JP2001015341A - Electronic component and radio terminal equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily manufacture an electronic component or to improve the mountability or characteristics of the component, by providing grooves into a base through a conductive film formed on the base and terminal sections at both end sections of the base, and by specifying the formed lengths, film thicknesses, kind of crystal grains, etc., of the terminal sections. SOLUTION: An electronic component is constituted in such a way that a base 11 is formed by pressing and extruding an insulating material, etc. A conductive film 12 having surface roughness of <=0.2 μm is formed on the base 11 by plating or vapor deposition by sputtering. Grooves 13 are formed into the base 11 through the conductive film 12 optically by projecting a laser beam upon the film 12, mechanically by pressing a grindstone against the film 12, or selective etching by using a resist, etc. A protective material 14 is applied to the component of the base 11 and film 12 where the grooves 13 are provided. Terminal sections 15 and 16 containing crystal grains of 1-5 μm in diameter are respectively fitted to both ends of the base 11. When this component is used as an inductance element, the element can practically cope with a high frequency region of 1-6 GHz and have a very high Q-value (>=35). The lengths P5 and P6 of the terminal directions 15 and 16 in the longitudinal direction of the element and the full length L1 of the element are adjusted to meet relations, 0.07<P5÷L1<0.3 and 0.07<P6÷L1<0.3, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a radio terminal device which are used for electronic equipment such as mobile communication, and particularly preferably used for high frequency circuits and the like. In particular, the present invention relates to an electronic component and a wireless terminal device in which a conductive film is provided on an insulating substrate.

[0002]

2. Description of the Related Art FIG. 14 is a side view showing a conventional inductance element. In FIG. 14, reference numeral 1 denotes a square-pillar-shaped or column-shaped base, 2 denotes a conductive film formed on the base 1, 3 denotes a groove provided in the conductive film 2, and 4 denotes a stacked layer on the conductive film 2 Protected material.

[0003] Such electronic components are adjusted to predetermined characteristics by adjusting the interval between the grooves 3 and the like.

A prior example is disclosed in Japanese Patent Application Laid-Open No. 7-307201.
JP, JP-A-7-297033, JP-A-5-1
JP-A-29133, JP-A-1-238003, JP-A-57-117636, JP-A-5-29925
No. 0, Japanese Unexamined Patent Publication No. 7-297033, and the like.

[0005]

However, as the size of the device is reduced, there is a problem that the mountability of the device is deteriorated and the characteristics are deteriorated.

An object of the present invention is to provide an electronic component and a radio terminal device which can solve at least one of easiness of production, good mounting property, and improvement of characteristics. I do.

[0007]

SUMMARY OF THE INVENTION The present invention relates to an electronic component having a conductive film provided on a base, grooves formed in the conductive film, and terminals provided at both ends of the base. The length, thickness, type of crystal grains, and the like are specified.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 comprises a base,
An electronic component comprising: a conductive film provided on the base; a groove provided in the conductive film; and a pair of terminals provided on an end face of the base so as to sandwich the base. When the total length in the direction in which the pair of terminal portions face each other is L1, the lengths P5 and P6 of the pair of terminal portions in the direction in which the pair of terminal portions face each other are 0.07 <P5 ÷, respectively. By having a relationship of L1 <0.3 0.07 <P6 ÷ L1 <0.3, a large bonding area with a circuit board or the like can be obtained, the bonding strength can be increased, and the mountability can be improved. It is possible to prevent a short circuit between the terminal portions and the like, and prevent deterioration of characteristics.

According to a second aspect of the present invention, a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base so as to sandwich the base. An electronic component comprising a pair of terminal portions provided, wherein the surface roughness of the terminal portions is 1 μm to 10 μm as a center line average roughness, thereby increasing the bonding area and improving the bonding strength. And improve the mountability,
Deterioration of characteristics of a film formed on the terminal portion can be prevented.

According to a third aspect of the present invention, a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base so as to sandwich the base. An electronic component comprising a pair of terminal portions provided, wherein the crystal grains constituting the terminal portions are flake-shaped, and the crystal grain size is 1
By setting the thickness to 5 μm, the crystallinity of the terminal portion can be improved, and the deterioration of the electrical characteristics of the terminal portion can be prevented.

According to a fourth aspect of the present invention, there is provided a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base sandwiching the base. An electronic component comprising a pair of terminal portions provided, wherein the crystal grains constituting the terminal portions are spherical, and the crystal grain size is 0.1%.
By setting the thickness to μm to 0.8 μm, the crystallinity of the terminal portion can be improved, and the deterioration of the electrical characteristics of the terminal portion can be prevented.

