 26i' as shown by arrows c and d.

At this time, the coolant already stored in the heat storage tank 25 'is pushed out, and is discharged from the heat storage tank 25' as shown by arrows f, g, h in the discharge line 26o 'and the line 26.
Reflux flows to the cooling section 23 'via d' and the reflux line 24o '.

At the time when the temperature of the coolant flowing out of the temperature adjusting plate 22A 'has dropped to a predetermined temperature, FIG.
As shown by arrows a and b in (b), the cooling liquid flowing from the cooling section 23 'to the temperature adjustment plate 22A' via the supply pipe 24i 'flows from the temperature adjustment plate 22A' to arrows c and h.
As shown in (5), the water flows back to the cooling unit 23 'through the reflux pipe 24o'.

At the start of the temperature rise, as shown by arrows a, i and j in FIG.
Coolant is supplied to the heat storage tank 25 'via i', the pipe 26c ', and the discharge pipe 26o'.

As a result, the high-temperature coolant stored in the heat storage tank 25 'is pushed out, and the heat storage tank 2'
From 5 ', as shown by arrows k and l, it is introduced into the temperature adjustment plate 22A' via the introduction line 26o 'and the reflux line 24o', and the temperature adjustment plate 22A 'is heated.

On the other hand, as shown by arrows m, n, and o in FIG.
Supply line 24i ', reversing line 24r', reflux line 24
It is returned to the cooling part 23 'via o'.

When the temperature of the coolant flowing out of the heat storage tank 25 'has dropped to a predetermined temperature, the cooling unit 23'
The supply of the cooling liquid from is stopped.

As described above, this temperature adjustment system 2
0 ′ is characterized in that the direction of supply of the coolant to the temperature adjustment plate 22A ′ (the direction of flow of the coolant inside the temperature adjustment plate 22A ′) is reversed between when the semiconductor wafer W is cooled and when the semiconductor wafer W is heated. Things.

It goes without saying that the temperature control system 20 'having the above-described structure can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 15 to 19 show a seventh embodiment of the temperature control system according to the present invention. This temperature control system 30 includes a processing unit 32, a cooling unit 33, and a fluid circulation circuit 34. Further, a heat storage body 35 as heat storage means
Heat storage unit 35U provided with
Is provided.

Here, the processing section 32 and the cooling section 33
Is exactly the same as the processing unit 2 and the cooling unit 3 of the temperature adjustment system 1 shown in FIGS. 1 to 3, and the elements that perform the same operations as the elements of the temperature adjustment system 1 are shown in FIGS. A detailed description of the configuration will be omitted by adding a number obtained by adding 30 to the reference numeral.

As shown in FIG. 15, the fluid circulation circuit 34
It has a supply pipe 34i for supplying the cooling liquid from the cooling section 33 to the temperature adjusting plate 32A of the processing section 32, and a circulation pipe 34o for circulating the cooling liquid from the temperature adjusting plate 32A of the processing section 32 to the cooling section 33. And the supply line 34 described above.
i is provided with a pump p for pumping the cooling liquid.

A heat storage unit 35U is connected to the above-mentioned fluid circulation circuit 34 via a bypass circuit 36. The bypass circuit 36 has an introduction pipe 36i and a discharge pipe 36o connected to a reflux pipe 34o. A switching valve 3 as a flow path switching means is provided at a branching / merging portion of the reflux pipeline 34o, the introduction pipeline 36i, and the discharge pipeline 36o.
7A and a switching valve 37B are provided.

The fluid circulating circuit 34 is provided with a first inverting circuit 34R and a second inverting circuit 34S with the bypass circuit 36 interposed therebetween.

As shown in FIG. 16, a heat storage unit 35U connected to the fluid circulation circuit 34 via a bypass circuit 36 has a heat storage body 35 inside a pipe 35Ua through which a coolant flows.
And a heat insulating material 35 outside the pipe 35Ua.
It is configured by installing Ub.

The heat storage body 35 is formed by winding a tube 35a made of a thin metal plate and a corrugated plate 35b, and recovers and stores thermal energy from a high-temperature cooling liquid flowing through the inside thereof. It acts to give thermal energy to the low-temperature coolant flowing through the inside.

The heat storage unit 135U shown in FIG. 17 accommodates a heat storage body 135 inside a pipe 135Ua, and
A heat insulator 135Ub is provided outside of 5Ua, and the heat storage body 135 is a block 135a made of a resin material.
And a large number of through-holes 135b through which the coolant flows.

The heat storage unit 235U shown in FIG. 18 has a heat insulator 235Ub installed outside the heat storage 235, and the heat storage 235 is a square tube 235 through which the coolant flows.
A large number of pins (fins) 235b are erected inside a.

