JP2001209056A - Device for production of liquid crystal panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize rapid and uniform conduction of heat from a surface board to the whole substrate. SOLUTION: The surface board 1 is formed into one body from a heat- resistant material having high rigidity and an almost same coefficient of thermal expansion as that of substrates A, B, so that it maintains its form without causing deformation by heat. A heating means 2 and a cooling means 3 are embedded as two-dimensionally and densely arranged near to each other in the surface board, so that the whole pressurizing face 1a of the surface board 1 is uniformly and rapidly heated by operating the heating means 2 and is rapidly cooled by operating the cooling means 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus for manufacturing a liquid crystal panel used for a liquid crystal display (LCD).
Specifically, the two substrates bonded together with high accuracy are set on a surface plate, and the substrate is heated by the heating means of the surface plate while pressing the substrate with the accuracy and crushing to a predetermined gap. The present invention relates to a liquid crystal panel manufacturing apparatus for curing a thermosetting adhesive therebetween.

[0002]

2. Description of the Related Art Conventionally, as a liquid crystal panel manufacturing apparatus of this kind, for example, as disclosed in Japanese Patent No. 2934438, a platen is divided into an upper layer member and a lower layer member, and a cooling means is provided in the upper layer member. Some are buried and the lower layer members are equipped with heating means. This is a pressurized state of the substrate,
By operating the heating means of the lower layer member, the substrate is heated via the upper layer member by heat conduction from the lower layer member, and at the time of cooling after thermoforming, the lower layer member is separated from the upper layer member to rapidly cool the upper layer member. are doing.

[0003]

However, in such a conventional liquid crystal panel manufacturing apparatus, heat from the lower layer member is transmitted to the substrate via the upper layer member via the joint surface between the upper layer member and the lower layer member. If the joint surface between the upper layer member and the lower layer member is completely flat and the entire surface can be brought into contact, heat can be uniformly transmitted to the entire upper layer member and the substrate, but it is difficult to process the upper and lower joint surfaces completely flat respectively. And the production cost is high. In particular, when it is necessary to increase the size of the upper layer member and the lower layer member of the platen with the increase in the size of the substrate, it is very difficult to completely flatten the upper and lower joining surfaces, and it If irregularities occur, there will be partially contacting and non-contacting parts,
Heat conduction delays from the part that comes in partial contact to the part that does not come into contact, which delays the heat conduction, making it difficult to heat the entire substrate uniformly, and it takes time for heat transfer to take place. And, as a result, there is a problem that temperature control is difficult.

[0004] An object of the present invention is to quickly and uniformly conduct heat from the surface plate to the entire substrate. The invention described in claim 2 is claim 1
In addition to the object of the invention described in (1), an object of the present invention is to completely prevent deformation of the surface plate due to a temperature change.

[0005]

In order to achieve the above-mentioned object, according to the first aspect of the present invention, there is provided a heat resistant material having a high rigidity and a thermal expansion coefficient substantially equal to that of a substrate. And the heating means and the cooling means are embedded in the inside thereof in a planarly dense state and close to each other. According to a second aspect of the present invention, in addition to the configuration of the first aspect of the present invention, a configuration is provided in which linear heating means and cooling means are alternately arranged close to the upper and lower positions of the surface plate. I do.

[0006]

According to the first aspect of the present invention, the base is integrally formed of a heat-resistant material having high rigidity and a thermal expansion coefficient substantially equal to that of the substrate, thereby maintaining the shape without deformation due to heat. By embedding the heating means and the cooling means in the interior thereof in a plane dense state and close to each other,
The entire upper surface of the platen is rapidly and uniformly heated by the operation of the heating means, and rapidly cooled by the operation of the cooling means. According to the second aspect of the present invention, in addition to the configuration of the first aspect, a configuration is provided in which linear heating means and cooling means are alternately arranged at the upper and lower intermediate positions of the surface plate so as to be close to each other. The upper and lower halves of the surface plate have the same condition with the cooling means interposed therebetween, and there is no temperature difference between the upper and lower halves of the surface plate due to heating and cooling.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, as shown in FIGS. 1 and 2, two glass substrates A and B, which are accurately bonded in the air, are set on a surface plate 1, and an upper cover 4 is lowered to form an annular sealing material 5. To form a closed space 6 surrounded by an annular sealing material 5 between the surface plate 1 and the upper lid 4. Substrates A and B are pressurized via the switch 7.