According to a fifth aspect of the present invention, there is provided a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base sandwiching the base. An electronic component provided with a pair of terminal portions provided, wherein the thickness of the terminal portion on the end surface of the base is set to 10 μm to 30 μm, thereby preventing electrode erosion of the terminal portion and improving mountability. In addition to being able to improve the quality, it is possible to prevent the deterioration of the Q value caused by the reduction in the size of the base, so that the loss is reduced and the characteristics can be improved.

According to a sixth aspect of the present invention, there is provided a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base sandwiching the base. An electronic component including a pair of terminal portions provided, wherein the terminal portion is provided on an end surface of the base and a side surface adjacent to the end surface,
The thickness of the terminal portion formed on the side surface is 10 μm to 25 μm.
Since the Q value deterioration caused by the μm can be prevented, the loss can be reduced and the characteristics can be improved.

According to a seventh aspect of the present invention, there is provided a base, a conductive film provided on the base, a groove provided in the conductive film, and an end face of the base sandwiching the base. An electronic component comprising a pair of terminal portions provided, wherein the total length in the direction in which the pair of terminal portions face each other is L1, and the pair of terminal portions in the direction in which the pair of terminal portions face each other. Have a relationship of 0.07 <P5 ÷ L1 <0.3 and 0.07 <P6 ÷ L1 <0.3, respectively, and the surface roughness of the terminal portion is determined by the center line average roughness. 1 μm to 10 μm, the thickness of the terminal portion on the end surface of the base is 10 μm to 30 μm, and the terminal portion is provided on the end surface of the base and the side surface adjacent to the end surface, and is formed on the side surface. Terminal thickness is 10
By setting the thickness to μm to 25 μm, the deterioration of the terminal portion and the Q value can be prevented, and the bonding strength between the terminal portion and the circuit board can be increased, so that the mountability and characteristics can be improved.

According to an eighth aspect of the present invention, in the first to seventh aspects, a conductive film is also provided on the end face of the base, and a terminal portion is provided via the conductive film, so that a relatively flat conductive film is provided. Since the terminal portion is provided on the substrate, the crystallinity of the terminal portion is improved, and the characteristics are improved.

According to the ninth aspect of the present invention, the provision of the protective material for covering the groove in the first to eighth aspects can prevent the conductive film and the like from deteriorating and prevent the characteristics from deteriorating.

According to a tenth aspect of the present invention, when at least one of a corrosion-resistant film and a bonding film is provided on the terminal portion, the characteristic of the terminal portion is provided when the corrosion-resistant film is provided. Deterioration can be prevented, and when a bonding film is provided, the bonding property with a circuit board or the like can be improved, and the mountability can be improved.

The invention according to claim 11 is the invention according to claims 1 to 10
In the above, the terminal portion is formed by solidifying the conductive paste, so that a terminal portion having good mountability and having no characteristic deterioration can be easily manufactured.

According to a twelfth aspect of the present invention, in the eleventh aspect, the conductive paste contains a conductive material, a resin material, and a solvent, so that a conductive paste that can be applied to the base can be easily manufactured.

According to a thirteenth aspect, in the twelfth aspect, a thermosetting resin is used as the resin material, and
By curing at 50 ° C. to 230 ° C., it is possible to easily form a terminal having good characteristics only by applying heat,
In addition, when the bonding film is provided on the element, melting of the bonding film and the like can be prevented, and deterioration of characteristics can be prevented.

According to a fourteenth aspect of the present invention, in the twelfth aspect, by using silver particles as the conductive material, the electrical characteristics of the terminal portion are good, and the production and cost are advantageous.

According to a fifteenth aspect of the present invention, in the fourteenth aspect, the conductive paste can be easily applied by setting the silver particles in the conductive paste to 50% by weight to 70% by weight. Can be manufactured.

According to a sixteenth aspect of the present invention, in the eleventh aspect, by applying a conductive paste to the terminal portion via a dipping method or a roller, a terminal portion having good characteristics can be easily manufactured.

According to a seventeenth aspect of the present invention, in the ninth aspect, the protective material is formed of an electrodeposition film, so that the device can be protected thinly and surely. Can be formed, so that productivity is improved.

The invention according to claim 18 is the invention according to claims 1 to 17
In the above, the base has a prism shape with a substantially square bottom, so that the rolling of the element can be suppressed with a simple configuration, which is extremely advantageous in terms of cost and facilitates the manufacture of the base. Thus, the productivity is improved and the mountability is also improved.

