JP2001121063A - Filter apparatus and liquid treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove foams contained in a treatment liquid while lowering the consumption of the treatment liquid. SOLUTION: N2 gas is blown to a development solution tank 41 and a development solution is supplied to the surface of a wafer W from a supply nozzle 3 through a filter apparatus 5 by the pressure of the gas. The filter apparatus 5 is provided with a circular flow route 53 communicating from the lower side to the upper side, a filter 55 for removing impurities installed in the inside, a gas discharge route 56 connected to the uppermost part of the flow route 53, and a filter 57 for removing foams so installed as to partially close the gas discharge route 56 and made of, for example, hollow fiber membranes through which a gas can permeate but a liquid cannot. Although the dissolved N2 gas contained in the development solution is evaporated and becomes foams in the flow route 53, the filter 57 for removing foams selectively pass the foams though, so that only foams can be removed from the development solution and the consumption of the development solution can be saved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a liquid processing apparatus for performing, for example, development processing on a substrate, for example, and a filter device included in the liquid processing apparatus.

[0002]

2. Description of the Related Art A mask for forming a circuit pattern on the surface of a semiconductor wafer (hereinafter, referred to as a wafer) is formed by applying a resist to a wafer surface and then irradiating the resist surface with light, an electron beam or an ion beam. And by developing. Of these, the developing step is to dissolve the part irradiated with light or the like in the exposure step or the part not irradiated with an alkaline aqueous solution or the like, and is conventionally performed by the method shown in FIG.

That is, in this conventional method, a wafer W is suction-held on a spin chuck 11 having a vacuum suction function, and a large number of ejection holes 12 are arranged over a length corresponding to the diameter of the wafer W. The supply nozzle 13 is positioned at the center of the wafer W such that the discharge hole 12 is, for example, 1 mm above the surface of the wafer W. Then, the developing solution 10 is supplied to the central portion of the surface of the wafer W from the discharge holes 12 to perform liquid filling as shown in the figure, and then the wafer W is rotated by half a rotation (180 Rotation).

In this type of developing device, as shown in FIG. 11, a nitrogen (N 2) gas is blown into a tank 14, and the developing solution 10 in the tank 14 is sent out by the pressure, so that a filter section 15, a valve 16 and the like are provided. Through the supply nozzle 13 to the wafer W.

The filter section 15 removes particles and the like mixed in the developing solution 10 by filtration. For example, a filter 101 for removing the particles and the like is placed in a case 100 by a flow of the developing solution. Road 10
2 and the flow path 102
A drain passage 103 having a valve 104 is connected to an upper side of the drain passage 103. Reference numeral 105 denotes a capacitance sensor for detecting generation of bubbles, and reference numerals 106 and 107 denote supply paths for the developer 10.

[0006]

However, this developer 1
In the supply system 0, N2 gas is pressurized into the tank 14 as described above, so that N2 is dissolved in the developer 10 sent out by this pressurization. In the filter section 15, the case 10 is provided more than the supply path 106 of the developer 10.
Since the developer 10 flows into the case 100 from the supply path 106 because of its large volume, the pressure is reduced here, and the pressure difference causes N2 dissolved in the developer 10 to evaporate to form fine bubbles ( Microbubbles) are generated.

If such bubbles are mixed in the developer 10, the flow rate of the developer 10 fluctuates due to the presence of the bubbles, or the bubbles adhere to the filter 101 of the filter unit 15, and the filtration accuracy deteriorates. In addition, when the developing solution 10 is loaded on the wafer W, the reaction between the developing solution and the resist becomes insufficient or stopped in the portion where bubbles are mixed, and a development defect occurs. I do.

For this reason, conventionally, bubbles generated in the filter section 15 have been manually removed by opening the valve 104 and the developer 10 via the drain passage 103. Here, the capacitance sensor 105 is set to be in the ON state when the air bubble increases above a certain reference value, and to be in the OFF state when the air bubble becomes equal to or less than the reference value. This was performed based on the OFF signal.

However, in the above-described method, since the developer 10 containing bubbles is discharged, the amount of the developer 10 to be discarded increases, and the consumption of the entire developer 10 increases. is there.

The present invention has been made under such circumstances, and an object of the present invention is to provide a filter device and a liquid processing apparatus which can reduce the consumption of a processing liquid.