The platen 1 is integrally formed of a heat-resistant material having high rigidity and a thermal expansion coefficient similar to that of the substrates A and B, for example, carbon, and is heated by a heating means 2 embedded therein. Or a thickness that does not easily deform even when cooled by the cooling means 3.

The heating means 2 and the cooling means 3 are buried in a dense state in a plane and close to each other. In the case of this embodiment, as shown in FIGS. 1 and 2, the linear heating means 2 and the cooling means 3 are alternately approached in the horizontal direction at a predetermined pitch, for example, 50 to 60 mm, at the upper and lower intermediate positions of the surface plate 1. A plurality of the heaters are arranged in parallel with each other, and a linear heater that generates heat when energized is used as the heating means 2, and a cooling pipe through which cooling water passes is used as the cooling means 3.

Further, since the outer peripheral portion is more likely to be radiated and cooled as compared with the central portion of the surface plate 1, the temperature of the heating means 2 is set so that the heating temperature of the outer peripheral portion is higher than the heating temperature of the central portion. Thus, it is also possible to control so that the entire pressing surface 1a of the surface plate 1 has a uniform temperature.

Further, an annular sealing member 5 such as an O-ring is attached to the pressing surface 1a of the surface plate 1 so as to face a pressing surface 4a of an upper lid 4 described later.
Inside, are mounted two substrates A and B composed of, for example, a color filter on which a desired pattern is formed and a TFT substrate through a positioning means such as a frame (not shown). A suction passage 1b is opened in the surface plate 1 so as to communicate with the space between the annular sealing material 5 and the substrates A and B, and the suction passage 1b is configured to suck and exhaust the inside of the annular sealing material 5 from the inside. .

One of the substrates A and B is provided with an adhesive C made of a thermosetting resin on one of the substrates, and a part thereof is provided with a liquid crystal injection hole C.
It is applied in the shape of a frame which is opened as 1 and a large number of spacers D are scattered on the other substrate. 1 and 2 have only one frame of the adhesive C, but the present invention is not limited to this. If the substrates A and B are large, a plurality of frames of the adhesive C are disposed therebetween. It can also be done.

On the other hand, the upper cover 4 is made of a rigid body such as carbon, and is reciprocally supported by an elevating mechanism such as a drive cylinder (not shown). After the contact with the lifting mechanism, the link with the lifting mechanism is released so that the lifting mechanism can be moved up and down freely.

A heating / cooling means 7 is provided on the pressurizing surface 4a of the upper lid 4, and the upper lid 4 itself is made of a material having excellent heat insulating properties so that the heat of the heating / cooling means 7 is not released. Alternatively, although not shown, a heat insulating material is interposed between the pressing surface 4a of the upper lid 4 and the heating / cooling means 7.
In the case of the present embodiment, the heating / cooling means 7 is configured by integrally laminating a planar heater that generates heat by energization and a metal plate having a plurality of cooling pipes through which cooling water passes.

Further, a cushioning material 8 covering the heating / cooling means 7 and abutting on the substrates A and B is fixed to the pressing surface 4a of the upper lid 4. The cushioning material 8 is made of, for example, silicon foam rubber having excellent heat resistance (100 ° C. or higher) and a material more excellent in durability than that, for curing the adhesive C between the substrates A and B. When the pressing surface 4a of the upper lid 4 comes into contact with the annular sealing material 5, its thickness dimension is as shown in FIG.
As shown in the figure, the front end surface 8a is not in contact with the upper end surfaces of the substrates A and B via a gap, and the upper lid 4 is pushed down at atmospheric pressure due to the reduced pressure in the closed space 6 surrounded by the annular sealing material 5C. When the end face 8a is turned on, as shown in FIG.
Are set so as to be brought into contact with the upper end surfaces of the substrates A and B to be compressed and deformed.

In the present embodiment, a cushioning material 8 'which is softer than the annular sealing material 5C is provided at the peripheral portion of the pressing surface 4a of the upper lid 4 facing the annular sealing material 5C. Is pressed down at atmospheric pressure, the peripheral cushioning material 8 'is compressed and deformed prior to the annular sealing material 5C, and the tip end surface 8a of the cushioning material 8 is brought into contact with the upper end surfaces of the substrates A and B to be compressed and deformed. Is set to However, the present invention is not limited to this. The top surface 8a of the cushioning material 8 is brought into contact with the upper end surfaces of the substrates A and B within a range where the annular sealing material 5C is crushed as the upper lid 4 is pushed down at atmospheric pressure. If it can be compressed and deformed, a projection made of a rigid body may be formed integrally with the upper lid 4 instead of the peripheral cushioning material 8 '.

