JP2001236888A - Transfer film for forming dielectric layer, and manufacturing method for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer film for forming a dielectric layer, capable of forming an dielectric layer of which the uniformity of the film distribution is high and provide a manufacturing method to efficiently manufacture a plasma display panel with a dielectric layer, having a highly uniform film thickness distribution. SOLUTION: The transfer film for forming the dielectric layer is made, in such a manner that a film-forming material layer comprising a glass paste composition is formed on a supporting film. A dielectric layer is produced within the ±2 μm range for each film distribution in the average film thickness by burning the film forming material layer transferred from the transfer film on the surface of the base plate. A manufacturing method for the plasma display panel includes a manufacturing process, where the film forming material layer of the transfer film is transferred on the surface of the base plate for the plasma display panel and burned, to form the dielectric layer on the base plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a transfer film and a method for manufacturing a plasma display panel.

[0002]

2. Description of the Related Art In recent years, a plasma display has attracted attention as a flat fluorescent display device. FIG. 1 is a schematic diagram showing a cross-sectional shape of an AC type plasma display panel (hereinafter, also referred to as “PDP”). In this figure, 1 and 2 are glass substrates arranged to face each other,
Reference numeral 3 denotes a partition, which is divided by the glass substrate 1, the glass substrate 2, and the partition 3 to form cells. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 to reduce the resistance of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, 7
Is a fluorescent substance held in the cell, 8 is a dielectric layer formed on the inner surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, and 9 is an inner surface of the glass substrate 2 so as to cover the address electrode 6. Is a protective film made of, for example, magnesium oxide.

As a method for forming the dielectric layer 8, a paste-like glass paste composition containing a glass powder, a binder resin and a solvent is prepared, and the glass paste composition is applied to a glass substrate by, for example, a screen printing method. There is known a method in which a film-forming material layer is formed by applying the film-forming material to the surface of the glass substrate and drying, and the film-forming material layer is baked to remove an organic substance and to sinter the glass powder.

Here, in order to make the dielectric layer 8 have good transparency, that is, high light transmittance, it is necessary to sufficiently defoam the film forming material layer in the firing step.
In order to sufficiently defoam the film-forming material layer in the firing step, a glass powder having a low softening point is used as the glass powder of the glass paste composition, and firing is performed at a high temperature for a long time. It is preferable to make the fluidity of the film forming material layer high in the above.

The thickness of the film-forming material layer formed on the glass substrate 1 is determined in consideration of the amount of reduction in film thickness (reduction) due to the removal of organic substances in the firing step. It is necessary that the thickness of the dielectric layer 8 is about 1.3 to 2.0 times the thickness of the dielectric layer 8.
Is formed, the thickness of the film forming material layer is set to 30 to 10
It is necessary to be about 0 μm. On the other hand, when applying the glass paste composition by a screen printing method,
The thickness of the coating film formed by the number of coating steps is 15 to 2
It is about 5 μm. Therefore, in order to form a film-forming material layer having a required thickness, multiple printing is performed, that is, the glass paste composition is repeatedly applied to the surface of a glass substrate a plurality of times, for example, 2 to 7 times. There is a need.

However, in the case of forming a film forming material layer by multiple printing using a screen printing method,
The dielectric layer formed by firing the film forming material layer does not have a uniform film thickness, and the film thickness distribution with respect to the average film thickness cannot be within ± 5%. This is because it is difficult to uniformly apply the glass paste composition to the surface of the glass substrate in the multiple printing by the screen printing method, and the larger the application area (panel size), and the larger the number of application times. The more the thickness of the dielectric layer varies, the greater the degree of variation. And, in the panel material obtained through the application process by the multiple printing, that is, in the glass substrate having the dielectric layer, in the surface thereof, the dielectric characteristics are non-uniform due to the non-uniformity of the film thickness. This causes display defects such as uneven brightness in a PDP. Further, in the screen printing method, the mesh shape of the screen plate may be transferred to the surface of the film forming material layer, and the dielectric layer formed by firing such a film forming material layer has a smooth surface. Inferior to

