JP2002057236A - Ceramic package and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily provide a ceramic package at a low cost by a rational manufacturing method, capable of airtightly fixing by high strength for fixing a lid or a sealing ring with a brazing material, a solder or the like, and to provide a method for manufacturing the same. SOLUTION: The ceramic package 100 comprises a peripheral part 110 which is made of ceramics as a periphery of a component housing recess 120, and an annular metallized layer 131 surrounding the recess 120 on a top surface 111 of the part 110. The surface 11 of the part 110 has a protruding part 112, protruding partly by deformation due to pressing before baking and a protruding part 132 which partly protrudes in the width direction along the part 112 even on the layer 131.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic package having a component receiving recess for receiving an IC chip, a quartz oscillator, a SAW filter, an optical IC chip and other components.
And its manufacturing method.

[0002]

2. Description of the Related Art Conventionally, IC chips, quartz oscillators, S
A ceramic package that holds components such as an AW filter and an optical IC chip in a component receiving recess and seals a metal or ceramic lid with a brazing material or solder to a metallized layer formed around the periphery. Are known. In addition, a sealing ring is fixed to the metallized layer formed in the peripheral part with brazing material or solder, and the sealing ring and a lid made of metal or the like are sealed with brazing material or solder, or sealed with seam weld. Also known are ceramic packages.

In order to fix the lid or the sealing ring to the metallized layer with a brazing material or solder, it is required to tightly adhere these to the metallized layer (ceramic package) with high strength. For this reason, for example, Japanese Unexamined Patent Publication No. 9-139439 discloses a brazing method for a ceramic package in which a metal cap is welded to a seal ring (sealing ring) joined to a brazing metallization pattern by a brazing material. It discloses a method in which a convex portion that partially raises a formation region of a metallization pattern for attachment is formed by a thick film method. In particular,
For example, when forming a metallized layer around the ceramic package, first, a metallized pattern for brazing is formed. After that, a refractory metal paste or insulator paste is printed on a part of the paste to form a brazing filler pool thick film pattern. Print the metallized pattern. As a result, a convex portion is formed in the metallized pattern, so that the space between the metallized pattern for brazing and the seal ring can be increased, a brazing material pool can be secured, and brazing strength can be improved. .

[0004]

However, in the invention disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 9-139439,
Since the convex portions are formed by the thick film method, it is necessary to print the refractory metal paste or the insulating paste a plurality of times with different printing patterns, which is troublesome and increases the cost. The present invention has been made in view of such a problem, and in fixing a lid or a sealing ring with a brazing material, solder, or the like, it can be airtightly fixed with high strength, and a rational manufacturing method Accordingly, an object of the present invention is to provide an easy and inexpensive ceramic package and a method for manufacturing the same.

[0005]

Means for Solving the Problems, Means and Effects The solution is to form an annular metallization surrounding the component receiving recess and having a peripheral portion made of ceramic and surrounding the component receiving recess on the top surface of the peripheral portion. A ceramic package having a layer, wherein a part of a top surface of the peripheral portion has a raised portion partially raised by deformation due to pressing before firing, and a peripheral portion of the annular metalized layer is formed. At least a part of the direction is a ceramic package having a convex portion that is partially raised in the width direction along the raised portion.

The ceramic package of the present invention has a raised portion on a part of the top surface of the peripheral portion, and the annular metallized layer has a raised portion that is partially raised in the width direction along the raised portion. Have. As described above, since the top surface of the peripheral portion is not flat but bulges due to the deformation due to the pressing, it is not necessary to provide convex portions on the metallization layer by printing a plurality of different patterns as in the related art. Can be formed.

In addition, since the annular metallized layer has a convex portion which is partially raised in the width direction along the raised portion, when the lid or the sealing ring is fixed with a brazing material or solder, the metallized layer has A gap between the lid and the sealing ring can be secured for the height of the projection, so fill this area with brazing material or solder and increase the amount of brazing material or solder that will join the two. In addition, a large meniscus formed by brazing material or solder can be secured. For this reason,
The lid and the sealing ring can be hermetically fixed to the ceramic package with high strength.

As the material of the ceramic package, known materials can be used, and examples thereof include alumina, aluminum nitride, low-temperature fired glass ceramic, and mullite. The metallized layer may be appropriately selected in consideration of the material of the ceramic package and the like. For example, W, Mo, Mo-Mn, Cu, Ag, A
u, Ag-Pt, Ag-Pd and the like. further,
The metallized layer may be subjected to various types of plating as needed, and examples thereof include those subjected to Ni plating or Ni and Au plating. Further, the ceramic package of the present invention may include one in which a sealing ring is fixed to a metallized layer with a brazing material or solder.

