JP2001250832A - Device for supporting work and its supporting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for supporting a work and its supporting method by which the work can be held in stable position. SOLUTION: In a device for supporting a work which supports a carrier 3 provided with a housing 3a for housing a package 4 to which a semiconductor chip is mounted, a recessed part 2a whose outer periphery is left and surface is removed is provided on the upper surface of a supporting member 2 which is brought into contact with the lower surface of the carrier 3 and positions the carrier 3. While the carrier 3 is placed on the supporting member 2, the carrier 3 is sucked in vacuum through a suction hole 2c, thereby producing a sucked space between the recessed part 2a and the lower surface of the carrier 3. This vacuum suction makes the carrier to be sucked in vacuum, and the package 4 in the housing part 3a is sucked in vacuum through a suction hole 3b of the housing part 3a so that the package 4 is held in position. Thus, the package 4 can be held in position in such a stable state where the warpage of the carrier 3 is corrected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work receiving apparatus and a work receiving method for receiving a work held in a container in an electronic component mounting apparatus.

[0002]

2. Description of the Related Art Usually, a work such as a small package on which a semiconductor chip is mounted is handled in a state where many works are housed in a tray-shaped container. In some cases, these containers are used as carriers for transportation in an electronic component mounting apparatus. And, at a mounting position where the electronic component is mounted on each work, a support device is provided for positioning and holding the work. In this lower receiving device, the lower receiving member is brought into contact with the lower surface of the carrier, and the carrier and the work are held by vacuum suction by vacuum suction.

As a method of holding a work housed in a carrier, a method of sucking and holding a work to a carrier by individually vacuum suctioning suction holes provided in respective housing sections for housing the work has conventionally been used. Was used. For this reason, the lower receiving device is provided with a suction hole for communicating with each of the suction holes opened on the lower surface of the carrier and for performing vacuum suction, and at the time of lower receiving, the lower surface of the carrier is brought into close contact with the suction hole of the lower receiving device. Vacuum suction was being performed.

[0004]

However, the carrier is apt to bend due to a load or thermal deformation, and the flatness is not always completely maintained in use.
When vacuum suction is performed while the bent carrier is placed on the lower receiving device, a vacuum leak occurs between the suction hole of the carrier and the suction hole of the lower receiving device, and the workpiece is stably held. There was a problem that it was not possible.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a work supporting device and a work supporting method capable of holding the work in a stable state.

[0006]

According to a first aspect of the present invention, there is provided a work receiving device for positioning a plate-like container provided with an accommodating portion for accommodating a work on which an electronic component is mounted. A lower receiving device, comprising: a lower receiving member having a lower receiving surface that abuts on a lower surface of the container and is positioned vertically, and a suction space provided between the lower surface of the container and an upper surface of the lower receiving member. And a concave portion communicating with a suction hole provided in the housing portion, and sucking the suction space to vacuum-suction the container and vacuum-suck a work housed in the housing portion to hold a position. Vacuum suction means.

According to a second aspect of the present invention, there is provided a lower receiving device for a workpiece, wherein the lower receiving device contacts the lower surface of the container in the recess to prevent deformation of the container during vacuum suction. A support is provided.

According to a third aspect of the present invention, there is provided a work supporting method for positioning a plate-shaped container provided with a housing portion for housing a work on which an electronic component is mounted and receiving the work. A vacuum space is formed between the lower surface of the container and the lower receiving member to form a suction space and communicate with a suction hole provided in the housing portion by vacuum suction means. In addition to the vacuum suction, the position of the work accommodated in the accommodation section is maintained by vacuum suction.

According to the present invention, a suction space is formed between the lower surface of the container provided on the upper surface of the lower receiving member and the container for accommodating the work in the container, and the inside of the concave portion communicating with the suction hole provided in the container is formed. Vacuum suction by the vacuum suction means, vacuum suction of the container and vacuum suction of the work accommodated in the housing portion to maintain the position, thereby correcting the bending of the container and vacuum sucking the work in a stable positioning state. Position.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a cross-sectional view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a lower receiving device of a work according to an embodiment of the present invention, and FIG. It is sectional drawing of the lower receiving device of a workpiece | work.

