JP2002071749A - Socket for evaluating test of ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for evaluating the test of an IC package, capable of corresponding to the densified arrangement of solder balls provided to the IC package. SOLUTION: The socket 1 for evaluating the test of the IC package 70 having solder balls 71 provided to the bottom surface thereof is equipped with a socket main body 10, the IC placing plate 20 provided to the socket main body, contacts 30 and sliders 41, and the IC placing plate 20 is fixed to the socket main body 10 and the contacts 30 are arranged under the IC placing plate 20, and the sliders 41 are arranged between the first and second connection parts of the contacts so as to be movable up and down. The first and second connection parts of the contacts are released from the contact with the sliders 41 when the sliders 41 are moved upwardly to come into contact with the solder balls 71 of the IC package 70 placed on the IC placing plate 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a socket for testing and evaluating an IC package having a solder ball on a bottom surface.

[0002]

2. Description of the Related Art Conventionally, as sockets for test evaluation of an IC package having a solder ball on a bottom surface, for example, those described in JP-A-8-273777 and JP-A-10-189191 are known.

[0003] The socket described in Japanese Patent Application Laid-Open No. 10-189191 is provided with a socket base, and a pedestal and a contact pin mounted on the socket base. The socket base has an IC housing recess for housing the BGA type IC package. The contact pin has a scissor portion formed in a plate-like scissor shape. The contact pins are arranged in a grid pattern on the socket board, with the scissors on top. An IC package is placed on the scissors of each contact pin arranged as described above.

The IC package is mounted such that solder balls arranged in a grid on the bottom surface are located between the scissors of each contact pin. The pedestal has a sliding hole into which the scissors of the contact pin are inserted. The pedestal moves forward and backward with respect to the socket base in conjunction with the operation of the holding cover. Since the contact pins are inserted into sliding holes formed in the pedestal, when the pedestal rises from the position where it has been pushed down to the full stroke, the scissor portions of the contact pins are squeezed by the sliding holes in a direction approaching each other. It is.

[0005] By this narrowing, the scissors of the contact pins come into contact with the solder balls. The scissors of the contact pin rotate with respect to the solder ball while maintaining the state of contact with the solder ball. Therefore, since the oxide film attached to the solder ball can be removed by the rotation,
Good contact can be expected.

However, in the socket having this configuration,
An IC package is mounted on the scissors of each contact pin, and the scissors directly contact the IC package. For this reason, when the scissors are narrowed by the sliding holes, there is a problem that the IC package is shifted in various directions from the initial mounting position. In addition, I
At the time of mounting the C package or the like, the contact (scissors of the contact) may hit the IC package, and the solder ball or the IC package itself may be damaged, which may affect workability and productivity.

On the other hand, the socket described in Japanese Patent Application Laid-Open No. 8-273777 has a socket body, mounting means provided on the socket body, and contact pins and slide members provided on the socket body. Have. The mounting means is integrated with the socket body for mounting an IC component having connection terminals arranged below the IC body.

A cover member is attached to the socket body. The cover member is arranged above the mounting means. The cover member is reciprocated when the IC component is loaded or unloaded. The contact pin is arranged below the mounting means. The contact pins are arranged integrally with the socket body so as to correspond to the connection terminals of the IC component. The contact pin is capable of being displaced by elastically deforming contact points formed at the tip thereof in first and second horizontal directions orthogonal to each other.

[0009] The slide member is arranged below the mounting means. The slide member is attached to the socket body so as to be able to move up and down. The slide member moves up and down in conjunction with the reciprocation of the cover member. Holes through which the respective contact pins penetrate are arranged in the slide member. Each of the holes is provided with a first action portion and a second action portion for displacing the contact pin in the first and second horizontal directions, respectively.

[0010] When the slide member is moved up or down, the first action portion sequentially moves the contact portion of the contact pin to the first position.
The contact portion is displaced in the second horizontal direction by the second action portion.