Next, the operation of the liquid crystal panel manufacturing apparatus will be described. First, in the initial state, the surface plate 1 is made of an adhesive C
Is kept at a temperature that does not affect the temperature, for example, 60 ° C. or lower, and the upper cover 4 is raised to set the substrates A and B on the surface plate 1. After the completion of this setting, as shown in FIG. 1A, the upper lid 4 is lowered by gravity or driven by a cylinder to come into contact with the annular sealing material 5, whereby the upper lid 4 and the platen 1
A closed space 6 surrounded by the annular sealing material 5 is formed between the closed space 6.

Thereafter, suction and exhaust are started from the suction passage 1b of the platen 1, and the pressure in the closed space 6 is reduced. Thereby, as shown in FIG. 1B, the upper lid 4 is gradually pushed down at atmospheric pressure, and the tip end surface 8a of the cushioning material 8 is pressed against the substrates A and B and is compressed and deformed. As a result, the thickness unevenness between the pressing surface 4a of the upper lid 4 and the upper end surfaces of the substrates A and B is averaged regardless of the flatness of the pressing surface 4a of the upper lid 4. Therefore, the substrates A,
B can be reliably pressed to a predetermined gap while keeping B completely parallel.

Further, with the decompression of the closed space 6, both substrates A,
The air remaining between B, specifically, the air remaining in the liquid crystal enclosing space C2 surrounded by the adhesive C is extracted from the liquid crystal injection hole C1 opened in a part of the adhesive C. Therefore, the air remaining in the liquid crystal enclosing space C2 does not become a reaction force against the pressurization of the substrates A and B, and can be smoothly crushed to a predetermined gap.

When the substrates A and B are crushed to near the predetermined gap, the heating means 2 of the surface plate 1 and the heating / cooling means 7 of the upper lid 4 are energized to uniformly raise the temperature of the substrates A and B. Then, the adhesive C is softened to form a predetermined gap, and the temperature is controlled until the adhesive C is cured.

At this time, the platen 1 has high rigidity and the substrates A and B
Since it is integrally formed of a heat-resistant material having the same coefficient of thermal expansion as above, the shape is maintained without deformation due to heat, and the heating means 2 is placed in the interior thereof in a planarly dense state and mutually The pressure surface 1a of the surface plate 1
The whole is rapidly heated uniformly. Therefore, heat can be quickly and uniformly transferred from the surface plate 1 to the entire substrates A and B.

After the curing of the adhesive C is completed, the suction and exhaust from the suction passage 1b of the surface plate 1 is stopped, and the cooling means 3 of the surface plate 1 and the cooling pipe of the heating / cooling means 7 of the upper lid 4 are connected to the cooling pipe. Each of the substrates is cooled by passing water, and then the upper lid 4 is raised to take out the substrates A and B. Thereafter, the above-described operation is repeated.

On the other hand, FIGS. 3 and 4 each show another embodiment of the present invention. In FIG. 3, the heating means 2 of the surface plate 1 is not a large number of linear heaters but a planar heater, which is disposed at an intermediate position between the upper and lower surfaces of the surface plate 1 and is cooled on one of the upper and lower sides. The configuration in which a plurality of cooling pipes are arranged at predetermined pitches in the horizontal direction as means 3 is different from the embodiment shown in FIGS. 1 and 2, and the other configuration is the embodiment shown in FIGS. 1 and 2. Is the same as

Therefore, in the apparatus shown in FIG. 3, since there is no gap between the heat sources as compared with the embodiment shown in FIGS.
There is an advantage that the entire substrates A and B can be heated more uniformly, and the structure can be simplified and the manufacturing cost can be reduced as compared with the case where a large number of linear heaters are arranged.

In FIG. 4, the structure of the upper lid 4 is a hollow structure having a built-in reflecting plate 7 'with a heater as described in Japanese Patent No. 2934438, and a pressing surface which contacts the substrates A and B is provided. The configuration of the flexible film 9 having the same coefficient of thermal expansion as the substrates A and B is different from the embodiment shown in FIGS. 1 and 2, and other configurations are shown in FIGS. 1 and 2. This is the same as the embodiment described above.

