JP2001232794A - Ink jet head, its manufacturing method, ink jet recorder and actuator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent electrostatic attraction and repellence characteristics from deteriorating due to adhesion of moisture to the bottom face of a diaphragm and the surface of an electrode substrate and to prevent malfunction due to sticking of the diaphragm to the electrode substrate through moisture adhering to the surface of the substrate by sealing an opening for interconnecting an oscillation chamber formed between the electrode and the diaphragm with the outside using a sealant. SOLUTION: An oscillation chamber 12 is sealed with a sealant 40. In Fig. 10(A), the ACF(anisotropic conductive film) of an FPC 30 is fused and compressed to connect the FPC 30 with an electrode 11 and to seal the oscillation chamber 12 with fused ACF. In Fig. 10(B), the oscillation chamber 12 is sealed with a sealant in which connection of the FPC 30 and the electrode 1 may be performed independently from sealing of the oscillation chamber 12. An adhesive may be employed as the sealant and the FPC 30 may be connected with the electrode through that adhesive or connection and sealing may be performed using the AFC of the FPC substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head for ejecting ink droplets only when recording is required and attaching the ink droplets to a recording sheet, a method for manufacturing the same, an ink jet recording apparatus equipped with the ink jet head, and The present invention relates to an actuator for ejecting a liquid.

[0002]

2. Description of the Related Art An ink jet recording apparatus has many advantages, such as extremely low noise during recording, high-speed printing, and the use of inexpensive plain paper with a high degree of freedom of ink. Among them, the so-called ink-on-demand method, which discharges ink droplets only when recording is necessary, is currently the mainstream because it does not require collection of ink droplets unnecessary for recording.

[0003] Ink-on-demand type ink jet heads use a piezoelectric element as a driving means (Japanese Patent Publication No. 2-51734) or a method in which ink is heated to generate bubbles and the ink is ejected at the pressure. (Sho 61
-59911). However, the above-described ink jet head has the following problems.

Recently, high-speed and high-quality printing is required for printing by an ink-jet recording apparatus. In order to achieve this, a multi-nozzle and a high-density nozzle are used to finely process a piezoelectric element. Adhering to each diaphragm is rather difficult. In addition, there is a problem in that the dimensional accuracy in the conventional machining causes a large variation in print quality.

In the method of heating the ink, since the driving means is formed by a thin-film resistance heating element, the above-mentioned problem does not exist. There is a problem that the life of the ink jet head is short because the resistance heating element is damaged by the impact.

[0006] To solve the above problems, Japanese Patent Laid-Open No.
As disclosed in Japanese Patent Application Laid-Open No. 50601, there is an ink jet head recording apparatus using electrostatic force for a driving unit. This method has the advantages of small size, high density, high printing quality and long life.

In the above-mentioned electrostatic system, the bottom surface of the ink discharge chamber communicating with the ink nozzle is formed as an elastically deformable diaphragm. Substrates are arranged opposite to the diaphragm at a constant interval (gap). Opposing electrodes are respectively arranged on the diaphragm and the substrate, and the space (gap) between these opposing electrodes must be sealed. If not sealed, moisture adheres to the surface of the opposing electrode, that is, the bottom surface of the opposing diaphragm, and the surface of the substrate while the ink jet head is driven, and the electrostatic attraction characteristics and the electrostatic repulsion characteristics May decrease. In addition, moisture attached to the surface of the substrate may leave the diaphragm and the electrode substrate in a state of being adhered to each other, which may render the operation inoperable.

Further, the ink jet head needs a portion for transmitting a recording signal to the recording head.
Regarding this portion, a configuration in which a wiring board for transmitting a recording signal from a recording device to a recording head is bent at an arbitrary position and used is disclosed in, for example, JP-A-5-169660 and JP-A-5-169662. However, in the above configuration, when the wiring board is bent, stress is generated on the bonding surface between the electrode and the wiring board, and there is a concern that the wiring board may be peeled off or a conduction failure may occur.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-described problems. An ink jet head for deforming a diaphragm by electrostatic force, an ink jet recording apparatus equipped with the ink jet head, and generally a diaphragm The actuator is driven by an electric signal, a communication hole (opening) for communicating a vibration chamber (gap) formed between the electrode and the vibration plate with the outside is sealed with a sealing material. By making the material in contact with the FPC board for transmitting electric signals, first, moisture adheres to the surface of the opposing electrode, that is, the bottom surface of the opposing diaphragm, and the surface of the electrode substrate. Electrostatic attraction characteristics and electrostatic repulsion characteristics are reduced, and moisture adhered to the surface of the substrate causes the diaphragm and the electrode substrate to remain stuck and becomes inoperable. In addition, the sealing material (adhesive) is in contact with a wiring substrate (FPC substrate) for transmitting a recording signal from a recording device to a recording head, so that the wiring substrate is bent. To prevent the occurrence of peeling or poor conduction of the wiring board which occurs when the adhesive is used, and furthermore, the adhesive used for sealing the communication hole and the adhesive used for reinforcing the connection between the electrode substrate of the actuator and the flexible substrate as described above. By using the same adhesive and in the same step, an inexpensive and highly reliable ink jet recording apparatus can be provided.