As a means for solving the above-mentioned problems in the case where the film-forming material layer is formed by the screen printing method, the present inventors apply a glass paste composition on a supporting film, dry the coating film, and dry the coating film. Forming a film forming material layer on the support film, transferring the film forming material layer formed on the support film to the surface of the glass substrate to which the electrodes are fixed, and baking the transferred film forming material layer to form the glass forming material layer. A method of manufacturing a PDP including a step of forming a dielectric layer on the surface of a substrate has been proposed (see JP-A-9-102273).
According to such a manufacturing method, it is basically possible to form a dielectric layer excellent in uniformity of film thickness and surface uniformity.

Further, the present inventors have proposed a support film, a film-forming material layer obtained from a glass paste composition, and a film-forming material layer, which can be suitably used for forming a dielectric layer of PDP. A composite film formed by laminating a cover film easily provided on the surface of a forming material layer has also been proposed (Japanese Patent Application No. 9-1016).
No. 53). The composite film (transfer film) having such a configuration is also advantageous in that it can be wound into a roll and stored.

[0009]

As described above, in the conventional screen printing method, it is difficult to form a dielectric layer having high uniformity in film thickness due to the characteristics of the process. In a PDP provided with a dielectric layer having low uniformity of the film thickness, the dielectric constant, the luminance, the withstand voltage, and the like become non-uniform. As a result, a quality problem such as the occurrence of luminance unevenness in a display operation occurs. Cheap.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a transfer film for forming a dielectric layer capable of forming a dielectric layer having a highly uniform film thickness distribution. To provide. Another object of the present invention is to provide a PDP manufacturing method capable of efficiently manufacturing a PDP provided with a dielectric layer having a highly uniform film thickness distribution.

[0011]

The transfer film for forming a dielectric layer according to the present invention is a transfer film for forming a dielectric layer comprising a film forming material layer made of a glass paste composition formed on a support film. By firing the film forming material layer transferred from the transfer film to the surface of the substrate,
A dielectric layer having a film thickness distribution within a range of ± 2 μm with respect to the average film thickness is formed.

In the method of manufacturing a plasma display panel according to the present invention, the film-forming material layer of the transfer film is transferred to a surface of a substrate for a plasma display panel on which a dielectric layer is to be formed, and is baked. Forming a dielectric layer on the substrate.

[0013]

According to the above transfer film, a dielectric layer having a thickness distribution within a range of ± 2 μm with respect to the average film thickness is formed, so that the dielectric layer formed using this transfer film is provided. The resulting PDP is excellent in dielectric constant, luminance, dielectric strength and the like, does not cause display defects such as luminance unevenness due to uneven film thickness distribution, and therefore has high quality.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The transfer film of the present invention is formed so that the range of the thickness distribution of the dielectric layer obtained by transferring it to a substrate and firing is less than ± 2 μm with respect to the average thickness. It is necessary that a material layer is formed. The film thickness distribution of the dielectric layer depends on the film thickness reduction during firing and the film thickness distribution of the film forming material layer. In other words, the larger the amount of film reduction during firing, the more uniform the thickness of the dielectric layer after firing. In order to increase the amount of film loss during firing, it is effective to increase the amount of binder resin in the film forming material layer. However, if the amount of binder resin is too large, the firing residue and the like cause Quality may be impaired. In order to improve the film thickness distribution while maintaining the quality of the obtained dielectric layer, it is important to control both the amount of reduction in the film during firing and the control of the film thickness of the film forming material layer by a coating method or the like. Become. For example, when the amount of film reduction at the time of baking that varies depending on the amount of the binder resin is about 50%, the film thickness distribution of the film forming material layer is about ± 4 μm or less with respect to the average film thickness, and the above film reduction amount is about When the film thickness is 55%, the film thickness distribution of the film forming material layer is about ± 4.5 μm or less with respect to the average film thickness. It is necessary that the thickness is not more than about ± 6.7 μm.

