JP2001257456A - Apparatus for partial soldering - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable solder supply that independently corresponds to each land and enable flux coating and preheating to also correspond to each land in soldering on a substrate having fine patterns. SOLUTION: A soldering nozzle and a flux-apply nozzle, both having openings of small-sized holes that correspond to respective lands on the substrate, are formed by using small-diameter pipes, while metal plates of good thermal conduction are used for heat conductors. Stable and proper quantity of molten solder is taken in by sucking or pressing. Soldering process elementals, for example, sucking of solder, sucking of flux, preheat time, spreading of solder, and so on, are controlled by means of a simple linear mechanism, and can be finely adjusted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for partially soldering a printed circuit board on which electronic components are mounted, corresponding to each land where soldering is required, using molten solder.

[0002]

2. Description of the Related Art Japanese Patent Application No. 19642/1999 discloses a method of independently supplying, heating, and infiltrating each land or pad by using molten solder in a printed wiring board which has been increasingly fine-pitched in recent years. Techniques have been devised. The use of the soldering nozzle disclosed in this application makes it possible for anyone to easily perform a pattern with a fine pitch with stable quality, efficiently.

[0003] For example, in comparison with a soldering robot used in a large number of machining and assembly lines in recent years, the efficiency of the apparatus using the soldering nozzle of the above-described invention has been improved several times or more. This is a natural result of a simultaneous multi-point system for a robot that performs sequential processing of soldering one point at a time. Also, high-temperature soldering for shortening the tact time, unlike the soldering bits of robots, is not required, and the thermal effect on components is reduced. Also, no solder balls were generated. And with a robot, it is now possible to easily solder a micro-pitch connector into which a bit cannot enter.

[0004] This is a more remarkable characteristic than a local solder bath using jet solder. With a device that is immersed in solder for local surface heating, short-circuiting occurs frequently and soldering in places that are impossible is also a target of stable quality soldering. Above all, compared to conventional solder tank nozzles, the device of the above invention has been reformed so that soldering nozzles can be prepared in any place, any number, even if dense, so partial soldering The field was greatly expanded.

[0005]

As described above, although the independent supply of solder for each land or pad is performed at multiple points at the same time, a great advantage is produced. However, the pitch can be reduced, or one step can be completed in a shorter time. For example, there has been a demand for stable quality with higher quality due to rapid heat conduction and the like as in a multilayer substrate, as well as flexible control of device functions.

In order to make it possible to solder even a so-called half-pitch connector by the method of the present invention, a nozzle body of a fixed size includes an independent solder accommodating portion of a fine pitch and a heater, and a gap between them is thermally conductive. A nozzle filled with a good material must be prepared. Cutting from a block of metal as before has been impossible because of the small diameter processing. In addition, as the number of multi-layered substrates has increased due to the progress of multi-functional integration of the substrates, a tendency has been observed that the amount of heat absorbed by lands and pads has increased significantly, and quick heat supply has become an essential issue.

[0007] In the trend of narrowing the pitch, the solder supply apparatus using the molten solder quickly and reliably secures the solder in the solder hole with a stable amount even if it is minute. The question is how much is possible.

[0008] Appropriate flux application and preheating play an important role in performing continuous soldering with stable quality and high yield. In particular, in the land-compatible soldering mechanism, the solder supply and heating are performed independently for each land, so if the flux application and preheating are also performed independently for each land, the quality is good and the thermal effect on the parts is small. In addition, efficient soldering that does not waste liquid material can be performed.

In such a land-compatible soldering mechanism, it is necessary to finely adjust the amount, time, and speed of solder suction, supply, flux suction, application, preheating, and the like to find optimal soldering conditions. No. For that purpose, it is necessary to control each of the plurality of driving elements numerically based on a simple and wasteless mechanism.

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and in soldering on a substrate having a fine pattern, it is possible to supply molten solder independently for each land and to perform rapid heat conduction. A nozzle is built up, and in addition, an independent flux application and pre-heating mechanism is incorporated for each land, and these elements work together to inductively create and maintain the optimum soldering conditions. It is intended to provide a partial soldering device.