According to this socket, the contact portion of the contact pin comes into contact with the solder ball by being displaced in the first horizontal direction. Thereafter, the contact portion of the contact pin is displaced in the second horizontal direction while being in contact with the solder ball, and rubs the surface of the solder ball linearly. In this way,
The contact portion of the contact pin contacts a part of the connection terminal (solder ball) of the IC component mounted on the mounting means (upper plate). Therefore, even if an oxide film is formed on the surface of the solder ball, the contact portion contacts from one side of the solder ball and rubs the surface linearly,
Since the oxide film can be broken, good contact can be expected.

Further, since the IC component (IC package) is mounted on the mounting means integrated with the socket body, the
It is possible to prevent C from being shifted from the initial mounting position in various directions. Further, when the IC package is mounted on the socket, the contact does not hit the IC package.

However, in this socket, since the contact portion of the contact pin contacts the solder ball from only one side, if the oxide film on one side is not successfully destroyed,
There is a problem that electrical connection cannot be secured.

On the other hand, in another socket described in the same publication, the contact portion of the contact pin is formed in two forks in the above-mentioned socket described in the same publication. Further, the first action portion and the second action portion are formed at substantially the same phase position on the inner wall surface of the hole arranged in the slide member or an extension surface thereof,
The first action portion acts to widen the forked portion of the contact pin. Each of the forked portions is provided with an inclined portion that protrudes in a flange shape. The bifurcated portion is expanded when the slide member moves downward and the first operating portion formed on the slide member contacts the inclined portion of the contact pin.

According to the socket having this configuration, the bifurcated portions of the contact pins are displaced toward the solder ball and come into contact with the solder pin sandwiched therebetween. Thereafter, the forked portion of the contact pin is displaced while being in contact with the solder ball therebetween. As a result, the forked portion rubs the surface of the solder ball linearly from both sides.

In this manner, the bifurcated portions of the contact pins are in contact with the surface of the IC component mounted on the mounting means (upper plate), sandwiching both sides of the solder ball. Therefore, even if an oxide film is formed on the surface of the solder ball, the forked portion contacts both sides of the solder ball and rubs in a linear manner, which can destroy the oxide film, so that good contact is ensured. Can be expected. In addition, since the forked portion makes contact with both sides of the solder ball, even if the oxide film on one side is not successfully destroyed, the oxide film on the other side can be destroyed, so that more reliable contact can be secured. .

[0017]

However, in this socket, each of the contact pins has a bifurcated portion formed with an inclined portion that protrudes in a flange shape in order to widen the bifurcated portion. Therefore, it is necessary to provide a space for accommodating the inclined portion in the socket, and it is not possible to arrange the contact pins at a high density.

Therefore, there is a problem that it is difficult to provide a test evaluation socket corresponding to an IC package in which solder balls are arranged at high density. Further, since the contact pin of this socket has an inclined portion that protrudes in a flange shape, the shape is complicated, and there is also a problem that the production is troublesome and costly.

An object of the present invention is to correspond to an IC package in which solder balls are arranged at a high density.
It is an object of the present invention to provide an IC package test / evaluation socket which can have a relatively simple structure and can ensure more reliable contact with a solder ball.

[0020]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a socket for test evaluation of an IC package according to the present invention is a socket for test evaluation of an IC package having a solder ball on a bottom surface thereof, and a socket body. And an IC mounting plate, a contact and a slider mounted on the socket main body, wherein the IC mounting plate is fixed to the socket main body, and the contact is provided below the IC mounting plate. A base end portion disposed and fixed to the socket body, a first contact portion and a second contact portion displaceable in a direction of coming and going with each other, and a first contact portion and a base end portion. A first connecting portion connecting the first connecting portion and a second connecting portion connecting the second contact portion and the base end portion, wherein the slider includes the first connecting portion and the second connecting portion; Move up and down between joints The first and second connecting portions are displaced in directions away from each other by contacting the slider moved downwardly with the first and second connecting portions, respectively. An abutment portion is provided, and each of the first and second contact portions releases the abutment of the slider when the slider moves upward, and the IC mounted on the IC mounting plate. It is configured to contact the solder ball of the package.