Further, another solution is a ceramic package which has a peripheral portion made of ceramic which forms a periphery of the component accommodating concave portion, and which has an annular metallized layer surrounding the component accommodating concave portion on the top surface of the peripheral portion. The unfired peripheral portion that becomes the peripheral portion after firing and the unfired metallized layer that becomes the annular metalized layer after firing are deformed by pressing unevenly from the unfired metallized layer side, and the unfired peripheral portion is deformed. An unfired raised portion that is partially raised on a part of the top surface, and an unfired portion that is partially raised in the width direction along the unfired raised portion on at least a portion in the circumferential direction of the annular metalized layer. The ceramic package is formed by forming a protrusion and firing the same to form a raised portion on the peripheral portion and a protrusion on the metallized layer.

[0010] In the absence of the unfired metallized layer, the top surface of the unfired peripheral portion is pressed to form only the unfired raised portion, and then, before or after firing, the unfired raised portion (filled portion) is formed. An unfired metallized layer may be formed so as to cover the rising portion. However, it is difficult to print the metallized layer on the top surface of the peripheral portion that is not flat due to the unfired raised portion (protruded portion). In addition, since the distance between the top of the rising portion and the mask is short, the thickness of the printed metal paste tends to be thin at the top of the rising portion. Further, the metal paste printed on the top of the rising portion may flow and move to the bottom of the rising portion. Therefore, the thickness of the metallized layer at the top of the raised portion is easily formed thin, and as a result, the height of the convex portion is easily formed low.

On the other hand, in the ceramic package of the present invention, an unsintered metallized layer is formed in advance, and then the unsintered metallized layer is also pressed by non-uniform pressing to form an unsintered raised portion and Since the unsintered convex portions are formed, it is not necessary to form the unsintered metallized layer in a plurality of different print patterns, and the ceramic package can be easily and inexpensively formed. In addition, since the previously formed unfired metallized layer is pressed, the height of the convex portion can be easily increased. Particularly, considering that the thickness of the metallized layer obtained by one printing is about several tens of μm, it is preferable that the height of the convex portion is equal to or more than this. That is, it is preferable that the height of the projection is 15 μm or more.

In the present specification, the non-uniform pressing means a pressing in which the pressing force from the unfired metallized layer side is not uniform. Specifically, for example, the portion corresponding to the unfired raised portion and the unfired convex portion is not pressed, and only the other portion is pressed, and also the portion corresponding to the unfired raised portion and the unfired convex portion. Although other parts are also pressed, there are cases where the pressing force of the part corresponding to the unfired raised part and the unfired convex part is smaller than that of the other part.

Further, in the ceramic package according to any one of the above, it is preferable that the raised portion and the protruding portion are annular ceramic packages surrounding the component accommodating recess.

If the raised portion and the protruding portion are not annular, but are cut off at a part in the circumferential direction, when the lid or the sealing ring is fixed with a brazing material or solder, the portion is more rigid than the other portions. The amount of the accumulated brazing material or solder increases, and in this portion, the problem that the brazing material or solder flows into the inside of the ceramic package (the concave portion for accommodating the component) or flows out outside tends to occur. On the other hand, if the protruding portion or the convex portion is formed in an annular shape, the amount of the brazing material or solder is less likely to be non-uniform when the lid or the sealing ring is fixed by brazing or soldering.

Further, in the above ceramic package, it is preferable that the annular convex portion is a ceramic package located on the component housing concave side with respect to a center line in a width direction of the annular metallized layer.

When the lid or the sealing ring is fixed to the metallized layer with a brazing material or solder, it is preferable to increase the amount of the brazing material or solder contributing to the fixing, increase the meniscus, and increase the bonding strength. However, if excess brazing material or solder flows into the component accommodating recess, short-circuiting or poor characteristics may occur due to contact with the accommodated component or the electrode in the component accommodating recess.