Hereinafter, the structure of the transfer film of the present invention will be described in detail. <Transfer Film> FIG. 2A is a schematic cross-sectional view showing the transfer film of the present invention wound in a roll shape, and FIG. 2B is an enlarged view showing the layer structure of the transfer film. It is sectional drawing [partial detailed view of (X)]. The transfer film shown in FIG. 2 is a composite film used for forming a dielectric layer constituting a PDP,
1, a film-forming material layer F2 releasably formed on the surface of the support film F1, and a peelable cover film F3 provided on the surface of the film-forming material layer F2. . The cover film F3 may not be used depending on the properties of the film forming material layer F2 or for the purpose of reducing the weight of the roll around which the transfer film is wound. The surface of the support film F1 and the surface of the cover film F3 where the film forming material layer F2 is in contact may be subjected to a release treatment.

A support film F1 constituting a transfer film
Is preferably a resin film having flexibility as well as heat resistance and solvent resistance. When the support film F1 has flexibility, the transfer film can be wound in a roll shape, and thus, the storage and supply of the film forming material layer are facilitated. Examples of the resin forming the support film F1 include, for example, fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, and polyfluoroethylene;
Examples include nylon and cellulose. The thickness of the support film F1 is not particularly limited, but is, for example, 20 to 100 μm.

The film forming material layer F2 constituting the transfer film
Is a layer that becomes a glass sintered body that forms a dielectric layer when fired, and contains glass powder and a binder resin as essential components, and further contains various additives as necessary. The thickness of the film-forming material layer F2 varies depending on the content of the glass powder, the type and size of the panel to be produced, and is, for example, 5 to 200 μm, preferably 10 to 100 μm, and the thickness is 10 to 100 μm.
If it is μm, the thickness of the dielectric layer required for a large panel can be sufficiently secured. If the thickness is less than 5 μm, the thickness of the finally formed dielectric layer will be too small, and the desired dielectric properties may not be secured.

A cover film F constituting a transfer film
Reference numeral 3 denotes a film for protecting the surface of the film forming material layer F2, that is, the contact surface with the glass substrate. This cover film F3 is also preferably a resin film having flexibility. Examples of the resin forming the cover film F3 include the resins exemplified as those forming the support film F1. The thickness of the cover film F3 is, for example, 20 to 100 μm.

In the transfer film having the above structure, a film-forming material layer (F2) is formed on a support film (F1).
A cover film (F3) on the film forming material layer (F2)
Can be manufactured.

As a method for forming the film-forming material layer, a glass paste composition containing a glass powder, a binder resin, additives and a solvent which are added as required, is coated on the support film F1, and coated. A method of drying the film to remove part or all of the solvent can be used.

The glass paste composition that can be suitably used for producing the transfer film of the present invention will be described below.

<Glass Powder> The glass powder constituting the glass paste composition is not particularly limited, but preferably has a softening point in the range of 400 to 600 ° C. When the softening point of the glass powder is less than 400 ° C., the glass powder is melted at a stage where the organic substance such as the binder resin is not completely decomposed and removed in the firing step of the film forming material layer using the glass paste composition. Therefore, a part of the organic substance remains in the formed dielectric layer, and as a result, the dielectric layer tends to be colored and its transparency (high transmittance) tends to decrease. On the other hand, when the softening point of the glass powder exceeds 600 ° C., it is necessary to bake at a temperature higher than the softening point, so that the glass substrate is likely to be distorted. Specific examples of suitable glass powder component systems include lead oxide, boron oxide, and silicon oxide (P
bO—B ₂ O ₃ —SiO ₂ ) mixed substance system, zinc oxide, boron oxide, silicon oxide (ZnO—B ₂ O ₃ —S)
substance mixture based iO ₂ system), lead oxide, boron oxide, silicon oxide, aluminum oxide (PbO-B ₂ O ₃ -Si
O ₂ -Al ₂ O ₃ -based mixed material system, lead oxide, zinc oxide, boron oxide, silicon oxide (PbO-ZnO-B ₂₎
O ₃ can be exemplified a mixed substance based -SiO ₂ system).