[0011]

Therefore, in the present invention,
In a filter device for removing impurities and bubbles contained in the treatment liquid, an impurity removal filter for removing the impurities, a flow path for passing the treatment liquid through the impurity removal filter, Connected to the flow path,
An exhaust path for exhausting gas to the outside of the filter device,
Inside the exhaust path or at the connection between the exhaust path and the flow path, a filter for removing air bubbles provided so as to close the exhaust path, comprising a filter for removing air bubbles, which prevents liquid permeation,
A gas is permeated, and bubbles are removed from the processing liquid by transmitting bubbles contained in the processing liquid through the bubble removing filter. In such a filter device, only air bubbles can be removed from the processing liquid, so that the processing liquid is not discarded and the consumption of the processing liquid can be reduced.

Here, a hollow fiber membrane is preferably used as the air bubble removing filter. In this case, since the hollow fiber membrane can secure a wide contact area with a small volume, the air bubbles can be efficiently removed. . Further, an ultrasonic wave generating means is provided outside the flow path, and ultrasonic vibration is applied to the processing liquid flowing through the flow path to vaporize a dissolved gas contained in the processing liquid to generate bubbles. In this case, the dissolved gas can also be removed, so that the amount of the dissolved gas contained in the treatment liquid can be further reduced.

[0013] Further, the filter device is formed in an annular shape so that the processing liquid flows upward from below, and the filter for removing impurities is provided inside the filter device. It may be provided on the side, in which case the amount of air bubbles removed can be increased. Furthermore, the pressure of the exhaust path may be made lower than that of the flow path. In this case, not only the bubbles contained in the processing liquid but also the dissolved gas can be removed. Can be reduced.

A liquid processing apparatus incorporating such a filter device supplies a processing liquid from which impurities and bubbles have been removed in the filter device to a surface of a substrate held substantially horizontally by a substrate holding portion from a supply nozzle. Thus, a liquid film of the processing liquid is formed on the substrate surface.

According to the present invention, bubbles contained in the processing liquid from the processing liquid tank are removed in the intermediate tank, and the processing liquid is supplied from a supply nozzle to the surface of the substrate held substantially horizontally by the substrate holding section. A liquid processing apparatus that forms a liquid film of a processing liquid on the surface of the substrate, wherein the intermediate tank has an exhaust path for exhausting gas to the outside of the intermediate tank, and an internal or intermediate tank and an exhaust path of the exhaust path. A filter for removing air bubbles provided so as to close the exhaust path, wherein the filter for removing air bubbles blocks liquid permeation and allows gas to permeate, and is included in the processing liquid. The liquid processing apparatus may be configured to remove bubbles from the processing liquid by transmitting bubbles to the filter for removing bubbles, and in this case, only the bubbles can be removed from the processing liquid. Reduction of processing solution consumption It is possible to achieve. At this time, examples of the processing liquid include a developing liquid.

[0016]

FIG. 1 is a diagram showing a configuration of an embodiment in which a liquid processing apparatus according to the present invention is applied to a development processing apparatus. In the figure, reference numeral 2 denotes a spin chuck, which is a substrate holding unit that holds the center of the back surface of the wafer W forming a substrate by vacuum suction and holds it substantially horizontally, and rotates around a vertical axis. It is configured to be rotatable and vertically movable by an elevator 21 and a lifting mechanism 22.

Around the wafer W held by the spin chuck 2, the cleaning liquid and the developing solution are surrounded around the side and the lower side of the wafer W so that the cleaning liquid and the developing liquid do not scatter outside the apparatus when the wafer W is cleaned. The cup 23 is provided as described above, and a discharge path 24 for sucking and discharging the liquid flowing down here is connected to the bottom of the cup 23.

In the drawing, reference numeral 3 denotes a supply nozzle for supplying a developing solution as a processing solution to the surface of the wafer W. As shown in FIG. 2A, for example, a plurality of supply nozzles 3 are arranged along the wafer W over a length equal to or greater than the width of the effective area (device formation area) of the wafer W. Discharge holes 31 are provided.

Next, the supply system of the developer in the supply nozzle 3 will be described. In this supply system, an inert gas such as N2 gas is blown into a developing solution tank 41 which forms a processing solution tank and contains a developing solution 40.
0 is the filter device 5 and the air operated valve 42
Is supplied to the supply nozzle 3 through the supply nozzle 31 and is discharged from the supply hole 31.
The filter device 5, the air operated valve 42, and the supply nozzle 3 are connected by a supply channel 43.

