JP2001338942A - Method for sucking and arranging small metal balls and its apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for suction and arrangement and its apparatus having a comparatively simple configuration but allowing a suction nozzle of a suction jig to suck small metal balls in a arranged state. SOLUTION: A suction arrangement apparatus 20 for making the suction jig 10 that sucks the small metal balls B and mounts them on a predetermined position for a work-piece P suck the small metal balls B in the arranged state is characterized by comprising a container 15 that accommodates the small metal balls B, an adhesion means for making an opening edge of the container 15 adhere to a suction face 11 of the suction jig 10, a vacuum suction means for vacuuming a vacuum chamber 13 connecting with a suction hole 12 so as to make the suction hole 12 of the suction jig 10 suck the small metal balls B, and a vertically moving means 22, 23 for making the container 15 and the suction jig 10 vertically move in the state of adhering each other while vacuuming the vacuum chamber 13 by the vacuum suction means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which minute metal balls such as solder balls are suctioned in a state of being aligned and conveyed.
For example, the present invention relates to a suction aligning method and apparatus for sucking fine metal spheres in an aligned state on a suction jig for mounting on a predetermined position of a work such as a semiconductor chip or a circuit board.

[0002]

2. Description of the Related Art On a work such as an electrode of a semiconductor chip,
In order to dispose minute metal spheres such as solder balls, a suction jig having a lower surface for sucking the minute metal spheres using a vacuum suction force is used. JP-A-58-11813
No. 1 discloses an invention relating to this kind of suction jig. In this invention, a solder ball in a solder ball container is sucked using a suction jig, and this is fixed to a predetermined position of a semiconductor chip, for example. Then, the vacuum suction force for suction is released, and the electromagnet mounted on the suction jig is urged to lower the lower wall of the suction jig (the wall for sucking the minute metal sphere). It is taught to vibrate and thereby drop a minute metal sphere.

Conventional methods for adsorbing fine metal spheres in such an adsorbing jig in an aligned state are roughly classified into the following three methods as shown in FIGS. 1, 2 and 3. The first method is to make the solder balls jump in the container.Specific examples include blowing gas upward from the bottom of the solder ball container to blow up the solder balls in the container, or as shown in FIG. As shown in FIG. 1, a vibration generator 2 is provided at the bottom of a container 1, and the vibration generator 2
By vibrating the solder ball B in the container 1 by vibrating the solder ball B up and down, the solder ball B jumps in the container and is taken into the suction hole 4 of the suction jig 3 for vacuum suction (Japanese Patent Application Laid-Open No. H10-74767). Gazette, JP-A-8-264930
Reference).

[0004] In a second method, as shown in FIG.
By rotating the solder ball B in the container 1 in the vertical plane about the axis 7 while maintaining the state in which the suction surface 6 of the suction jig 3 is in close contact with the opening edge 5 of the suction jig 3 While being rolled and flown on the alignment surface 6 (adsorption surface), it is taken into each adsorption hole 4 one by one.

[0005] A third method is as shown in FIG.
A gas supply device 8 is provided at the bottom of the container, a gas is supplied to the layer of the solder balls B in the container 1 by the gas supply device 8, and this layer is brought into a fluidized state. And into each of the suction holes 4 (Japanese Patent Laid-Open No. 8-64944).
Reference).

In the first method, the solder ball B jumping in the container 1 and approaching the suction hole 4 is taken into the suction hole 4, but the density of the solder ball B near the suction hole 4 is reduced. Therefore, it takes a long time to take in the solder balls B into all the suction holes 4.

According to the second method, the solder balls B can be sucked in all suction holes 4 of the suction jig 3 in a reliable and aligned state, but both are held while the container 1 is kept in close contact with the suction jig 3. It requires time and equipment to rotate them together, and this equipment is also expensive.

In the third method, it is necessary to put a large amount of solder balls B in the container 1, and a gas for fluidizing the solder ball layer and the upper surface of the fluidized solder ball layer are detected. For example, there is a problem that a device configuration is complicated, for example, a sensor is required.

