JP2001230464A - Substrate-integrated piezoelectric element and thin-film magnetic head using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a piezoelectric element section integrally with a substrate to use the substrate-integrated piezoelectric element as a substrate to mount function elements or the like and also form the head body of a thin-film magnetic heads on the substrate- integrated piezoelectric element using a pretreatment, film formation, and lithography for pattern formation, which are now available, and know-how of these processes. SOLUTION: Lower electrodes 22 which are processed into a specified shape and size are disposed on the surface of an insulation substrate 20 and a piezoelectric layer 24 is formed on the lower electrodes 22. Conductor columns 26 for connection are formed upright continuously from the lower electrodes through the piezoelectric layer to be exposed on the surface and used as extraction terminals. Upper electrodes 28 are formed on the surface of the piezoelectric layer. For an alternative structure, the piezoelectric layer is embedded in a recessed section of the insulation substrate so that a space may be formed between the side wall of the recessed section and the piezoelectric layer, and the electrodes are formed on opposite side faces of the piezoelectric layer. By using the insulation substrate as a slider and forming the head body of a head on the piezoelectric element section, a thin-film magnetic head can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate-integrated piezoelectric element having a piezoelectric element formed integrally with an insulating substrate, and a head body formed on the piezoelectric element for displacement control or shock detection. The present invention relates to a thin-film magnetic head capable of performing such operations. The substrate-integrated piezoelectric element according to the present invention is not limited to the head body of the thin-film magnetic head, but can also be used as a substrate for mounting various sensor elements and functional elements.

[0002]

2. Description of the Related Art A general method of manufacturing a thin film magnetic head is as follows.
In this method, a slider serving as a glider is used as a substrate, and a magnetic sensor (magnetic resistance element), a magnetic coil (electromagnetic converter), and the like are formed thereon by a thin-film generation technique and a photo-photolithography technique. As shown in FIG. 10, a head body 12 composed of a magnetic sensor, a magnetic coil, and the like is arrayed and formed in units of thousands on a substrate 10 serving as a slider. The thin film magnetic heads 16 are processed. The head main body 12 is formed through a complicated process in which the number of thin film layers is dozens.

[0003] The above-mentioned slider receives an air flow generated by rotation of a recording medium (magnetic disk) at an inclined angle,
As a result, the head body floats at a minute gap of about several tens of nanometers. Therefore, the recording medium facing surface of the slider is
Smoothed by high precision polishing. In addition, even if a magnetic recording medium rotating at a high speed may come into contact with the air cushion during operation due to vibration exceeding the proof stress of the air cushion, an extremely hard material (typically, alumina titanium) is used so that damage is small. And the like).

As described above, the manufacturing process of the head main body on the substrate includes dozens of thin film layers alone, each of which comprises a pre-treatment for adhesion, a film formation, and a photolithography process for morphological formation. Among them, the magnetic sensor (magnetoresistive element) is a delicate magnetoresistive effect material, which is likely to be deteriorated by the influence of a heat treatment in a later process. It is.

By the way, it has been conventionally proposed to incorporate a piezoelectric element into a thin-film magnetic head in order to perform displacement control or impact detection. For example, there is a configuration in which a piezoelectric element is provided between a slider and a head main body. For the piezoelectric element, a lead zirconate titanate-based piezoelectric material that is usually sintered at a temperature of about 1000 ° C. or higher is used. Therefore, an assembling method such as manufacturing a piezoelectric element separately and bonding each piezoelectric element to a slider is adopted.

[0006]

When a piezoelectric element is incorporated in a thin-film magnetic head in view of a conventional general thin-film magnetic head manufacturing method in which a plurality of head bodies are formed using a slider as a substrate and cut and separated vertically and horizontally. In addition, the structure for mounting the individual piezoelectric elements has problems in mass productivity and quality uniformity. In addition, the method of attaching the piezoelectric body using an adhesive or the like is not suitable for miniaturization because the rigidity or reliability is reduced due to the presence of the adhesive, and the characteristics of the piezoelectric element cannot be sufficiently exhibited. Problem.

If the piezoelectric element portion is to be formed directly on the substrate, a mismatch occurs between the firing temperature of the piezoelectric material (about 1000 ° C. or more) and the processing temperature of the head body (about 300 ° C. or less). In addition, there are many problems that need to be solved, such as an electrode lead-out structure and an electrode formation structure.