As described above, it is needless to say that various structures can be adopted as the heat storage body constituting the heat storage unit as shown in FIGS. In any of the above-described heat storage units (35U, 135U, 235U), it is desirable to provide a heating means such as a heater in order to compensate for a decrease in heat energy stored in the heat storage bodies (35, 135, 235). Of course.

Here, the manner of heating / cooling semiconductor wafer W in temperature control system 30 having the above-described configuration is basically the same as that of temperature control system 1 described above.

In the temperature control system 30 having the above-described configuration, at the start of cooling, as shown by arrows a and b in FIG. 19A, the cooling system 33 flows from the cooling unit 33 into the temperature control plate 32A via the supply pipe 34i. The liquid is introduced from the temperature adjusting plate 32A into the heat storage unit 35 via the circulation line 34o and the introduction line 36i as shown by arrows c and d.

Here, the coolant flowing into the temperature adjusting plate 32A absorbs heat when passing through a flow path (not shown) provided inside the temperature adjusting plate 32A, and the heated coolant is heated. Is passed through the heat storage unit 35 in the heat storage unit 35U, so that the heat energy of the coolant is stored in the heat storage unit 35.

The coolant that has passed through the heat storage unit 35U recirculates to the cooling unit 33 via the discharge pipe 36o and the recirculation pipe 34o as shown by arrows e and f in FIG. .

At the time when the temperature of the coolant flowing out of the temperature adjusting plate 32A has dropped to a predetermined temperature, FIG.
(b) As shown by arrows a and b in FIG.
The coolant that has flowed into the temperature adjustment plate 32A via 4i flows back from the temperature adjustment plate 32A to the cooling unit 33 via the circulation line 34o as shown by arrows c and f.

At the start of the temperature rise, as shown by arrows a, g, and h in FIG. 19C, the cooling liquid from the cooling unit 33 passes through the supply pipe 34i, the reflux pipe 34o, and the discharge pipe 36o. Via the heat storage unit 35.

Here, when the low-temperature coolant from the cooling unit 33 passes through the heat storage unit 35 in the heat storage unit 35U, the coolant is heated by the heat energy stored in the heat storage unit 35. Becomes

As described above, the cooling liquid heated by passing through the heat storage unit 35U is temperature-adjusted through the introduction pipe 36i and the supply pipe 34i as shown by arrows i and b in FIG. The temperature adjustment plate 3
Heat 2A.

The coolant that has passed through the temperature adjusting plate 32A flows again from the reflux line 34o and the supply line 34i as shown by arrows c, j and f in FIG.
It recirculates to the cooling unit 33 via 4o.

Heat storage element 3 in heat storage unit 35U
When all of the heat energy of No. 5 is consumed, the supply of the cooling liquid from the cooling unit 33 is stopped, and thereafter, the temperature is raised to the set temperature by the electric heater (not shown) in the processing unit 32, Is held.

It is needless to say that the temperature control system 30 having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 20 to 21 show an eighth embodiment of the temperature control system according to the present invention. This temperature control system 30 'comprises a processing section 32', a cooling section 33 ', and a fluid circulation circuit 34. And a heat storage unit 35U 'having a heat storage body 35' as a heat storage means, and a bypass circuit 36 '.

Here, the temperature adjustment system 30 ′
In the middle of the fluid circulation circuit 34 ', one inversion circuit 34S'
This is basically the same as the temperature control system 30 of the seventh embodiment shown in FIGS.

Therefore, in the temperature control system 30 ', elements having the same functions as those of the temperature control system 30 are denoted by the same reference numerals as those in FIGS. Detailed description is omitted.

It goes without saying that a heat storage unit having the same configuration as heat storage unit 135U shown in FIG. 17 or heat storage unit 235U shown in FIG. 18 may be used instead of heat storage unit 35U '.

The temperature control system 30 'having the above-described configuration.
The flow of the cooling liquid at the time of temperature decrease is shown in FIG.
As shown in (b), it is the same as the temperature adjustment system 30 shown in FIGS.

At the start of heating, the heat storage unit 35
As shown by arrows i and k in FIG. 21 (c), the cooling liquid heated by passing through the heat storage body 35 'of U' is temperature-adjusted via the introduction pipe 36i 'and the reflux pipe 34o'. Plate 32
A 'is introduced.

On the other hand, as shown by arrows l and f in FIG. 21 (c), the cooling liquid having passed through the temperature adjusting plate 32A 'passes through the supply pipe 34i' and the reflux pipe 34o 'to cool the cooling section 33'.
It is recirculated.