[0009]

SUMMARY OF THE INVENTION The present invention is directed to a method and apparatus for adsorbing and aligning small metal spheres in an adsorbing hole of an adsorbing jig with a relatively simple structure. The task is to provide.

[0010]

According to the present invention, in order to solve the above-mentioned problems, the fine metal spheres are arranged on a suction jig for sucking the fine metal spheres and mounting the same at a predetermined position on a work. A method for adsorbing in a state, wherein the container containing the micro metal spheres is closely attached to the suction surface of the suction jig or is engaged with a gap smaller than the diameter of one micro metal sphere, A step of vertically moving the suction jig and the container in close contact or engaging with a gap smaller than the diameter of one minute metal ball while vacuum-suctioning the suction hole opened on the suction surface of the suction jig; Is provided.

Further, according to the present invention, there is provided a suction aligning apparatus for sucking the fine metal spheres in a state where the fine metal spheres are aligned on a suction jig for sucking the fine metal spheres and mounting the same at a predetermined position on a work. And a container for accommodating the fine metal spheres, and an opening / closer for bringing the opening edge of the container into close contact with the suction surface of the suction jig or a gap smaller than the diameter of one fine metal sphere.
Engaging means, vacuum suction means for vacuum-suctioning a vacuum chamber communicating with the suction hole in order to make the minute metal spheres suck in the suction hole of the suction jig, and vacuuming the vacuum chamber by the vacuum suction means. Up / down moving means for vertically moving the container and the suction jig in close contact with each other or with a gap smaller than one minute metal ball while sucking the suction jig. Is provided.

Further, according to the present invention, there is provided a method for adsorbing a minute metal sphere in an aligned state on an adsorption jig for adsorbing the minute metal sphere and mounting the same at a predetermined position on a work, After the suction jig is relatively moved in a horizontal direction on the container containing the micro metal spheres, the container is raised so as to approach the suction surface of the suction jig, and then the raising operation is rapidly performed. The method according to claim 1, wherein the micro metal spheres are suspended in the container by stopping the suction, and the micro metal spheres are suctioned by vacuum-suctioning the suction holes formed in the suction surface of the suction jig. Is provided.

Further, according to the present invention, there is provided a suction aligning apparatus for sucking a fine metal sphere in a state where the fine metal sphere is aligned with a suction jig for sucking the fine metal sphere and mounting the same at a predetermined position on a work. A container containing the fine metal spheres, lifting means for raising the container so as to approach the suction surface of the suction jig, and a lifting operation when the container approaches the suction surface of the suction jig. Suction means for suddenly stopping the apparatus, and vacuum suction means for vacuum-suctioning a vacuum chamber communicating with the suction hole for sucking the minute metal spheres into the suction hole of the suction jig. An alignment device is provided.

The fine metal spheres to be suction-aligned in the present invention include not only solder balls but also fine spheres made of various metal alloy materials, microspheres around which plastic spheres are coated with a metal alloy material, and the like.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described based on preferred embodiments. This example is
For example, suction and alignment are performed to suck the solder balls in a state where the solder balls are securely and aligned with a minute metal ball for forming a protruding electrode (bump) on a substrate or a semiconductor chip, that is, a suction jig for sucking the solder balls. Things.

FIGS. 4 and 5 are diagrams for explaining the basic concept of the first embodiment of the present invention. FIG.
A preparation step for causing the suction jig 10 to suck the solder ball B will be described. As is known, the suction jig 10 has a large number of suction holes 12 on its suction surface 11, and the suction holes 12 communicate with a closed vacuum chamber 13 inside the suction jig 10. The chamber 13 is connected to a vacuum source (for example, a blower) (not shown) through a port 14. Solder ball B is container 1
5, the upper edge 16 of the solder ball container 15 is brought into close contact with the suction surface 11 of the suction jig 10.