[0010]

According to a first aspect of the present invention, there is provided a nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes, and A vibration plate constituting at least one wall of the ink liquid discharge chamber, and an electrode disposed to face the vibration plate,
A vibration chamber formed between the vibration plate and the electrode to form a gap that causes deformation of the vibration plate; and an F connected to the electrode for transmitting an electric signal to the electrode.
An ink jet head comprising a PC board, wherein the electric signal is applied between the vibration plate and the electrode to deform the vibration plate by electrostatic force and eject ink liquid from the nozzle holes; And an opening communicating with the FPC board is sealed with a sealing material, and the sealing material is in contact with the FPC board.

The invention of claim 2 is the invention of claim 1, wherein the sealing material for sealing the opening is an epoxy resin.

According to a third aspect of the present invention, in the first aspect of the present invention, the sealing material for sealing the opening is an adhesive which can be cured at room temperature.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the sealing material sealing the opening is applied to the FPC board in advance when the FPC board is heated and pressed against the electrode. The adhesive forming the anisotropic conductive film described above.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the present invention, there is provided an ink discharge substrate constituting the ink liquid discharge chamber, and at least one wall of the substrate is provided with the vibration plate. In the inkjet head in which the nozzle plate is bonded to the side facing the vibration plate with an adhesive, the inkjet head includes a groove on a surface of the ink discharge substrate on which the nozzle plate is bonded, When the opening is sealed by a sealing material, the sealing material is prevented from flowing into the ink liquid discharge chamber side.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects of the present invention, the ink liquid discharge chamber and the vibration plate are formed such that a side on which boron is injected is placed on the silicon substrate on which boron is injected. The ink liquid discharge chamber is formed in two rows on both sides of the ink supply path with the ink supply path formed in the center therebetween, and the ink liquid discharge direction is configured to be the same direction. It is characterized by having.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the space forming the vibration chamber is inclined along a longitudinal direction or a short direction of the vibration chamber. It is a characteristic.

[0018] The invention according to claim 8 is a nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets,
An ink discharge chamber that communicates with each of the nozzle holes, a vibration plate that forms at least one wall of the ink liquid discharge chamber, an electrode that is disposed to face the vibration plate, and the vibration plate and the electrode. A vibration chamber formed between the vibration plate and forming a gap that causes deformation of the vibration plate, and an FPC board connected to the electrode for transmitting an electric signal to the electrode, wherein the vibration chamber and the outside The opening communicating with the FPC board is sealed with a sealing material, and the sealing agent is in contact with the FPC board.
When connecting a PC board to the electrodes,
The anisotropic conductive film of the PC substrate is brought into contact by applying pressure and heat to melt the adhesive forming the anisotropic conductive film, and the molten adhesive is used to connect the vibration chambers to the outside. The opening is sealed.

According to a ninth aspect of the present invention, there is provided a nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets,
An ink discharge chamber that communicates with each of the nozzle holes, a vibration plate that forms at least one wall of the ink liquid discharge chamber, an electrode that is disposed to face the vibration plate, and the vibration plate and the electrode. A vibration chamber formed between the vibration plate and forming a gap that causes deformation of the vibration plate, and an FPC board connected to the electrode for transmitting an electric signal to the electrode, wherein the vibration chamber and the outside Is sealed by a sealing material, and the sealing agent is in contact with the FPC substrate.
Y. Injecting an adhesive using a Z dispenser, sealing the adhesive with the adhesive to seal an opening communicating each of the vibration chambers with the outside, and bringing the adhesive into contact with the FPC board. It was done.

According to a tenth aspect of the present invention, there is provided a nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes,
A diaphragm constituting at least one wall of the ink liquid discharge chamber, an electrode arranged opposite to the diaphragm, and a gap formed between the diaphragm and the electrode to cause deformation of the diaphragm. A vibration chamber being formed, and an FPC board connected to the electrode for transmitting an electric signal to the electrode, wherein an opening communicating the vibration chamber with the outside is sealed with a sealing material. Mounting an inkjet head in which the sealant is in contact with the FPC substrate, reciprocating the inkjet head with respect to the recording paper, and applying an electric signal through the FPC substrate between the diaphragm and the electrode. Then, the diaphragm is deformed by an electrostatic force to eject ink liquid from the nozzle holes, and printing is performed on the recording paper.

