JP2001216692A - Disk bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a disk bonding device which is capable of efficiently bonding disks, is simple in the constitution of a manufacturing apparatus and is capable of executing good working processes. SOLUTION: This device is provided with first and second working lines 2a and 2b for forming adhesive uncured disks which are coated with adhesives and are superposed on each other and a transporting means 3 for accepting the adhesive uncured disks successively discharged from the first and second working lines 2a and 2b, carrying the adhesive uncured disks into a photoirradiation position 20 and ejecting the adhesive cured disks cured with the adhesives after the completion of photoirradiation from the photoirradiation position 20. First and second shutters 7a and 7b which are respectively interposed in a first photoirradiation route 6 for irradiating the front surfaces of the disks 1 in the photoirradiation position 20 with light and a second photoirradiation route 6b for irradiating the rear surfaces of the disks 1 with the light and controls photoirradiation time are arranged. The periods of carrying the disks into and out of the photoirradiation position 20 by the transporting means are constant without depending upon the first and second working lines 2a and 2b. The device is provided with a control section 9 which controls the opening and closing of first and second shutters 7a and 7b according to the first and second working lines 2a and 2b accepting the adhesive uncured disks.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disc bonding apparatus.

[0002]

2. Description of the Related Art A digital video disk or a digital versatile disk (hereinafter referred to as "DVD") is prepared by bonding two disk substrates having an information recording layer on at least one of them with an adhesive. Is done.

As a disc bonding apparatus, for example, a disc substrate on which an adhesive is to be bonded is spin-coated and excess adhesive is shaken off, and then, as shown in FIG. One that is placed on a pallet 15 in a state of being superimposed and irradiated with ultraviolet rays by an ultraviolet irradiation lamp 6 while being transported in the direction of arrow P to cure the adhesive.

Although heat is generated during the irradiation of ultraviolet rays, the pallet 15 is made of iron, aluminum or the like and does not transmit ultraviolet rays, so that the upper disk 1a and the lower disk 1b
In some cases, uneven heating may occur and the disk 1 may warp. Therefore, the shape of the pallet 15 may be made a special shape, or a cooling means 26 for supplying cooling air may be provided.
The disk 1 is configured to buffer warpage.

[0005]

However, in the above-mentioned apparatus, the number of types of pallets 15 having a special shape increases, and adjustment is complicated. In addition, the pallets 15 must be removed and replaced at the time of adjustment, which complicates the operation. There is a problem.

To solve such a problem, Japanese Patent Laid-Open Publication No. Hei 10-199051 discloses that an adhesive is applied to an ultraviolet-permeable tray 16 instead of a specially-shaped pallet 15 as shown in FIG. An apparatus is disclosed in which the discs 1 are placed one on top of another, and the adhesive is cured by irradiating ultraviolet rays from both sides of the discs 1.

In this apparatus, the ultraviolet irradiation units 18a, 18
The amount of ultraviolet irradiation from b is controlled differently on the front and back of the disk 1 to improve the warpage of the disk 1. However, this method has a problem that the lifetime is short because a xenon lamp is used as a light source.

Further, in order to efficiently attach the disks, a plurality of production lines for applying an adhesive, superimposing the adhesives, transferring the adhesives to a light irradiation position and curing the adhesives are provided, and the production lines are arranged in parallel. Although it will be operated, there is a problem that the manufacturing apparatus becomes large.

The present invention has been made to solve the above-mentioned problems, and to provide a disk bonding apparatus which can efficiently perform disk bonding, has a simple structure of a manufacturing apparatus, and can execute good processing. With the goal.

[0010]

A disk bonding apparatus according to the present invention is characterized in that first and second shutters are provided at light irradiation positions.

According to the present invention, the irradiation time of light can be made constant by the first and second shutters even if the unloading tact of the processing line varies, and good processing can be efficiently performed.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A disk bonding apparatus according to a first aspect of the present invention is a disk bonding apparatus which irradiates light from both sides of the disk in a state where the disks coated with the adhesive are superposed to cure the adhesive. In a bonding apparatus, a plurality of processing lines for applying an adhesive to create an uncured adhesive disk and a plurality of the uncured adhesive disks sequentially discharged from the plurality of processing lines are received and the received adhesive Transport means for carrying the uncured disk into the light irradiation position and carrying out the adhesive-cured disk in which the light irradiation has been completed and the adhesive has been cured from the light irradiation position; and light on the surface of the disk at the light irradiation position. Irradiating the first
Light irradiating path and second irradiating light to the back surface of the disk
First and second shutters respectively interposed in the light irradiation path to control the light irradiation time, and the transfer of the disc to the light irradiation position by the transfer means regardless of the processing line for receiving the uncured adhesive disc. And a controller for controlling the opening and closing of the first and second shutters in accordance with the processing line for receiving the uncured adhesive disk at a constant loading and unloading cycle.