[0027] The invention of claim 19 is the invention of claims 1 to 18.
In the above, when length L1, width L2, and height L3, L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8
mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm), it is possible to configure a small-sized circuit board which is excellent in mountability because it is small and hardly causes element breakage.

The invention according to claim 20 is the invention according to claims 1 to 19
In the above, the terminal portion is extended from the end surface of the base to the protection material provided on the side surface of the base, and the protection material is sandwiched between the terminal portion and the conductive film, whereby the terminal portion is formed. The formation area of the terminal portion can be enlarged, and the length of the terminal portion can be set to a predetermined length without increasing the thickness of only the terminal portion formed on the end face of the base. Properties and the like can be improved.

According to a twenty-first aspect of the present invention, a base, a conductive film provided on the base, a spiral groove provided in the conductive film, and a protection provided so as to cover the groove. Material, and a terminal portion provided on the conductive film provided on the end of the base and on the protective material, and the terminal portion and the extreme end of the groove face each other via the protective material. Accordingly, the region where the coil-shaped conductive film left in the spiral shape is formed can be widened and the number of turns can be increased, so that an electronic component having high inductance can be provided.

The invention according to claim 22 is the invention according to claims 1 to 20
In the above, the terminal portion side end of the groove and the terminal portion are opposed to each other with a protective material interposed therebetween, so that the region where the coil-shaped conductive film left in the spiral shape is formed can be increased, and the number of turns can be increased. Therefore, an electronic component having a high inductance can be provided.

The invention according to claim 23 is the invention according to claims 1-22
In, by forming an inductance component by the conductive film and the groove, excellent in mountability, easy to manufacture,
In addition, a chip inductor with small deterioration in characteristics can be manufactured.

The invention according to claim 24 is the invention according to claims 1-22
By using a resistive film instead of a conductive film, a chip resistor excellent in mountability, easy to manufacture, and with little deterioration in characteristics can be manufactured.

The invention according to claim 25 is the invention according to claims 1 to 22.
In the above, by providing a groove for dividing the conductive film into at least two and having a capacitance component, a chip capacitor having excellent mountability, easy manufacture, and small deterioration of characteristics can be manufactured.

According to a twenty-sixth aspect of the present invention, a display means, a conversion means for converting at least one of a data signal and an audio signal into a transmission signal or a reception signal into at least one of a data signal and an audio signal, and An antenna for transmitting and receiving a signal and the reception signal, and a wireless terminal device including control means for controlling each unit, comprising: a transmission circuit;
26. At least one of a filter circuit, an antenna section, a peripheral section of a matching circuit for each stage, and the like.
By using the described electronic components, excellent mountability,
Since it is possible to use an electronic component that is easy to manufacture and that has small deterioration in characteristics, it is possible to reduce deterioration in characteristics of the terminal and a defective rate in manufacturing, and to improve productivity.

Hereinafter, embodiments of the electronic component and the wireless terminal device according to the present invention will be specifically described by taking an inductance element as an example.

FIGS. 1 and 2 are side sectional views showing an inductance element according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a base which is formed by subjecting an insulating material or the like to press working, extrusion, or the like.
Reference numeral 2 denotes a conductive film provided on the base 11.
2 is formed on the base 11 by an evaporation method such as a plating method or a sputtering method.

Reference numeral 13 denotes a groove provided in the base 11 and the conductive film 12. The groove 13 is formed by irradiating the conductive film 12 with a laser beam or the like, or mechanically by applying a grindstone or the like to the conductive film 12. Or by selective etching using a resist or the like.

Reference numeral 14 denotes a protective material applied to the portion of the base 11 and the conductive film 12 where the groove 13 is provided. Reference numerals 15 and 16 denote terminal portions respectively attached to the ends of the base 11. The base 11 is sandwiched between the terminal portions 16. That is, the terminal portions 15 and 16 in the base 11
Is basically the end of the base 11, and the side surfaces of the base 11 and the terminal portions 15, 16 are basically in non-contact.

Further, the inductance element of the present embodiment has a practical frequency band of 1 to 6 GHz, corresponding to a high frequency range, and has a very high Q value (35 or more).
Length L1, width L2, height L3 of the inductance element
Is preferably as follows.