An object of the present invention is to provide a substrate-integrated piezoelectric element in which a sensor element and a functional element are provided on the piezoelectric element section by forming the piezoelectric element section integrally with the substrate. It is to provide. Another object of the present invention is to use a substrate-integrated piezoelectric element,
An object of the present invention is to provide a thin-film magnetic head capable of forming a head body by utilizing existing lithography processes for pretreatment, film generation, and morphology and its know-how.

[0009]

SUMMARY OF THE INVENTION According to the present invention, a lower electrode is provided on a surface of an insulating substrate, and a lower electrode is formed on the lower electrode so as to penetrate the piezoelectric layer. A connection conductor pillar is continuously provided from the projection and is exposed to the surface to be a lead terminal, and an upper electrode is provided on the surface of the piezoelectric layer at a position away from the connection conductor pillar and opposed to the lower electrode. Substrate-integrated piezoelectric element. As a result, it is possible to form a lead terminal from the lower electrode. Therefore, by polarizing the piezoelectric layer in the thickness direction, it is possible to integrally form the piezoelectric element portion that is deformed in thickness with the substrate.

According to the present invention, a concave portion is formed on a surface of an insulating substrate, a piezoelectric layer is buried in the concave portion so as to form a gap between the concave portion and a side wall of the concave portion, and is connected at a bottom surface. The piezoelectric element is a substrate-integrated piezoelectric element that is polarized in the thickness direction and has a pair of electrodes provided in a gap between the opposing side surfaces of the piezoelectric layer and the concave side walls. This makes it possible to integrally form the piezoelectric element portion that undergoes shear deformation with the substrate.

Further, the present invention is a thin film magnetic head using the above-described substrate-integrated piezoelectric element. The insulating substrate constitutes a slider, and a head body is formed on the surface of the piezoelectric element. When an upper electrode is provided on the surface of the piezoelectric layer, it is preferable that the metal thin film on the base side of the head body also serves as the upper electrode of the piezoelectric element.

In a thin-film magnetic head, the direction of displacement of the head body by voltage control on the piezoelectric element is set to a direction perpendicular to the surface of the slider facing the recording medium, and the gap distance between the sensor section of the head body and the recording medium is set. Is controllable. There is also a configuration in which the displacement direction of the head main body by voltage control on the piezoelectric element portion is set in the recording track width direction, and the displacement of the head main body with respect to the slider in the recording track width direction can be controlled. Alternatively, there is also a configuration in which the presence or absence of contact with the recording medium can be detected by using the sensor function of the piezoelectric element unit.

[0013]

FIG. 1 is an explanatory view showing one embodiment of a substrate-integrated piezoelectric element according to the present invention. This substrate-integrated piezoelectric element is suitable for mounting a head body to form a thin-film magnetic head. A lower electrode 22 is formed on the surface of the insulating substrate 20, and a piezoelectric layer 24 is formed on the lower electrode 22. A connecting conductor column is formed continuously from the lower electrode 22 so as to penetrate the piezoelectric layer 24. A structure in which an upper electrode is provided facing the lower electrode 22 at a position on the surface of the piezoelectric layer 24 distant from the connection conductor pillar 26, and the upper end surface is exposed to serve as a lead terminal. And the piezoelectric layer 2
4 is polarized in the thickness direction. Here, the piezoelectric layer 24
Is provided on the entire surface of the substrate 20.

A number of lower electrodes 22 are formed on a surface of an insulating substrate (for example, a sintered body of alumina titanium or the like) 20 serving as a slider by photolithography to form a regular array in a matrix. As shown enlarged in FIG.
A connection conductor pillar (connection via) 26 is formed so as to be connected to each lower electrode 22. The height of the connecting conductor pillar 26 must be equal to or greater than the final thickness of the piezoelectric layer 24 (the position indicated by the broken line). Here, the lower electrode defines an active region for the piezoelectric layer. The piezoelectric layer 24 is formed on the entire surface of these electrode materials. Then, a heat treatment is performed to sinter the piezoelectric layer 24. After that, the entire surface of the piezoelectric layer 24 is polished to the position indicated by the broken line to expose the upper end surface of the connecting conductor pillar 26. Further, an upper electrode 28 is provided on the surface of the piezoelectric layer 24 at a position distant from the exposed surface of the connecting conductor pillar, facing the lower electrode. Piezoelectric layer 24
Is subjected to a polarization treatment in the thickness direction.