[0011]

In order to achieve the above object, first, in a partial soldering apparatus using a soldering nozzle of the present invention, the soldering nozzle has a small diameter at a position corresponding to a land or a pad of a substrate. A pipe is provided as a solder hole to house a heater, or a pipe for a heat exchange medium mechanism from an external heat source is also provided at the same time, they are enclosed and fixed by a nozzle case, and the resulting gap is filled with a heat conductor. is there.

The heat conductor can be made of molten solder or made of a metal laminate.

The soldering nozzle inserts a solder suction rod into a pipe as a solder hole and moves the rod up and down.
It is effective to provide an airtight packing between the solder hole and the solder suction rod.

The inside of the pipe as the above-mentioned solder hole or a part of the solder suction rod may be a surface adapted to the solder.

Further, a solder hole having one opening corresponding to a plurality of lands or pads is provided. The solder hole is provided with one or more solder suction rods which move up and down, and the solder holes are formed. The surface to be soldered is a surface that is compatible with solder.

A solder storage chamber having a solder pressure inlet opened on the upper surface of the soldering nozzle and an airtight chamber adjacent thereto are provided to connect the two chambers, and the connection opening is connected to the solder pressure inlet. An air press-fit tube is connected to the upper part of the airtight chamber, and the solder storage chamber is filled with the molten solder, and the lower part of the airtight chamber is also filled at the same time.

The above-mentioned solder press-fitting tank is housed in a solder tank which also stores molten solder, and a support rod for moving one of them up and down can be provided.

A flux application nozzle may be used in which small holes are provided at positions corresponding to the lands or pads of the substrate, and the holes are used as flux holes.

The flux hole is formed by a pipe,
They may be contained and fixed by a flux nozzle case, or a flux suction rod may be provided in a flux hole.

A sponge body or a brush is put inside, and a flux tank impregnated with a flux or a flux diluting tank impregnated with a flux diluent can be used in accordance with the flux application nozzle.

Further, a small-diameter hole or a concave portion is provided at a position corresponding to a land or a pad of the substrate to form a partial preheat hole, and a preheat nozzle combined with a heater can be used. The preheat hole and the preheat heater case are connected by a pipe. It is good to form, fit in a preheat nozzle case, fix it, and fill it with a heat conductor.

It is effective to provide a preheat sequence device using a soldering nozzle instead of the preheat nozzle.

One or a plurality of ball screws are combined with two or more ball nuts, and a bearing, a nut receiving timing pulley or a sprocket is attached to the ball nut so as to be rotatable, and assembled into a horizontal plate or a pallet. A timing belt or chain is hung on a pulley or sprocket and driven by a motor. In the case of a pallet, a ball nut connected horizontally is rotated synchronously, and a ball screw is also driven by a motor. Soldering nozzles, preheat nozzles, flux application nozzles It is preferable to use a vertical positioning mechanism in which solder suction rods and flux suction rods are individually connected to two or more horizontal plates or pallets.

The vertical positioning mechanism may be combined with left and right front and rear positioning mechanisms, and an air cylinder may be incorporated in the vertical movement mechanism of the solder suction rod or the soldering nozzle.

[0025]

In the partial soldering apparatus constructed as described above, first, the flux nozzle sucks the flux into the opened flux hole by capillary action, and contacts and applies the corresponding land or pad on the substrate. When sucking up from the flux tank, the sponge body or brush removes the flux adsorbed integrally with the densely packed flux hole opening, thereby enabling pinpoint suction and application. Also, a flux suction rod is inserted into the flux hole to change the volume of the flux hole and adjust the amount of flux to be taken. Further, when the work is not set even after a certain period of time, the tip of the flux application nozzle is immersed in the flux diluent tank.

The preheat holes in the heated preheat nozzle approach and contact the corresponding lands or pads on the substrate with the opening thereof, thereby preheating. Alternatively, the function of the preheat nozzle is performed immediately before soldering with the soldering nozzle by incorporating the preheat sequence device.

The solder holes, flux holes, and preheat holes corresponding to the lands or pads become holes having a small diameter and a small gap between them if the pattern of the substrate becomes narrower and the land pitch becomes smaller, making it difficult to manufacture by cutting. By combining the cut small-diameter pipes while positioning them with the case, which is the outer shell of the nozzle, a nozzle having a solder hole, a flux hole, and a preheat hole opened at a minute and accurate position can be obtained. If heating is necessary, a case for incorporating the heater is also prepared with a pipe, and the gap with the case is filled with a heat conductor. The heat conductor may be a molten solder, and a metal plate having a high conductivity may be stacked by making a hole for a pipe. In this case, the heater case and the nozzle case can be omitted.