On the other hand, in the ceramic package of the present invention, the annular convex portion is located closer to the component housing concave portion than the center line in the width direction in the annular metallized layer. That is,
When the metallized layer is viewed in the width direction, the width outside the convex portion is larger than the width inside the convex portion (on the component housing concave side). Therefore, when the lid or the sealing ring is fixed with the brazing material or the solder, the brazing material adheres to the outside of the convex portion compared to the amount of the brazing material or the solder adhered to the inside (the component housing concave portion) from the convex portion. And the amount of solder can be increased.
For this reason, it is possible to prevent excess brazing material or solder from flowing into the component accommodating recess, and to prevent problems such as contact with the accommodated component or the electrode in the component accommodating recess. Also, if there is a lot of brazing material or solder on the outside, a relatively large meniscus can be formed on the outside, so that the lid and the sealing ring can be firmly fixed.

Still another solution is a method of manufacturing a ceramic package, which comprises laminating a plurality of ceramic green sheets, each having a predetermined shape, in a predetermined order, and forming an unfired ceramic green sheet around a component housing recess. A laminating step of forming a laminate having a peripheral portion and having an annular unfired metallized layer surrounding the component accommodating recess on the top surface of the unfired peripheral portion; and pressing the laminate to form a plurality of the ceramic green sheets. Are pressed against each other to form a press-bonded laminate, wherein the unsintered metallized layer and the unsintered peripheral portion are pressed unevenly from the unsintered metallized layer side to form a top of the unsintered peripheral portion. An unfired raised portion that is partially raised on a part of the surface, and an unfired convex portion that is partially raised along the unfired raised portion on a part of the unfired metallized layer. A bonding step of forming a method for producing a ceramic package comprising a.

In the method for manufacturing a ceramic package according to the present invention, an unfired raised portion and an unfired convex portion are formed on the press-bonded laminate. For this reason, even in a ceramic package completed by firing thereafter, a raised portion and a convex portion are formed. For this reason, when the seal ring or the lid is fixed on the metallized layer, the brazing material or the solder easily accumulates on the lower surface of the seal ring or the lid, and can be firmly and airtightly fixed. Moreover, in the pressing step, the ceramic green sheets are brought into close contact with each other to form a pressed laminated body, and the unfired metallized layer and the unfired peripheral portion are pressed unevenly to form the unfired raised portions and the unfired convex portions. Since they can be formed at the same time, there is no need to separately provide a step of forming an unfired raised portion and an unfired convex portion, and a ceramic package can be formed easily and inexpensively.

Further, in the above-described method for manufacturing a ceramic package, in the pressing step, the unsintered metallized layer and the unsintered peripheral portion may be formed by a pressing tool having an opening that opens a part of a contact surface. The contact surface is pressed against the unsintered metallized layer, and the unsintered raised portion is located at a position corresponding to the opening on the top surface of the unsintered peripheral portion, and the unsintered metallized portion. It is preferable to use a method for manufacturing a ceramic package in which the unfired convex portion is formed at a position corresponding to the opening in the layer.

In the method for manufacturing a ceramic package according to the present invention, an unfired raised portion and an unfired convex portion are formed in a pressing step by using a pressing tool having an opening. For this reason, it is possible to easily and reliably form the protruding portion and the convex portion in a desired shape and position. Note that the opening of the pressing tool includes both a through-hole penetrating from the contact surface of the pressing tool to the opposite surface and a concave portion formed in the contact surface.

Still another solution is a method of manufacturing a ceramic package, comprising: an unsintered peripheral portion surrounding a component accommodating concave portion; and an annular shape surrounding the component accommodating concave portion on a top surface of the unsintered peripheral portion. Of the unfired ceramic body including the unfired metallized layer, the unfired metallized layer and the unfired peripheral portion are pressed unevenly from the unfired metallized layer side, and a part of the top surface of the unfired peripheral portion Forming an unfired raised portion that partially rises in the unfired convex portion forming step of forming an unfired convex portion that partially rises along the unfired raised portion on a part of the unfired metallized layer. This is a method for manufacturing a ceramic package including the same.

In the method of manufacturing a ceramic package according to the present invention, in the unsintered convex portion forming step, the unsintered metallized layer and the unsintered peripheral portion are pressed unevenly to form the unsintered raised portion and the unsintered convex portion. I do. Therefore, even in the ceramic package completed by firing thereafter, the raised portions and the protruding portions are formed. For this reason, when the seal ring or the lid is fixed on the metallized layer, the brazing material or the solder easily accumulates on the lower surface of the seal ring or the lid,
Strong and airtight. In addition, since the unfired raised portion and the unfired convex portion can be formed by uneven pressing, it is not necessary to print a metal pace or the like a plurality of times with different print patterns, and a ceramic package can be manufactured easily and at low cost. .