FIG. 5 shows the next step following the step of FIG. In this step, the suction jig 10 and the solder ball container 15 are shaken up and down in this state while being in close contact with each other while vacuum suction is performed through the port 14 of the suction jig 10. As a result, the solder balls B in the solder ball container 15 are in a floating state, and the solder balls B approaching the suction surface 11 of the suction jig 10 are taken into the suction holes 12 and
It is adsorbed on 2. In the process shown in FIG. 5, that is, when the suction jig 10 and the container 15 are moved up and down together, the acceleration / deceleration is desirably equal to or greater than the gravitational acceleration to obtain the effect of the present invention.

FIGS. 6 and 7 show a suction aligning apparatus according to a preferred embodiment of the present invention. 6 shows a station for sucking the solder balls B in the container 15 by the suction jig 10, and FIG. 7 shows a station for mounting the solder balls B transported by the suction jig 10 on the substrate P or the like.

The suction aligning device 20 has a column 21. The column 21 is provided with a ball screw 22 extending in the vertical direction and a servomotor 23 for rotating the ball screw 22 in both forward and reverse directions. An arm 24 is engaged with the ball screw 22. The arm 24 is raised by forward or reverse rotation of the ball screw 22, and is lowered when the ball screw 22 rotates in the opposite direction.

The suction jig 10 with the suction surface 11 facing downward is fixed to the arm 24. As shown in FIG. 6, the suction station includes a base 30 and a base 30.
A rod 32 inserted vertically into a through hole 31 formed in a vertical direction, a base plate 33 fixed to an upper end of the rod 32, a base plate 33 and a base 3
The compression spring 34 is disposed between the base plate 33 and the container 15 containing the solder balls B.

When the suction aligner 20 moves to the suction station (FIG. 6), the arm 24, that is, the suction jig 1 is moved.
Decrease 0. The lowering operation of the suction jig 10 is continued even after the suction surface 11 of the suction jig 10 comes into contact with the upper opening edge 16 of the container 15 on the base plate 33, and resists the spring force of the compression spring 34. The container 15, that is, the base plate 33 is pushed down.

Next, the suction jig 10 is moved up and down while keeping the suction jig 10 in close contact with the container 15 by repeatedly rotating the servomotor 23 forward and backward while vacuum-sucking through the port 14 of the suction jig 10. With this vertical movement, the solder balls B in the container 15 float, and the solder balls B approaching the suction jig 10 are taken into the suction holes 12 of the suction jig 10 and sucked. In the process, when the acceleration is increased when the suction jig 10 and the container 15 are raised and lowered by the servomotor 23, the container 15
Since the density of the solder balls B floating in the upper region of the inside increases (FIG. 8), the probability of taking the solder balls B into all the suction holes 12 increases.

When the above operation is completed, the suction aligner 2
No. 0 raises the arm 24, that is, the suction jig 10 to release the suction jig 10 from engagement with the container 15, and then moves to the mounting station in FIG. When the suction jig 10 reaches a position above the substrate P, the arm 24 is lowered to position the suction jig 10 at a position adjacent to the substrate P. Next, the vacuum of the vacuum chamber 13 is released to the atmosphere or the air is blown into the vacuum chamber 13 through the port 14 of the suction jig 10 to release the suction force for holding the solder ball B. As a result, the solder balls B fall from the suction jig 10 toward the substrate P (the mounting of the solder balls B on the substrate P).

As shown in FIG. 9, the suction aligning device 20 may move the arm 24 up and down by a vertical drive mechanism 35 having a linear motor instead of the servo motor 23, as shown in FIG. As described above, the arm 24 may be moved up and down by the cam mechanism 36. The cam mechanism 36 includes, for example, a cam 38 that rotates around a shaft 37, a cam follower 39 that contacts the cam surface of the cam 38, and a spring 40 that urges the cam follower 39 toward the cam surface. And cam follower 3
9 is attached to the base 41 of the arm 24, and this base 4
1 may slide on a guide surface (not shown) extending in the vertical direction.