As described above, this temperature control system 3
0 ′ is characterized in that the supply direction of the coolant to the temperature adjustment plate 32A ′ (the direction of flow of the coolant inside the temperature adjustment plate 32A ′) is reversed between when the semiconductor wafer W is cooled and when the semiconductor wafer W is heated. Things.

It is needless to say that the temperature control system 30 'having the above-described structure can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 22 to 24 show a ninth embodiment of the temperature control system according to the present invention. This temperature control system 40 includes a processing unit 42, a cooling unit 43, and a fluid circulation circuit 44. Further, a heat storage pipe 4 as a heat storage means
5 and a bypass circuit 46.

Here, the processing section 42 and the cooling section 43
Is exactly the same as the processing unit 2 and the cooling unit 3 of the temperature adjustment system 1 shown in FIGS. 1 to 3, and the elements that perform the same operations as the elements of the temperature adjustment system 1 are shown in FIGS. By attaching a number obtained by adding 40 to the reference numeral, detailed description of the configuration is omitted.

As shown in FIG. 22, the fluid circulation circuit 44
It has a supply pipe 44i for supplying the cooling liquid from the cooling section 43 to the temperature adjusting plate 42A of the processing section 42, and a circulation pipe 44o for circulating the cooling liquid from the temperature adjusting plate 42A of the processing section 42 to the cooling section 43. And supply line 44 described above.
i is provided with a pump p for pumping the cooling liquid.

On the other hand, a heat storage pipe (container) 45 constituting heat storage means is interposed in the above-mentioned reflux pipe 44o, and a bypass circuit 46 is connected so as to bypass the heat storage pipe 45. A switching valve 47A and a switching valve 47B as flow path switching means are provided at a branch / merge portion between the circulation pipe 44o and the bypass circuit 46, respectively.

The fluid circulating circuit 44 is provided with a first inverting circuit 44R and a second inverting circuit 44S with the above-described heat storage pipeline 45 and bypass circuit 46 interposed therebetween.
Incidentally, the switching valve 47A and the switching valve 47B described above are
The first inversion circuit 44R and the second inversion circuit 44S respectively
It is also one of the components.

Here, the bypass circuit 46 substantially constitutes a part of the recirculation line 44o, as will be described later in detail, so that the heat storage line 45 is connected in parallel with the fluid circulation circuit 44. What is connected.

As described above, the heat storage pipe 45 connected in parallel with the fluid circulation circuit 44 constitutes a disconnectable container capable of maintaining the temperature of the coolant contained therein. And an internal volume that can reliably contain the entire amount of the cooling liquid introduced from the start of the temperature decrease to the predetermined temperature described below.

Further, as shown in FIG. 23 (a), the heat storage pipe 45 is formed so as to meander finely, so that the appearance is compact and the sufficient internal volume described above is secured. I have.

The heat storage pipe 145 shown in FIG. 23 (b) is formed in a spiral shape, and the pipe 245 shown in FIG. 23 (c) is provided with a tank 245t to make the appearance compact. In addition, it is configured to secure the sufficient internal volume described above.

As described above, it is needless to say that various configurations can be adopted as the heat storage conduit constituting the heat storage means as shown in FIGS. 23 (a) to 23 (c). Further, it is needless to say that any of the above-mentioned heat storage pipes (45, 145, 245) is desirably provided with a heating means such as a heater in order to compensate for a decrease in stored thermal energy.

Here, the manner of heating / cooling the semiconductor wafer W in the temperature control system 40 having the above-described configuration is basically the same as that of the temperature control system 1 described above.

In the temperature control system 40 having the above-described structure, at the start of the temperature drop, as shown by arrows a and b in FIG. 24A, the cooling flow from the cooling unit 43 to the temperature control plate 42A via the supply pipe 44i. After absorbing the heat from the temperature adjusting plate 42A, the liquid is introduced into the heat storage pipe 45 via the reflux pipe 44o as shown by the arrow c.

At this time, the cooling liquid already stored in the heat storage pipe 45 is pushed out by the cooling liquid flowing from the temperature adjusting plate 42A, and flows from the heat storage pipe 45 through the reflux pipe 44o as shown by an arrow d. To return to the cooling unit 43.

At the time when the temperature of the cooling liquid flowing out of the temperature adjusting plate 42A decreases to a predetermined temperature, FIG.
As shown by arrows a and b in FIG.
The coolant flowing into the temperature adjustment plate 42A through the temperature adjustment plate 4A is supplied from the reflux line 44o and the bypass circuit 46 from the temperature adjustment plate 42A as shown by arrows c, e, and d.
It again flows back to the cooling unit 43 via the reflux pipe 44o.