According to the socket for test evaluation of the IC package according to the present invention, the slider is disposed between the first connection portion and the second connection portion of the contact so as to be movable in the vertical direction. When the slider moves downward, the slider comes into contact with the contact portions provided on the first connection portion and the second connection portion of the contact. As a result, the first contact portion and the second contact portion of the contact are displaced away from each other.

In this manner, the first contact portion and the second contact portion of the contact are displaced away from each other, so that the contact has the first contact portion and the second contact portion as in the prior art. There is no need for an inclined portion that protrudes in a flange shape for displacing them in a direction away from each other. Therefore,
Since it is not necessary to secure the inclined portion accommodating space in the socket, the arrangement density of the contacts can be increased, and a socket for test evaluation of the IC package corresponding to the high density of the solder balls provided in the IC package can be provided. It becomes possible.

Further, since the inclined portion protruding like a flange is not required, the configuration of the socket can be relatively simplified. Further, since the first and second contact portions are provided, even if the contact of one of the contact portions with the solder ball is not successful, the contact of the other contact portion can be expected. Therefore, more reliable contact with the solder ball can be ensured.

The contact has a first arm and a second arm formed of a metal material having elasticity and arranged substantially parallel to each other, and the first arm has the first arm at one end thereof. A contact portion is provided, the other end is connected to the base end portion, and a metal portion between one end and the other end is bent to form the contact portion, and the second contact portion is formed. The arm has one end provided with the second contact portion, the other end connected to the base end, and a metal portion between the one end and the other end is bent to form the arm. It is preferable that a contact portion is formed, and the slider is disposed between the first arm and the second arm. This eliminates the need for an inclined portion that protrudes in a flange shape as in the related art, and provides a more simplified socket.

One end of the first arm is provided with a first solder holding claw protruding from one end of the second arm, and one end of the second arm is provided with one end of the first arm. A second solder holding claw protruding at one end side is provided, the first contact portion is formed at a tip of the first solder holding claw, and the second contact portion is provided with the second solder holding claw. It is preferably formed at the tip of the nail.

Thus, even if an oxide film is formed on the surface of the solder ball, the first and second solder holding claws sandwich both sides of the solder ball, so that the oxide film is broken and electrical connection is established. It is possible to secure. Also, since both sides of the solder ball are sandwiched, even if the destruction of one oxide film is not successful, it can be expected that the other oxide film will be destroyed and electrical connection will be secured, ensuring more reliable contact It becomes possible. Further, since both sides of the solder ball are held by the solder holding claws, even if a portion shifted from the center of the solder ball is held, contact with the solder ball is not lost.

It is preferable that the first and second solder holding claws are respectively set so as to hold the surface of the solder ball above the center of the solder ball. As a result, the first and second solder holding claws each move slightly upward along the surface of the solder ball while being in contact with the surface. That is, the movement rubs the surface of the solder ball, so that the oxide film is more reliably destroyed, and good contact can be ensured.

It is preferable that the first and second solder holding claws are respectively set so as to come into contact with the surface of the solder ball below the center of the solder ball. Thereby, each of the first and second solder holding claws moves slightly downward along the surface of the solder ball while being in contact with the surface. In other words, the movement rubs the solder ball surface, so the oxide film is more reliably destroyed,
Good contact can be ensured.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a socket for test evaluation of an IC package (hereinafter simply referred to as a socket) according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a socket according to the present invention.

The socket 1 has a solder ball 71 (B
This is a socket for test evaluation of the IC package 70 including the GA. The socket 1 is a socket body 10
And an IC mounting plate 20, a contact 30, and a slider 41 mounted on the socket body 10. The socket 1 has a slider lifting mechanism 50 for moving the slider 41 in the vertical direction and an IC fixing mechanism 60 for fixing the IC package 70 mounted on the IC mounting plate 20 to the IC mounting plate 20. It has.

The configuration of the IC mounting plate 20 will be described with reference to FIGS. FIG. 2 is a plan view of an IC mounting plate provided in the socket according to the present invention.
FIG. 3 is a front view of an IC mounting plate provided in the socket according to the present invention. FIG. 4 is a side view of an IC mounting plate provided in the socket according to the present invention.

