JP2002010624A - Power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make small a power supply device which has electrical parts mounted boards. SOLUTION: In the power supply device which has a metal body of equipment 1 and a plurality of conversion boards 18 which are fabricated to dispose parallel each other, a supporting structure 5 on which the conversion boards 18 are supported in close contact is formed on the interior wall surfaces of the body of equipment which are face-arranged each other, a side of the conversion boards 18 on which electrical parts are mounted constitutes a cooling plate 8 made of metal, and the cooling plate 8 is pressed by using a screw jack 7 to make face contact with the supporting structure 5. Further a cooling water channel 4 in which cooling water circulates is provided on the inside of the side walls and the bottom of the body of equipment on which the supporting structure 5 is formed, a heat conducting members 6 which suppress air convection is disposed between the conversion boards 18, and the end parts of the heat conducting members 6 is directly fixed on the wall face of the cubicle 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply device incorporating an electric component mounting board on which heat-generating components are mounted, and more particularly to a power supply device in which heat generated from the mounted electric components is taken into consideration.

[0002]

2. Description of the Related Art Conventionally, heat radiation of a heat-generating component mounted on an electric component mounting board, for example, a printed board is disclosed in
As disclosed in Japanese Patent Application Laid-Open No. 83838, a method of attaching cooling fins to a printed circuit board and forcibly cooling with a cooling fan is common. However, when mounting high heat-generating components, it is difficult to reduce the size of the printed circuit board because the distance between components must be ensured in order to reduce the influence of heat on surrounding components. In the case of an apparatus incorporating a plurality of printed circuit boards, heat is affected between the printed circuit boards. Therefore, as described in Japanese Patent Application Laid-Open No. 6-291482, a convection shielding plate or the like is inserted between printed circuit boards. However, it is difficult to reduce the size of the entire apparatus.

As a structure for cooling the entire apparatus, there is a structure disclosed in Japanese Patent Application Laid-Open No. H10-75583, in which one surface of an outer shell is used as a cooler and a heat-generating component is mounted on the surface to be cooled. No consideration is given to the case of incorporating two printed circuit boards.

[0004]

According to the prior art,
Heating elements mounted on a printed circuit board mounted inside the housing can only radiate heat to the housing through the air inside the housing or directly by radiation, so cooling on these printed boards is sufficient. As a result, in order to reduce the heat generation density, the printed circuit board and the entire apparatus had to be enlarged.

An object of the present invention is to make a power supply device equipped with an electric component mounting board compact.

[0006]

As described above, the increase in the size of the power supply device in which the electric component mounting board is mounted in the housing is due to sufficient removal of heat from the heat generating components mounted on the electric component mounting board. It is because it is not done. The inventors have studied the removal of heat from the heat-generating components in stages as follows, and have reached the present invention.

First, in order to efficiently remove the heat of the heat-generating component, it is necessary to conduct the heat because the conventional convection or radiation removal is not sufficient. In order to remove the heat of the heat generating component by conduction, it is necessary to form a heat conduction path. The inventors examined the heat conduction path in three stages: from the heat-generating component to the electric component mounting board, from the electric component mounting board to the housing, and from the housing to the outside.

First, in order to conduct heat from the heat-generating component to the electric component mounting board, it is necessary to attach the electric component to a member having good heat conductivity. For this purpose, a metal heat sink is provided separately from the conventional printed circuit board, and the electric components are bonded to this heat sink, and the electric components and the printed circuit board are connected by lead wires passing through the holes provided in the heat sink. Then, the heat sink and the printed board were overlapped and integrated to form an electric component mounting board. Aluminum (including an aluminum alloy, hereinafter the same) and copper (including a copper alloy, the same hereinafter) were used as the heat sink. In addition, in order to efficiently conduct heat from the heat-generating component to the heat sink, the electric component is bonded to the heat sink.
The air layer on the bonding surface was reduced by using a silicone type adhesive having good thermal conductivity.