Further, in the above-described method for manufacturing a ceramic package, in the step of forming the unsintered convex portion, the unsintered metallized layer and the unsintered peripheral portion may be formed by pressing an opening having an opening in a part of the contact surface. With the tool, the contact surface is pressed against the unfired metallized layer, and the unfired raised portion is located at a position corresponding to the opening on the top surface of the unfired peripheral portion, and It is preferable to use a method for manufacturing a ceramic package in which the unfired convex portions are formed at positions corresponding to the openings in the unfired metallized layer.

In the method of manufacturing a ceramic package according to the present invention, an unfired raised portion and an unfired convex portion are formed by pressing using a pressing tool having an opening. For this reason, it is possible to easily and reliably form the protruding portion and the convex portion in a desired shape and position.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. FIG. 1 is a plan view of the ceramic package 100 of the present embodiment, and FIG. 2 is a partially enlarged cross-sectional view thereof. A ceramic package (hereinafter, also simply referred to as a package) 100 made of alumina ceramic has a substantially square shape in a plan view, a plate shape having a lower surface 101 and an upper surface 102, and a substantially square-shaped peripheral portion located at a periphery in a plan view. 1
10 and a component storage recess 120 (hereinafter also simply referred to as a recess) 120 formed in the center and surrounded by the peripheral portion 110.

The peripheral portion 110 is sandwiched between an inner wall surface 113 and an outer wall surface 114 constituting the concave portion 120, and a top surface 111 corresponding to the upper surface 102 of the package 100 has a swelling slightly higher than the surroundings. It has a part 112.
The raised portion 112 surrounds the recess 120,
It is formed in an annular shape of a square shape. This rising portion 112
As described later, before firing of the package 100, the unfired peripheral portion is pressed to form an unfired raised portion. When the top surface 111 of the peripheral portion 110 is viewed in the width direction (the left-right direction in FIG. 2), the raised portion 112 is on the inner side, that is, the concave portion 120 side (the right direction in FIG. 2).
Are formed at positions shifted from each other.

On the top surface 111 of the peripheral portion 110,
The part slightly recessed from each of the inner wall surface 113 and the outer wall surface 114 has tungsten
Is formed. Therefore, this metallized layer 113 is
2, the projection 132 has a height of 15 μm or more, specifically, about 20 μm, which is partially raised in the width direction (the horizontal direction in FIG. 2). The protruding portion 132 is also a raised portion 112
It is formed in an annular shape like a square. As described above, since the raised portion 112 is formed at a position shifted to the concave portion 120 side, the convex portion 132 is also formed on the metallized layer 1.
When the metallization layer 31 is viewed in the width direction (the left-right direction in FIG. 2), the inner side of the metallization layer 131 with respect to the width direction center line CL
That is, it is formed at a position shifted toward the recess 120 (to the right in FIG. 2).

On the other hand, a step 122 is formed in the recess 120 so as to be higher than the bottom 121 in a stepwise manner, and the bottom 121 has a bottom pad 14 for fixing electronic components.
In the step portion 122, a wiring layer 1 also serving as a bonding pad for connecting to an electronic component with a bonding wire
42 are formed. The wiring layer 142 extends not only on the step portion 122 but also into the peripheral portion 110.

As described above, the package 100 has the convex portion 132 on the metallized layer 131 formed on the top surface 111 of the peripheral portion 110. For this reason, for example, as shown in FIG.
Consider a case in which a sealing ring 150 made of Kovar is brazed to the metallization layer 131 with a silver brazing material (72Ag-28Cu) 160 in order to fix the sealing ring 150 to zero. Then, the sealing ring 150
The lower surface 151 of the metallization layer 131 is in contact with the convex portion 132 of the metallized layer 131, so that the metallized layer 131 is located on the concave portion 120 side (right side in FIG. 3) and outside (left side in FIG.
And a relatively large gap is formed between them. These gaps are filled with silver brazing materials 161 and 163, respectively, so that silver brazing materials 160 contributing to fix sealing ring 150 to metallization layer 131 as compared with a case where there is no convex portion 132 are provided.
The amount of (161, 163) increases. In addition, silver brazing material 16
Reference numerals 1 and 163 denote inner peripheral surfaces 153 of the sealing ring 150, respectively.
And meniscus 1 formed by wetting and spreading on outer peripheral surface 154
62 and 164 also increase. For this reason, the sealing ring 15
0 can be firmly and airtightly fixed to the metallized layer 131. Prior to brazing the metallization layer 131 and the sealing ring 150, it is preferable that both surfaces of the silver brazing material 160 be nickel-plated in order to ensure wettability.