<Binder Resin> The binder resin constituting the glass paste composition is preferably an acrylic resin.
By containing an acrylic resin as the binder resin, the formed film forming material layer exhibits excellent heat adhesion to the substrate. Therefore, when a transfer film is produced by applying the glass paste composition on a support film, the resulting transfer film has excellent transferability of the film-forming material layer, that is, excellent heat adhesion to the substrate. As the acrylic resin constituting the glass paste composition, glass powder having an appropriate tackiness can be bound and can be completely burned out and removed by a baking treatment of the film forming material at 400 ° C. to 600 ° C. ( (Co) polymers. Such acrylic resin includes a homopolymer of a (meth) acrylate compound represented by the following general formula (i), a copolymer of two or more (meth) acrylate compounds represented by the following general formula (i), And a copolymer of a (meth) acrylate compound represented by the following general formula (i) and a copolymerizable monomer.

[0024]

Embedded image

[In the formula, R ¹ represents a hydrogen atom or a methyl group, and R ² represents a monovalent organic group. ]

Specific examples of the (meth) acrylate compound represented by the general formula (i) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, and butyl ( (Meth) acrylate, isobutyl (meth)
Acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) Acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, Alkyl (meth) acrylates such as isostearyl (meth) acrylate; hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, Rokishipuropiru (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3
Hydroxyalkyl (meth) acrylates such as -hydroxybutyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate; phenoxyethyl (meth)
Phenoxyalkyl (meth) acrylates such as acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate; 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2
-Alkoxyalkyl (meth) acrylates such as propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate and 2-methoxybutyl (meth) acrylate; polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxy Polyethylene glycol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonylphenoxy polyethylene glycol (meth) acrylate, polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, nonylphenoxy Polyalkylenes such as polypropylene glycol (meth) acrylate Recol (meth) acrylate; cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, bornyl ( Examples thereof include cycloalkyl (meth) acrylates such as (meth) acrylate, isobornyl (meth) acrylate, and tricyclodecanyl (meth) acrylate; benzyl (meth) acrylate, and tetrahydrofurfuryl (meth) acrylate. Among these, in the above general formula (i), the group represented by R ² is preferably a group containing an alkyl group or an oxyalkylene group. As a particularly preferred (meth) acrylate compound, butyl (meth) acrylate , Ethylhexyl (meth) acrylate, lauryl (meth) acrylate, isodecyl (meth) acrylate and 2-ethoxyethyl (meth) acrylate.

The other copolymerizable monomer is not particularly limited as long as it is a compound copolymerizable with the above (meth) acrylate compound. Examples thereof include (meth) acrylic acid, vinylbenzoic acid, maleic acid, and the like. Unsaturated carboxylic acids such as vinyl phthalic acid; vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene,
Examples include vinyl group-containing radically polymerizable compounds such as butadiene and isoprene.

The content of the (meth) acrylate compound represented by the general formula (i) in the acrylic resin is at least 70% by mass or more, preferably 90% by mass.
It is above. In particular, a (co) polymer composed of only the (meth) acrylate compound represented by the general formula (i) is preferable. Here, specific examples of preferred acrylic resins include polymethyl methacrylate, polybutyl methacrylate, and methyl methacrylate-butyl methacrylate copolymer. The molecular weight of the acrylic resin is preferably 4,000 to 300,000 as a weight average molecular weight in terms of polystyrene by GPC (hereinafter, also simply referred to as “weight average molecular weight”),
More preferably, it is set to 10,000 to 200,000.