As shown in FIG. 11, a pair of parallel link members 46 and 47, which are vertically separated from each other, are attached to the vertical plane of the machine frame 45 as the suction aligning device 20. The other end may be attached to an upright member 48 extending vertically upward from the main body of the suction jig 10. When one of the link members 46 (or 47) is rotated by a motor (not shown), the suction jig 10 in close contact with the container 15 rotates in a vertical plane, whereby the container 15 is substantially moved up and down. Then, the solder balls B in the container 15 float in the container 15. Further, as shown in FIG. 12, the suction aligning device 20 may be configured such that the suction jig 10 and the container 15 are freely dropped in a state of being in close contact with each other, and the solder balls B in the container 15 are moved upward.

The suction jig 10 attached to the suction aligning device 20
As shown in FIGS. 12 and 13, a groove 50 extending in the circumferential direction is provided on the surface of the opening edge of the container 15, and the port 50 is evacuated from the port 51 by vacuum suction as shown in FIGS. Alternatively, the container 15 may be brought into close contact with the suction jig 10. As another adhesion means, FIG.
As shown in FIG. 3, permanent magnets 53 are arranged on the surface of the opening edge of the container 15 so as to extend in the circumferential direction or to be spaced apart from each other in the circumferential direction. Good.

As shown in FIG. 15, the suction jig and the ball container may be moved up and down while maintaining a clearance smaller than the diameter of one solder ball.

Next, a second embodiment of the present invention will be described based on a preferred embodiment. In this embodiment, similarly to the above embodiment, for example, a fine metal sphere for forming a protruding electrode (bump) on a substrate or a semiconductor chip or the like, that is, a metal jig for sucking a solder ball is securely and aligned in a suction jig. This is to perform suction alignment for sucking the solder balls.

FIG. 16 is a diagram for explaining the basic concept of the second embodiment of the present invention. Suction jig 60
Has a large number of suction holes 62 on its suction surface 61, as in the above-described embodiment.
The vacuum chamber 63 communicates with a vacuum source (for example, a blower) (not shown) through a port 64. Solder ball B is ball container 6
5. FIG. 16 shows a state when the ball container 65 is lowered, and shows a state when the ball container 65 is raised. In the present embodiment, the suction jig 6
0 is located on a different place from the ball container 65, the suction jig 60 is relatively moved in the horizontal direction to
After the suction jig 60 is positioned above the
5 is raised so as to approach the suction jig 60, and then the ball container 65 is suddenly stopped, so that the solder balls B
The solder ball B is floated by using the inertia force of (1), and the solder ball B is sucked by vacuum suction into the suction hole 62 opened on the suction surface 61 of the suction jig 60. The rising speed of the ball container 65 depends on the height at which the solder ball B is to be jumped up (FIG. 1).
6 so that the upper layer of the solder balls in the state of the container 65 described below reaches the surface of the suction jig 60 as shown in the state of the container 65 on the upper side.

FIG. 17 shows a suction aligning apparatus according to a preferred embodiment of the present invention. This suction aligning device includes a solder ball mounting station similar to that shown in FIG. 7 described above together with the suction station.

The suction aligning device 70 has a column 71, and the column 71 is provided with a ball screw 72 extending in the vertical direction and a servomotor 73 for rotating the ball screw 72 in both forward and reverse directions. An arm 74 is engaged with the ball screw 72. The arm 74 is raised by forward rotation or reverse rotation of the ball screw 72, and is lowered when the ball screw 72 rotates in the opposite direction.

A suction jig 60 with the suction surface 61 facing downward is fixed to the arm 74. Also, the support 71
A stopper 75 for stopping the lifting of the ball container 65 suddenly is attached to the lower side. This stopper 75
Is provided so that a clearance smaller than the diameter of one solder ball is opened between the suction container 60 and the suction jig 60 when the ball container 65 is stopped. In this case, the floating solder balls B do not scatter outside the ball container 65.
On the other hand, the ball container 65 is placed on a base 76,
A rod 77 is connected to the lower part of the ball 6, and the ball container 65 is vertically moved by an air cylinder 78 via the rod 77 and the base 76. The lateral movement of the base 76 and the rod 77 is restricted by support means (not shown).