An eleventh aspect of the present invention is characterized in that, in the tenth aspect of the present invention, the sealing material for sealing the opening is an epoxy resin.

According to a twelfth aspect of the present invention, in the tenth aspect of the present invention, the sealing material for sealing the opening is an adhesive which can be cured at room temperature.

According to a thirteenth aspect of the present invention, in the tenth aspect of the present invention, the sealing material for sealing the opening is formed of the FPC.
The FP flowing out when the substrate is heated and pressed against the electrode;
The adhesive is characterized in that it is an adhesive for forming an anisotropic conductive film which is previously applied to a C substrate.

The invention of claim 14 is the invention of claims 10 to 13
Any one of the inventions, characterized in that a groove is provided on the surface of the ink discharge substrate constituting the ink liquid discharge chamber on the side where the nozzle plate is bonded.

The invention of claim 15 is the invention of claims 10 to 14
In any one of the inventions, the ink liquid discharge chamber and the vibration plate are formed on a boron-injected Si substrate as the vibration plate on the side where boron is injected, and the ink liquid discharge chamber is formed at the center. The ink supply path is formed in two rows on both sides of the ink supply path, and the discharge direction of the ink liquid is the same.

The invention of claim 16 is the invention of claims 10 to 15
In any one of the inventions, the space forming the vibration chamber is characterized by being inclined along the longitudinal direction of the vibration chamber.

A seventeenth aspect of the present invention includes a diaphragm substrate having at least one surface formed as a diaphragm, and an electrode substrate having electrodes disposed with a predetermined gap from the diaphragm. In an actuator that deforms the diaphragm by applying a voltage between the diaphragm and the electrode, a portion communicating with the outside of the gap formed between the diaphragm and the electrode, It is characterized by being sealed with a sealing material.

The invention according to claim 18 is a liquid chamber substrate having a liquid chamber having at least one surface formed as a vibration plate, a nozzle plate having a nozzle hole covering the liquid chamber and communicating with the liquid chamber. An electrode substrate having an electrode disposed with a predetermined gap kept between the diaphragm and the diaphragm, wherein a voltage is applied between the diaphragm and the electrode to deform the diaphragm, and the return force In the actuator that pressurizes the liquid in the liquid chamber and ejects the liquid from the nozzle, a portion communicating with the outside of the gap formed between the vibration plate and the electrode is formed by a sealing material. It is characterized by being sealed.

According to a nineteenth aspect of the present invention, in the invention of the eighteenth aspect, the substrate having the liquid chamber has a groove on a surface of the substrate covered with the nozzle plate, and the sealing material is formed by the groove. It is characterized in that it is prevented from entering the pressurizing chamber.

According to a twentieth aspect of the present invention, in the actuator, a liquid chamber substrate is laminated on the electrode substrate, and a nozzle plate is laminated on the liquid chamber substrate. A step portion having at least one opening for forming a predetermined gap with the chamber substrate, and an electrode formed on the step portion, wherein the liquid chamber substrate has a liquid chamber facing the electrode. And a side facing the electrode is formed of a conductive diaphragm, and an opening communicating with the outside of the gap is sealed with a sealing material.

According to a twenty-first aspect of the present invention, in the twentieth aspect, the liquid chamber substrate has a groove on the surface on the side where the nozzle plate is provided and on the opening side where the gap communicates with the outside. And an opening communicating with the outside of the gap is sealed with a sealing material.

The invention of claim 22 is the invention of claim 20 or 21
In the invention, the liquid chambers are formed in two rows, openings are provided between the rows, and liquid is supplied to the respective liquid chambers through the openings between the rows.

[0032]

FIG. 1 is an enlarged plan view (FIG. 1B) showing a wafer (FIG. 1A) for forming an ink electrode substrate of an ink-jet head according to the present invention, and a part thereof taken out. ) And an enlarged sectional view taken along the line CC of FIG. 1B (FIG. 1C), first, as shown in FIG.
A mold (100) Si substrate 10 is prepared, and FIG.
(B), as shown in FIG. 1 (C), an electrode portion 11 and a gap portion 12 are formed.

FIG. 2 is an enlarged plan view (FIG. 2 (B)) showing a wafer (FIG. 2 (A)) for forming the discharge chamber of the ink jet head according to the present invention, and a part thereof taken out.
As shown in FIG. 2A, boron is implanted (110).
A Si substrate 20 is prepared, and the P-type (100) Si substrate 10 on which the electrode portion 11 and the gap portion 12 are formed is directly bonded to the (110) Si substrate 20 injected with boron, and then boron is injected. Polishing is performed until the thickness of the (110) Si substrate 20 becomes 100 μm.