The lower electrode 22 has a zigzag shape, and the connecting conductor 26 is located at one end thereof. The upper electrode 28 has a mirror-symmetrical shape with respect to the lower electrode 22, and is provided in a positional relationship such that most of the areas overlap. The exposed surface of the connecting conductor post 26 and one end of the upper electrode 28 serve as a lead terminal of the piezoelectric element portion. By forming the connecting conductor pillars 26 in this manner, while having an integral structure with the substrate,
Connection with the lower electrode 22 for applying an electric field to the piezoelectric layer 24 becomes possible.

The piezoelectric layer is formed, for example, by mixing a piezoelectric material and an organic binder to maintain uniformity, controlling the thickness by coating by screen printing or scraping off a blade, and forming the layer at a predetermined temperature exceeding 1000 ° C. It is provided by firing. Since shrinkage occurs in this firing step, there is a possibility that the entire body may be warped if the piezoelectric layer is formed on the entire surface of the substrate. Therefore, if the piezoelectric layer is formed in a pattern corresponding to each piezoelectric element part, or if a groove is formed and the piezoelectric element part is divided from the beginning, the contraction stress is relaxed and warpage and cracks are prevented. it can. Another material may be embedded in the formed groove. The piezoelectric material is not particularly limited and is selected in consideration of a later process.
Any material such as a general lead zirconate titanate can be used. The thickness of the piezoelectric layer may be, for example, about 1 to 7 μm. By reducing the thickness, the required electric field strength can be secured even at low voltage driving.

As the electrode material, a material that can withstand the firing temperature of the piezoelectric layer is selected. For example, a platinum group metal or an alloy thereof can be used. The shape-processed electrode may be, for example, a method of screen-printing a conductive paste.

When manufacturing a thin-film magnetic head, this substrate-integrated piezoelectric element is passed through a film-forming process of a magnetic film or the like to form a head body. Therefore, the piezoelectric element portion is subjected to a sintering process at a high temperature before forming the head main body, and is also subjected to a necessary polarization process. By the way, the piezoelectric body maintains the piezoelectric characteristics up to the so-called Curie temperature, but when the temperature is exceeded, the piezoelectric polarization disappears. The Curie temperature of the piezoelectric body is 130
Since the material varies from about ° C to about 350 ° C depending on the material, the material is selected in consideration of the processing temperature in the subsequent film forming process such as a magnetic film.

Since the surface of the piezoelectric element portion which has been subjected to the necessary processing in this manner is smooth, it can be used as a substrate without changing the restrictions in the manufacturing process of the existing head main body. A thin film magnetic head incorporating a part can be manufactured. That is, a thin film magnetic head is obtained by arranging and forming a large number of head bodies at positions corresponding to the respective piezoelectric element portions, and then cutting and separating the head bodies individually with a slice cutter and polishing the gliding surface of the slider as in the related art.

FIG. 3 shows the obtained thin film magnetic head. The slider 30 and the piezoelectric element part 32 are integrated, and a head body (magnetic sensor and magnetic transducer part) 34 is provided on the piezoelectric element part 32. The thin-film magnetic head with this structure uses the sensor function of the piezoelectric element,
This is effective for detecting the presence or absence of contact with the recording medium. Further, the piezoelectric element portion 32 is displaced in the thickness direction when a voltage is applied. Therefore, if the inclination angle of the slider with respect to the recording medium is used, it can be applied to the adjustment of the gap between the head main body and the recording medium. However, when utilizing the thickness deformation, the displacement is extremely small, so a separate displacement enlarging mechanism must be additionally provided.

In some cases, the magnetic body of the head main body, which is a film immediately above the piezoelectric element portion, is formed as a film covering the entire surface as a base portion of a magnetic circuit. The effective portion as the magnetic circuit is a magnetic material on the upper portion that has been processed, and enables a high-speed change by minimizing a magnetic flux that changes in accordance with a signal to a necessary minimum. Prior to the formation of the magnetic material (in many cases, a nickel-iron-based alloy), a metal electrode serving as a plating electrode covers a large area of the base, and it is economical to use this as the upper electrode of the piezoelectric layer.