A solder suction rod is inserted into a smooth inner surface of a solder hole formed by a pipe to change the volume of the solder hole and adjust the amount of solder to be taken. An airtight packing is incorporated between the solder hole and the solder suction rod to stabilize the suction of the solder at a negative pressure. When the inner surface of the solder hole surrounded by the pipe is processed into a surface that is compatible with the solder, suction by capillary action occurs, and a small amount of solder is reliably taken in.

In the case where the land or the pad has a fine narrow pitch exceeding a certain limit, a solder hole having an opening including a plurality of lands or pads at the same time is provided.
The inner surface is adapted to be adapted to the solder. The solder taken into the solder hole is pushed out from the opening and infiltrates the soldering portion in common. After that, the solder suction rod is pulled up to absorb excess solder, and soldered to an extremely small portion.

The solder filled in the solder storage chamber and connected to the lower part of the airtight chamber is connected to the solder hole opening of the soldering nozzle which is closely attached to the pressure inlet of the solder injection tank, and increases the air pressure of the airtight chamber. Pressed by At this time, if the solder suction rod is inserted into the solder hole, the solder is slid and the amount of solder whose volume is increased is pressed into the inside of the solder hole. Also, sink the solder press-fit tank into the solder of another solder tank, heat and melt the solder in the solder tank, sink the solder press-fit tank deeply, take in the solder from the press-in port, and then ascend to raise the press-in port to the solder surface. The soldering nozzle and the solder press-fitting tank are separated from each other in the air after the solder is secured, and the solder is cut easily.

A ball nut on a plane, which is rotatably mounted on a pallet, is synchronously rotated by a pulse motor or a servomotor via a timing pulley and a belt, and is soldered to a plurality of pallets by a soldering nozzle, a preheat nozzle, a flux application nozzle, The solder sucking rod, the flux sucking rod, etc. are individually connected and individually moved up and down. If two or four ball screw shaft ends are also rotated synchronously by a motor, the connected nozzles and rods are vertically moved together as a whole while maintaining the interval between them. Using a single ball screw and a pallet as one horizontal plate, a smooth vertical movement can be obtained with a slide rod parallel to the ball screw. If the movement positioning in the plane direction is incorporated in addition to the vertical movement, each nozzle contacts any point on the substrate. If an air cylinder is incorporated in the vertical movement mechanism of the soldering nozzle or the solder suction rod, the soldering nozzle or the solder suction rod is quickly separated from the solder surface, and suction with good solder cutting is achieved.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described with reference to the drawings. In FIG. 1, a solder hole 4 of a soldering nozzle 5 and a heater housing case 6 or a heat exchange part corresponding to a plurality of lands 2 on a substrate 1 are formed by pipes. The heat conductor 9 is filled in a gap formed in the nozzle case 8 which is formed by the nozzle 7 and holds and fixes them.

In the embodiment shown in FIG. 2, of the embodiment shown in FIG. 1, the heat conductor 9 is a metal laminated plate 11, and the heating heater storage case and the nozzle case are unnecessary.

In the embodiment shown in FIG. 3, the solder suction rod 40 is slid into the pipe 7 forming the solder hole 4 in the embodiment shown in FIG. An airtight packing 52 was provided between them.

In the embodiment shown in FIG. 4, there is one opening 47 corresponding to a specific plurality of lands 2 at the same time,
In addition, a soldering nozzle 49 having a plurality of small holes at the upper part thereof, a part of the inner surface of which is a surface 50 adapted to solder, and a solder hole 48 having a solder suction rod 40 sliding inside is shown.

In the embodiment shown in FIG. 5, the nozzle opening 3 of the soldering nozzle 46 is brought into close contact with the solder pressure inlet 12 through the heat-resistant packing 18, and the solder storage chamber 14 and the adjacent airtight chamber 13 are connected. The upper edge 16 of the opening formed in the wall 15 separating the two chambers is located below the solder pressure inlet 12, an air press-fit pipe 17 is connected to the upper part of the airtight chamber 13, and the lower parts of the solder storage chamber 14 and the airtight chamber 13 are also melted solder. Solder press-fit tank 1 filled with 10
9 shows a situation in which they are immersed in another solder tank 21 and moved up and down along the support rod 22 to increase the pressure in the airtight chamber 13 and press-fit the solder.