As shown in FIG. 2, the IC mounting plate 20 (also referred to as an adapter) has an IC mounting surface 2 on its upper surface.
2 is formed in a rectangular plate shape. I
The four corners of the lower surface of the C mounting plate 20 are respectively shown in FIG.
As shown in FIG. 1, an engaging portion 21 for engaging with the socket body 10 is provided. The IC mounting plate 20 is
The engaging portions 21 are respectively inserted into engaging holes (not shown) provided in the socket body 10 and engaged with and fixed to the socket body 10.

At four corners of the upper surface of the IC mounting plate 20, there are provided IC guiding portions 23 for guiding (or guiding) the IC package 70 inserted from above the socket 1 to the IC mounting surface 22. ing. IC guidance unit 23
Is formed with an inclined surface 23 a inclined with respect to the IC mounting surface 22 so that the IC package 70 is guided to a predetermined position on the IC mounting surface 22.

The periphery of the IC package 70 inserted from above the socket 1 contacts at least one of the inclined surfaces 23a, and the IC package 70 slides down the inclined surface 23a toward the IC mounting surface 22. As a result, the IC package 70 is mounted at a predetermined position on the IC mounting surface 22.

The IC mounting plate 20 is formed with a solder ball insertion groove 24 communicating the upper surface and the lower surface thereof. The solder ball insertion groove 24 is formed in an elongated rectangle. The solder balls 71 of the IC package 70 mounted on the IC mounting plate 20 are inserted into the solder ball insertion grooves 24.

The structure of the contact 30 will be described with reference to FIGS. FIG. 5 is a front view of a contact provided in the socket according to the present invention. FIG. 6 is a side view of a contact provided in the socket according to the present invention.

The contact 30 is, as shown in FIG.
It is arranged below the C mounting plate 20. The contact 30 includes a first arm 33a and a second arm 33b formed of a metal material so as to have elasticity.
And a contact base 37. These are combined to form one contact 30 as shown in FIGS.

First arm 33a and second arm 33b
Are arranged substantially parallel to each other. First arm 33a
Is provided with a solder holding claw 36a protruding from one end of the second arm 33b. The other end of the first arm 33a is connected to the contact base 37.
On the other hand, one end of the second arm 33b has the first arm 3
A solder holding claw 36b is provided so as to protrude from one end of 3a. The other end of the second arm 33b is connected to the contact base 37.

As shown in FIGS. 5 and 6, the contact 30 has a first contact portion 32a and a second contact portion 32a which can be displaced in directions of coming into contact with and separated from each other. Part 32b, a first connecting part 33a connecting between the first contact part 32a and the base end part 31, and a second connecting part 33a connecting between the second contact part 32a and the base end part 31 And a connecting portion 33b.

The base 31 is provided integrally with the contact base 37. The first contact portion 32a is provided at the tip of the solder holding claw 36a. Also, the second contact portion 3
2b is provided at the tip of the solder holding claw 36b. First
Correspond to the first arm 33a. The second connecting portion 33b is connected to the second arm 33b.
It corresponds to.

As shown in FIG. 11, the first and second arms 33a and 33b serving as the first and second connecting portions are respectively brought into contact with the slider 41 moved downward as shown in FIG. A contact portion 34 for displacing the portion 32a and the second contact portion 32b in directions away from each other is provided. The contact portion 34 is formed by bending a metal portion between one end and the other end of the first arm 33a. The contact portion 34 is formed by bending a metal portion between one end and the other end of the second arm 33b.

As shown in FIG. 10, when the slider 41 moves upward, the first and second contact portions 32a and 32b are released from the contact of the slider 41 with the contact portion 34, and the IC mounting is performed. IC mounted on mounting plate 20
It contacts the solder ball 71 of the package 70.

The contact portion 34 of the arm 33a and the arm 33b
Is set to be shorter than the width of the slider 41. Therefore, the slider 4 moved downward
1 is inserted between the contact portions 34, 34 of the arms 35a, 35b and comes into contact with each other.
3b is elastically deformed. FIG. 11 shows this state.