Next, a nitride film serving as an etching mask is deposited on a substrate in which the (100) Si substrate 10 and the (110) Si substrate 20 into which boron is implanted are directly bonded, as shown in FIG. (A) is a plan view, and FIG. 3 (B) is an enlarged cross-sectional view taken along line BB of FIG. 3 (A)).
Back surface channel portion 22, vibration chamber sealing adhesive intrusion preventing groove 23,
The temporary bonding area 24 and the groove 25 for preventing the temporary adhesive from entering are formed by wet etching. Next, each chip is cut from the wafer by dicing.

Thereafter, as shown in FIG. 4 (FIG. 4 (A) is a plan view as viewed from the liquid chamber side, and FIG. 4 (B) is an enlarged sectional view taken along line BB of FIG. 4 (A)). The substrate 20 is dry-etched, and the individual electrode 11 is exposed by opening an electrode extraction portion. Thereafter, as shown in FIG. 5 (a plan view as viewed from the liquid chamber side), the exposed individual electrodes 11 and the FPC cable 30 are electrically connected by an anisotropic conductive film. A driver IC is mounted on the FPC cable 30 by wire bonding.

Next, as shown in FIG. 6, in order to join the nozzle plate and the actuator, the silicon liquid chamber substrate 2 is used.
An adhesive is applied to the upper surface of the “0”. After that, the adhesive 26 for sealing the vibration chamber is applied to the X. Y. Apply with a Z dispenser. At this time, the adhesive 26 for sealing the vibration chamber is
The vibration chamber sealing adhesive 26 also serves to reinforce the FPC cable 30 by being applied so as to be in contact with the FPC cable 30. Then, the photo-curing adhesive 2 is used as a temporary adhesive in the temporary adhesive application area.
7 is applied by a dispenser.

Thereafter, as shown in FIG. 7, the nozzle plate 50 formed by Ni electroforming is positioned with respect to the electrostatic actuator to which the adhesive has been applied as described above, and temporary pressurization is performed. Here, the photo-curable adhesive 27 is irradiated with ultraviolet rays to cure the temporary adhesive, and is subjected to main pressure to be cured by heating.

According to the present invention, the sealing material (adhesive) for sealing the vibration chamber is applied so as to be in contact with the FPC cable, so that the sealing of the vibration chamber and the adhesion and reinforcement of the FPC cable can be performed with the same adhesive and the same process. By doing so, the throughput can be improved and the cost can be reduced. In addition, by using an elastic epoxy adhesive that can be cured at room temperature as the adhesive, it is possible to prevent the diaphragm from being deformed due to curing shrinkage during curing of the adhesive. Further, since the vibration chamber sealing adhesive intrusion preventing groove is formed, the amount of the vibration chamber sealing adhesive entering the liquid chamber can be controlled, and a highly reliable inkjet head is formed. It is possible.

FIGS. 8A to 8D and 9E to 9H are cross-sectional views of an essential part for explaining an example of a manufacturing process of the ink jet head according to the present invention. As shown in FIG. ,
A P-type (100) Si substrate 101 (625 μm thick) was prepared, and an oxide film 102 was formed to a thickness of 2 μm by wet oxidation. The oxidation conditions are 1050 ° C. and 18.5 h.
Next, as shown in FIG. 8B, the resist was patterned using a gradation mask, and the oxide film was patterned by dry etching and wet etching. By using a gradation mask to form an electrode shape, a non-parallel (inclined) gap can be formed, and an electrode shape that is advantageous for lowering the voltage can be formed. The direction of the gradation may be either the length direction or the width direction of the electrode.

Next, as shown in FIG. 8C, TiN 103 serving as an electrode was formed to a thickness of 200 nm by a sputtering method. Thereafter, TiN was separated by etching for individual electrodes, and then a silicon oxide film 104 having a thickness of 150 nm was formed as an electrode protection film. Next, the silicon oxide film and TiN other than the electrode portion were removed by dry etching and wet etching, respectively, thereby producing an electrode substrate corresponding to the electrode substrate 10 shown in FIGS. Substrate 10).

Thereafter, as shown in FIG. 8D, a (110) Si substrate 201 having a thickness of 400 μm and implanted with boron is used.
(Corresponding to the liquid chamber substrate 20 shown in FIGS. 2 to 7; hereinafter, referred to as the liquid chamber substrate 20) by direct bonding to 900-1.
Bonding was performed at 000 ° C., and then polishing was performed to a thickness of 100 μm. Next, a nitride film is laminated and patterned on the electrode substrate 10 and the Si substrate 20 as shown in FIG.
As shown in (E), a back channel 105 was formed in the electrode substrate 10 by wet etching.