In the embodiment shown in FIG. 6, a plurality of small holes opened corresponding to a plurality of lands 2 are formed by a pipe 7 to form a flux hole 23, and a flux application nozzle 24 is used to slide a flux suction rod 26. When the liquid is sucked from the flux tank 27, the excess liquid is removed by the action of the sponge body 51.

In the embodiment shown in FIG. 7, a plurality of small holes, which correspond to a plurality of lands 2 and are opened, are formed by a pipe 7 to form a preheat hole 29, and are fixed together with a preheat heater case 53 in a preheat nozzle case 54. Then, preheating is performed using the preheating nozzle 30 configured to fill the generated gap with the heat conductor 9.

In the embodiment shown in FIG.
Ball screw 32, ball nut 33, bearing 3
5. Attach the nut receiving base 36, the timing pulley 37, and the timing belt 38 respectively, rotate them synchronously by the motor 39, move the connected soldering nozzle 46 and the solder suction rod 40 up and down, and move the shaft end of the ball screw 32 to the motor 39.
The air cylinder 45 is incorporated in the middle of the vertical drive mechanism.

[0040]

Since the present invention is configured as described above, it has the following effects.

When the solder is heated and melted to form a liquid, the solder exhibits a large surface tension characteristic. It has been a concern that the surface tension may cause an obstacle such as a short circuit when soldering a very small amount. Soldering workers are well aware that solders that are once attached to each other are difficult to separate. That is why it has been a long time since the supply of minute amounts of solder using cream solder became a natural processing technique.
However, if you look at this surface tension at a slightly different angle, you can't say that it's just mischief. For example, I am surprised at how quickly it penetrates even a small gap. And whenever the flux effect is working, it tends to be round and small. It can be said that the properties of solder as a liquid are not found in cream solder at all. When this is used for supplying a small amount of solder onto the board, dripping, scumming, improper plate removal, solder balls, etc., attached to the cream solder are wiped out, obstructing parts due to overall heating during reflow, and heat-resistant parts. There is no waste such as mounting. There is no need to perform solder supply and infiltration in separate steps, unlike cream solder. It is thought that soldering, which is left to nature, will also facilitate process control. Why hasn't this property been reviewed and used?

What happens if a component having a small pitch and a small amount of solder is temporarily bonded and fixed and flowed by a flow soldering device? Apart from the sudden heating of the solder damaging it, you will be surprised again by the number of unsolders and shorts. This results in no significant difference in local soldering using a jet nozzle for partial surface heating. In this soldering, the supply of the solder is performed in an infinitely continuous manner in a large amount, and the solder is immersed while flowing. The entire surface of the substrate is brought into contact with the solder flow so as to allow the solder to spread therein. The result is a lot of non-infiltration and countless shorts. What if we touch the solder that is not continuous here? That is, consider soldering one by one using a soldering iron having a bit as small as possible. Regardless of efficiency, short-circuiting and unsoldering do not occur.

The molten solder will never cause a short circuit if an appropriate amount is applied independently to a necessary place together with a necessary heat. Of course, no dripping, no shading, no solder balls. Rather, it penetrates even a small gap instantaneously. Since only the soldering point is heated, the thermal effect on the parts is minimized.
This is because surface tension works to protect it.

Thus, the flux application nozzle, the preheat nozzle, the soldering nozzle, and the driving mechanism of the flux application nozzle and the preheating nozzle according to the present invention realize an appropriate amount of solder at a necessary place and necessary heat at the same time. This is a partial soldering device that has been repeatedly improved based on a nozzle mechanism that forms a fine hole with a pipe for the purpose of stably and reliably sucking and supplying flux and solder.

The flux exhibits its effect only at the soldering points. The flux adhering to the resist and the parts is not only wasted but also causes harm. The flux application nozzle is applied only to the land or the pad, and the amount can be adjusted to a necessary minimum. Since it does not scatter like a spray fluxer, there is no need for exhaust equipment such as a duct.
Above all, the amount of flux used has dropped dramatically. And since it is incorporated into a main mechanism using a ball screw as a part, the configuration is simple and takes up little space, and the cost is lower than that of the conventional coating apparatus.