As is well known, as a deformation mode of the piezoelectric body, there is a shear deformation in addition to the above-described thickness deformation. In contrast, the shear deformation has a larger deformation amount. Since the deformation is supported by the rigidity of the substrate, high rigidity can be maintained. For these reasons, there are many cases where it is desirable to employ a shearing type.

FIG. 4 is a cross-sectional view showing another embodiment of the substrate-integrated piezoelectric element according to the present invention, which is of a type in which shear deformation occurs. A concave portion 41 is formed on the surface of the insulating substrate 40,
A piezoelectric layer 42 is buried in the concave portion 41 so as to form a gap between the concave portion 41 and the side wall of the concave portion, and the piezoelectric layer 42 is polarized in the thickness direction. A pair of electrodes 44 is provided in a gap between the side walls.

FIG. 5 shows a manufacturing process of this piezoelectric element. The recess 41 is formed on the substrate 40. The recess 41 may have a groove structure formed by machining. In the case of a thin film magnetic head, the substrate 40 is made of a material constituting a slider. A coating 45 such as a resist film is attached so as to cover the substrate 40 on which the concave portion 41 is formed, and is softened by heating to be dripped into the concave portion (Step A). Here, the film 45 is made of a material which has a weak bonding force with a piezoelectric layer to be formed later and is easily peeled, so that the film is contracted so that a gap is formed between the film and the substrate or the stress is relaxed. Since the bottom surface of the concave portion of the substrate 40 and the piezoelectric layer must be firmly joined to each other, the coating 45 is formed by ion etching or the like in which the substrate 40 is irradiated with ions in a vertical direction.
Are removed to expose the bottom surface and remove only the side wall portions (see step B).

Next, a piezoelectric paste 46 obtained by kneading a piezoelectric material and an organic binder is embedded in the concave portion 41 with a squeegee 47, and excess piezoelectric paste on the surface is scraped off (see step C). When firing is performed at a predetermined temperature in this state, the piezoelectric layer 42
Since the film shrinks and the coating is removed, a gap is formed on the side surface of the concave portion, and the bottom is firmly bonded to the substrate (see step D). That is, since the piezoelectric layer 42 has a free surface except for the substrate coupling portion (the bottom of the concave portion), the stress is temporarily released there. A resist pattern 48 is formed so as to leave a gap portion (see step E), and a metal 49 is caused to enter the gap by performing electroless plating (F).
Process). In the electroless plating, if the pretreatment conditions are appropriately set, the surface of the piezoelectric layer is etched to selectively invade the grain boundaries, and the grain boundaries can be filled with plating like a mesh and firmly joined. . If the resist is removed, the plating on the resist is also removed by lift-off, and the electrode 44 is formed (see step G).

The piezoelectric layer 42 is polarized in the thickness direction. The polarization treatment may be performed after the completion of the G step, but is preferably performed after the completion of the D step. When a drive voltage is applied between the pair of electrodes 44, the piezoelectric layer 42 is sheared and displaced in parallel with the surface.

The thickness of the piezoelectric material to be used and the thickness of the piezoelectric layer to be formed may be the same as those in the above embodiment. The bottom surface of the concave portion may have an anchor effect as a rough surface in order to improve the bonding force with the piezoelectric layer. If the side surface of the concave portion is treated to reduce the adhesive force with the piezoelectric layer, it is not always necessary to leave the film by the above method, and the gap is formed only by shrinking during firing. It is also possible to form. Since the electrodes are attached after firing the piezoelectric material, nickel or the like can be used.

In the case of a thin-film magnetic head, a head body is formed on the piezoelectric element. The method of forming the head body may be the same as the conventional method. An example is shown in FIG. The electrodes 44 of the piezoelectric element section 52 are positioned on both left and right sides (both sides in the recording track width direction) of the slider 50,
4a is provided. The head main body 54 is formed on the piezoelectric element section 52. When a voltage is applied between both electrodes, the piezoelectric element portion 52 is sheared in the horizontal direction (the direction of the arrow s). Since the back side of the piezoelectric layer is firmly fixed to the substrate side (slider), the front side of the piezoelectric layer (accordingly, the head body) is displaced in the horizontal direction.