First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a carrier 3 which is a plate-like container is provided on a lower receiving member 2 provided on a mounting stage 1.
Is placed. A large number of concave receiving portions 3a (see FIG. 2) are provided on the upper surface of the carrier 3 in a lattice shape, and each of the receiving portions 3a stores a package 4 which is a work in advance in a previous process. The package 4 is provided with a concave portion 4a on which a semiconductor chip 5 as an electronic component is mounted.
The semiconductor chip 5 is mounted on the package 4 inside.

FIG. 1 shows a mounting stage 1 at a mounting position where a semiconductor chip 5 is mounted on a package 4. The mounting stage 1 includes a block-shaped lower receiving member 2 as a lower receiving device for a work. I have. By placing the carrier 3 on the lower receiving member 2, the upper surface of the lower receiving member 2 comes into contact with the lower surface of the carrier 3, whereby the carrier 3 containing the package 4 is received by the lower receiving member 2, Positioning and fixing during mounting of the semiconductor chip 5 are performed.

A chip supply unit 7 is provided on the side of the mounting stage 1. The chip supply unit 7 supplies the semiconductor chips 5 mounted on the package 4 in a state of being accommodated in the chip tray 7a. The mounting head 6 is arranged to be vertically and horizontally movable with the chip supply unit 7 and the mounting position as a movement range. The mounting head 6 picked up by suctioning the semiconductor chips 5 arranged on the chip tray 7a by the suction nozzle 6a is moved onto the carrier 3 positioned on the mounting stage 1 and lowered with respect to the carrier 3. The semiconductor chip 5 is provided in the recess 4 of the package 4.
a.

Next, referring to FIG. 2 and FIG.
The carrier 3 that accommodates the carrier 3 and the lower receiving member 2 that abuts on the carrier 3 to receive the carrier 3 will be described. As shown in FIG. 2, on the upper surface of the carrier 3, a large number of accommodation portions 3a for accommodating the packages 4 are provided in a lattice shape, and as shown in FIG. Is provided. On the upper surface of the lower receiving member 2, a concave portion 2 whose surface is removed in a concave shape leaving an outer edge portion and a plurality of internal island portions 2b.
a is formed.

A suction hole 2c is opened at the center of the concave portion 2a. The suction hole 2c communicates with the suction pipe 11 through an inner hole formed inside the lower receiving member 2. The suction pipe 11 is connected to the vacuum suction means 12. Also, the lower receiving member 2
A sealing member 10 made of resin is mounted on the upper surface along the outer periphery of the concave portion 2a.

The upper surface of the lower receiving member 2 is brought into contact with the lower surface of the carrier 3, and the vacuum suction means 12 is driven to vacuum-evacuate from the suction hole 2c.
Is sucked in a vacuum, whereby the carrier 3 is vacuum-sucked on the upper surface of the lower receiving member 2. That is, the recess 2
The space formed by a and the lower surface of the carrier 3 is an adsorption space. The suction space communicates with the suction holes 3b of each of the storage portions 3a of the carrier 3.

The vacuum suction process will be described. When the carrier 3 containing the package 4 is lowered with respect to the lower receiving member 2 as shown in FIG. 3A while vacuum-sucking from the suction tube 11, the upper end of the seal member 10 first contacts the lower surface of the carrier 3. Then, by continuing the vacuum suction in this state, as shown in FIG.
Are deformed by being pressed by the vacuum suction force, and the lower surface of the carrier 3 contacts the outer edge of the upper surface of the lower receiving member 2. As a result, the carrier 3 is positioned and fixed in the vertical direction following the upper surface of the lower receiving member 2. That is, the upper surface of the lower receiving member 2 is a lower receiving surface for positioning the carrier 3 in the vertical direction.

At this time, since the concave portion 2a as a suction space for vacuum-suctioning the carrier 3 has a larger suction area than a normal suction hole, the force for holding and holding the carrier 3 is large. Therefore, even if the carrier 3 which is bent from the beginning is placed, the lower receiving member 2
The deformation can be completely corrected by aligning the carrier 3 on the upper surface of the substrate.