At this time, the first and second contact portions 32a,
32b are displaced away from each other. Slider 41
Is moved upward to release the contact of the slider 41 with the contact portion 34, the elastically deformed arms 33
a and 33b try to return to the original shape. FIG.
This state is shown.

As shown in FIG. 12, the contact 30
The first and second contact portions 32 a and 32 b are fixed to the socket body 10 with the respective contact portions 32 a and 32 b positioned in the solder ball insertion grooves 24 of the IC mounting plate 20. Therefore, the first
The second contact portions 32a and 32b can be displaced in the solder ball insertion groove 24 in a direction of coming and coming from each other.

Next, the configuration of the slider 41 will be described with reference to FIG. 1 and FIGS. FIG. 7 is a plan view of a slider body mounted on the socket according to the present invention. FIG. 8 is a front view of a slider main body provided in the socket according to the present invention. FIG. 9 is a side view of the slider main body provided in the socket according to the present invention. FIG. 10 and FIG. 11 are explanatory views of the positional relationship between a contact and a slider mounted on the socket according to the present invention.

The slider 41 is provided on the slider body 40. The slider body 40 is, as shown in FIG.
It is arranged below the IC mounting plate 20. The slider body 40 is supported by the socket body 10 via a plurality of slider body support springs 53. As shown in FIG. 7, a plurality of contact insertion holes 42 are formed in the slider body 40 so that the upper surface and the lower surface communicate with each other.

As shown in FIGS. 8 and 9, the slider 41 is provided between a specific contact insertion hole 42 and another contact insertion hole 42 adjacent thereto. The slider 41 is formed integrally with the slider body 40 in a wedge shape. In the specific contact insertion hole 42, FIG.
0, the first arm 33a of the contact 30
Is inserted. The second arm 33b of the contact 30 is inserted into another contact insertion hole 42 adjacent to the specific contact insertion hole 42.

As described above, the first arm 33a and the second arm 33b of the contact 30 are inserted into the respective contact insertion holes 42.
Is inserted, the slider 41 is disposed between the first arm 33a and the second arm 33b.

Next, the slider lifting mechanism 50 will be described with reference to FIGS. FIG. 12 is a side view of the socket 1 according to the present invention. The slider lifting mechanism 50 is a mechanism for moving the slider 41 in the up-down direction.
The slider lifting mechanism 50 includes a socket cover 51, a cross link 52, and a slider body support spring 53.

The socket cover 51 is attached to the socket body 10 so as to be movable in the vertical direction. The socket cover 51 moves up and down with respect to the socket body 10. The cross link 52 is, as shown in FIG.
They are arranged on both sides of the IC mounting plate 20, respectively. The intersecting link 52 includes a pair of levers 52a and 52b. As shown in FIG.
A lever shaft 52d is provided on one end side of 2b. Further, a slider body pressing portion 54 that protrudes in a flange shape is provided on each of the side surfaces on one end side of each of the levers 52a and 52b.

The other end of each of the levers 52a and 52b is provided with a sliding portion 52c which slides along the inner side surface 51a of the socket cover 51. The sliding portion 52c is
The socket cover 51 is formed, for example, in an arc shape so as to easily slide along the inner side surface 51a of the socket cover 51.

Each of the levers 52a and 52b has its lever shaft 52d inserted into a lever hole (not shown) formed in the socket body 10, and can swing about the lever shaft 52d. Each lever 52a, 52b
Are interlaced as shown in FIG. In the crossed state, the slider body pressing portions 54 of the levers 52a, 52b
However, as shown in FIG. 1, it is in contact with the upper surface of the slider body 40. For this reason, further swinging of each of the levers 52a and 52b is prevented. The socket cover 51 has a sliding portion 52 of each lever 52a, 52b on its inner side surface 51a.
c are brought into contact with each other and attached to the socket body 10.

Next, the operation of the slider lifting mechanism 50 will be described with reference to FIGS. 12 and 13
FIG. 2 is a side view of the socket according to the present invention. FIG.
The state where the slider 41 is located at the upper limit position is shown. FIG. 13 shows a state where the slider 41 is located between the upper limit position and the lower limit position.