In the suction aligner 70, at the suction station, as shown in FIG. 17, the air cylinder 78 operates to raise the container 65 via the rod 77 and the base plate 76. When the container 65 reaches the vicinity of the suction surface 61 of the suction jig 60,
The base plate 76 is stopped by hitting the stopper 75. At this time, the solder ball B is in a floating state due to its inertial force as shown in FIG. The solder ball B approaching the suction surface of the suction jig 60 is
2 and is adsorbed by the adsorption holes 62. After the suction, the suction jig 60 is moved to the solder ball mounting station by lowering the ball container 65. The operation in the solder ball mounting station is the same as in the above-described embodiment.

According to this embodiment, the density of the solder balls B around the suction holes 62 of the suction jig 60 increases, and the solder balls B are easily sucked. As a result, the time required for adsorption is reduced.
Further, after the ball container 65 is lifted, suddenly stopped, and lowered, the operation of moving the suction jig 60 up and down becomes unnecessary, and the suction jig 60 can be immediately moved to the solder ball mounting station. Work is possible. Therefore, the cycle time is greatly reduced, and the productivity is improved. Further, the amount of the solder balls B in the ball container 65 may be small, and the suction can be performed even if the bottom surface of the ball container is visible, so that the damage of the solder balls B can be reduced.

The example of the second embodiment is not limited to the above, and various modifications and changes are possible. First, the vertical movement of the ball container 65 may be a method using a motor and a ball screw or a method using a linear motor instead of using an air cylinder. As a method of suddenly stopping the ball container 65, instead of using a stopper, a method of suddenly decelerating using a servomotor may be used, or the suction jig 60 may be used as an alternative to the stopper. In this case, the suction jig 60 and the ball container 65 are completely adhered as shown in FIG. In addition, the clearance with the suction jig 60 when the rising of the ball container 65 is suddenly stopped is a clearance smaller than the diameter of one ball or no clearance in the above, but when scattering is not a problem, The clearance may be of any size.

In the embodiment of the second embodiment, the ball container 65 is raised with the suction jig 60 fixed on the ball container 65. However, when the ball container 65 is raised, the suction jig is lowered. You may do so.

Further, in the embodiment of the second embodiment, after the solder balls are adsorbed, the suction jig 60 is moved to the solder ball mounting station by lowering the container 65. May be raised and moved, or the suction jig 60 and the ball container 65 may be moved at the same time and then moved.

Further, in the second embodiment, FIG.
The vibration generator 80 may be attached to the suction jig 60 as shown in FIG. The vibration generator 80 may be mounted inside or outside the suction jig 60. The operation of the vibration generator 80 is controlled by a vibration generator control circuit 81. The timing of applying the vibration may be given continuously while the solder ball B is floating, may be given after the floating state of the solder ball B ends, or may be given after the solder ball B is floating. You may give it intermittently while you are there. By applying the vibration, it is possible to prevent a state where a plurality of solder balls B are attracted to one attracting hole 62. Therefore, thereby, the productivity can be further improved. As the vibration generator 80, in addition to the ultrasonic vibrator, various conventionally known vibration imparting means can be adopted.

Further, in the second embodiment, FIG.
A striking means 90 for striking the suction jig 60 as shown in FIG. In this example, an air cylinder is used as the striking means. When the hitting means 90 is provided, the state in which the solder balls B are stuck to each other and the solder balls B adhering to places not related to the suction holes 62 can be dropped by hitting, thereby reducing the number of retries (repeated suction work). Becomes possible. Therefore, this can further improve the productivity. Note that, in the example of FIG.
Although an air cylinder was used as 0, the invention is not limited thereto, and various known means for hitting the suction jig 60, such as a structure for dropping a weight, a method for hitting with the force of a spring, and the like, can be adopted.