Next, in order to transfer heat from the electric component mounting board to the housing, the housing is formed of aluminum or copper,
The heat radiating plate of the electric component mounting board is configured to be in contact with and fixed to the housing. In order to reliably and easily contact and fix the heat sink to the housing, a plurality of protrusions having a flat portion extending horizontally along a pair of opposed wall surfaces of the housing are provided as support portions. The heat radiating plate was brought into contact with and fixed to the flat surface by surface contact. To contact and fix the heat radiating plate to the flat portion, a supporting portion of an adjacent step or a screw jack supported on the bottom surface of the housing was used.

Further, in order to extract heat transferred to the housing to the outside, a cooling medium flow path is provided inside the wall and the bottom surface of the housing where the supporting portion is formed, and the cooling medium flow path is circulated. A cooling medium circulating flow that is a part of a passage can be configured. The cooling medium flow path was divided into a plurality of flow paths, and care was taken so that the cooling medium flowed as evenly as possible.

A good heat conducting member made of copper, aluminum or the like having good heat conductivity is arranged between vertically adjacent electric component mounting boards, and an end of the good heat conducting member is attached to a housing. Directly abutting and contacting and fixing, preventing the influence of heat on the upper board, suppressing the convection of air in the housing, and transferring the heat transmitted from the air or the radiant heat from the electric component mounting board to the housing. You may do so.

That is, the object is to provide a metal casing,
A plurality of electrical component mounting boards provided in the metal housing so as to be parallel to each other; and a support portion on which an inner wall surface of the housing is supported by contacting the electrical component mounting board. The power supply device is characterized in that a surface of the electrical component mounting board that contacts the four-character portion is made of metal, and an electrical component is mounted on the metal surface.

[0013] The above object also has a metal housing, and a plurality of electric component mounting boards provided inside the metal housing so as to be parallel to each other. The present invention is also achieved by a power supply device characterized in that a cooling medium passage through which a cooling medium circulates is formed in a wall surface of a bottom surface.

The power supply may be a combination of the above two items, and it is desirable to provide a detachable lid at the opening of the housing.

When a plurality of electric component mounting boards are provided, a heat conductive member for suppressing convection of air is arranged between the electric component mounting board and an electric component mounting board vertically adjacent to the electric component mounting board. It is desirable that the end of the conductive member be directly in contact with the housing wall surface and fixed.

When one of the two components having different calorific values is arranged so that the other component is sandwiched between the casing and the wall surface of the casing, the component having the larger calorific value is positioned farther from the casing wall surface. It is desirable to arrange so that

Further, it is preferable that the electric component mounting board is configured to be pressed by using a screw jack so as to come into surface contact with the supporting portion.

Regarding the influence of heat received from the surroundings, a (simple) hermetically sealed housing and
By forming a flow path in the housing wall and flowing the cooling liquid, the influence of heat on the inside of the housing can be almost suppressed.

[0019]

FIG. 1 is a block diagram showing an embodiment of the present invention.
This will be described with reference to FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view taken along line AA of FIG.
1 is a perspective view of the embodiment shown in FIGS. 1 and 2, FIG. 4 is a perspective view showing a flow channel structure of the present embodiment, and FIGS. It is a top view showing an example.

The power supply device shown in FIG. 1 is a quadrangular prism-shaped metal housing 1 arranged with two surfaces facing each other horizontal.
And a plurality of rectangular inner walls protruding inward and extending horizontally along the wall surfaces on a pair of side wall inner surfaces orthogonal to the horizontal surface of the housing 1 and opposed to each other. Both ends are formed in a concave portion formed between the lower supporting portion 5 and the lower surface of the lower supporting portion 5 or between the lower surface of the lower supporting portion 5 and the lower surface of the housing 1. Conversion board 18 which is an electric component mounting board
A screw jack 7 disposed on the upper surface of the support portion 5 to press the conversion board 18 against the lower surface of the support portion 5; and a substrate take-out side cover 1 for closing an end of the housing 1 on the substrate take-out side in the axial direction.
4, an input / output unit side cover 15 for closing the other end of the housing 1 in the axial direction, an input / output connector 16 attached to the input / output unit side cover 15, and a plurality of conversion boards 18. Conductive member 6 arranged in the direction and blocking the convection of air in the vertical direction
And is configured.