The filter device 5 is for removing particles, such as impurities, and air bubbles such as N2 mixed in the developing solution 40. The structure of the filter device 5 will be described with reference to FIG.
In the drawing, reference numeral 50 denotes a case in which the inner volume is larger than the supply flow path 43, an outer cylinder 51 and an inner cylinder 52 are provided therein, and a developing solution flow path 53 is formed therebetween. Inside, the developer 40 flows upward from below.

Each of the outer cylinder 51 and the inner cylinder 52 has a cylindrical shape whose both ends are closed.
Are arranged so as to face the flow direction. The inner cylinder 52 is
Side wall 51a (longitudinal wall) and bottom wall 51b of outer cylinder 51
(A wall closing the opening on the upstream side) is provided inside the outer cylinder 51 so as to open a predetermined space. The outer cylinder 51
The downstream opening of the inner cylinder 52 is integrated with the upper wall 50c (51).
c, 52c), and thus between the outer cylinder 51 and the inner cylinder 52, the side wall 52a (lengthwise wall) and the bottom wall 52b (the upstream opening of the inner cylinder 52 are closed). An annular flow path 53 of the developer 40 is formed around the wall.

On the side wall 52a and the bottom wall 52b of the inner cylinder 52,
A large number of flow holes 54 for allowing the developer 40 to flow therethrough are formed inside the inner cylinder 52, and the inside of such an inner cylinder 52 is made of, for example, polyethylene for removing the particles. The filter 55 for removing impurities is provided. The bottom wall 51b of the outer cylinder 51 and the inner cylinder 5
The supply flow path 43 is connected to each of the upper walls 52c of the bottom case 51.
Is provided with an inlet 5a for the developer and the upper wall 52c which is the upper end of the case 50 is provided with an outlet 5b for the developer.

Further, an exhaust path 56 for discharging bubbles such as N2 to the outside of the filter section 5 is connected to the upper side (downstream side) of the flow path 53 in the case 50. In this example, the exhaust path 56 is connected to the flow path 53 via the upper wall 51 c of the outer cylinder 51, and is mixed with the developer 40 at a connection portion of the exhaust path 56 with the flow path 53. A bubble removing filter 57 for removing bubbles is provided in an exhaust path 56.
It is provided so as to close a part of.

The air bubble removing filter 57 has a property of permeating only gas without permeating liquid.
For example, it is constituted by a hollow fiber membrane M. Here, the hollow fiber membrane M is formed by bundling hollow fibers F having a hollow core as shown in FIG.
In this example, the hollow fiber membrane M is made of, for example, a synthetic polymer and has a hole diameter L1 of the hole 58 of about 0.001 μm and a membrane thickness L2 of about 0.5 mm to 20 mm. Is used. Such a hollow fiber membrane M is arranged such that, for example, the length direction of the hollow fiber F is substantially the same as the flowing direction of the developer.

Next, the operation of the above embodiment will be described. The spin chuck 2 rises above the cup 22,
A wafer W that has already been coated with a resist in the previous process and that has been exposed is transferred from an arm (not shown) to the spin chuck 2 and held there. Thereafter, the supply nozzle 3 is set above the central portion of the wafer W so that the discharge hole 31 is located, for example, 1 mm above the surface of the wafer W.

On the other hand, in the supply system of the developing solution 40, N 2 gas is blown into the developing solution tank 41, and the developing solution 40 containing N 2 is supplied through the supply channel 43 by the gas pressure to the filter device 5.
Sent to In the filter device 5, the developer 40 supplied from the inlet 5 a into the case 50 through the supply channel 43 is provided.
Flows through the flow path 53 from bottom to top by pressurization of N2.
Has a large internal volume, and the flow path rapidly expands near the inlet 5a, resulting in a reduced pressure state. This pressure difference vaporizes N2 dissolved in the developer 40 to generate bubbles.