The preheating time was greatly shortened because of the application of the minimum necessary amount of flux. Moreover, the preheating nozzle of the point heating minimizes the heat influence on the parts. In particular, preheating immediately before soldering, which also serves as a soldering nozzle, requires only a sequence mechanism and does not require a dedicated nozzle, and furthermore, soldering in the next step is continuously performed without interruption, so that heat diffusion can be suppressed. . This was an important issue for the point preheat of heating only the land. That is, the heat is prevented from disappearing for a time shorter than a few seconds before the solder is supplied, so that not only the preheating nozzle but also the substrate moving mechanism and the space for the preheating are not required.

Each nozzle using a very small diameter pipe paved the way for a smaller pitch. It was very difficult to make a hole having a diameter of 1 mm or less and a depth of 2, 30 mm in a solid metal block. In the soldering nozzle, it is important how much heat conduction is increased.
Eliminating the air layer that provides heat insulation inside the nozzle mechanism, stacking a plate-shaped workpiece using solder, copper alloy, aluminum, etc. from the so-called heat transfer cement as a filler, and tens of times the conduction efficiency Brought improvement. With the increase in the number of multilayer substrates, it is now possible to greatly reduce the problem of insufficient infiltration of through holes that have large heat absorption.

The method of reliably incorporating a fixed amount of solder into a solder hole formed by a pipe has characteristics in several types described in the claims. First, when the solder hole opening is brought into contact with the solder liquid surface and sucked, a mechanism for inserting the solder hole pipe deep into the solder becomes unnecessary. Here, air entered into the gap between the solder suction rod and the airtight packing attached so as not to reduce the negative pressure of the solder hole worked effectively. Next, when the inner surface of the solder hole is made to be a surface that is compatible with the solder, natural solder suction is performed by capillary action. The smaller the diameter, the more difficult it is to create and maintain a surface that is compatible with the solder, and the formation of an oxide film of the solder also hinders, so that measures such as brushing are indispensable. In the case of a connector with a very fine pitch, QFP, etc., if a plurality of locations are infiltrated with one molten solder at the same time and a nozzle that sucks up excess is used,
The result easily exceeded the pitch limit of the conventional soldering.

[0050] Soldering by inserting the solder hole pipe deep into the solder bath was one of the most stable methods, but the weight of the solder around it worked to try to push it into the pipe. Depends on power stability. In this case, a mechanism for vertically driving the solder hole pipe is required. In addition, an air film is formed between the solder hole pipe and the outer cylinder for vertical movement, which hinders heat conduction. In addition, the vertical movement caused by the ball screw not only increases the tact time, but also tends to cause solder erosion at the time of ascending, which necessitates quick lifting. The solder press-fit tank keeps the solder hole opening on the solder liquid level and applies pressure to the solder itself and pushes it in, so that the above-mentioned vertical drive is unnecessary while maintaining stability, so the outer cylinder is removed and heat conduction is improved, Solder erosion was eliminated because the air pressure injection into the airtight chamber was instantaneously switched by a valve.

In this apparatus for performing fine soldering, not only the position, timing and speed of the soldering nozzle, preheat nozzle, flux application nozzle, solder sucking rod, flux sucking rod, etc., but also the entirety are simultaneously moved. In this case, control must be performed to move to the solder bath and the flux bath liquid level, and then adjust to the land on the substrate. The vertical mechanism was useful for easily performing these arbitrary fine adjustments using numerical values, and also reducing waste and reducing space by also using element parts in the mechanism.

The fine pitch of substrates used in electronic equipment is progressing without stopping. It is considered that this partial soldering device, which uses these minute nozzles and also has a mechanism for effectively using them, and which can make full use of the surface tension of the molten solder, can exert its effects in a wide field.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of a soldering nozzle.

FIG. 2 is a longitudinal sectional view showing an embodiment of a soldering nozzle.

FIG. 3 is a longitudinal sectional view showing an embodiment of a soldering nozzle.

FIG. 4 is a longitudinal sectional view showing an embodiment of a soldering nozzle.

FIG. 5 is a longitudinal sectional view showing an embodiment of a solder press-fit tank.