At the start of the temperature rise, as shown by arrows a and f in FIG. 24C, a heat storage pipe as heat storage means is supplied from the cooling section 43 via the supply pipe 44i and the second inversion circuit 44S. Coolant is supplied to 45.

As a result, the high-temperature coolant stored in the heat storage pipe 45 is pushed out, and as shown by arrows g and b from the heat storage pipe 45, through the first inversion circuit 44R and the supply pipe 44i. Into the temperature adjustment plate 42A,
The temperature adjustment plate 42A is heated.

On the other hand, as shown by arrows c, h and d, the cooling liquid having passed through the temperature adjusting plate 42A is returned to the reflux line 44o.
Then, the water is returned to the cooling unit 43 from the supply pipe 44i via the reflux pipe 44o again.

When the temperature of the coolant flowing out of the heat storage pipe line 45 drops to a predetermined temperature, the supply of the coolant from the cooling unit 43 is stopped, and thereafter, the electric heater (see FIG. Thus, the temperature is raised to the set temperature and the set temperature is maintained.

It is needless to say that the temperature control system 40 having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 25 and 26 show a tenth embodiment of the temperature control system according to the present invention. This temperature control system 40 'comprises a processing unit 42', a cooling unit 43 ',
And a fluid circulation circuit 44 ', a heat storage pipe 45' as heat storage means, and a bypass circuit 46 '.

Here, the temperature adjustment system 40 '
In the middle of the fluid circulation circuit 44 ', one inversion circuit 44S'
This is basically the same as the temperature control system 40 of the ninth embodiment shown in FIGS.

Therefore, in the temperature control system 40 ', elements having the same functions as those of the temperature control system 40 are denoted by the same reference numerals as those in FIGS. Detailed description is omitted.

It is to be noted that, instead of the heat storage pipeline 45 ', FIG.
It goes without saying that a heat storage pipe having the same configuration as the heat storage pipe 145 shown in FIG. 23B or the heat storage pipe 245 shown in FIG.

The temperature control system 40 'having the above-described configuration.
The flow of the cooling liquid at the time of temperature decrease is shown in FIG.
As shown in (b), it is the same as the temperature adjustment system 40 shown in FIGS.

At the start of heating, as shown by arrows a and f in FIG.
The coolant is supplied to the heat storage pipe 45 'as the heat storage means via the second inversion circuit 44S'.

The high-temperature coolant discharged from the heat storage pipe 45 'is supplied from the heat storage pipe 45' to the temperature adjusting plate 42 via the reflux pipe 44o 'as shown by an arrow g.
The cooling liquid introduced into A 'and passed through the temperature adjusting plate 42A' is supplied to the cooling section 43 through the supply pipe 44i 'and the reflux pipe 44o' as shown by arrows h and d in FIG. ′
It is recirculated.

As described above, this temperature control system 4
0 ′ is characterized in that the supply direction of the coolant to the temperature adjustment plate 42A ′ (the direction of flow of the coolant inside the temperature adjustment plate 42A ′) is reversed between when the semiconductor wafer W is cooled and when the semiconductor wafer W is heated. Things.

It is needless to say that the temperature control system 40 'having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

Incidentally, the above-described temperature adjustment system 4
0, and as another embodiment based on the temperature control system 40 ', the volume of the heat storage line 45 (45') as the heat storage means is made equal to the volume of the flow path in the temperature control plate 42A (42A '). There is also provided a temperature adjustment system that sets and performs heating / cooling on the semiconductor wafer W as described below.

The volume of the heat storage pipe 45 is
In the temperature control system 40 set to be equal to the volume of the flow path in 2A, the temperature control plate 42
A, the temperature adjustment plate 42A
The cooling liquid inside, that is, the cooling liquid which is at the same temperature (high temperature set temperature) as the temperature adjusting plate 42A at the time of heating is pushed out from the temperature adjusting plate 42A and introduced into the heat storage pipe 45, and is already in the heat storage pipe 45. The cooling liquid stored in the cooling unit 43 is pushed out from the heat storage pipe 45 and flows back to the cooling unit 43.

When all of the coolant stored in the heat storage pipe 45 is pushed out and all the high-temperature coolant that has been in the temperature control plate 42A is stored in the heat storage pipe 45, the temperature control plate 42A Cooling water through bypass circuit 46
To the cooling unit 43 via

At the start of the temperature rise, the cooling liquid is supplied from the cooling section 43 to the heat storage pipe 45, whereby the high-temperature coolant stored in the heat storage pipe 45 is pushed out to the temperature adjusting plate 42A. The introduced cooling liquid having the same temperature as the low-temperature target temperature in the temperature adjusting plate 42A is pushed out from the temperature adjusting plate 42A and flows back to the cooling unit 43.