Thereafter, as shown in FIG. 9F, the liquid chamber 21 was formed by wet etching. At this time, the temporary adhesive area for liquid chamber bonding, the temporary adhesive intrusion prevention groove, and the vibration chamber sealing adhesive intrusion prevention groove described in FIG. 3 were simultaneously formed. Boron-implanted region 2 in liquid chamber substrate 20
Since the etching rate of Ob is lower than that of the Si region 20a in which boron is not implanted, it is possible to selectively leave only the boron implanted region 20b.

After that, the boron-implanted Si and silicon oxide films were etched to open the back channel. Thereafter, a common electrode portion of the liquid chamber was formed by depositing aluminum through a metal mask. Here, the chip was cut into chips by dicing, and thereafter, as shown in FIG. 9G, openings were formed in the electrode extraction portions by dry etching. Further, the silicon oxide film on the TiN in the electrode extraction region was removed by dry etching.

Thereafter, as shown in FIG. 9H, the FPC board 30 is connected on the exposed electrodes 11 and the sealing material 40 is formed.
Then, the vibration chamber 12 was sealed, and then the nozzle plate 50 was bonded onto the liquid chamber substrate 20 to form an ink jet head.

FIG. 10 is an enlarged sectional view of a main part for explaining details of the case where the vibration chamber 12 is sealed with the sealing material 40.
In the example shown in FIG. 10A, the ACF (anisotropic conductive film) of the FPC 30 is melted and pressed to connect the FPC 30 to the electrode 11 and seal the vibration chamber 12 with the melted ACF. In the example shown in FIG. 10B, a sealing material is used, and the vibration chamber 12 is sealed with the sealing material. In this case, the connection between the FPC 30 and the electrode 11 is made. When,
Although it can be performed independently of the sealing of the vibration chamber 12, an adhesive is used as a sealing material, the connection between the FPC board and the electrode is performed with the adhesive, and further, the ACF of the FPC board is used. , Connection and sealing may be performed.

FIG. 10C is a main part configuration diagram for explaining in detail the state of sealing the vibration chamber 12 with the sealing material (or adhesive) as described above. And FP
When connecting the C substrate 30 to the electrode 11, the opening communicating with the outside of the vibration chamber 12 is sealed with a sealing material or an adhesive.
In that case, the sealing material (or adhesive) 40 is
May enter the ink discharge chamber 21 through a gap between the upper surface nozzle plate 50 and the lower surface of the upper surface nozzle plate 50. Therefore,
In the present invention, as described above, the groove 23 is provided on the upper surface of the liquid chamber substrate 20, and the groove 23 prevents the sealing material or the adhesive 40 from entering the liquid chamber 21. I have. The groove 23 is formed in the liquid chamber substrate 20 by (110) S
By using the i-substrate, the liquid chamber 21 can be easily formed by etching at the same time when the liquid chamber 21 is formed.

FIG. 11 is an exploded view of an ink jet head using the actuator prepared as described above. The anisotropic conductive material of the FPC cable 30 is applied to the electrode 11 of the electrostatic actuator prepared as described above. The film forming section 31 was pressed and melted to make electrical connection, and at the same time, the vibration chamber was sealed. The driver IC 32 is mounted on the FPC cable 30 by wire bonding. Then, in order to join the nozzle plate 50 and the actuator section (liquid chamber substrate 20), the silicon liquid chamber substrate 2
The adhesive was applied to the upper surface of the No. 0. When the silicon liquid chamber substrate 20 and the nozzle plate 50 are joined by an adhesive, since the protrusion of the adhesive affects the ejection characteristics, the coating film thickness needs to be about 1 μm. Therefore, the method of applying the adhesive on the upper surface of the silicon liquid chamber substrate 20 was performed by a transfer method.

In this embodiment, the adhesive is thinned on the roller by a doctor blade, the adhesive is transferred from the roller by the transfer pad, and the silicon liquid chamber substrate 20 is transferred from the transfer pad.
Was performed by a method of transferring an adhesive to the upper surface of the substrate. Further, in order to seal the vibration chamber, an elastic epoxy adhesive Wurtite 1540 (manufactured by Toho Kasei Co., Ltd.) Y. Coated with a Z dispenser. At this time, the adhesive for sealing the vibration chamber was applied so as to contact the FPC cable 30 in order to reinforce the adhesion of the FPC cable 30. In addition, the nozzle plate 50
In order to position the silicon liquid chamber and the silicon liquid chamber, an ultraviolet curing adhesive for temporary bonding was applied to a temporary adhesive application area of the silicon liquid chamber by a dispenser. Then, the nozzle plate formed by Ni electroforming was positioned with respect to the electrostatic actuator to which the adhesive was applied, and temporary pressurization was performed.