Therefore, the substrate shown in FIG. 4 can be quickly moved from the platen 1 similarly to the embodiment shown in FIGS.
It is still possible to conduct heat uniformly to the entire B.

In the embodiment described above, the substrates A and B are
The closed space 6 is formed by setting the upper lid 4 and lowering the upper lid 4 to come into contact with the annular seal material 5. Although the case where the substrates A and B are pressurized is shown, the present invention is not limited to this, and the substrates A and B are heated by the heating means 2 of the platen 1 while being crushed to a predetermined gap. Other structures may be used as long as the effect of curing the thermosetting adhesive C between the first and second members B can be obtained. Further, in the embodiment shown in FIGS. 1 and 2, a plurality of linear heating means 2 and cooling means 3 are respectively arranged in parallel, but the present invention is not limited to this. 3 may be arranged in such a manner as to be separated from each other in the vertical direction so that a plurality of them intersect when viewed from the plane.

[0028]

As described above, according to the first aspect of the present invention, the platen is integrally formed of a heat-resistant material having high rigidity and a thermal expansion coefficient similar to that of the substrate. As a result, the shape is maintained without deformation due to heat, and the heating means and the cooling means are buried inside thereof in a planarly dense state and close to each other, so that the platen is activated by the operation of the heating means. The entire pressurized surface is rapidly heated uniformly,
Because of the rapid cooling by the operation of the cooling means, heat can be quickly and uniformly transferred from the surface plate to the entire substrate. Therefore, when slight unevenness occurs on the upper and lower joint surfaces of the surface plate, the part of the substrate that is partially contacted conducts heat first and the part that is not contacted has a longer entire surface of the substrate than the conventional one where heat conduction is delayed. It can be heated uniformly and has excellent thermal response and easy temperature control.
This effect is particularly noticeable when the size of the surface plate is increased with the increase in the size of the substrate. Further, as compared with the prior art in which the upper and lower joint surfaces of the surface plate are completely flattened, there is no need to perform an operation of completely flattening the joint surface, so that the production cost of the surface plate can be greatly reduced.

According to a second aspect of the present invention, in addition to the effect of the first aspect, the upper half and the lower half of the platen have the same condition with the heating means and the cooling means interposed therebetween. Since there is no difference in temperature between the upper half and the lower half, deformation of the surface plate due to temperature change can be completely prevented.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view of a liquid crystal panel manufacturing apparatus showing one embodiment of the present invention, wherein (a) shows a state before decompression,
(B) shows the time when the substrate is pressurized by decompression.

FIG. 2 is a cross-sectional plan view taken along the line (2)-(2) of FIG. 1 (a).

FIG. 3 is a longitudinal sectional front view of a liquid crystal panel manufacturing apparatus showing another embodiment of the present invention, showing a state before decompression.

FIG. 4 is a longitudinal sectional front view of a liquid crystal panel manufacturing apparatus showing another embodiment of the present invention, showing a state before decompression.

[Explanation of symbols]

 A, B substrate C adhesive 1 surface plate 2 heating means 3 cooling means

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Joe Aoyama 2-9-9 Kandanishikicho, Chiyoda-ku, Tokyo Shin-Etsu Engineering Co., Ltd. F-term (reference) 2H088 FA04 FA30 2H089 NA45 NA48 NA60 NA60 QA12

Claims (2)

[Claims] 1. The two substrates (A, B) bonded with high precision are set on a surface plate (1), and the substrates (A, B) are pressed and crushed to a predetermined gap while maintaining the precision. In the liquid crystal panel manufacturing apparatus, the heating means (2) of the surface plate (1) heats the thermosetting adhesive (C) between the two substrates (A, B). ) Is integrally formed of a heat-resistant material having high rigidity and a thermal expansion coefficient similar to that of the substrate (A, B), and the heating means (2) and the cooling means (3) are densely planarized inside. A liquid crystal panel manufacturing apparatus characterized by being buried in a state of being close to each other. 2. The liquid crystal panel manufacturing apparatus according to claim 1, wherein linear heating means and cooling means (3) are alternately arranged close to the upper and lower intermediate positions of the surface plate (1).