FIG. 6 is a longitudinal sectional view showing an example of a flux application nozzle.

FIG. 7 is a longitudinal sectional view showing an embodiment of a preheat nozzle.

FIG. 8 is a longitudinal sectional view showing an embodiment of a vertical drive mechanism.

[Explanation of symbols]

 Reference Signs List 1 board 2 land 3, 47 opening 4, 48 solder hole 5, 46, 49 soldering nozzle 6 heater housing case 7 pipe 8 nozzle case 9 heat conductor 10 molten solder 11 metal laminate 12 solder pressure inlet 13 airtight chamber 14 Solder Storage Room 15 Partition Wall 16 Upper Edge of Opening 17 Air Press-In Pipe 18 Heat-Resistant Packing 19 Solder Press-In Tank 20 Heater 21 Solder Tank 22 Support Rod 23 Flux Hole 24 Flux Application Nozzle 25 Flux Nozzle Case 26 Flux Suction Rod 27 Flux Tank 28 Flux dilution tank 29 Preheat hole 30 Preheat nozzle 31 Preheat sequence device 32 Ball screw 33 Ball nut 34 Pallet 35 Bearing 36 Nut holder 37 Timing pulley 38 Timing belt 39 Over data 40 solder wicking rod 41 transverse plate 42 a linear bearing 43 slide rod 44 horizontally positioning the ball screw 45 adapt to solder the air cylinder 50 face 51 cavernosal 52 airtight packing 53 preheat heater case 54 preheat nozzle case

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // B23K 101: 42 B23K 101: 42

Claims (20)