When the socket cover 51 is pushed down in FIG. 12 by a mechanical device or the like, the sliding portions 52c of the levers 52a and 52b constituting the intersecting link 52 slide along the inner side surface 51a of the socket cover 51, respectively. I do. At the same time, each lever 52a, 52b
Each lever 52a, 5a
The slider body pressing portion 2b pushes down the slider body 40. Since the slider 41 is provided integrally with the slider main body, the slider 41 moves downward when the slider main body 40 is pressed down.

When the slider body 40 is pushed down, the plurality of slider body support springs 53 are elastically deformed.
Therefore, when the force applied to push down the socket cover 51 is removed, the slider body support spring 53 attempts to return to the original shape, and the slider body 4
0 is pushed up. Therefore, the slider 41 moves upward.

Next, referring to FIG.
0 will be explained. The IC fixing mechanism 60 connects the IC package 70 mounted on the IC mounting plate 20 to the IC plate 70.
This is a mechanism for fixing to zero. The IC fixing mechanism 60
The pusher 61 includes a pusher 61, a pusher pressing member 62, and a pusher spring 63.

The pusher 61, as shown in FIG.
They are arranged on both sides of the IC mounting plate 20, respectively. The pusher 61 includes a pusher main body 61a, an IC pressing portion 61b provided at one end of the pusher main body 61a so as to protrude from the front surface of the main body 61a, and a pusher 61 protruding from the rear surface of the main body 61a at the other end of the pusher main body 61a. A pusher action portion 61c provided in this state and a pusher shaft (not shown) provided on a side surface on the other end side of the pusher main body 61a are provided.

The pusher 61 has a pusher shaft whose pusher shaft is formed in the socket body 10 (not shown).
And can swing about the pusher shaft. Pusher action portion 61c and socket body 10
A pusher spring 63 compressed and elastically deformed in the axial direction is disposed between the pusher spring 63 and the pusher spring 63. Pusher spring 63
The pusher 61 tends to swing toward the IC mounting plate 20 due to the force for returning to the original shape of the pusher 61.

At this time, the IC pressing portion 6 of the pusher 61
Since 1b abuts on the IC mounting plate 20, further swinging of the pusher 61 is prevented. Therefore, I
When the C package 70 is mounted on the IC mounting plate 20, the pusher 61 holds the IC package 70 between the IC pressing portion 61b and the IC mounting plate 20, as shown in FIG. I do. Thus, the IC
The package 70 is fixed to the IC mounting plate 20.

Next, referring to FIG. 12 to FIG.
The operation of the fixing mechanism 60 will be described. FIG. 12 to FIG.
It is a side view of the socket concerning this invention. FIG. 12 shows a state where the pusher 61 fixes the IC package 70 to the IC mounting plate. FIG. 13 shows a state in which the pusher pressing member 62 is in contact with the pusher 61. FIG. 14 shows a state where the pressing of the pusher 61 against the IC package 70 is released.

When the socket cover 51 is pressed down in FIG. 12 by a mechanical device or the like, the pusher pressing member 62 provided inside the socket cover 51 moves downward, and as shown in FIG. It comes into contact with the action portion 61c. Furthermore, socket cover 5
13 is pushed down in FIG. 13, the pusher pressing member 62 is pushed by the pusher action portion 61c as shown in FIG.
By pushing down, the pusher 61 is swung.

Thus, the fixation of the IC package 70 by the pusher 61 is released. When the pusher 61 is swung in this manner, the pusher action portion 61c
As a result, the pusher spring 63 is compressed in the axial direction and elastically deformed. Therefore, when the force applied to push down the socket cover 51 is removed, the pusher spring 63 is swung in the opposite direction by the force of the pusher spring 63 to return to the original shape,
As shown in FIG. 12, it returns to the original position.