Thereafter, the ultraviolet-curable adhesive was irradiated with ultraviolet rays to cure the adhesive, and then subjected to main pressure to be cured by heating. When heating and joining, silicon and the nozzle plate (N
(i or SUS). When warpage occurs, the actuator may be broken by internal stress. Therefore, a lower curing temperature of the adhesive is better, so a two-component mixed type (room temperature curing type) epoxy adhesive was used. Although the curing temperature is preferably as low as possible, in this example, the curing was performed at 50 ° C.

Further, a joint 80 for supplying ink from an ink supply tank or an ink cartridge is provided.
Then, the frame 60 to which the filter 70 was heat-welded was bonded and bonded. An adhesive was applied to the frame to bond the actuator and the nozzle plate, and the actuator was positioned and bonded. In FIG. 11, reference numerals 61 and 81 denote holes through which the FPC 30 passes, and reference numeral 62 denotes an ink supply hole.

According to the above configuration, when a pulse voltage is applied to the individual electrode, the diaphragm is deformed toward the electrode by electrostatic force. Then, the ink flows from the common liquid chamber through the fluid resistance portion into the pressure generating chamber, and the volume of the pressure generating chamber increases. Here, when the pulse voltage is released, the electrostatic force is eliminated, and the diaphragm returns to the original state. The pressure in the pressure generating chamber is increased by the elastic force of the vibration plate, and ink is ejected from the nozzle holes.

FIG. 12 is a view showing an example of a recording apparatus using an ink jet head according to the present invention.
Denotes an inkjet head; 101, a carriage on which the inkjet head 100 is mounted; the carriage for reciprocating the inkjet head 100 in the arrow X direction; 102, a drive shaft for reciprocating the carriage 101 in the arrow X direction; A guide rod 105 for guiding the reciprocating movement of 101 is a recording paper. As is well known, the inkjet head 100 is reciprocated in the arrow X direction, and the recording paper 105 is moved in the arrow Y direction. 105 is to be printed.

[0053]

According to the present invention, an opening communicating each vibration chamber with the outside is sealed with a sealing material (adhesive), and the sealing material contacts a flexible substrate for transmitting an electric signal. First, moisture adheres to the surface of the counter electrode, that is, the bottom surface of the opposed diaphragm, and / or the surface of the electrode substrate, and the electrostatic attraction characteristics and the electrostatic repulsion characteristics are reduced.
In addition, it is possible to prevent the vibration plate and the electrode substrate from being stuck to each other due to moisture attached to the surface of the electrode substrate, thereby preventing operation failure. Furthermore, by adopting a configuration in which the sealing material is in contact with a wiring substrate for transmitting a recording signal from a recording device to a recording head, peeling or conduction failure of the wiring substrate caused when the wiring substrate is bent is reduced. It is possible to prevent occurrence. In addition, the sealing material used for sealing the opening and the adhesive used for reinforcing the bonding between the electrode substrate of the actuator and the flexible substrate are made of the same material (sealing material,
By using an adhesive) and performing it in a simultaneous step, an inexpensive and highly reliable inkjet recording apparatus can be provided.

The use of an epoxy adhesive as an adhesive sealing the opening communicating each vibrating chamber with the outside causes shrinkage of the adhesive when the adhesive is hardened, so that the vibrating chamber becomes negative pressure and vibrates. It is possible to prevent the plate from being deformed.

By using an adhesive that can be cured at room temperature as the adhesive that seals the opening that communicates each vibration chamber with the outside, when the actuator member and the nozzle member are made of different materials, high-temperature bonding is performed. Even if bonding failures occur due to differences in thermal expansion coefficients, low-temperature or room-temperature bonding enables simultaneous sealing of the communication holes and FPC reinforcement at the time of liquid chamber bonding, resulting in an inexpensive and highly reliable inkjet head, recording device, and actuator. It is possible to provide.

The adhesive that seals the opening for communicating each vibration chamber with the outside is X. Y. By using a Z dispenser to apply, it is possible to apply an adhesive for opening sealing and FPC reinforcement with high accuracy, and to provide a highly reliable inkjet head, recording apparatus, and actuator. It is possible.

An opening communicating each vibration chamber with the outside is sealed with an adhesive, and a concave portion for preventing the adhesive from entering the inside is provided on the substrate on which the ink liquid ejection chamber is formed. Since it is formed, it is possible to prevent the adhesive that intrudes between the nozzle and the discharge chamber substrate from entering the recess inside the liquid chamber at the time of liquid chamber joining. It is possible to provide devices and actuators.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an outline of an electrode substrate used for carrying out the present invention.