Although the bubbles of N 2 rise, a gas-permeable bubble removing filter 57 is provided on the upper side of the filter device 5, and passes through the filter 57 and passes through the exhaust passage 56. And is exhausted to the outside of the filter device 5. When the flow path 53 is filled with the developing solution 40, the inside of the developing solution 40 rises,
And is exhausted to the outside of the filter device 5. At this time, the developer 40 comes into contact with the filter 57 in a state where the developer 40 enters the inside and the outside of the hollow fiber F. However, since the developer 40 cannot pass through the hollow fiber F, only the N2 bubbles which are going to rise pass through the filter 57. I will do it.

On the other hand, the developing solution 40 cannot pass through the filter 57, but flows into the impurity removing filter 55 from the through hole 54 of the inner cylinder 52 toward the outlet 5b.
The particles flow downstream via the outlet 5b while the particles are removed by contact with the filter 55.

As shown in FIG. 2B, while supplying the developing solution 40 supplied to the supply nozzle 31 through the supply flow path 43 to the central portion in the diameter direction of the surface of the wafer W from the discharge hole 32, The wafer W is rotated by 180 degrees. By doing so, the developing solution 40 from the central portion over the diameter direction of the wafer W
Is spread over the wafer W while the liquid is discharged, so that the liquid level can be completed. At the same time, a liquid film of the developing solution 40 is formed with a predetermined thickness on the entire surface of the wafer W.

After the development is performed for a predetermined time while the developing solution 40 is kept on the wafer W, the cleaning liquid, for example, pure water is discharged from the cleaning nozzle (not shown) onto the wafer surface to perform cleaning. Next, the wafer W is rotated to dry the wafer W.

As described above, in the liquid processing apparatus of the present invention, the gas is transmitted through the connection between the flow path 53 and the exhaust path 56.
Since the bubble removing filter 57 for preventing liquid from permeating is provided, bubbles such as N2 contained in the developer 40 can be selectively transmitted by the filter 57, and the bubbles are removed from the developer 40. be able to. As described above, only the bubbles in the developer 40 can be selectively removed.
As compared with the conventional method in which bubbles are removed together with the developer 40, the consumption of the developer 40 can be reduced.
0 can be saved.

At this time, since the hollow fiber membrane M is used as the bubble removing filter 57, the developer 40 also enters the hole 58, and the developer 40 and the hollow fiber membrane M are not only on the outer surface of the yarn but also on the inner surface. It comes into contact with the surface. Thereby, in the hollow fiber membrane M, a large contact area (membrane area) can be ensured with a small volume, so that bubbles can be efficiently removed.

Further, by providing the exhaust path 56 so as to be in contact with the uppermost part of the flow path 53, the bubbles can be removed from the developer 40 by utilizing the rise of the bubbles. 53 to the uppermost part of the supply passage 53, and then through the impurity removal filter 55 and the outlet 5 b, the downstream supply passage 4.
3, the bubbles can be sufficiently removed from the developer 40 flowing through the filter device 5.

If the bubbles can be removed from the developing solution 40, the flow rate of the developing solution 40 fluctuates by the amount of the bubbles, and the amount of the developing solution 40 supplied onto the wafer W differs from the original amount. In addition, uneven development line width can be suppressed.
In addition, air bubbles adhere to the impurity filter 55 and filtration accuracy deteriorates, and particles mixed into the developer 40
Is also supplied to the wafer W and the contamination of the wafer W is suppressed.

If the bubbles generated by the filter device 5 are not removed here, they are supplied to the wafer as they are through the supply channel 43 together with the developing solution 40, or are again supplied to the pressurized state in the supply channel 43. Therefore, it dissolves in the developer 40 and is discharged as it is from the supply nozzle 3 onto the wafer surface, and is vaporized again as bubbles (micro bubbles) by the impact of the collision at this time. When bubbles are mixed in the developing solution 40 that has been loaded on the wafer W in this manner, the development line width becomes non-uniform as described above. However, as described above, the N2 bubbles are generated by the filter device 5. Is removed after generation, the amount of N2 dissolved in the developer 40 is reduced, and the amount of bubbles generated in a later step can be reduced, so that the uniformity of the development processing can be improved.

In such a developing device, for example, as shown in FIG. 5, an exhaust pump 61 is connected to the other end (the side not connected to the flow path 53) of the exhaust passage 56 of the filter device 5. In such a configuration, the exhaust path 56 is constantly evacuated by the exhaust pump 61, and the exhaust path 56
Pressure within the flow path 53, for example, 10
The developing process is performed under a negative pressure of about Pa.