Next, the operation of inserting the IC package 70 into the socket 1 will be described with reference to FIGS. 15 and 16 are front views of the socket according to the present invention. FIG. 15 shows a normal state of the socket 1 (a state in which the socket cover 51 is not pushed down), and shows a state in which the slider 41 and the socket cover 51 are located at their respective upper limit positions.

FIG. 16 shows a state in which the socket cover 51 is pushed down and the slider 41 is moving downward. FIG. 17 shows a state in which the socket cover 51 is further pushed down, and the slider 41 and the socket cover 51 are located at their respective lower limit positions.

When the socket cover 51 is not pressed down, as shown in FIG. 15, the slider 41 moves the arms 33a, 3b between the arms 33a and 33b.
3b. When the socket cover 51 is pushed downward in FIG. 15, the slider 41 is moved downward by the slider lifting mechanism 50 as shown in FIG.

At this time, the slider 41 is
a, 33b by contacting the abutting portions 34 of the arms 33a, 33b, respectively.
And the second contact portions 32a and 32b are displaced away from each other. As a result, a space is formed between the first contact portion 32a and the second contact portion 32b in which the solder ball 71 is inserted.

When the socket cover 51 is further pushed down in FIG. 16, the slider 41 is moved to its lower limit position by the slider lifting mechanism 50 as shown in FIG. In this way, a space into which the solder ball 71 is inserted is completely formed. At the same time, pusher 6
1 is an IC pressing portion 61b by the IC fixing mechanism 60.
Is swung in a direction away from the IC mounting surface 22.

As described above, with the space into which the solder ball 71 is inserted and the pusher 61 swung, the IC package 70 is inserted from above the socket 1 and the IC mounting plate is inserted. The IC package 70 is mounted on the IC package 20. FIG. 17 shows a state where the IC package 70 is mounted. When the force applied to push down the socket cover 51 is removed, first, the pusher 61 is moved by the IC pressing mechanism 61 by the IC fixing mechanism 60.
b is swung in the direction in which it contacts the IC mounting surface 22.

Since the IC package 70 is mounted on the IC mounting surface 22, the package 70 is
And the IC mounting plate 20 and are fixed. At the same time, the slider 41 moves the slider lifting mechanism 5
It is moved upward by 0 and is located at the original upper limit position. Thereby, the contact portion 34 of each arm 33a, 33b
Is released, and the solder holding claws 36a and 36b respectively hold both sides of the solder ball 71 of the IC package 70 mounted on the IC mounting plate 20. At this time, the contact portions 32a and 32b contact both sides of the solder ball 71, respectively. The socket cover 51 is similarly moved upward by the slider lifting mechanism 50 and returns to the original upper limit position.

FIG. 18 is a view for explaining a state in which a contact mounted on a socket for test evaluation of an IC package according to the present invention has come into contact with a solder ball. As shown in the figure, it is preferable that the first and second solder holding claws 36a and 36b are set so as to hold the surface of the solder ball above the center of the solder ball 71, respectively. It is preferable that the first and second solder holding claws 36a and 36b are set so as to respectively hold the surface of the solder ball below the center of the solder ball 71. By setting the length of the engaging portion 21 of the IC mounting plate 20 to an appropriate length, the solder holding claws 36a and 36b can be set to hold the solder ball 71 as described above.

[0072]

As described above, the IC according to the present invention is
According to the socket for test evaluation of a package, it is possible to cope with an IC package in which solder balls are arranged at high density, the configuration can be relatively simplified, and more reliable contact with the solder balls can be ensured. It is possible to provide a socket for test evaluation of an IC package.

[Brief description of the drawings]

FIG. 1 is a front view of a test evaluation socket of an IC package according to the present invention.

FIG. 2 is a plan view of an IC mounting plate provided in a test evaluation socket of the IC package according to the present invention.

FIG. 3 is a front view of an IC mounting plate provided in a test evaluation socket of the IC package according to the present invention.

FIG. 4 is a side view of an IC mounting plate provided in a test evaluation socket of the IC package according to the present invention.