Further, in the present embodiment, as described above, the convex portion 132 is formed so as to be shifted toward the concave portion 120. Therefore, the amount of the silver brazing material 163 accumulated in the gap outside the projection 132 (left side in FIG. 3) is larger than the amount of the silver brazing material 161 accumulated in the gap inside the projection 132 (concave side, right side in FIG. 3). The amount increases. If the amount of the silver brazing material 161 is large, there is a problem that the silver brazing material 161 drips inward, that is, flows out to the concave side, or the separated silver brazing material contacts the wiring layer 142 or the mounted electronic component EP. May occur,
By performing the above, the amount of the silver brazing material 161 accumulated in the inner gap can be relatively reduced, and the silver brazing material 1
61 can be prevented. On the other hand, the amount of the silver brazing material 163 accumulated in the gap outside the convex portion 132 is increased, and the meniscus 164 on the outside can be increased. This is advantageous in terms of stress, and the sealing ring 150 is more firmly formed by the metallized layer 131. Can be fixed.

After that, the sealing ring 150 and the silver brazing material 1
The nickel package and the gold plating are applied to the exposed portions of the bottom surface pad 141, the bottom pad 141, and the wiring layer 142 to complete the ceramic package 100. Thereafter, as shown by a broken line in FIG. 3, the electronic component EP is mounted on the bottom pad 141 of the bottom surface 121, connected to the wiring layer 142 by the bonding wire WR, and further covered with the metal lid LD to cover the lid lower surface LD.
A and the upper surface 152 of the sealing ring 150 are seam-welded to seal the package 100. Thereby, the electronic component E
P is hermetically sealed.

Next, a method of manufacturing the package 100 of the present embodiment will be described. First, a ceramic green sheet mainly composed of alumina ceramic is formed by a known method, punched into a predetermined shape, and a metal paste layer having a predetermined pattern mainly composed of tungsten is formed by printing. In this embodiment, as shown in FIG. 4, a ceramic green sheet (hereinafter, also simply referred to as a sheet) 21 is used.
0, 230, 250 and 260 are prepared. Here, a metal paste layer 221 is formed on the upper surface 212 of the sheet 210. The sheet 230 has a through-hole 233 penetrating between the lower surface 231 and the upper surface 232, and the metal paste layer 241 is formed on the upper surface 232. The sheet 250 has a lower surface 251 and an upper surface 252.
Is formed. Further, a through hole 263 penetrating between the lower surface 261 and the upper surface 262 is formed in the sheet 260.
Has a metal paste layer 271 formed thereon. In addition,
From these sheets 210 and the like, a plurality of packages 10
0 is formed.

Next, in the laminating step, as shown in FIG. 5, these sheets 210, 230, 250, 260
Are aligned in order to form a stacked body 280 in which four layers of sheets are stacked. This laminate 280
A peripheral portion 283 and a concave portion 284 surrounded by the peripheral portion 283 are formed between the lower surface 281 and the upper surface 282.

Further, a pressure bonding step (a step of forming an unfired convex portion)
At this time, as shown in FIG.
K is placed so that the upper surface DKA and the lower surface 281 of the stacked body 280 are in contact with each other. Next, the pressing plate PR made of stainless steel is placed on the laminate 280, and the lower surface P of the pressing plate PR is placed.
The RA is brought into contact with the upper surface 282 of the stacked body 280. The pressing plate PR has a through hole PR penetrating between the lower surface PRA and the upper surface PRB at a position corresponding to the concave portion 284 of the laminate.
C is perforated by etching from both sides. Further, an opening PRR having a depth of about 0.2 mm is formed in the lower surface PRA by half etching at a position facing the metal paste layer 271 formed on the upper surface 281 of the peripheral portion 283. As shown in FIG. 6, the opening PRR is formed at a position slightly inward (toward the concave portion 284, right side in FIG. 6) with respect to the metal paste layer 271, and surrounds the periphery of the through hole PRC. Is formed. Further, the through-hole PRC is formed slightly smaller than the concave portion 284, and has a size such that the pressing plate PR projects about 0.1 to 0.2 mm inward (right side in the figure) from the concave portion 284.