For this reason, in the filter device 5, a pressure difference corresponding to the pressurization of N2 on the upstream side of the filter device 5 and the negative pressure in the exhaust passage 56 is generated.
Since two bubbles are generated, the amount of bubbles generated here increases compared to the case where the inside of the exhaust path 56 is not exhausted. As a result, the amount of bubbles that can be removed by the filter device 5 increases, so that the amount of N2 dissolved in the developer 40 decreases, and the amount of bubbles generated in a later step can be further reduced.

Next, another example of the present invention will be described with reference to FIG. 6. The filter device 5 of this example includes, for example, a piezoelectric element 62 as an ultrasonic wave generating means on the bottom wall of a case 50. Other configurations are the same as those of the filter device 5 shown in FIG. 3 described above.

In such a configuration, an ultrasonic wave is generated in the flow path 53 by the piezoelectric element 62, and the ultrasonic wave is caused to flow through the ultrasonic wave.
Of the developer 40
N2 dissolved therein is forced to foam. That is, in the filter device 5, the N2 dissolved in the developer 40 is vaporized by the pressure difference, and the N2 dissolved in the developer 40 is forcibly foamed by the ultrasonic waves.

As described above, in this example, the amount of N 2 bubbles generated in the filter device 5 further increases, and thus the amount of bubbles removed here increases. Can be further reduced, and the amount of bubbles generated in a later step can be further reduced, so that high uniformity of the development processing can be ensured.

In such a developing device, as shown in FIG. 5, an exhaust pump (not shown) is connected to the other end of the exhaust path 56 (the side not connected to the flow path 53). During the developing process, the exhaust path 56 may be constantly exhausted so as to be in a negative pressure state. In this case, the pressure difference increases in the filter device 5. A larger amount of air bubbles can be removed than when no air is exhausted.

FIG. 7 shows still another example of the present invention.
In this example, air bubbles contained in the developer 40 are removed in the intermediate tank 7 instead of the filter device 5. In the supply system of the developer 40 in this example, an opening / closing valve 70 composed of, for example, an air operated valve and the intermediate tank 7 are arranged in this order from the upstream side between the developer tank 41 containing the developer 40 and the filter unit 5. It is provided in.

In this example, an inert gas such as N 2 gas is blown into the developing solution tank 41, and the developing solution 40 is sent to the intermediate tank 7 via the opening / closing valve 70 by this gas pressure.
In the intermediate tank 7, bubbles generated by vaporizing N2 dissolved in the developer 40 and bubbles such as air entering the developer 40 by opening and closing the on-off valve 70 are removed.

An example of the structure of the intermediate tank 7 will be described with reference to FIG. 8. In FIG. 8, reference numeral 71 denotes a tank having a larger internal volume than the supply flow path 43. The supply flow path 43 is connected to the supply flow path 43 on the downstream side, and the developer 40 flows inside the tank 71 from the bottom to the top.

On the upper side (downstream side) of the tank 71,
For example, an exhaust path 72 for discharging a gas such as N2 to the outside of the intermediate tank 7 is connected. At a connection portion between the exhaust path 72 and the tank 71, for example, bubbles mixed with the developer 40 are removed. Consisting of, for example, a hollow fiber membrane M for removal,
An air bubble removing filter 73 having a property of permeating only gas but not permeating liquid is provided so as to block a part of the exhaust path 72.

Also in this example, the bubble removing filter 73 is used.
A hollow fiber membrane M similar to the above-described example is used, and such a hollow fiber membrane M is formed so that, for example, the length direction of the hole 58 is substantially the same as the flowing direction of the developer. Are located.

In such an intermediate tank 7, the developer 40 supplied into the tank 71 via the supply channel 43 flows upward from below in the channel 53 by pressurizing N2. However, as described above, the opening / closing valve 70
Gas is mixed in due to opening and closing. Also, the supply channel 43
When the developer 40 is sent from the tank 71 to the tank 71, the pressure is reduced in the tank 71, and the pressure difference causes the gas such as N2 and air dissolved in the developer 40 to evaporate to generate bubbles.