When the coolant in the temperature adjusting plate 42A is completely replaced with the high-temperature coolant in the heat storage pipe 45, the supply of the coolant from the cooling unit 43 is stopped. After that, an electric heater (not shown) in the processing unit 42
Therefore, the temperature is raised to the set temperature and the set temperature is maintained.

Here, the energy of the electric heater at the time of heating is determined by increasing the temperature of the temperature adjusting plate 42A, increasing the temperature of the cooling liquid in the temperature adjusting plate 42A, and further increasing the temperature of the wafer W mounted on the temperature adjusting plate 42A. Although it is consumed for raising the temperature, according to the above-described configuration, since energy allocated to raising the temperature of the cooling liquid in the temperature adjustment plate 42A becomes unnecessary, energy consumption and energy loss are reduced by that amount. Becomes

Also, in the temperature control system 40 'in which the volume of the heat storage pipe 45' is set equal to the volume of the flow path in the temperature control plate 42A ', the heat storage pipe 4
Needless to say, the same operation and effect can be obtained as in the temperature adjustment system 40 in which the volume of No. 5 is set equal to the volume of the flow path in the temperature adjustment plate 42A.

FIGS. 27 to 29 show an eleventh embodiment of the temperature control system according to the present invention. The temperature control system 50 comprises a first processing section 52 (A) and a second processing section 52 (B). ), A cooling unit 53, and a fluid circulation circuit 54.

In the temperature control system 50, the first processing unit 52 (A) and the second processing unit 52 (B) perform heating and cooling of the semiconductor wafer in the opposite manners, respectively.
In other words, the embodiment is carried out in such a manner that one side is cooled when heated, while the other side is cooled when cooled.

The temperature control system 50 includes a first processing unit 52 (A) and a second processing unit 52, as described later in detail.
(B), when one of the processing units performs cooling,
The temperature adjustment plate in the other processing unit is configured to function as a heat storage unit for storing thermal energy of the cooling liquid.

Here, the configurations of the first processing section 52 (A), the second processing section 52 (B), and the cooling section 53 are shown in FIGS.
Processing unit 2 and cooling unit 3 of the temperature adjustment system 1 shown in FIG.
Since the elements that perform the same operations as the elements of the temperature adjustment system 1 are given the same reference numerals as in FIG. 1 to FIG. 3 plus 50, detailed description of the configuration is omitted.

The heating / cooling modes of the first processing section 52 (A) and the second processing section 52 (B) with respect to the semiconductor wafer W in the respective processing sections are also basically the same as those of the temperature adjustment system 1 described above. There is no change.

As shown in FIG. 27, the fluid circulation circuit 54
Is a first supply line 54 connected to the first processing unit 52 (A).
Ai, the first reflux line 54Ao, and the second processing unit 52
(B) connected to the second supply line 54Bi and the second reflux line 54Bo, and the main supply line 5 connected to the cooling unit 53.
4Mi and a main reflux line 54Mo. A pump p for pumping the cooling liquid from the cooling unit 53 is interposed in the main supply line 54Mi.

The first supply line 54Ai and the second supply line 54
A branch / merge portion between Bi and the main supply line 54Mi and a branch / merge portion between the first reflux line 54Ao, the second reflux line 54Bo, and the main reflux line 54Mo are provided as flow switching means, respectively. A switching valve 57A and a switching valve 57B are provided.

Further, the first supply line 54Ai and the second reflux line 54Bo are connected via a bypass line 56A, and the first supply line 54Ai and the second reflux line 54B are connected to each other.
A switching valve 57C as a flow path switching means is installed at a branch / merge portion between the o and the bypass conduit 56A.

The first circulation line 54Ao and the second supply line 54Bi are connected via a bypass line 56B, and the first circulation line 54Ao and the second supply line 54B are connected to each other.
A switching valve 57D as a flow path switching unit is installed at a branch / merge portion between i and the bypass conduit 56B.

In the temperature control system 50 having the above-described configuration, when the temperature of the first processing unit 52 (A) starts to decrease,
As shown by arrows a and b in FIG. 28A, the coolant flowing from the cooling unit 53 into the temperature adjusting plate 52A (A) via the main supply pipe 54Mi and the first supply pipe 54Ai is subjected to the temperature adjustment. After absorbing heat from plate 52A (A), arrow c,
As shown in d and e, it is introduced into the temperature adjustment plate 52A (B) in the second processing section 52 (B) via the first reflux line 54Ao, the bypass line 56B, and the second supply line 54Bi. Thereby, the thermal energy of the coolant is stored in the temperature adjusting plate 52A (B).