According to this configuration, the irradiation time of light can be kept constant even if the unloading tact time of the processing line varies, so that good processing can be performed efficiently, and the bonding of disks with stable quality can be realized.

According to a second aspect of the present invention, there is provided the disk bonding apparatus according to the first aspect, wherein the controller is configured to control the opening / closing time of the first shutter and the second opening / closing time in accordance with the received processing line.
The shutter opening / closing time is set individually.

According to this configuration, the warpage of the disk can be improved and the quality can be further improved. According to a third aspect of the present invention, in the disk bonding apparatus according to the first aspect, the control unit separately controls an opening / closing time of the first shutter and an opening / closing time of the second shutter according to the degree of warpage of the disk. It is configured to be set.

According to this configuration, the same effect as described above can be obtained. Hereinafter, a disk bonding apparatus according to the present invention will be described based on specific embodiments with reference to FIGS.

As shown in FIG. 1, the disc laminating apparatus uses a plurality of processing lines, in this case, first and second processing lines 2a and 2b, in which an adhesive is applied and superposed. The hardened disk 1 is prepared, and the adhesive uncured disk 1 is transported to the light irradiation position 20 by the transporting means 3, and the adhesive is cured by irradiating light from both sides of the adhesive uncured disk 1. 1 is created.

Also, the first and second processing lines 2a, 2b
Irrespective of the tact time, the operation of the transfer means 3 is configured to be a single operation, so that the ultraviolet irradiation time is constant even if the unloading tact time on the first and second processing lines 2a and 2b varies. It is controlled by the control unit 9.

More specifically, the first and second processing lines 2a,
2b, an adhesive application position 23 for applying an adhesive to the disk 1, a spin position 24 for spin coating the applied adhesive, and the disk 1 in the direction of arrow A from the adhesive application position 23 to the spin position 24. Robot arm 10 for transport
Are provided.

The conveying means 3 is provided at each position arranged on the same circumference, that is, at a disk supply position 19 where the uncured adhesive disc 1 is carried in, and a light irradiation for irradiating the uncured adhesive disc 1 with ultraviolet rays. A position 20, a disk discharge position 21 from which the adhesive-cured disk with the cured adhesive is discharged, and a plate temperature adjusting position 2 at which the temperature of the glass plate 8 is adjusted after the adhesive-cured disk 1 is removed.
2 is driven intermittently in the direction of arrow B about point R.

At a light irradiation position 20 where the ultraviolet ray is irradiated to the adhesive uncured disk 1, the adhesive uncured disk 1
And a UV irradiation lamp 6b as a second light irradiation path for irradiating light to the back surface of the adhesive uncured disc 1 is provided. Between the disk 1 and the ultraviolet irradiation lamps 6a and 6b, first and second shutters 7a and 7b for controlling the light irradiation time are interposed.

Further, the control unit 9 controls the disk 1 to the light irradiation position 20 by the transporting means 3 irrespective of the first and second processing lines 2a and 2b for receiving the uncured adhesive disk 1.
The opening and closing of the first and second shutters 7a and 7b are controlled in accordance with the first and second processing lines 2a and 2b for receiving the uncured adhesive disc 1 at a constant loading and unloading cycle. I have.

Hereinafter, a specific bonding process of the disk bonding device configured as described above will be described with reference to a time table shown in FIG. First, the first disk a1 is supplied to the first processing line 2a, and is carried into the adhesive application position 23 by the robot arm 10. At the adhesive application position 23, the nozzle 4 is inserted between the disks 1a and 1b as shown in FIG.
The adhesive 5 is injected while rotating a and 1b at low speed in the direction of arrow C. At this time, the application time of the adhesive 5 is t1.

The disk a1 on which the adhesive 5 has been applied is transported to the spin position 24 by the robot arm 10 at a handling time t2. At spin position 24, FIG.
As shown in (b), the disk is spun at high speed in the direction of arrow C, and the adhesive 5 is applied to the disks 1a and 1a.
b, the excess adhesive 5 is shaken off, and air bubbles are also removed. The processing time at this time is t3.