While these bubbles rise, the intermediate tank 7
A gas permeable filter 73 is provided on the upper side of the intermediate tank 7, so that the gas passes through the filter 73 and is exhausted to the outside of the intermediate tank 7 through the exhaust path 72. When the inside of the tank 71 is filled with the developing solution 40, the inside of the developing solution 40 rises, passes through the filter 73, and is exhausted to the outside. At this time, the developing solution 40 comes into contact with the filter 73, but since the developing solution 40 cannot pass through the hollow fiber membrane M,
Only bubbles that are going to rise pass through the filter 73, and the developer 40 that cannot pass through the filter 73 flows from the downstream supply channel 43 toward the filter unit 5.

As described above, also in this example, the developer 40
Since only bubbles can be removed from the developer, the amount of the developing solution 40 can be reduced, and the amount of gas such as N2 dissolved in the developing solution 40 can be reduced, thereby reducing the amount of bubbles generated in a later process. be able to.

Also in this example, an exhaust pump (not shown) is connected to the other end of the exhaust path 71 (the side not connected to the tank 71), and the exhaust pump is connected to the exhaust path 71 during the developing process. May be constantly exhausted so as to be in a negative pressure state, or an ultrasonic generating means such as a piezoelectric element is provided in the tank 71, and the developer 40 in the tank 71 is subjected to ultrasonic vibration to forcibly dissolve the liquid. The gas generated may be vaporized. In these cases, the amount of bubbles that can be removed in the intermediate tank 7 further increases, so that the amount of bubbles generated in a later step can be further reduced.

In the above, in the present invention, the above-described filter device 5 and the intermediate tank 7 may be combined to remove the gas, or one of them may be used. Further, in the above-described example, the developer 40 is sent out to the supply channel 43 by applying pressure by blowing N2 into the developer tank 41. However, as shown in FIG. For example, a fixed-quantity pump 8 such as a bellows pump may be provided between the two and the pump 8 may be used to send out the developer 40 to the filter device 5. In this case, a gas such as air is mixed into the developer 40 by the operation of the pump 8, so that the bubbles are removed in the filter device 5 and the intermediate tank 8. , The developer 40 by the pressure of the pump 8
Will flow from bottom to top.

The present invention can be applied not only to the supply system of the developer but also to the supply system of a solvent for the resist solution such as a thinner used for the coating process of the resist solution. Then, bubbles such as N2 generated by the change in volume are removed. At this time, the type of the hollow fiber membrane M is appropriately selected according to the type of the treatment liquid.

Further, in the present invention, for example, the hole 58 of the hollow fiber membrane tube formed in a tube shape with the hollow fiber membrane M is formed into an inverted U shape, that is, the hole 58 is bent so that the hole 58 is bent. The length direction of the hole 58 is substantially the same as the direction of flow of the developer, and both ends of the hole 58 face the upstream side in the direction of flow of the developer, and the hole 58 extends downstream in the direction of flow of the developer. You may make it arrange | position so that a bending part may be located. In this case, the surface area of the hollow fiber membrane M can be further increased, and the developer enters the inside from both ends of the hole 58, so that the contact area increases and the bubbles can be efficiently removed. Can be.

Further, in the present invention, the connection between the supply passage 43 on the upstream side of the filter device 5 and the passage 53 and the connection between the supply passage 43 on the upstream side of the intermediate tank 7 and the intermediate tank 7 are formed. It is more preferable to make the diameter smaller than the inner diameter of the supply channel 43, to increase the pressure difference at these connection portions, and to combine with a foaming means for increasing the amount of bubbles generated by the pressure difference.

[0055]

According to the present invention, only air bubbles can be selectively removed from the processing liquid, so that the consumption of the processing liquid can be reduced. In another aspect of the invention, bubbles can be removed from the processing liquid, and the uniformity of the liquid processing can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of a liquid processing apparatus of the present invention.

FIG. 2 is a bottom view and a perspective view showing an example of a supply nozzle provided in the liquid processing apparatus.

FIG. 3 is a cross-sectional view illustrating an example of a filter unit provided in the liquid processing apparatus.

FIG. 4 is a perspective view illustrating a hollow fiber membrane provided in the filter unit.

FIG. 5 is a sectional view showing another example of the filter unit.

FIG. 6 is a sectional view showing still another example of the filter unit.

FIG. 7 is a sectional view showing another example of the embodiment of the liquid processing apparatus of the present invention.

FIG. 8 is a sectional view showing an example of an intermediate tank provided in the liquid processing apparatus.