[0040]

According to the first invention (corresponding to the first embodiment), the container containing the fine metal spheres is moved up and down in a state in which the container is in close contact with / engagement with the suction surface of the suction jig. The fine metal spheres in the inside are in a floating state, and the density of the fine metal spheres near the suction surface of the suction jig increases. As a result, the fine metal spheres tend to be taken into all the suction holes of the suction jig, and the fine metal spheres can be suctioned in a state where they are aligned with the suction holes of the suction jig. According to the second invention (corresponding to the second embodiment), the container containing the fine metal spheres is lifted so as to approach the suction surface of the suction jig, and then the lifting operation is suddenly stopped. Are in a floating state, and the density of the fine metal spheres in the vicinity of the suction surface of the suction jig increases as in the above case. As a result, the fine metal spheres tend to be taken into all the suction holes of the suction jig, and the fine metal spheres can be suctioned in a state where they are aligned with the suction holes of the suction jig. Therefore, according to these inventions, a very high-speed suction operation can be performed, the cycle time is significantly reduced, and the productivity is improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a conventional example of a form in which a fine metal ball is taken into a suction hole of a suction jig for vacuum suction by vibrating a container up and down to move a minute metal ball in the container.

FIG. 2 is an explanatory view of a conventional example in which a minute metal sphere in a container is taken into a suction hole by rotating in a vertical plane while maintaining a state in which a suction jig is kept in close contact with a container. .

FIG. 3 is an explanatory view of a conventional example of a type in which a gas is supplied into a container by a gas supply device, a solder ball layer is fluidized, and minute metal spheres in the container are taken into suction holes.

FIG. 4 is a diagram illustrating a state in which both a suction jig and a container for small metal spheres are brought into close contact with each other to explain the principle of the first embodiment of the present invention.

FIG. 5 is an explanatory view showing a state in which the suction jig and the container that have been brought into close contact with each other are moved up and down together with the state shown in FIG. 4 so as to float fine metal spheres in the container.

FIG. 6 is a configuration diagram of a suction alignment device of a preferred example according to the first embodiment of the present invention.

FIG. 7 is an explanatory view of a process in which a part of the suction aligning device shown in FIG. 6 laterally moves a suction jig and mounts a fine metal ball on a work such as a substrate.

FIG. 8 is an explanatory view showing a state in which the suction jig and the container that are brought into close contact with each other are moved up and down together to displace the fine metal spheres in the container upward.

FIG. 9 is a configuration diagram of a modified example of the suction alignment device according to the first embodiment of the present invention.

FIG. 10 is a configuration diagram of another modified example of the suction alignment device according to the first embodiment of the present invention.

FIG. 11 is a configuration diagram of another modified example of the suction aligning device according to the first embodiment of the present invention.

FIG. 12 is an explanatory diagram showing a modification of the suction alignment method according to the embodiment of the present invention.

FIG. 13 is a schematic configuration diagram of a modified example of a means for bringing a suction jig and a container into close contact with each other.

FIG. 14 is a schematic configuration diagram of another modification of the means for bringing the suction jig and the container into close contact with each other.

FIG. 15 is an explanatory diagram in the case where the suction jig and the container are moved up and down while maintaining a clearance smaller than the diameter of one solder ball.

FIG. 16 is a diagram for explaining the principle of the second embodiment of the present invention.

FIG. 17 is a configuration diagram of a suction alignment device of a preferred example according to the second embodiment of the present invention.

FIG. 18 is an explanatory diagram in a case where the suction jig is used as a stopper for suddenly stopping the upward movement of the ball container.

FIG. 19 is an explanatory view when a vibration generator of a suction jig is attached.

FIG. 20 is an explanatory view in the case where an air cylinder for hitting the suction jig is attached.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Suction jig 12 Suction hole 13 Vacuum chamber of a suction jig 14 Port connected to a vacuum chamber 15 Container 20 Suction alignment device 22 Vertically extending ball screw 23 Servo motor 24 Arm to which a suction jig is attached 30 Base 31 Base Through-hole 32 Rod 33 Base plate 34 Compression spring 35 Vertical drive mechanism with linear motor 36 Cam mechanism 50 Groove 51 Port 53 Permanent magnet B Solder ball 60 Suction jig 62 Suction hole 63 Vacuum chamber of suction jig 64 Leads to vacuum chamber Port 65 Container 70 Suction alignment device 72 Ball screw extending vertically 73 Servo motor 74 Arm with suction jig 75 Stopper 76 Base 77 Rod 78 Air cylinder 80 Vibration generator 81 Vibration generator controller 90 Blowing means (Air cylinder )