FIG. 2 is a diagram for explaining an outline of a liquid chamber substrate used for carrying out the present invention.

FIG. 3 is a plan view and a cross-sectional view of a liquid chamber side.

FIG. 4 is a plan view and a cross-sectional view of the liquid chamber side when an electrode take-out portion is opened.

FIG. 5 is a plan view of a liquid chamber when an FPC cable is connected.

FIG. 6 is a plan view on the liquid chamber side when an adhesive is applied.

FIG. 7 is a plan view of the liquid chamber when the nozzle plate is bonded.

FIG. 8 is a fragmentary cross-sectional view for explaining a part of the inkjet head manufacturing process according to the present invention.

9 is a fragmentary cross-sectional view for explaining the manufacturing step of the inkjet head according to the present invention, which is subsequent to the step of FIG. 8;

FIG. 10 is a view showing details of a vibration chamber sealing portion.

FIG. 11 is an exploded perspective view of a main part of the inkjet head according to the present invention.

FIG. 12 is a main part configuration diagram showing an example of an ink jet recording apparatus to which the ink jet head according to the present invention is applied.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electrode board, 11 ... Electrode part, 12 ... Gap part (vibration chamber), 20 ... Liquid chamber substrate, 21 ... Liquid chamber, 22 ... Flow path part,
23: vibration chamber sealing material intrusion prevention groove, 30: FPC cable, 40: sealing material (adhesive), 50: nozzle plate,
60 ... frame, 70 ... filter, 80 ... joint part.

Claims (22)