Thereafter, a flexible rubber having a very low rubber hardness,
For example, a rubber sheet RB made of silicon rubber is placed on the pressing plate PR, and pressure is applied between the table DK and the rubber sheet RB. Then, the rubber sheet RB presses the peripheral portion 283 of the laminate 280 via the pressing plate PR. Thereby, the metal paste layer 271 is pressed by the pressing plate PR. At the same time, the rubber sheet RB passes through the through hole PRC of the pressing plate PR and enters the concave portion 284 of the laminate 280, and the inner wall of the concave portion 284 and the metal paste layers 221, 24
Press 1 or the like. For this reason, the laminated body 280 is pressed uniformly, and the sheets 210 and 230 and the like are brought into close contact with each other and integrated. Note that, as described above, the pressing plate PR is
4, the pressure of the rubber sheet RB is prevented from concentrating on the inner corner 285 of the peripheral portion 283, and this portion is prevented from being rounded, and the shape of the peripheral portion 283 (the inner corner 285) is reduced. Can be maintained with high accuracy. Then, FIG.
Then, a break blade is inserted along a cutting line SL indicated by a dashed line to form break grooves 298 and 299 (see FIG. 7). In addition, you may cut | disconnect along the cutting line SL.

The compression bonding is performed as described above, and the compression bonding laminate 290 shown in FIG. 7 is formed. This crimped laminate 290
A peripheral portion 293 and a concave portion 294 surrounded by the peripheral portion 293 are formed between the lower surface 291 and the upper surface 292. Further, the press-bonded laminate 290 has a peripheral portion 29.
An unfired raised portion 295 is formed on the upper surface 292, which is the top surface of No.3. The metal paste layer, that is, the unsintered metallized layer 296 is also formed with unsintered convex portions 297 having a height of about 30 μm that swell along the unsintered raised portions 295. The unfired raised portion 295 and the unfired convex portion 2
Reference numeral 97 is formed at a position corresponding to the opening PRR of the pressing plate PR. In the pressure bonding step, the peripheral portion 2 of the laminate 280
When the pressing plate 83 is pressed by the pressing plate PR, no pressing force is applied to a portion of the metal paste layer 271 and the peripheral portion 283 corresponding to the opening PRR. For this reason, the metal paste layer 271 and the peripheral portion 283 are deformed so as to enter the opening PRR, and after the pressing plate PR is removed after the pressing step, the unfired raised portion 295 and the unfired convex portion 297 are formed.
Is considered to have appeared.

Next, the pressure-bonded laminated body 290 including the unfired metallized layer is simultaneously fired by a known method, and is broken along the break grooves 298 and 299. Thus, the ceramic package 100 (see FIG. 1) having the raised portions 112 corresponding to the unfired raised portions 295 and the convex portions 132 having a height of about 20 μm corresponding to the unfired raised portions 297 can be formed.

As described above, in the present embodiment, the unfired convex portion 297 and therefore the convex portion 132 can be formed without printing the metal paste a plurality of times with different print patterns. Further, in the present embodiment, by using the pressing plate PR, in the pressing step of pressing the respective sheets 210, 230, etc., the pressing of the respective sheets 210, etc., and the unfired raised portion 2 are performed.
95 and the formation of the unfired convex portion 297 were simultaneously performed. Therefore, there is no need to separately provide a special step for forming the unfired convex portion 297 (the convex portion 132), and the convex portion can be formed easily and inexpensively.

In the above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to the above-described embodiments, and it is needless to say that the present invention can be appropriately modified and applied without departing from the gist of the present invention. Nor. In the above embodiment, as described above, the convex portion 132 is formed in a substantially rectangular shape in an annular shape. However, in order to form a gap between the lower surface 151 of the sealing ring 150 and the metallized layer 131, the protrusion 13
It is not necessary to form 2 in an annular shape. Therefore, a part of the metallization layer 131 formed in a substantially rectangular shape in the circumferential direction includes:
There may be a portion where the projection 132 is not formed. For example, the protrusion 132 may be formed intermittently in a broken line shape. However, the silver brazing material 160 is more likely to be insufficient in the portion where the convex portion 132 is not formed than in the portion where the convex portion 132 is formed, and a communication hole for communicating bubbles and the inside and outside is formed in the silver brazing material. There is a possibility that sealing failure may occur. Therefore, as in the above embodiment, the protrusion 13
Preferably, 2 is formed in a ring shape.

In the above embodiment, the convex portion 132 is formed in a substantially rectangular shape, that is, a square frame shape, and the distance between the inner wall surface 113 and each side of the convex portion 132 is equal.
However, the protrusion 132 may have an appropriate shape such as meandering. However, as in the above embodiment, the inner wall surface 1
13 and the protrusion 132 are constant, the protrusion 132
Since the amount of the silver brazing material 161 that accumulates further inside hardly changes in the circumferential direction, sagging hardly occurs inside or outside the brazing material.