FIG. 5 is a front view of a contact provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 6 is a side view of a contact provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 7 is a plan view of a slider main body provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 8 is a front view of a slider main body provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 9 is a side view of a slider main body provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 10 is an explanatory diagram of a positional relationship between a contact and a slider provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 11 is an explanatory diagram of a positional relationship between a contact and a slider provided in a socket for test evaluation of an IC package according to the present invention.

FIG. 12 is a side view of a test evaluation socket of an IC package according to the present invention.

FIG. 13 is a side view of a socket for test evaluation of an IC package according to the present invention.

FIG. 14 is a side view of a socket for test evaluation of an IC package according to the present invention.

FIG. 15 is a front view of a socket for test evaluation of an IC package according to the present invention.

FIG. 16 is a front view of a socket for test evaluation of an IC package according to the present invention.

FIG. 17 is a front view of a socket for test evaluation of an IC package according to the present invention.

FIG. 18 is an explanatory view showing a state in which a contact provided in a socket for test evaluation of an IC package according to the present invention is in contact with a solder ball.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket 10 Socket main body 20 IC mounting plate 24 Solder ball insertion groove 30 Contact 31 Base end 32a, 32b Contact part 33a, 33b Connection part (arm) 40 Slider main body 41 Slider 42 Contact insertion hole 50 Slider elevating mechanism 51 Socket Cover 52 Intersecting link 52a, 52b Lever 52c Sliding part 52d Lever shaft 53 Slider body support spring 54 Slider body pressing part 60 IC fixing mechanism 61 Pusher 61a Pusher body 61b IC pressing part 61c Pusher action part 62 Pusher pressing member 63 Pusher spring 70 IC package 71 Solder ball (BGA)

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2G003 AA07 AG01 AG03 AG08 AG12 AG16 AH04 AH05 AH07 2G011 AA01 AA15 AB01 AB06 AC14 AE03 AF02 5E024 CA18 CB03

Claims (5)

[Claims] 1. A test evaluation socket for an IC package having a solder ball on a bottom surface, comprising: a socket main body; an IC mounting plate, a contact, and a slider mounted on the socket main body; The mounting plate is fixed to the socket main body, and the contact is disposed below the IC mounting plate, and is displaceable in a direction of coming into contact with and separating from the base end fixed to the socket main body. A first contact portion and a second contact portion, a first connection portion connecting the first contact portion and the base end portion, and a connection portion between the second contact portion and the base end portion A second connecting portion, wherein the slider is disposed between the first connecting portion and the second connecting portion so as to be movable in a vertical direction, and the slider is provided on the first and second connecting portions. Respectively contact the slider that has moved downward. A contact portion for displacing the first contact portion and the second contact portion in a direction away from each other is provided, and the first and second contact portions are respectively provided when the slider is moved upward. A test evaluation socket for an IC package, wherein the abutment of the slider is released to make contact with a solder ball of the IC package mounted on the IC mounting plate. 2. The contact comprises a first arm and a second arm formed of an elastic metal material and arranged substantially parallel to each other, wherein the first arm has the first arm at one end thereof. A contact portion is provided, the other end is connected to the base end portion, and a metal portion between one end and the other end is bent to form the contact portion; The second arm is provided with the second contact portion at one end, the other end is connected to the base end portion, and a metal portion between the one end and the other end is bent. The socket for test evaluation of an IC package according to claim 1, wherein the contact portion is formed, and the slider is disposed between the first arm and the second arm. 3. A first solder holding claw projecting from one end of the second arm is provided at one end of the first arm, and the first arm is provided with one end of the first arm at one end of the second arm. A second solder holding claw protruding from one end of the arm is provided, the first contact portion is formed at a tip of the first solder holding claw, and the second contact portion is provided on the second solder holding claw. 3. The test evaluation socket for an IC package according to claim 2, wherein the socket is formed at a tip of the solder pinching nail. 4. The test evaluation of an IC package according to claim 3, wherein said first and second solder holding claws are respectively set so as to hold a surface of the solder ball above a center of the solder ball. socket. 5. The IC package according to claim 3, wherein each of the first and second solder holding claws is set so as to hold a surface of the solder ball below a center of the solder ball. socket.