[Claims] 1. A nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes, and at least one wall of the ink liquid discharge chamber. A diaphragm, an electrode disposed opposite to the diaphragm, a vibration chamber formed between the diaphragm and the electrode to form a gap that causes deformation of the diaphragm, and connected to the electrode. And an FPC board for transmitting an electric signal to the electrode, applying the electric signal between the vibration plate and the electrode, deforming the vibration plate by electrostatic force, and forming an ink liquid from the nozzle hole. An opening for communicating the vibration chamber with the outside is sealed with a sealing material, and the sealing material is in contact with the FPC board. De. 2. The ink jet head according to claim 1, wherein a sealing material sealing the opening is an epoxy resin. 3. The ink jet head according to claim 1, wherein the sealing material sealing the opening is an adhesive that can be cured at room temperature. 4. An anisotropic conductive film, which is applied beforehand to the FPC board and flows out when the FPC board is heated and pressed against the electrode, forms a sealing material that seals the opening. 2. The ink jet head according to claim 1, wherein the adhesive is an adhesive. 5. An ink discharge substrate forming the ink liquid discharge chamber, wherein at least one wall of the substrate forms the diaphragm, and the nozzle plate is bonded to a side facing the diaphragm. An ink-jet head bonded with an agent, the ink discharge substrate is provided with a groove on a surface on a side to which the nozzle plate is bonded, and when the opening is sealed with the sealing material, the sealing is performed. 5. The ink jet head according to claim 1, wherein the material is prevented from flowing into the ink liquid discharge chamber. 6. The ink liquid discharge chamber and the vibration plate are formed on a boron-implanted Si substrate on the side where boron is injected as the vibration plate, and the ink liquid discharge chamber is formed at the center of the ink supply. 6. The ink supply path according to claim 1, wherein the ink supply path is formed in two rows on both sides of the path, and the ink liquid is ejected in the same direction. Inkjet head. 7. The ink jet head according to claim 1, wherein a space forming the vibration chamber is inclined along a longitudinal direction or a short direction of the vibration chamber. 8. A nozzle plate having one or more nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes, and at least one wall of the ink liquid discharge chamber. A diaphragm, an electrode disposed opposite to the diaphragm, a vibration chamber formed between the diaphragm and the electrode to form a gap that causes deformation of the diaphragm, and connected to the electrode. And an FPC board for transmitting an electric signal to the electrode, wherein an opening for communicating the vibration chamber with the outside is sealed with a sealing material, and the sealing material is in contact with the FPC board. In the method of manufacturing an inkjet head, when the FPC substrate is connected to the electrode, an anisotropic conductive film of the FPC substrate is brought into contact with the electrode by heating under pressure to form the anisotropic conductive film. Melting adhesive An opening for communicating each of the vibration chambers with the outside is sealed with the molten adhesive. 9. A nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes, and at least one wall of the ink liquid discharge chamber. A diaphragm, an electrode disposed opposite to the diaphragm, a vibration chamber formed between the diaphragm and the electrode to form a gap that causes deformation of the diaphragm, and connected to the electrode. And an FPC board for transmitting an electric signal to the electrode, wherein an opening for communicating the vibration chamber with the outside is sealed with a sealing material, and the sealing agent comes into contact with the FPC board. In the method for manufacturing an ink jet head, Y. Injecting an adhesive using a Z dispenser, sealing the adhesive with the adhesive to seal an opening communicating each of the vibration chambers with the outside, and bringing the adhesive into contact with the FPC board. Of manufacturing an inkjet head. 10. A nozzle plate having a single or a plurality of nozzle holes for discharging ink droplets, an ink liquid discharge chamber communicating with each of the nozzle holes, and at least one wall of the ink liquid discharge chamber. A diaphragm, an electrode disposed opposite to the diaphragm, a vibration chamber formed between the diaphragm and the electrode to form a gap that causes deformation of the diaphragm, and connected to the electrode. An FPC board for transmitting an electric signal to the electrode, an opening communicating the vibration chamber with the outside is sealed with a sealing material,
The sealant is mounted with an inkjet head in contact with the FPC board, and the electrical signal is applied between the diaphragm and the electrode through the FPC board while reciprocating the inkjet head with respect to the recording paper. Wherein the diaphragm is deformed by electrostatic force to eject ink liquid from the nozzle holes, thereby printing on the recording paper. 11. The ink jet recording apparatus according to claim 10, wherein a sealing material for sealing the opening is an epoxy resin. 12. The ink jet recording apparatus according to claim 10, wherein the sealing material sealing the opening is an adhesive that can be cured at room temperature. 13. The sealing material sealing the opening flows out when the FPC board is heated and pressed against the electrode.
The inkjet recording apparatus according to claim 10, wherein the adhesive is an adhesive that forms an anisotropic conductive film that is applied to the FPC substrate in advance. 14. A groove provided on a surface of the ink discharge substrate constituting the ink liquid discharge chamber on a side to which the nozzle plate is adhered.
14. The ink jet recording apparatus according to any one of claims 1 to 13. 15. The ink liquid discharge chamber and the vibration plate are formed on a boron-implanted Si substrate on the side where boron is injected as the vibration plate, and the ink liquid discharge chamber is formed at the center of the ink supply. The ink supply path is formed in two lines on both sides of the ink supply path, and the ink liquid is ejected in the same direction.
15. The inkjet recording apparatus according to any one of 0 to 14. 16. The ink jet recording apparatus according to claim 10, wherein a space forming the vibration chamber is inclined along a longitudinal direction or a short direction of the vibration chamber. . 17. A diaphragm substrate having at least one surface formed as a diaphragm, and an electrode substrate having electrodes disposed with a predetermined gap from the diaphragm,
In an actuator for deforming the diaphragm by applying a voltage between the diaphragm and the electrode, a portion communicating with the outside of the gap formed between the diaphragm and the electrode is sealed. An actuator characterized by being sealed with a stopper. 18. A liquid chamber substrate having a liquid chamber having at least one surface formed as a vibration plate, a nozzle plate covering the liquid chamber and having a nozzle hole communicating with the liquid chamber, and the vibration plate An electrode substrate having electrodes disposed with a predetermined gap therebetween, wherein a voltage is applied between the diaphragm and the electrodes to deform the diaphragm, and the return force causes the liquid chamber to deform. In the actuator that pressurizes the liquid and ejects the liquid from the nozzle, a portion communicating with the outside of the gap formed between the diaphragm and the electrode is sealed with a sealing material. An actuator, characterized in that: 19. A substrate having the liquid chamber has a groove on a surface of the substrate covered with the nozzle plate, and the groove prevents the sealing material from entering the pressure chamber. 19. The actuator according to claim 18, wherein: 20. A liquid chamber substrate is laminated on the electrode substrate,
And an actuator in which a nozzle plate is laminated on the liquid chamber substrate, wherein the electrode substrate has at least one step portion for forming a predetermined gap between the electrode substrate and the liquid chamber substrate, An electrode formed on the stepped portion, a liquid chamber is formed on the liquid chamber substrate so as to face the electrode, and a side facing the electrode is formed of a conductive diaphragm, and the gap is formed. An opening, which communicates with the outside of the actuator, is sealed with a sealing material. 21. The liquid chamber substrate has a groove on a surface on a side where the nozzle plate is disposed and on an opening side where the gap communicates with the outside, and communicates with the outside of the gap. 21. The actuator according to claim 20, wherein the opening is sealed by a sealing material. 22. The liquid chamber according to claim 20, wherein the liquid chambers are formed in two rows, an opening is provided between the rows, and the liquid is supplied to each of the liquid chambers through the openings between the rows.
2. The actuator according to 1.