When the application of the adhesive 5 on the first disk a1 has been completed in the above-described steps and the robot 5 has taken out the adhesive 5 from the adhesive application position 23, the second disk a2
Is carried into the adhesive application position 23, and the same processing is performed.

The processing of the first disk b1 in the second processing line 2b is started slightly after the start time of the disk processing in the first processing line 2a. In the second processing line 2b, the adhesive 5 is applied in the adhesive application position 23 at the application time m1 in the same manner as described above, and is conveyed to the spin position 24 in the handling time m2. A coating process is performed.
When the application process of the first disk b1 is completed,
The processing of the second disk b2 is started.

Here, in the first processing line 2a, the processing time T of the first disk a1 (T = t1 + t2 + t3)
And the processing time S of the second disk a2 (S = s1 + s2
+ S3), and the processing time M of the first disk b1 in the second processing line 2b (M = m1 +
m2 + m3) and the processing time N (N
= N1 + n2 + n3), and the processing time of all disks is the same within the same line.

The disk a1 spin-coated on the first processing line 2a is placed by the robot arm 10 on the glass plate 8 which has been adjusted in temperature and is waiting at the disk supply position 19 of the transfer means 3. .

The conveying means 3 is driven to rotate in the direction of arrow B and moves to the light irradiation position 20. At the light irradiation position 20, FIG.
As shown in FIG. 1A, a UV light irradiation lamps 6a and 6b and first and second shutters 7a and 7b are provided.
Is carried in, as shown in FIG.
Shutters 7a and 7b move in the direction of arrow E to irradiate the disk a1 with ultraviolet rays.

When a predetermined ultraviolet irradiation time t4 has elapsed,
The first and second shutters 7a and 7b move in the direction of arrow F to block ultraviolet irradiation on the disk a1. The shutter opening / closing time at this time is t5.

Then, as shown in FIG. 4 (d), the adhesive-cured disk 1 in which the adhesive has been cured is carried out in the direction of arrow G, and is conveyed to the disk take-out position 21 at the take-out time T6.

When the hardening of the adhesive of the disk a1 supplied from the first processing line 2a is completed, the second
The disk b1 is supplied from the processing line 2b, and the adhesive 5 is cured by the irradiation of ultraviolet rays in the same manner as described above.

However, as described above, each disk processing is performed with the same tact within the same processing line, but when a plurality of processing lines are provided, the disk processing in the first processing line 2a is performed. Time T (T = t1 + t2 + t
3) is different from the disk processing time M (M = m1 + m2 + m3) in the second processing line 2b, and the unloading tact in the first and second processing lines may vary.

If the unloading tact varies, the irradiation time of the ultraviolet rays to the disk b1 from the second processing line 2b supplied after the disk a1 from the first processing line 2a is not constant, Quality becomes unstable.

Therefore, regardless of the first and second processing lines 2a and 2b for receiving the uncured adhesive disk, the period of loading and unloading of the disk to the light irradiation position 20 by the transfer means 3 is made constant. In this embodiment, the controller 9 controls the opening / closing time (t) of the first and second shutters 7a and 7b.
, M5, s5, n5...) To the first and second processing lines 2
a and 2b are adjusted.

Accordingly, the first and second processing lines 2a, 2
Even if there is variation in the unloading tact of b, the light irradiation time, here, t4, m4, S4, n4,... can be set to the same time, and the disks can be stably bonded with high quality.

The disk on which the adhesive has been cured as described above is conveyed to the disk discharge position 21, where dust and dirt on the disk 1 are removed by the air blow 11, and then the inspection device 12 warps the disk 1. The thickness of the adhesive and the adhesive layer, the surface and the inside scratches are inspected by an optical test. After the disk 1 is removed, the temperature of the glass plate 8 is detected.

The glass plate 8 from which the disk 1 has been taken out is conveyed to a plate temperature adjusting position 22, where the glass plate 8 is cooled. As the cooling means, a cooling unit 14 for blowing cooling air 13 on the front and back of the glass plate 8 as shown in FIG. 5 is used.

The glass plate 8 cooled to a predetermined temperature is conveyed to the disk supply position 19, where the plate temperature is detected before the disk is supplied, and if the temperature is a suitable temperature, the same routine as described above is repeated.