As a result, the displacement direction of the head body 54 by the voltage control of the piezoelectric element 52 is set in the recording track width direction, and the displacement of the head body 54 with respect to the slider 50 in the recording track width direction can be controlled. In a magnetic disk drive, head position control for driving a plurality of thin-film magnetic heads collectively is performed. However, errors cannot be completely absorbed with the increase in density in the disk radial direction, and each thin-film magnetic head reads its own signal from its own read signal. It has become necessary to perform feedback control in order to obtain an accurate radial position. The configuration of this embodiment is useful for such control because each thin-film magnetic head can be displaced in the recording track width direction.

Next, a configuration for vertically displacing the head body will be described. FIG. 7 shows an example of the thin film magnetic head in that case. The piezoelectric element portion 62 is formed integrally with the slider 60, and the piezoelectric element portion 62 is formed such that both electrodes thereof are located on the upper and lower sides of the slider (both sides perpendicular to the recording medium surface). The head body 64 includes the piezoelectric element section 6.
2 is formed. When a drive voltage is applied between both electrodes, the piezoelectric element portion 62 is sheared vertically (in the direction of arrow s). Since the back surface of the piezoelectric layer is firmly fixed to the substrate side (slider), the front side of the piezoelectric layer (accordingly, the head body) is vertically displaced.

Thus, the direction of displacement of the head body by voltage control on the piezoelectric element portion is set to a direction perpendicular to the surface of the slider facing the recording medium, and the gap distance between the sensor portion of the head body and the recording medium is reduced. Control becomes possible. The slider flies under the pressure of the air flow and keeps the air gap constant.However, by slightly raising and lowering the head body in the above configuration, the slider can be made closer to the recording medium, and more appropriate for monitoring the read signal amplitude. It is also possible to control to keep the distance.

For example, the piezoelectric layer has a thickness of 4 μm and a voltage of 4 μm.
V, if the piezoelectric constant d _{15 of} shear deformation = 700 pm / V, the head body approaches the recording medium by 2.8 nm. This is two orders of magnitude larger than the thickness deformation, and the response speed is not inferior. Since the flying height of the slider in the thin-film magnetic head is several tens of nm, the displacement of the head body due to shear deformation is sufficiently effective. Although the piezoelectric body is deformed in the plane direction even by this shearing deformation, the amount of the change is small, the distortion applied to the head body (magnetic film) is small, and it is suitable for combination with a material sensitive to magnetostriction.

FIG. 8 shows an example of the state of use. Recording medium 7
0 forms a magnetic recording film 73 on the disk substrate 72;
In this configuration, a medium protection film 74 is provided thereon. Since the thin-film magnetic head 76 may be the same as that shown in FIG. 7, corresponding members are denoted by the same reference numerals for simplification of description. In addition to keeping the air gap with the recording medium 70 constant by floating with the slider 60, the head main body 64 is slightly moved up and down by the piezoelectric element portion 62 so as to be closer to the recording medium 70 or slightly. The gap can be actively controlled according to the irregularities. That is, it is possible to control the position to the optimum gap according to the amplitude of the read signal from the head main body 64 while preventing the collision between the thin-film magnetic head 76 and the recording medium 70. In this configuration, since the slider and the head main body are merely coupled via the bulk piezoelectric layer, there is no problem in securing rigidity. Further, since the shearing deformation occurs, even if the shearing surface is constrained, a force hardly acts on the shearing surface, and there is no possibility that the slider or the head body is adversely affected.

FIG. 9 shows an example of the air gap control circuit using the thin film magnetic head according to the present invention. Here, the piezoelectric element unit 80 is used as a medium contact detection element and a position adjustment element. The terminal voltage of the piezoelectric element section 80 is passed through a band-pass filter to detect a contact signal. The medium address at that time is detected by amplifying a signal of a magnetic sensor (magnetic resistance element) of the head body by a sense amplifier, and the medium address is managed. During operation, at a predetermined medium address, the amount of shear deformation of the piezoelectric element unit 80 is adjusted by the piezoelectric driving unit, and the flying height of the head body (magnetic sensor) is controlled.

When the voltage generated by the piezoelectric element section 80 is monitored, the acoustic waveform due to the contact has a unique feature, and is separated and discriminated by a band-pass filter.
The presence or absence of contact can be detected. In the magnetic disk device, the position of the recording surface is all managed, and the abnormal part is called retry and the recording and reproduction is tried again.If the reproduction is not possible, the recording part of the address can be moved to another position. Is being done. Under such control, it is also possible to control the levitation of only the address low for abnormal or insufficient signal amplitude as described above, distinguish it from other normal parts, and judge how far contact can be avoided. Is possible,
In addition to the address management of the recording medium, the proximity distance can be controlled within a range where the contact is not performed.