At the time of receiving the carrier, the lower surface of the carrier 3 contacts and is supported by the upper surface of the island-shaped portion 2b which remains unremoved at a plurality of positions in the concave portion 2a. Thereby, even if the thin and flexible carrier 3 is sucked by a large vacuum suction force, the carrier 3 is not excessively bent.
That is, the unremoved island-shaped portion 2b in the concave portion 2a is a support portion for preventing the carrier 3 (container) from being deformed during vacuum suction. The shape and arrangement of the island-shaped portions 2b as support portions are set based on the size, bending strength, and the like of the carrier 3.

Further, by continuing the vacuum suction in the suction space (recess 2a), vacuum suction is performed from the suction hole 3b communicating with the suction space, and the package 4 in the housing 3a is evacuated to the bottom of the housing 3a. The position is held by suction. In the vacuum suction of the package 4, as described above, the carrier 3 is firmly sucked on the upper surface of the lower receiving member 2 by the suction space.
Thus, a good vacuum tight state is maintained for the outside. That is, the suction holes 3b of the respective housing portions 3a are suctioned in a good state by the vacuum suction means 12 through the suction space and the suction holes 2c.

Therefore, there is no vacuum leak due to the bending of the carrier 3, which occurs in the method of individually vacuum-suctioning the suction holes of the respective accommodating portions in the conventional supporting method. Accordingly, the position of the package 4 can be stably held by vacuum suction in the housing portion 3a, and the semiconductor chip 5 can be mounted on the package 4 in a stable posture.

In this embodiment, an example is shown in which the lower receiving member 2 is provided on a mounting stage on which the lower receiving member 2 is fixed. However, the lower receiving member 2 is disposed so as to be able to move up and down, and is conveyed by conveying means such as a conveyor. The lower receiving member 2 may be brought into contact with the lower surface of the carrier by raising the lower receiving member 2 with respect to the carrier.

[0023]

According to the present invention, a concave portion formed on the upper surface of the lower receiving member to form a suction space between the lower surface of the container for storing the work in the storage portion and communicating with the suction hole provided in the storage portion. The interior is evacuated by vacuum suction means, the container is vacuum-adsorbed, and the work accommodated in the accommodating section is vacuum-adsorbed to maintain the position, so the bending of the container is corrected and the occurrence of vacuum leak is eliminated. In addition, the work can be vacuum-sucked and held in a stable positioning state.

[Brief description of the drawings]

FIG. 1 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a lower receiving device of the work according to the embodiment of the present invention;

FIG. 3 is a cross-sectional view of a work receiving device according to an embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting stage 2 lower receiving member 2a concave portion 2b island portion 2c suction hole 3 carrier 3a housing portion 4 package 5 semiconductor chip 6 mounting head 10 sealing member 12 vacuum suction means

Claims (3)

[Claims] 1. A work receiving device for positioning and supporting a plate-shaped container provided with a housing portion for housing a work on which an electronic component is mounted, the work receiving device comprising: A lower receiving member having a lower receiving surface positioned in the direction, and a concave portion formed on the upper surface of the lower receiving member to form a suction space between the lower surface of the container and communicating with a suction hole provided in the housing portion. And a vacuum suction means for vacuum-sucking the container by sucking the suction space and vacuum-sucking the work housed in the housing part to maintain the position thereof. apparatus. 2. A lower receiving device for a workpiece according to claim 1, wherein a support portion is provided in said concave portion to abut against a lower surface of said container to prevent deformation of said container during vacuum suction. 3. A method of receiving a work, wherein a plate-like container provided with a housing portion for housing a work on which an electronic component is mounted is positioned and received, wherein the work is provided on an upper surface of a lower receiving member. A vacuum space is formed between the lower surface of the container and the suction hole provided in the housing portion, and the inside of the concave portion communicating with the suction hole is vacuum-suctioned by the vacuum suction means. A method of supporting a workpiece, wherein the workpiece is held by vacuum suction.