In the housing 1, a cooling water inlet 2 is formed above one of the pair of side walls on which the support portion is formed, and a cooling water outlet 3 is formed above the other side wall.
A cooling water flow path 4 which is a cooling medium flow path connecting the cooling water inlet 2 and the cooling water outlet 3 inside the wall thickness of both side walls and the bottom.
Are formed. As shown in FIG. 4, the cooling water flow path 4 is formed in most of the ranges of the side walls and the bottom wall, and is divided into a plurality of flow paths (three in the present embodiment).
The plurality of flow paths are provided by the cooling water inlet 2 and the cooling water outlet 3.
And join together near. It is desirable that the number of channels be changed according to the size of the housing 1.

In the present embodiment, the casing 1 is an aluminum casting in which the cooling water flow path 4 can be integrally formed in a wall. Note that, by increasing the number of flow paths, the heat transfer area is increased, so that the cooling efficiency is slightly increased. However, it is necessary to determine the number of flow paths in consideration of, for example, ease of manufacturing with a casting. Although it depends on the method of manufacturing the housing, the use of copper can improve the heat transfer efficiency. As for heat shielding from the surroundings, the cooling liquid is caused to flow through the flow path in the housing wall, and the housing 1 and the lids 14 and 15 form a (simple) hermetically sealed structure, whereby the heat inside the housing is affected by heat. Can also be suppressed.

The conversion board 18 includes a metal radiator plate 8,
Silicone adhesive 1 having good thermal conductivity is provided on the upper surface of heat sink 8.
Semiconductor modules 10 mounted via
And a heat generating component (not shown) such as a capacitor, a resistor, and a coil, and a printed circuit board 9 integrally connected to the rear surface (lower surface) of the heat sink 8. Semiconductor module 10 and other REET # 1 bonded to heat sink 8
1 is connected to the printed circuit board 9 through a hole 13 formed in the heat sink 8.

A plurality of the conversion boards 18 are arranged so that their ends overlap the support portions 5 formed in a rectangular bar shape along the side wall surface, and these conversion boards 18 are horizontally arranged so as to be parallel to each other. Are located. Further, the screw jack 7 is disposed between the lower surface of the end portion of the conversion board 18 and the upper surface of the support portion 5 immediately below the conversion board 18. The screw jack 7 has a screw portion (screw rod) 7c and a screw portion 7c.
And a plurality of fixing portions 7a having an inclined surface at the end in the screw hole direction and a hole through which the screw portion 7c penetrates. It comprises a plurality of jack portions 7b having inclined surfaces that slide in contact with each other. By turning the screw portion 7c, the jack portion 7b moves upward while being supported by the fixing portion 7a. . In other words, by turning the screw portion 7c, the conversion board 18 is pressed against the lower surface of the support portion 5 and makes surface contact with it, so that a surface pressure is generated between the heat sink 8 and the support portion 5 and the conversion board 18 is Fixed to 1.

The main circuit of the present power supply device includes a plurality of conversion boards 18 for converting a given electric input into a given voltage / current.
And an input / output connector 17 of the board and an input / output connector 16 of the entire apparatus. The power input to the power supply device is partially consumed as heat inside the device, and the internal temperature rises. The allowable temperature of semiconductor components such as ICs used in the control system of the device is generally Since the temperature is in the range of 85 to 100 ° C., it is necessary to remove generated heat and maintain the temperature below the allowable temperature.

However, when the ambient temperature of the device is under severe environmental conditions, for example, when the device is exposed to 80 to 100 ° C., even if the heat of these semiconductor parts is radiated to the ambient air to be cooled, the temperature of the semiconductor component is reduced to the allowable temperature. On the other hand, since there is no difference in temperature with the outside air, heat radiation to the surrounding outside air becomes practically impossible. In the present embodiment, a system in which the housing itself is water-cooled for cooling the apparatus is employed, and cooling water having a temperature lower than the ambient temperature is supplied to the housing and circulated in the housing. The cooling water flows in from the cooling water inlet 2 of the housing 1, cools the housing while passing through the cooling water flow path 4, flows out of the cooling water outlet 3,
Circulates to the cooling system.