At this time, the cooling liquid pushed out from the temperature adjusting plate 52A (B) returns to the cooling unit 53 via the second reflux pipe 54Bo and the main reflux pipe 54Mo as shown by arrows f and g. .

Here, the start time of the temperature decrease in the first processing unit 52 (A) is the start time of the temperature increase in the second processing unit 52 (B), and the temperature adjustment plate of the first processing unit 52 (A) is used. 5
The cooling liquid that has absorbed the heat from 2A (A) is
By being supplied to the temperature adjustment plate 52A (B) shown in FIG. 18B, heating of the temperature adjustment plate 52A (B) is started.

The temperature adjusting plate 5 of the first processing section 52 (A)
When the temperature of the cooling liquid flowing out of 2A (A) drops to a predetermined temperature, the cooling liquid flowing from the cooling unit 53 into the temperature adjusting plate 52A (A) as shown by arrows a and b in FIG. The liquid is transferred from the temperature adjustment plate 52A (A) by arrows c and g.
As shown in the figure, the first reflux line 54Ao and the main reflux line 54M
The air flows back to the cooling unit 53 via the line o.

At this time, the introduction of the coolant into the temperature adjusting plate 52A (B) of the second processing section 52 (B) is stopped,
Thereafter, the electric heater (not shown) in the second processing unit 52 (B) executes the temperature rise to the set temperature and the maintenance of the set temperature.

On the other hand, at the start of the temperature drop in the second processing section 52 (B), the main supply pipe 54Mi and the second supply pipe 54Bi are supplied from the cooling section 53 as shown by arrows a and b in FIG.
After absorbing the heat from the temperature adjustment plate 52A (B) through the temperature adjustment plate 52A (B), the coolant flows into the second reflux line 54B as shown by arrows c, d and e.
o, the bypass line 56A and the first supply line 54Ai, the temperature adjustment plate 5 in the first processing section 52 (A).
2A (A), whereby the thermal energy of the coolant is stored in the temperature adjustment plate 52A (A).

At this time, as shown by arrows f and g, the cooling liquid pushed out from the temperature adjusting plate 52A (A)
The refrigerant flows back to the cooling unit 53 via the circulation line 54Ao and the main circulation line 54Mo.

Here, the start time of the temperature decrease in the second processing unit 52 (B) is the start time of the temperature increase in the first processing unit 52 (A), and the temperature adjustment plate of the second processing unit 52 (B) is used. 5
The cooling liquid that has absorbed heat from 2A (B) is
By being supplied to the temperature adjustment plate 52A (A) of (A), the heating of the temperature adjustment plate 52A (A) is started.

The temperature adjusting plate 5 of the second processing section 52 (B)
When the temperature of the cooling liquid flowing out of 2A (B) drops to a predetermined temperature, the cooling liquid flowing into the temperature adjusting plate 52A (B) from the cooling unit 53 as shown by arrows a and b in FIG. The liquid is transferred from the temperature adjustment plate 52A (B) by arrows c and g.
As shown in the figure, the second reflux line 54Bo and the main reflux line 54M
The air flows back to the cooling unit 53 via the line o.

At this time, the introduction of the coolant into the temperature adjusting plate 52A (A) of the first processing section 52 (A) is stopped,
Thereafter, the electric heater (not shown) in the first processing unit 52 (A) executes the temperature increase to the set temperature and the maintenance of the set temperature.

It is needless to say that the temperature control system 50 having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

FIGS. 30 to 32 show a twelfth embodiment of the temperature control system according to the present invention. This temperature control system 50 'comprises a first processing section 52 (A)' and a second processing section 52 (A). (B) ′ and a cooling unit 53 ′.

In the fluid circulation circuit 54 ', a line 5 connecting the first supply line 54Ai' and the first reflux line 54Ao 'is provided.
8A 'is provided, and this line 58A' and the first supply line 5
A switching valve 57E 'is provided at each of the branching and merging points with the 4Ai' and the first reflux pipe 54Ao '.

A conduit 58B 'connecting the second supply conduit 54Bi' and the second reflux conduit 54Bo 'is provided. This conduit 58B' is connected to the second supply conduit 54Bi 'and the second reflux conduit. A switching valve 57 is provided at the branch / merging portion with 54Bo '.
F 'is provided.

Further, a line 58C 'is connected to the main supply line 54Mi' via a switching valve 57A ', and the line 58C' is connected to a bypass line 56A 'via a switching valve 57G'. It is connected to the.

Here, the pipe 58A 'and the switching valve 5
7E ', conduit 58B', switching valve 57F ', conduit 58
The configuration other than C 'and the switching valve 57G' is basically the same as the temperature adjustment system 40 of the eleventh embodiment shown in FIGS.