FIG. 9 is a sectional view showing still another example of the embodiment of the liquid processing apparatus of the present invention.

FIG. 10 is a side view showing a conventional developing device.

FIG. 11 is an explanatory diagram showing a supply system of a conventional developing device.

[Explanation of symbols]

 W semiconductor wafer 2 spin chuck 3 supply nozzle 31 supply hole 5 filter device 53 flow path 54 communication hole 55 impurity removal filter 56 exhaust path 57, 73 bubble removal filter 61 exhaust pump 62 piezoelectric element 7 intermediate tank 72 exhaust path

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B01D 36/02 B01D 36/02 4F042 53/22 53/22 5F046 63/02 63/02 B05C 11/10 B05C 11/10 G03F 7/30 502 G03F 7/30 502 H01L 21/027 H01L 21/30 569C F-term (reference) 2H096 AA25 GA29 GA30 4D006 GA41 HA01 KA72 KB14 MA01 MB03 PA01 PB01 PB63 PC01 4D011 AA08 AB10 AC0 AC04 AD03 4 BK03 4D066 AA05 BB02 BB31 4F042 AA07 BA06 CB25 5F046 LA03

Claims (9)

[Claims] 1. An impurity, bubbles and / or dissolved gas,
A filter device for removing the impurities and bubbles from the processing solution containing: an impurity removing filter for removing the impurities; and a flow path for flowing the processing solution through the impurity removing filter. An exhaust path connected to the flow path and for exhausting gas to the outside of the filter device; and an exhaust path provided inside the exhaust path or at a connection between the exhaust path and the flow path to close the exhaust path. An air bubble removal filter, wherein the air bubble removal filter prevents liquid permeation and allows gas to permeate, and allows air bubbles contained in the processing liquid to pass through this air bubble removal filter. A filter device for removing bubbles from the processing liquid. 2. The filter device according to claim 1, wherein the filter for removing air bubbles is formed of a hollow fiber membrane. 3. An ultrasonic wave generating means is provided outside the flow path, and ultrasonic vibration is applied to the processing liquid flowing through the flow path to vaporize a dissolved gas contained in the processing liquid to generate bubbles. The filter device according to claim 1, wherein the filter device is operated. 4. The flow path is formed in an annular shape so that the processing liquid flows upward from below, the impurity removing filter is provided inside the flow path, and the exhaust path is the flow path. The filter device according to claim 1, wherein the filter device is provided on an upper side of the filter. 5. The filter device according to claim 1, wherein the pressure in the exhaust path is lower than the pressure in the flow path. 6. A processing liquid from which impurities and bubbles have been removed in a filter device is supplied from a supply nozzle to a surface of a substrate held substantially horizontally by a substrate holding portion, and a liquid film of the processing liquid is applied to the surface of the substrate. In the liquid processing apparatus, the filter device is connected to the impurity removing filter for removing the impurity, a flow path for allowing the processing liquid to flow through the impurity removing filter, and connected to the flow path. An exhaust path for exhausting gas to the outside of the filter device, and a bubble removal filter provided to close the exhaust path, inside the exhaust path or at a connection between the exhaust path and the flow path, The filter for removing air bubbles is a filter that prevents liquid from permeating and allows gas to permeate, and removes air bubbles from the processing liquid by transmitting air bubbles contained in the processing liquid to the filter for removing air bubbles. Liquid processing apparatus, characterized by. 7. An air bubble contained in the processing liquid from the processing liquid tank is removed in the intermediate tank, and the processing liquid is supplied from a supply nozzle to the surface of the substrate held substantially horizontally by the substrate holding unit,
In a liquid processing apparatus that forms a liquid film of a processing liquid on the surface of the substrate, the intermediate tank has an exhaust path for exhausting gas to the outside of the intermediate tank, and an exhaust path inside or between the intermediate tank and the exhaust path. The connection portion further includes a filter for removing air bubbles provided so as to close the exhaust path, wherein the filter for removing air bubbles prevents liquid permeation and allows gas permeation, and is included in the processing liquid. A liquid processing apparatus characterized in that bubbles are removed from the treatment liquid by allowing bubbles to pass through the bubble removal filter. 8. The liquid processing apparatus according to claim 6, wherein the filter for removing bubbles is formed of a hollow fiber membrane. 9. The liquid processing apparatus according to claim 6, wherein the processing liquid is a developer.