As described above, when the operation of the transfer means 3 is a single operation state for a plurality of processing lines, the light irradiation position is set between the first and second light irradiation paths and the disk. By interposing the first and second shutters, it is possible to keep the light irradiation time constant even if the unloading tact of the processing line varies, thereby realizing the stable bonding of disks.

Further, in addition to the above configuration, the control unit 9 can individually set the opening and closing times of the first and second shutters 7a and 7b individually according to the received processing line or the degree of warpage of the disk 1. With the configuration for setting, the warpage of the disk 1 can be further reduced. Also in this case, the first
It is more effective to adjust the opening and closing time of the first and second shutters 7a and 7b according to the processing line 2a and the second processing line 2b.

Further, since the temperature rise of the glass plate 8 is controlled by the cooling unit 14 at the plate temperature adjusting position 22, there is no need to provide a cooling means on the glass plate 8, and the tilt is controlled only by adjusting the temperature of the glass plate 8. Can be adjusted.

A heating unit may be provided in place of the cooling unit depending on the degree of warpage of the disk 1. When heating, natural heating by ultraviolet energy or curing energy or forced heating by warm air is performed.

In the above description, the glass plate 8 is used as the pallet on which the disk 1 is mounted. However, the present invention is not limited to this, and the optical disk is coated in a state where the disks coated with the adhesive are superposed. Is not particularly limited as long as the adhesive can be cured by irradiating the adhesive from both sides of the disc, that is, a light-transmitting adhesive.

By using a light-transmitting pallet as described above, it is not necessary to use a pallet having a variety of special shapes as in the related art, and the pallet can be unified into one type of pallet (glass plate).

[0046]

As described above, according to the disk bonding apparatus of the present invention, a plurality of processing lines for producing an uncured adhesive disk, the uncured adhesive disk are carried into the light irradiation position, and the adhesive cured disk Is provided from the light irradiation position, and the first and the second light irradiation positions are provided.
A control unit that interposes first and second shutters for controlling the light irradiation time between the second light irradiation path and the disk, and controls opening and closing of the first and second shutters according to each processing line. Is provided, the lamination of disks can be performed efficiently by keeping the light irradiation time constant even if there is a variation in the tact time of unloading of the processing line, and the configuration of the manufacturing equipment is simple and good processing Can be realized.

Further, by configuring the control unit to individually set the opening and closing times of the first and second shutters in accordance with the received processing line or the degree of warpage of the disk, the warpage of the disk can be further improved. Quality can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a disk bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a disk bonding process according to the embodiment of the present invention.

FIG. 3 is a diagram showing a process of applying an adhesive to a disk according to the embodiment of the present invention.

FIG. 4 is a view showing a light irradiation step in the embodiment of the present invention.

FIG. 5 is a diagram for explaining temperature adjustment of a disk according to the embodiment of the present invention.

FIG. 6 is a diagram illustrating a conventional disk bonding apparatus.

FIG. 7 is a diagram illustrating another conventional disk bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Disc 2a, 2b 1st, 2nd processing line 3 Transport means 7a, 7b Shutter 9 Control part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenji Wada 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Naoki Fuka 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. GG28

Claims (3)

[Claims] 1. A disk bonding apparatus for irradiating light from both sides of a disk in a state where the disks coated with the adhesive are superposed to cure the adhesive, wherein the adhesive is applied and superposed. A plurality of processing lines for creating an uncured disk, and an adhesive uncured disk that is sequentially discharged from the plurality of processing lines are received, the received adhesive uncured disk is loaded into a light irradiation position, and light irradiation is completed. Transport means for unloading the adhesive-cured disk from which the adhesive has been cured from the light irradiation position, a first light irradiation path for irradiating light to the surface of the disk at the light irradiation position, and light on the back surface of the disk. First and second shutters respectively interposed in a second light irradiation path for irradiating light and controlling a light irradiation time; and the processing line for receiving an uncured adhesive disk. The opening and closing of the first and second shutters is controlled in accordance with the processing line for receiving the uncured adhesive disk at a constant cycle of loading and unloading the disk to and from the light irradiation position by the transporting means regardless of the operation. Disc bonding apparatus provided with a control unit. 2. The disk bonding apparatus according to claim 1, wherein the control unit is configured to individually set an opening / closing time of the first shutter and an opening / closing time of the second shutter according to the received processing line. . 3. The disk bonding apparatus according to claim 1, wherein the control unit is configured to individually set an opening / closing time of the first shutter and an opening / closing time of the second shutter according to the degree of warpage of the disk. .