In the above embodiment, a metal paste layer (unfired metallized layer) 271 is provided in advance on the laminate 280, and the laminate 280 is pressed with the pressing plate PR at the same time when the laminate 280 is pressed, so that the unfired raised portion 295 is formed. At the same time, an unfired convex portion 297 was formed on the unfired metallized layer 296, and was simultaneously fired to form the convex portion 132. However, the projection 132 may be formed by another procedure. For example, the laminate 2
80, the unsintered metallized layer is not formed in advance on the upper surface 282 which is the top surface of the peripheral portion 283, and the unsintered raised portion 295 is formed by pressing with the pressing plate PR at the same time as the pressing, and then the metal paste is formed. It may be applied to the upper surface 292 of the peripheral portion 293 of the pressure-bonded laminate 290, and then fired simultaneously. Alternatively, after the pressure-bonded laminated body 290 is once fired, a metal paste is applied to the protruding portion 112 of the package, and then fired again to form the convex portion 132. However, separately printing on the top surface of the peripheral part of the pressure-bonded laminate increases the number of steps and makes it difficult to perform positioning. In addition, it is difficult to print on the top surface of the peripheral portion of the press-bonded laminate having the unsintered ridges and swells, and the printing thickness of the unsintered ridges is reduced. Height tends to be low.
Therefore, it is preferable to form an unfired metallized layer in advance as in the present embodiment.

In the above-described embodiment, in the pressing step, the sheets 210 and the like are pressed and the unfired raised portions 295 and the unfired convex parts 297 are formed. After that, the unfired raised portions 295 and the unfired convex portions 297 can also be formed by pressing using a separate pressing plate PR. However, since additional steps are added, it is preferable to form an unfired raised portion and an unfired convex portion simultaneously with the press bonding as in this embodiment.

Further, in the above embodiment, the pressing plate PR having the opening PRR formed by half-etching is used. However, if the rubber sheet RB does not enter, the lower surface PRA of the pressing plate PR is used as the opening PRR. A through-hole penetrating between the upper surface and the upper surface PRB may be used. Also,
The pressing plate can be formed by pressing or electric discharge machining in addition to forming a through hole or an opening by etching.

Further, in the above embodiment, as shown in FIG. 3, the sealing ring 150 is fixed to the metallized layer 131 of the package 100 shown in FIGS. The case where the metal lid LD is sealed to the sealing ring 150 is illustrated. However, after mounting the electronic component on the package 100, the metal or ceramic lid can be directly sealed to the metallized layer 131 using a solder, a brazing material, or an adhesive. Also in this case, since the metallization layer 131 has the protrusion 132,
Solder or the like can be accumulated in the gap between the lid and the metallized layer 131, and the meniscus surface can be enlarged, so that the lid can be firmly and airtightly bonded to the metallized layer.

[Brief description of the drawings]

FIG. 1 is a plan view of a ceramic package according to a first embodiment.

FIG. 2 is a partially enlarged cross-sectional view of the ceramic package according to the first embodiment as seen from PP ′ in FIG. 1;

FIG. 3 is a partially enlarged end view showing a state in which a sealing ring is joined to the ceramic package according to the first embodiment and electronic components are mounted.

FIG. 4 is an explanatory view showing a ceramic green sheet before lamination in a manufacturing process of the ceramic package according to the first embodiment.

FIG. 5 is an explanatory view showing a state in which the ceramic green sheets shown in FIG. 4 are stacked in the process of manufacturing the ceramic package according to the first embodiment.

FIG. 6 is an explanatory view showing a pressure bonding step of pressing the laminate shown in FIG. 5 and pressing each ceramic green sheet in the manufacturing steps of the ceramic package according to the first embodiment.