As the cooling water flow path 4, the conversion board 18 is formed by forming a flow path 4 on both side surfaces (wall surfaces on which the support portions 5 are formed) and three inner surfaces of the bottom surface of the housing to flow the cooling liquid. The heat of the electric components mounted on the housing can be efficiently transferred and cooled, and the heat from the surroundings can be shielded and the influence of the heat from the surroundings on the electric components incorporated in the housing can be suppressed.

As a result, the cooling performance can be secured.
By increasing the mounting density of the electrical components and the arrangement density of the conversion board 18, the entire device can be made compact. In addition, since the flow path is formed on both sides of the housing and on the three inner surfaces of the bottom surface, it is possible to reduce the size in a configuration in which a plurality of conversion boards are incorporated in the device.

Next, cooling of the semiconductor module 10 mounted on the conversion board 18 will be described. Heat generated from the semiconductor module 10 is transmitted to the heat sink 8 via the silicon-based adhesive 12. By using the silicon adhesive 12 with good thermal conductivity between the component to be mounted and the heat sink,
The air layer on the bonding surface can be reduced, and the heat conduction efficiency can be improved. Further, the heat conducted to the heat radiating plate 8 is transmitted from the end of the heat radiating plate 8 pressed by the screw jack 7 to the support portion 5 protruding from the inner wall of the housing 1, and finally the inside of the housing is transferred. It is extracted by the passing cooling water.

In this embodiment, the housing 1 is made of metal,
Although the cooling water flow path 4 is formed inside the housing 1 and the heat of the electric components is easily transmitted to the housing 1 as described above, the cooling water flow path 4 is formed inside the housing 1. If it is difficult to radiate the heat transmitted to the metal housing 1 to the outside air by convection or radiation, it is possible to improve the heat radiation efficiency and increase the arrangement density of the conversion board 18. Can be

As described above, the semiconductor module 10
Most of the heat generated from the semiconductor module moves through the cooling path, but part of the heat generated from the semiconductor module 10 is radiated to the air inside the housing by natural convection. At this time, since the circulating flow is formed by cooling the heated air at the upper portion, the air heated by the heat of the conversion board 18 disposed at the lower portion of the housing is consequently disposed at the upper portion of the housing. The semiconductor module 10 of the converted conversion board 18 will be warmed. Therefore, the conversion board 1 arranged at the top of the housing
8, there is a problem that the other heat generating components cannot be cooled sufficiently.

In this embodiment, in order to cope with this problem, the heat conducting member 6 that easily conducts heat is disposed between the above-mentioned conversion boards 18 so as to partition the mounting space of the conversion board, and the end portion is formed. It is fixed to the housing 1. As a result, the air heated by the heat leakage from the lower conversion board,
The heat is cooled by the heat conducting member 6 without directly contacting the upper conversion board, and the heat absorbed by the heat conducting member 6 is absorbed by the cooling water flowing through the cooling water passage through the housing wall.

The heat conducting member 6 is desirably formed integrally with the housing 1 from the viewpoint of reducing the contact thermal resistance. At this time, it is desirable to form a fin on the surface of the heat conducting member to increase the heat transfer area, or to oxidize the surface in order to increase the radiation rate.

The heat of the heat-generating components mounted on the printed circuit board (more precisely, the heat radiating plate) is taken out by being transferred by the cooling structure described above. The transmission efficiency changes, and depending on the parts, the temperature may rise above the allowable temperature and breakage may occur. In FIG. 5, the arrangement of the circuit components will be described. High heat generation component 20
The heat generation temperature is At1, the allowable temperature is At2, and the heat generation component 21 is
And the allowable temperature is Bt2, and the relationship between the temperatures is At1> Bt1, At2> Bt2. Conventionally, it is a general component arrangement to arrange a high heat-generating component 20 having heat generation larger than that of the heat-generating component 21 at a position close to the cooling water flowing in the housing (the heat transfer distance to the cooling water is short). In this case, as shown in FIG. 5, the heat-generating component 21 is hindered by the presence of the high-heat-generating component 20 on the heat transfer route 22 on the printed circuit board. There is a possibility that the temperature of the component 21 rises above the allowable temperature and is broken.