Therefore, in the temperature control system 50 ', the elements having the same functions as those of the temperature control system 50 are denoted by the same reference numerals as those in FIGS. Detailed description is omitted.

The manner of heating / cooling the semiconductor wafer W in each of the first processing section 52 (A) 'and the second processing section 52 (B)' is also described in the temperature adjustment system 40 described above. There is basically no change.

The temperature control system 50 'having the above-described configuration.
The flow of the cooling liquid at the time of temperature decrease is shown in FIG.
As shown in (b), it is the same as the temperature adjustment system 50 shown in FIGS.

In the temperature control system 50 'having the above-described configuration, when the first processing section 52 (A)' is cooled (the second processing section 5 (A) ').
2 (B) ') is shown in FIG.
As shown in (a) and (b), there is no difference from the temperature adjustment system 50 shown in FIGS.

On the other hand, at the start of the temperature drop in the second processing section 52 (B) ', as shown by arrows a, h, i, and j in FIG. Line 58C ', bypass line 56A', and second reflux line 54B
The coolant flows into the temperature adjustment plate 52A (B) 'through the line o'.

The coolant that has absorbed the heat from the temperature adjusting plate 52A (B) ′, as indicated by arrows k, l and m,
It is introduced into the temperature adjustment plate 52A (A) 'in the first processing section 52 (A)' via the supply pipe 54Bi ', the bypass pipe 56B', and the first reflux pipe 54Ao '.

At this time, the temperature adjustment plate 52A (A) '
As shown by arrows n, o, q, and g, the coolant extruded from the first supply line 54Ai ', the line 58A', the first reflux line 54Ao ', and the main reflux line 54Mo'. To the cooling section 53 '.

When the temperature of the coolant flowing out of the temperature adjusting plate 52A (B) 'of the second processing section 52 (B)' has dropped to a predetermined temperature, arrows a, h, and b in FIG. i, j
As shown in FIG.
(B) 'flows into the temperature adjusting plate 52A.
(B) ', as shown by arrows k, r, s, and g, the second supply line 54Bi', the line 58B ', and the second reflux line 54Bo'.
And the cooling water to the cooling section 53 'through the main reflux pipe 54Mo'.

As described above, this temperature control system 5
0 ′ is the temperature adjustment plate 32 of the first processing unit 32 (A) ′.
A (A) ′, and the direction of supply of the cooling liquid to the temperature adjustment plate 32A (B) ′ of the second processing unit 32 (B) ′ is reversed between when the semiconductor wafer W is cooled and when the semiconductor wafer W is heated. Is what you do.

It is needless to say that the temperature control system 50 having the above-described configuration can provide the same operation and effects as those of the temperature control system 1 described above.

[Brief description of the drawings]

FIG. 1 is an overall view showing a first embodiment of a temperature adjustment system according to the present invention.

FIG. 2 is an overall view conceptually showing a first embodiment of a temperature adjustment system according to the present invention.

FIGS. 3 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in the first embodiment of the temperature control system.

FIGS. 4A, 4B, and 4C are conceptual diagrams showing a layout in a first embodiment of a temperature adjustment system.

FIG. 5 is an overall view conceptually showing a second embodiment of the temperature adjustment system according to the present invention.

FIGS. 6 (a), (b) and (c) are conceptual diagrams showing fluid flows in a second embodiment of the temperature control system.

FIG. 7 is an overall view conceptually showing a third embodiment of the temperature adjustment system according to the present invention.

FIGS. 8A, 8B, and 8C are conceptual diagrams showing fluid flows in a third embodiment of the temperature control system.

FIG. 9 is an overall view conceptually showing a fourth embodiment of the temperature adjustment system according to the present invention.

FIGS. 10 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in a fourth embodiment of the temperature control system.

FIG. 11 is an overall view conceptually showing a fifth embodiment of the temperature adjustment system according to the present invention.

FIGS. 12A, 12B and 12C are conceptual diagrams showing a flow of fluid in a fifth embodiment of the temperature control system.

FIG. 13 is an overall view conceptually showing a sixth embodiment of the temperature adjustment system according to the present invention.

FIGS. 14 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in a sixth embodiment of the temperature control system.

FIG. 15 is an overall view conceptually showing a seventh embodiment of the temperature control system according to the present invention.

FIGS. 16 (a), (b) and (c) are conceptual diagrams showing heat storage means in a seventh embodiment of the temperature control system.

FIGS. 17 (a), (b) and (c) are conceptual diagrams showing heat storage means in a seventh embodiment of the temperature control system.

FIGS. 18 (a), (b) and (c) are conceptual diagrams showing heat storage means in a seventh embodiment of the temperature control system.

FIGS. 19 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in a seventh embodiment of the temperature control system.