Claims (13)

[Claims] 1. A method for adsorbing minute metal spheres in an aligned state on a suction jig for adsorbing the minute metal spheres and mounting the minute metal spheres at a predetermined position on a workpiece, wherein the minute metal spheres are accommodated. Closely contacting the suction container with the suction surface of the suction jig or a gap smaller than the diameter of one minute metal ball, and then vacuum-suctioning the suction hole opened in the suction surface of the suction jig. A step of vertically moving the suction jig and the container in a state in which the suction jig and the container are brought into close contact with each other or engaged with a gap smaller than the diameter of one minute metal ball. 2. The suction alignment method according to claim 1, wherein the vertically moving step moves the suction jig and the container up and down at an acceleration equal to or higher than the acceleration of gravity. 3. A suction aligning device for sucking a minute metal sphere and holding the minute metal sphere in an aligned state on a suction jig for mounting the small metal sphere at a predetermined position on a workpiece, wherein the fine metal sphere is aligned. And a contact / engaging means for bringing the opening edge of the container into close contact with the suction surface of the suction jig or engaging with a gap smaller than the diameter of one minute metal ball, and the suction jig Vacuum suction means for vacuum-suctioning a vacuum chamber communicating with the suction hole in order to make the minute metal spheres suck in the suction hole of the container; and An up-and-down moving means for vertically moving the jig in close contact or engagement with a gap smaller than the diameter of one minute metal ball. 4. The suction aligning apparatus according to claim 3, wherein said vertical movement means includes a driving means comprising a cam mechanism for vertically moving said suction jig. 5. The vertical movement means includes a vertically extending ball screw engaged with an arm to which the suction jig is fixed, and a servo motor for rotating the ball screw in both forward and reverse directions. The suction aligning device according to claim 3, characterized in that: 6. The contact / engagement means includes a base, a vertical through-hole formed in the base, a rod vertically inserted into the through-hole, and a rod. A base plate fixed to an upper end, and a compression spring disposed between the base plate and the base; and a container containing the fine metal balls placed on the base plate; The suction aligning apparatus according to any one of claims 3 to 5, wherein the container is brought into close contact with the suction jig by pressing down the suction jig from above. 7. The suction aligning apparatus according to claim 3, wherein the close contact / engaging means is constituted by a magnet attached to a surface of an opening edge of the container. . 8. The container according to claim 1, wherein said contacting / engaging means comprises a groove extending in a circumferential direction opened on a surface of an opening edge of said container, and a port provided in said container and communicating with said groove and a vacuum suction source. The suction alignment device according to any one of claims 3 to 5, wherein: 9. A method for adsorbing fine metal spheres in an aligned state on a suction jig for adsorbing the fine metal spheres and mounting the fine metal spheres at a predetermined position on a workpiece, wherein the fine metal spheres are accommodated. After the suction jig is relatively moved in the horizontal direction on the container thus set, the container is lifted so as to approach the suction surface of the suction jig, and then the lifting operation is suddenly stopped, whereby minute A method for adsorbing and aligning minute metal spheres, wherein the metal spheres are floated in the container, and the suction holes formed in the suction surface of the suction jig are suctioned by vacuum. 10. The suction aligning device according to claim 9, wherein the suction jig is lowered during the lifting operation of the container. 11. A suction aligning device for sucking micro metal spheres and adsorbing the metal spheres in an aligned state on a suction jig for mounting the metal spheres at a predetermined position on a workpiece, wherein , A rising means for raising the container so as to approach the suction surface of the suction jig, and a quick stop means for suddenly stopping the raising operation when the container approaches the suction surface of the suction jig. And a vacuum suction means for vacuum-suctioning a vacuum chamber communicating with the suction hole in order to cause the minute metal sphere to be sucked into the suction hole of the suction jig. 12. The suction aligning apparatus according to claim 11, wherein a vibration applying means for applying vibration to the suction head is provided. 13. The suction aligning device according to claim 11, further comprising a hitting means for hitting the suction head.