The content ratio of the binder resin in the glass paste composition is 5 to 4 with respect to 100 parts by weight of the glass powder.
0 parts by weight, more preferably 10 parts by weight.
To 30 parts by weight. If the ratio of the binder resin is too small, the glass powder cannot be securely bound and held. There is a possibility that the resulting dielectric layer of the glass sintered body does not have sufficient strength, and that the uniformity of the film thickness distribution is poor.

<Solvent> The glass paste composition contains a solvent. As the solvent, those having good affinity for glass powder and good solubility of the binder resin, capable of imparting appropriate viscosity to the obtained glass paste composition, and which can be easily evaporated and removed by drying. It is preferred that Specific examples of such a solvent include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone and cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol; Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether; alkyl saturated aliphatic monocarboxylates such as n-butyl acetate and amyl acetate Esters: ethyl lactate, lactic acid-
Lactic acid esters such as n-butyl; methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, ethyl-3-
Ether esters such as ethoxypropionate can be exemplified, and these can be used alone or in combination of two or more. From the viewpoint of maintaining the viscosity of the composition in a suitable range, the content of the solvent in the glass paste composition is preferably 40 parts by weight or less, more preferably 5 to 30 parts by weight, based on 100 parts by weight of the glass powder. Parts by weight.

The glass paste composition contains, in addition to the above essential components, a dispersant, a tackifier, a surface tension modifier,
Various additives such as a stabilizer and an antifoaming agent may be contained as optional components. As an example of a preferred composition for forming a dielectric layer, as an example of a glass paste composition, it contains 50 to 80% by mass of lead oxide, 5 to 20% by mass of boron oxide, and 10 to 30% by mass of silicon oxide. Glass powder 1
A composition containing 00 parts by weight, 10 to 30 parts by weight of polybutyl methacrylate, and 10 to 50 parts by weight of a solvent composed of propylene glycol monomethyl ether can be exemplified.

The glass paste composition can be prepared by kneading a glass powder, a binder resin, a solvent and optional components using a kneader such as a roll kneader, a mixer or a homomixer. The glass paste composition thus prepared needs to be in the form of a paste having fluidity suitable for application, and has a viscosity of usually 1,000 to 30,000 cp, preferably 3,0 cp. 000 to 10,000 cp.

As a method of applying the glass paste composition on the support film, it is preferable that the state of the application apparatus does not exert an influence of vibration or the like based on a mechanical element on the application head. A coating method, a coating method using a curtain coater, a coating method using a wire coater, a coating method using a fountain coater, and the like can be suitably used. Among these, in particular, the coating method using a fountain coater is excellent in surface smoothness and film thickness uniformity because a predetermined amount of a coating solution can be directly applied on a support film without recirculation. It is preferable in that a coating film is formed. In the application by the fountain coater, for example, the application is performed at a coating speed of 4 to 30 m / min with a paste discharge amount necessary to obtain a target film thickness.

The coating film of the glass paste composition formed on the support film is dried to remove part or all of the solvent, thereby forming a film forming material layer constituting the transfer film. Here, the drying conditions of the coating film are as follows:
For example, the temperature is set at about 40 to 150 ° C. for about 0.1 to 30 minutes. The residual ratio of the solvent after drying, that is, the content ratio of the solvent in the film forming material layer is usually 10% by mass or less,
From the viewpoint of exhibiting the adhesion to the substrate and the appropriate shape retention to the film-forming material layer, the content is particularly preferably 1 to 5% by mass.

The above transfer film is used, for example, by transferring a film-forming material layer on a support film to the surface of a glass substrate for a PDP on which a dielectric layer is to be formed. Therefore, the film forming material layer can be reliably formed on the glass substrate by a simple operation, so that the efficiency in the process of forming the dielectric layer constituting the PDP can be improved, and the dielectric layer has stable dielectric properties. A dielectric layer can be formed.