[Claims] A lower surface is a plane that can simultaneously contact a plurality of lands (2) or pads at a soldering position on a substrate (1), and has an opening (3) on the lower surface, and the opening (3). (3) A soldering nozzle (5) having a plurality of solder holes (4) formed of small holes respectively corresponding to the positions of the lands (2) or pads.
The respective solder holes (4) and the heater storage case (6) or the heat exchange part are formed by pipes (7), and the gap formed in the nozzle case (8) for storing them is filled with the heat conductor (9). A partial soldering apparatus using the soldering nozzle (5) having the above configuration. 2. A molten solder (10) as a heat conductor (9)
2. The partial soldering apparatus according to claim 1, wherein a soldering nozzle (5) is used. 3. The partial soldering apparatus according to claim 1, wherein a soldering nozzle (5) is used, in which the heat conductor (9) is formed of a metal laminate (11). 4. A soldering rod (40) is slid into a pipe (7) forming a solder hole (4), or an airtight packing (52) is provided between the solder hole (4) and the solder sucking rod (40). 2. The partial soldering apparatus according to claim 1, further comprising: 5. A pipe (7) forming a solder hole (4), the whole or a part of an inner surface of which is a surface (50) adapted to solder, or a part of a solder suction rod (40) is adapted to solder similarly. 2. The partial soldering device according to claim 1, wherein the surface is a surface. 6. A lower surface of a soldering portion on the substrate (1) which can be in contact with a specific plurality of lands (2) or pads at the same time. ) Or an opening (47) corresponding to the pad at the same time, and one or a plurality of small holes above the opening (47), and a part or the whole of the inner surface thereof is a surface adapted to solder. And a partial soldering apparatus using a soldering nozzle (49) having a solder hole (48) with a solder sucking rod (40) sliding therein. 7. A solder storage chamber (14) having an upper surface with a surface including a solder pressure inlet (12) opened corresponding to a lower surface opening (3) of a solder hole (4) of a soldering nozzle (46). An airtight chamber (13) having an upper surface at a position higher than the solder pressure inlet (12) without being in contact with the soldering nozzle (46) closely contacted with the solder pressure inlet (12) is adjacent to the two chambers. A part of (15) is opened or connected by a connecting pipe, the upper edge (16) of the opening is below the solder pressure inlet (12), and the air press-fit pipe (1) is connected to the upper part of the airtight chamber (13).
7) are connected, and the airtight chamber (13) and the solder storage chamber (1) are connected.
4) with a heater (2) inside or outside
0) or a heat exchanger, and the lower part of the solder storage chamber (14) and the hermetic chamber (13) is filled with molten solder (10) to form a solder press-in tank (19). The solder press-in tank (19) is soldered. A partial soldering device used in accordance with the nozzle (46). 8. A solder rod (21) for accommodating a solder press-fit tank (19) in the stored molten solder (10), and a support rod (19) for vertically moving the solder press-fit tank (19) or the solder tank (21). The partial soldering apparatus according to claim 7, wherein the apparatus is used in combination with (22). 9. A plane which individually corresponds to the positions of a plurality of lands (2) or pads at a soldering position on the substrate (1), and a plane which the lands (2) or pads can contact simultaneously is defined as a lower surface. A partial soldering apparatus using a flux application nozzle (24) having a flux hole (23) composed of a plurality of small holes having an opening on the lower surface thereof. 10. In a flux application nozzle (24), each flux hole (23) is formed by a pipe (7), and these are formed in a flux nozzle case (2).
The partial soldering apparatus according to claim 9, wherein the flux application nozzle (24) is configured to be housed and fixed in (5). 11. Each flux hole (23).
10. The partial soldering apparatus according to claim 9, wherein a flux application nozzle (24) provided with a flux suction rod (26) sliding inside is used. 12. A flux tank (27) containing a sponge body (51) or a brush therein and containing a flux to be supplied to a flux application nozzle (24), and used in accordance with the flux application nozzle (24). Item 10. The partial soldering device according to Item 9. 13. A partial solder according to claim 9, wherein a flux dilution tank (28) accommodating a flux tank (27) and containing a sponge body (51) or a brush therein is used in accordance with the flux application nozzle (24). Mounting device. 14. An opening corresponding to a plurality of lands (2) or pads of a soldering position on the substrate (1), respectively, and a plane where the lands (2) or pads can simultaneously contact. And a preheating nozzle (30) having a heater (20) and a preheat hole (29) comprising a plurality of small holes or recesses having the following. 15. The preheat nozzle (30),
Each preheat hole (29) and a preheat heater case (53) are formed by a pipe (7), and they are housed and fixed in a preheat nozzle case (54), and a gap formed in the preheat nozzle case (54) is thermally conducted. 15. The partial soldering device according to claim 14, wherein the device is filled with a body. 16. A preheat sequence apparatus for bringing lands (2) or pads of a substrate (1) coated with flux into solder holes (4) and openings (3) of soldering nozzles (5), respectively, and approaching or contacting them. A partial soldering device using (31). 17. A ball screw (32) having at least two
At least one ball nut (33) is incorporated, and a bearing (35) is combined for each ball nut (33). The bearing (35) is a ball nut (33) that fixes the outer ring to the horizontal plate (41) and rotates the inner ring. The ball nut (33) incorporates a timing pulley (37) or a sprocket together with the nut support (36), and the horizontal plate (41) includes a linear bearing (42) and the like. And fix the ball screw (32)
And a motor (39) for driving a timing belt (38) or a chain meshed with a timing pulley (37) or a sprocket, and a motor (39) for sliding along a slide rod (43) provided in parallel with the horizontal plate (4).
1) Soldering nozzle (46), preheat nozzle (30), flux application nozzle (24), solder suction rod (40), flux suction rod (26) as required
And the corresponding ball screw (32)
A partial soldering device using a vertical positioning mechanism for transmitting rotation of another motor (39) to a shaft end. 18. A plurality of ball screws (32) each incorporating at least two or more ball nuts (33),
The horizontal plate (41) is shared with each other, and the ball nut (3
3) Each pallet (34) is connected horizontally while being rotatable one by one, and is horizontally connected and rotated via a timing pulley (37) or a timing belt (38) or a chain meshed with a sprocket. A motor (39) is provided for each pallet (34), and a motor (39) for connecting and rotating the timing pulleys (37) or the sprockets horizontally at the screw shaft ends thereof in parallel. 18. The partial soldering apparatus according to claim 17. 19. A horizontal positioning ball screw (44) that moves back and forth or left and right in each cross plate (41) or pallet (34) or as a whole, including the ball screw (32). 18. The partial soldering apparatus according to claim 17. 20. An air cylinder (45) in the middle of the vertical movement mechanism of the soldering nozzle (46) or the solder suction rod (40), that is, at the end of the rod connecting the soldering nozzle (46) and the pallet (34). 18. The partial soldering apparatus according to claim 17, wherein the soldering nozzle is used in combination with the soldering nozzle.