FIG. 7 is an explanatory view showing a pressure-bonded laminate formed through a pressure-bonding step shown in FIG. 6 in a manufacturing process of the ceramic package according to the first embodiment.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Ceramic package 101 Lower surface 102 Upper surface 110 Peripheral portion 111 Top surface of peripheral portion 112 Ridge portion 120 Component accommodating recess 122 Step 131 Metallization layer 132 Convex portion 150 Sealing ring 160 Brazing material 210, 230, 250, 260 Ceramic green sheet 221, 241 Metal paste layer 271 Metal paste layer (unfired metallized layer) 280 Laminated body (unfired ceramic body) 281 Lower surface of laminated body 282 Upper surface of laminated body (top surface) 283 Peripheral part of laminated body 290 Crimped laminated body 292 Upper surface (top surface) of pressure-bonded laminate 293 Peripheral portion of pressure-bonded laminate 295 Unfired raised portion 296 Unfired metallized layer 297 Unfired convex portion CL Center line in width direction EP Electronic component LD lid PR Press plate (press tool) PRA Lower surface (contact surface) PRR Opening of pressing tool RB flexible rubber

Claims (8)

[Claims] 1. A ceramic package which has a peripheral portion made of ceramic and forms a periphery of a component accommodating concave portion, and has an annular metallized layer surrounding the component accommodating concave portion on a top surface of the peripheral portion. A part of the top surface has a raised part that is partially raised by deformation due to the pressing before firing, and at least a part of the annular metallized layer in the circumferential direction includes the raised part. A ceramic package having a protruding portion that is partially raised in the width direction. 2. A ceramic package having a peripheral portion made of ceramic and surrounding a component-receiving recess, and comprising an annular metallization layer surrounding the component-receiving recess on a top surface of the peripheral portion, wherein the peripheral portion is formed after firing. The unfired peripheral portion and the unfired metallized layer that becomes the annular metallized layer after firing are deformed by pressing unevenly from the unfired metallized layer side,
An unfired raised portion that is partially raised on a part of the top surface of the unfired peripheral portion, and at least a portion in the circumferential direction of the annular metalized layer, a portion in the width direction along the unfired raised portion. A ceramic package comprising a non-sintered convex portion that rises up and formed and fired to form a raised portion in the peripheral portion and a convex portion in the metallized layer. 3. The ceramic package according to claim 1, wherein the raised portion and the convex portion have an annular shape surrounding the component housing concave portion. 4. The ceramic package according to claim 3, wherein the annular convex portion is located on the component housing concave side with respect to a center line in a width direction of the annular metallized layer. 5. A method for manufacturing a ceramic package, comprising: laminating a plurality of ceramic green sheets each formed into a predetermined shape in a predetermined order, and having an unfired peripheral portion surrounding a component receiving recess. A laminating step of forming a laminate having an annular unfired metallized layer surrounding the component accommodating recess on the top surface of the unfired peripheral portion; and pressing the laminate to bring the plurality of ceramic green sheets into close contact with each other. In the pressure bonding step of forming a pressure-bonded laminate, the unfired metallized layer and the unfired peripheral portion are pressed unevenly from the unfired metallized layer side to a part of the top surface of the unfired peripheral portion. Unfired raised portion that partially rises, and a pressure bonding step of forming an unfired convex portion that partially rises along the unfired raised portion on a part of the unfired metallized layer, Method of manufacturing a ceramic package that includes. 6. The method for manufacturing a ceramic package according to claim 5, wherein, in the pressing step, the unfired metallized layer and the unfired peripheral portion have an opening that opens to a part of a contact surface. With a pressing tool, the contact surface is pressed against the unfired metallized layer, and the unfired raised portion is positioned at a position corresponding to the opening on the top surface of the unfired peripheral portion, and And a method of manufacturing a ceramic package, wherein the unfired convex portion is formed at a position corresponding to the opening in the unfired metallized layer. 7. A method for manufacturing a ceramic package, comprising: an unsintered peripheral portion surrounding a component accommodating recess; and an annular unsintered metallized layer surrounding the component accommodating recess on a top surface of the unsintered peripheral portion. Of the unsintered ceramic body, the unsintered metallized layer and the unsintered peripheral portion are pressed unevenly from the unsintered metallized layer side, and partially rise on the top surface of the unsintered peripheral portion. Manufacturing of a ceramic package including an unsintered convex portion forming step of forming an unsintered raised portion and forming an unsintered convex portion that partially swells along the unsintered raised portion on a part of the unsintered metallized layer. Method. 8. The method for manufacturing a ceramic package according to claim 7, wherein, in the step of forming the unfired convex portion, the unfired metallized layer and the unfired peripheral portion are opened to a part of the contact surface. With a pressing tool having an opening, the abutting surface is pressed against the unfired metallized layer and pressed, and the unfired raised portion is located at a position corresponding to the opening on the top surface of the unfired peripheral portion. And a method of manufacturing a ceramic package, wherein the unfired convex portion is formed at a position corresponding to the opening in the unfired metallized layer.