As described above, in the above-mentioned transfer film, the film forming material layer is transferred onto the substrate and baked, so that the film thickness distribution is within ± 2 μm of the average film thickness. PDP having a dielectric layer formed using such a transfer film as a result of reliably forming a layer
Has excellent dielectric constant, luminance, dielectric strength, and the like, and has high quality without display defects such as uneven luminance in a display operation. Further, in the above transfer film, when a glass paste composition as a film forming material is applied on a supporting film by a coating method using a fountain coater, the uniformity of the film thickness distribution can be achieved without complicated control. Therefore, it is possible to reliably form a film-forming material layer having a high transfer ratio, and thus to easily produce a transfer film having the above-described effects.

<Method of Manufacturing PDP (Formation of Dielectric Layer)>
According to the present invention, using the transfer film having the above structure, the film forming material layer is transferred to the surface of the glass substrate on which the dielectric layer is to be formed, and the transferred film forming material layer is fired. As a result, a dielectric layer is formed on the surface of the substrate.

An example of the step of transferring the film forming material layer when the transfer film having the structure shown in FIG. 2 is used is as follows. The transfer film wound in a roll shape is cut into a size corresponding to the area of the substrate. The film-forming material layer (F) in the cut transfer film
After peeling the cover film (F3) from the surface of 2),
The transfer film is overlaid so that the surface of the film-forming material layer (F2) is in contact with the surface of the substrate. A heating roller is moved on the transfer film superimposed on the substrate to perform thermocompression bonding. The film-forming material layer (F) fixed to the substrate by thermocompression bonding
The support film (F1) is peeled off from 2). By the operation as described above, the film forming material layer (F2) on the support film (F1) is transferred onto the substrate. Here, as the transfer condition, for example, the surface temperature of the heating roller is 60
~ 120 ° C, roll pressure by heating roller is 1 ~ 5kg /
cm ² , the moving speed of the heating roller is 0.2 to 10.0 m /
Minutes. Such a transfer operation can be performed by a normal laminator device. The substrate may be preheated, and the preheating temperature may be, for example, 40 to 100 ° C.

The film forming material layer (F) transferred to the surface of the substrate
2) is converted into an inorganic sintered body by firing, and a dielectric layer is formed. Here, as a firing method, a method in which the substrate on which the film-forming material layer (F2) is transferred and formed is placed in a high-temperature atmosphere can be mentioned. As a result, the organic substances contained in the film forming material layer (F2), for example, the binder resin, the residual solvent, and various additives are decomposed and removed, and the glass powder is melted and sintered. Here, the firing temperature varies depending on the melting temperature of the substrate, the constituents in the film-forming material layer, and the like, but is, for example, 300 to 800 ° C, and more preferably 400 to 600 ° C.

In the above, only a portion where the thickness distribution of the film forming material layer in the transfer film is extremely uniform is cut into a predetermined size, transferred to the surface of a glass substrate for PDP, and baked. A dielectric layer may be formed.

[0041]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited by these. In the following, “parts” indicates “parts by weight”. Preparation of <Example 1> (1) Glass paste composition: lead oxide 70 wt%, boron oxide 10 _{wt%, PbO-B 2 O 3} -SiO 2 based glass powder having a composition of silicon oxide 20 wt% ( Softening point 500 ° C) 100 parts, binder resin composed of polybutyl methacrylate (weight average molecular weight: 50,000)
By kneading 20 parts, a solvent composed of propylene glycol monomethyl ether 20 parts using a disperser,
A glass paste composition having a viscosity of 4,000 cp was prepared.