FIG. 6 shows a component arrangement employed in the present embodiment, in which the heating component 21 is moved to the cooling surface side to secure a cooling route. In this case, the heat generating component 21 is the high heat generating component 20.
Is present on the heat transfer route, the temperature is expected to rise. However, since the cooling water temperature is lower than the heat generating component 21, the heat of the heat generating component is transmitted to the cooling water, Efficient cooling becomes possible without heat affecting the heat generating component 21 beyond the allowable temperature.
Then, the temperature of the heat generating component 21 is suppressed to the allowable temperature or lower. By changing the component mounting position in this way, efficient cooling becomes possible, and it is possible to prevent the heat-generating component 21 from being damaged by the heat from the high heat-generating component 20.

In the above embodiment, water is used as the cooling medium circulating inside the housing 1. However, it is not always necessary to use water, and other liquids may be used.

[0037]

According to the present invention, in a power supply device including a housing and an electric component mounting board housed in the housing, heat generated by the electric component mounted on the electric component mounting board is generated by the housing. Thus, heat can be efficiently radiated to the outside through the device, so that the mounting density of the electric components can be increased and the power supply device can be downsized.

[Brief description of the drawings]

FIG. 1 is a sectional view of an apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the device as viewed from a direction AA in FIG.

FIG. 3 is a configuration diagram of an embodiment of the present invention.

FIG. 4 is a flow path structure diagram of an embodiment of the present invention.

FIG. 5 is a component layout diagram of the embodiment of the present invention.

FIG. 6 is a component layout diagram of the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Cooling water inlet 3 Cooling water outlet 4 Cooling water channel 5 Support part 6 Heat conduction member 7 Screw jack 8 Heat sink 9 Printed circuit board 10 Semiconductor module 11 Lead 12 Adhesive 13 Hole 14 Board extraction side cover 15 Input / output part side Lid 16 Input / output connector 17 Board input / output connector 18 Conversion board 20 High heat generating component 21 Heat generating component 22 Heat transfer route 23 Electrical component mounting board

Continued on the front page F-term (reference) 5E322 AA02 AA05 DA04 FA01 FA04 5G016 AA04 AA09 CG02 CG17 5H740 PP01 PP02 PP04 PP05 PP06 PP07

Claims (7)

[Claims] 1. An electronic device comprising: a metal housing; and a plurality of electric component mounting boards provided inside the metal housing so as to be parallel to each other. A support portion for supporting the component mounting board in contact with the support portion is formed, and the surface of the electrical component mounting board in contact with the support portion is made of metal, and the electrical component is mounted on the metal surface. A power supply device characterized by the above-mentioned. 2. The power supply device according to claim 1, wherein the electric component mounting board is pressed against a support using a screw jack. 3. A housing comprising: a metal housing; and a plurality of electric component mounting boards provided inside the metal housing so as to be parallel to each other, and a wall surface on both side surfaces and a bottom surface of the housing. A power supply device, wherein a cooling medium passage through which a cooling medium circulates is formed. 4. An electronic device comprising: a metal housing; and a plurality of electric component mounting boards provided inside the metal housing so as to be parallel to each other. A support portion for supporting the component mounting board in contact with the support portion is formed, and the surface of the electrical component mounting board in contact with the support portion is made of metal, and the electrical component is mounted on the metal surface. When,
A power supply unit, wherein a cooling medium passage through which a cooling medium circulates is formed in both side surfaces and a bottom surface of the housing. 5. The power supply device according to claim 1, wherein the housing has an opening for mounting the electric component mounting board, and the opening is detachable. Power supply device characterized by having a simple lid. 6. The power supply device according to claim 1, wherein convection of air is suppressed between the electric component mounting board and an electric component mounting board vertically adjacent to the electric component mounting board. A power supply device, wherein a heat conductive member is disposed, and an end of the heat conductive member is directly in contact with and fixed to a wall surface of the housing. 7. The power supply device according to claim 1, wherein one of the two components having different calorific values is arranged so as to sandwich the other component between the component and a wall surface of the housing. A power supply device, wherein a component having a larger amount of heat generation is arranged at a position farther from the housing wall surface.