[0036]

As described above, the present invention is a substrate-integrated type piezoelectric element in which the piezoelectric element portion is formed integrally with the substrate, so that it is thin and has high rigidity, and can be mass-produced by taking many pieces on it. A sensor element, a functional element, and the like (for example, a head body) can be provided, and the miniaturization of components is not hindered. Even in the case of forming the piezoelectric element portion having a thickness deformation, since the connection conductor pillar is provided, it is possible to draw out from the lower electrode, so that a substrate integrated type can be realized. Further, even when a shearing deformation piezoelectric element portion is formed, an integrated substrate can be realized because the electrodes are devised. Although the piezoelectric layer is thin, one side is backed by a substrate, so that sufficient mechanical strength can be maintained and the application range is wide.

By using such a substrate-integrated piezoelectric element, the head body can be formed utilizing the existing lithography process of pretreatment, film formation and morphology and its know-how. Can be manufactured efficiently. Since the thin-film magnetic head incorporates a piezoelectric element, necessary functions such as displacement control in the track width direction, air gap adjustment, and impact detection can be added.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a substrate-integrated piezoelectric element according to the present invention.

FIG. 2 is an enlarged cross-sectional view showing a state during the manufacturing.

FIG. 3 is a longitudinal sectional view showing an example of the thin-film magnetic head according to the present invention.

FIG. 4 is a sectional view showing another embodiment of the substrate-integrated piezoelectric element according to the present invention.

FIG. 5 is an explanatory view showing an example of the manufacturing process.

FIG. 6 is an explanatory view showing another example of the thin-film magnetic head according to the present invention.

FIG. 7 is an enlarged sectional view showing still another example of the thin-film magnetic head according to the present invention.

FIG. 8 is an explanatory diagram showing the operation state.

FIG. 9 is an explanatory diagram of a gap adjustment control circuit of the thin-film magnetic head.

FIG. 10 is an explanatory diagram of the method for manufacturing the thin-film magnetic head.

[Explanation of symbols]

 Reference Signs List 20 Insulating substrate 22 Lower electrode 24 Piezoelectric layer 26 Connecting conductor pillar 28 Upper electrode

Claims (7)

[Claims] 1. A lower electrode having a shape processed on a surface of an insulating substrate, a piezoelectric layer is formed on the lower electrode, and a connecting conductor column is continuously formed from the lower electrode so as to penetrate the piezoelectric layer. A substrate which is provided on the surface of the piezoelectric layer so as to be exposed from the surface of the piezoelectric layer, and is provided with a top electrode facing the lower electrode at a position distant from the connection conductor pillar. Integrated piezoelectric element. 2. A concave portion is formed in a surface of an insulating substrate, and a piezoelectric layer is buried in the concave portion so as to form a gap between the concave portion and a side wall of the concave portion, and is bonded at a bottom surface. A substrate-integrated piezoelectric element, which is polarized and has a pair of electrodes provided in a gap between opposing side surfaces of a piezoelectric layer and recess side walls. 3. The slider according to claim 1, wherein the insulating substrate comprises a slider.
3. A thin-film magnetic head, wherein a head main body is formed on a surface of the substrate-integrated piezoelectric element according to 2. 4. The slider according to claim 1, wherein the insulating substrate comprises a slider.
A thin-film magnetic head, wherein a head main body is formed on the surface of the substrate-integrated piezoelectric element described above, and a metal thin film on a base side of the head main body also serves as an upper electrode of the piezoelectric element portion. 5. The head body according to claim 1, wherein a displacement direction of the head body by voltage control on the piezoelectric element portion is set to a direction perpendicular to a surface of the slider facing the recording medium, so that a gap distance between the head body and the recording medium can be controlled. 5. The thin-film magnetic head according to 4. 6. The thin film according to claim 4, wherein the displacement direction of the head body by voltage control on the piezoelectric element portion is set in the recording track width direction, and the displacement of the head body with respect to the slider in the recording track width direction can be controlled. Magnetic head. 7. The thin-film magnetic head according to claim 3, wherein the presence or absence of contact with a recording medium can be detected by using a sensor function of the piezoelectric element portion.