(2) Production of transfer film: A support film (width: 800) made of polyethylene terephthalate (PET), which is obtained by subjecting the composition prepared in the above (1) to release treatment in advance.
mm, length 1000 m, thickness 38 μm) using a fountain coater.
The solvent was removed by drying for 5 minutes while gradually increasing the temperature in a temperature range of 0 to 110 ° C., thereby forming a film forming material layer having an average film thickness of 50 μm on the support film. The film thickness distribution of this film forming material layer was in a range of ± 1 μm with respect to the average film thickness. Here, the application conditions of the glass paste composition were as follows: a coating speed of 10 m / min.
The coating was performed at a paste discharge amount necessary to obtain a target film thickness. Next, a cover film (width 800 mm, length 1
000 m, 25 μm in thickness) to produce a transfer film of the present invention having the configuration shown in FIG.

(3) Transfer of the film forming material layer: After the cover film is peeled off from the transfer film obtained in the above (2), the surface of the film forming material layer is applied to the surface of the glass substrate for a 20-inch panel. The transfer film (the laminate of the support film and the film-forming material layer) was overlapped so as to be in contact with each other, and the transfer film was thermocompression-bonded with a heating roll.
Here, the pressure condition is that the surface temperature of the heating roll is 1
At 10 ° C., the roll pressure was 3 kg / cm ² , and the moving speed of the heating roll was 1 m / min. After the completion of the thermocompression bonding, the support film was peeled off from the film forming material layer fixed (heat-bonded) to the surface of the glass substrate, and the transfer of the film forming material layer was completed.

(4) Firing the film-forming material layer (forming the dielectric layer): The glass substrate on which the film-forming material layer has been transferred and formed according to the above (3) is placed in a firing furnace, and the temperature in the furnace is set to room temperature. To 590 ° C at a rate of 10 ° C / min.
By baking for 30 minutes in the temperature atmosphere, a dielectric layer made of a glass sintered body was formed on the surface of the glass substrate.

The thickness distribution of the dielectric layer in the panel material thus obtained had an error of 0.5 μm at most with respect to the average value (20 μm). Further, even when this panel material was used as a PDP dielectric layer to form a panel, there was no quality problem such as uneven brightness caused by uneven film thickness in the display operation. Also,
Light transmittance of the formed dielectric layer (measuring wavelength 550 nm)
Was 85%, and this panel material was found to be excellent in colorless transparency.

[0046]

According to the transfer film of the present invention, a dielectric layer having a thickness distribution within a range of ± 2 μm with respect to the average film thickness is formed. A PDP having a body layer does not cause display defects such as luminance unevenness due to non-uniformity of the film thickness distribution.
It will have high quality.

According to the method of manufacturing a plasma display panel of the present invention, a PDP having high quality can be efficiently manufactured without causing display defects such as uneven brightness in a display operation.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a cross-sectional shape of an AC type plasma display panel.

FIG. 2A is a schematic cross-sectional view illustrating a transfer film of the present invention, and FIG. 2B is a cross-sectional view illustrating a layer configuration of the transfer film.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Glass substrate 3 Partition 4 Transparent electrode 5 Bus electrode 6 Address electrode 7 Fluorescent substance 8 Dielectric layer 9 Dielectric layer P Protective layer F1 Support film F2 Film forming material layer F3 Cover film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tadahiko Udagawa 2-11-24 Tsukiji, Chuo-ku, Tokyo Inside JSR Co., Ltd. (72) Inventor Shiro Takahashi 2-11-24 Tsukiji, Chuo-ku, Tokyo JSR Incorporated F term (reference) 5C027 AA05 5C040 GA02 GB02 GD09 JA19 KA07 KB08 KB24 MA30

Claims (2)

[Claims] 1. A transfer film for forming a dielectric layer, comprising a film forming material layer made of a glass paste composition formed on a support film, wherein the film forming material layer is transferred from the transfer film to the surface of a substrate. B. Forming a dielectric layer having a thickness distribution within a range of ± 2 [mu] m with respect to the average film thickness. 2. The method according to claim 1, wherein the film-forming material layer of the transfer film is transferred to a surface of a substrate for a plasma display panel on which a dielectric layer is to be formed, and is baked to form a dielectric layer on the substrate. A method for manufacturing a plasma display panel, comprising a step of forming a body layer.