FIG. 20 is an overall view conceptually showing an eighth embodiment of the temperature adjustment system according to the present invention.

FIGS. 21 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in an eighth embodiment of the temperature control system.

FIG. 22 is an overall view conceptually showing a ninth embodiment of the temperature adjustment system according to the present invention.

FIGS. 23 (a), (b) and (c) are conceptual diagrams showing heat storage means in a ninth embodiment of a temperature control system.

FIGS. 24 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in a ninth embodiment of the temperature control system.

FIG. 25 is an overall view conceptually showing a tenth embodiment of the temperature adjustment system according to the present invention.

FIGS. 26 (a), (b) and (c) are conceptual diagrams showing the flow of fluid in a tenth embodiment of the temperature control system.

FIG. 27 is an overall view conceptually showing an eleventh embodiment of the temperature adjustment system according to the present invention.

FIGS. 28 (a) and (b) show a first example of a temperature control system.
FIG. 2 is a conceptual diagram showing a flow of a fluid in one embodiment.

FIGS. 29 (a) and (b) show a first example of the temperature control system.
FIG. 2 is a conceptual diagram showing a flow of a fluid in one embodiment.

FIG. 30 is an overall view conceptually showing a twelfth embodiment of the temperature adjustment system according to the present invention.

FIGS. 31 (a) and (b) show the first temperature control system.
The conceptual diagram which shows the flow of the fluid in 2 Example.

FIGS. 32 (a) and (b) show the first temperature control system.
The conceptual diagram which shows the flow of the fluid in 2 Example.

FIG. 33 is an overall view showing a conventional temperature adjustment system.

[Explanation of symbols]

1, 1 ', 10, 10', 20, 20 ', 30, 3,
0 ', 40, 40', 50, 50 '... temperature control system, 2, 2', 12, 12 ', 22, 22', 22, 2
2 ', 32, 32', 42, 42 '... processing unit, 52 (A), 52 (A)' ... first processing unit, 52 (B), 52 (B) '... second processing unit, 3, 3 ', 13, 13', 23, 23 ', 33, 3
3 ', 43, 43', 53, 53 '... cooling units, 4, 4', 14, 14 ', 24, 24', 34, 3
4 ', 44, 44', 54, 54 '... fluid circulation circuit, 5, 5', 15, 15 ', 25, 25' ... heat storage tank
(Heat storage means), 35, 35 ', 135, 235 ... heat storage body (heat storage means), 45, 45', 145, 245 ... heat storage pipes (heat storage means), 7A, 7B, 7A ', 7B', 17A, 17B, 17
A ', 17B', 27Ai, 27Ao, 27Bi, 27
Bo, 27Ao ', 27Bi', 27Bo ', 37A,
37B, 37A ', 37B', 47A, 47B, 47
A ', 47B', 57A, 57B, 57C, 57D, 5
7A ', 57B', 57C ', 57D', 57E ', 5
7F ', 57G': switching valve (flow path switching means); W: semiconductor wafer (temperature control target).

Continued on the front page (72) Inventor Toshio Yoshimitsu 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Inside Komatsu Seisakusho Laboratory (72) Inventor Kadoya ▲ Wan ▼ ichi 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Inside Komatsu Seisakusho F Terms (Reference) 3L044 AA04 BA09 CA03 CA12 DB02 DD07 FA02 FA10 GA02 HA01 JA01 KA04 KA05 5F046 KA04 KA10 5H323 AA40 BB12 BB20 CA06 CB03 CB23 CB33 CB35 CB44 DA01 DA04 DB13 EE05 FF04 HH02 KK05

Claims (3)

[Claims] 1. A processing unit for performing heating and cooling of an object to be temperature-controlled comprises a temperature adjusting plate to which a fluid is circulated and supplied and heating means provided on the temperature adjusting plate. A cooling unit that cools the circulated fluid to a predetermined temperature; and a fluid circulation circuit that connects the processing unit and the cooling unit and circulates and supplies the fluid to the temperature adjustment plate. A temperature control system that alternately repeats heating and cooling, wherein the heat storage means is connected in parallel to the fluid circulation circuit, and stores thermal energy of the supplied fluid; and the fluid circulation circuit and the heat storage means And a flow path switching means for switching a flow path of the fluid. 2. The container according to claim 1, wherein the heat storage means is a container for storing the fluid heated by passing through the temperature adjustment plate of the processing unit when cooling the temperature controlled object. 2. The temperature control system according to 1. 3. The heat storage unit is a heat storage unit that stores heat absorbed from the fluid heated by passing through the temperature adjustment plate of the processing unit when cooling the temperature controlled object. The temperature adjustment system according to claim 1, wherein