L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8 mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
(Note that the dimensional error of each of L1, L2, and L3 is 0.3 mm.)
It is preferably equal to or less than 02 mm. If L1 is 0.2 mm or less, the required inductance cannot be obtained. Further, when L1 exceeds 2.0 mm, the element itself becomes large, and a substrate on which an electronic circuit or the like is formed (hereinafter abbreviated as a circuit substrate or the like).
It is not possible to reduce the size of a circuit board or the like, and thus it is impossible to reduce the size of an electronic device or the like on which the circuit board or the like is mounted.
When L2 and L3 are each 0.1 mm or less,
The mechanical strength of the element itself becomes too weak, and when the element is mounted on a circuit board or the like by a mounting device or the like, the element may be broken. On the other hand, if L2 and L3 are 1.0 mm or more, the elements become too large, and it is not possible to reduce the size of the circuit board or the like and, consequently, the size of the device.

The respective components of the inductance element configured as described above will be described in detail below.

First, the shape of the base 11 will be described.

It is preferable that the base 11 is formed in a prismatic or cylindrical shape. By forming the base 11 in a prismatic shape as shown in FIGS. And the like. In addition, among the rectangular bases, the base 11 is particularly preferably formed in a square pillar shape, which greatly facilitates the mounting and the positioning of the element on the circuit board. In addition, it is more preferable that the bottom surface is a rectangular parallelepiped having a square shape, so that the mountability and the like can be further improved. Further, since the base 11 has a prismatic structure, the structure becomes very simple, so that the productivity is good and the cost is very advantageous.

When the base 11 is formed in a columnar shape, a conductive film 12 is formed on the base 11 as described later, and when a groove is formed in the conductive film 12 by laser processing or the like, The depth of the groove and the like can be formed with high accuracy, and variations in characteristics can be suppressed.

Next, the chamfering of the base 11 will be described with reference to FIG.

FIG. 3 is a perspective view showing the base 11.

The corners 11b and 11c of the base 11 are chamfered, and the radius of curvature R1 of each of the chamfered corners 11b and 11c and the radius of curvature R2 of the corner 11a.
Is preferably formed as follows.

0.03 <R1 <0.15 (mm) 0.07 <R2 (mm) If R1 is 0.03 mm or less, the corners 11b and 11c
Because of the sharp point, the corners 11b and 11c may be chipped by a slight impact or the like, and the chipping may cause deterioration of characteristics or the like. When R1 is 0.15 mm or more, the corner 11
Since b and 11c are too round, the above-mentioned Manhattan phenomenon is likely to occur, which causes a problem. Furthermore, when R2 is 0.
When the thickness is less than or equal to 01 mm, burrs and the like are likely to occur at the corners 11a, and the thickness of the conductive film 12, which largely affects the characteristics of the element, may be significantly different between the corners 11f and the flat portion,
Variation in element characteristics increases.

Next, the constituent materials of the base 11 will be described. It is preferable to satisfy the following characteristics as a constituent material of the base 11.

Volume resistivity: 10 ¹³ Ωm or more (preferably 10 ¹⁴ Ωm or more) Thermal expansion coefficient: 5 × 10 ⁻⁴ / ° C. or less (preferably 2 × 10 Ω / m)
⁻⁵ / ° C. or less) [Coefficient of thermal expansion at 20 ° C. to 500 ° C.] Relative permittivity: 12 or less at 1 MHz (preferably 10
Bending strength: 1300 kg / cm ² or more (preferably 20
Density: ^{2 to 5} g / cm ³ (preferably ³ to 4 g / cm ³ ) When the constituent material of the base 11 has a volume resistivity of 10 ¹³ Ωm or less, the conductive material 12 and the base 11 Also, a current starts to flow in a predetermined manner, so that a parallel circuit is formed, and the self-resonant frequency f0 and the Q value decrease, which is not suitable for a high-frequency element.

If the coefficient of thermal expansion is 5 × 10 ⁻⁴ / ° C. or more, cracks may occur in the base 11 due to heat shock or the like. That is, when the thermal expansion coefficient is 5 × 10 ⁻⁴ / ° C. or more, the base 11 is locally heated to a high temperature because a laser beam or a grindstone is used when forming the groove 13 as described above. Although cracks and the like may occur in 11, the occurrence of cracks and the like can be greatly suppressed by having the above-described coefficient of thermal expansion.

If the dielectric constant is 12 or more at 1 MHz, the self-resonant frequency f0 and the Q value become low, and it is not suitable for a high-frequency device.

When the bending strength is 1300 kg / cm ² or less, the element may be broken when mounted on a circuit board or the like by a mounting apparatus.

When the density is 2 g / cm ³ or less, the base 1
1, the water absorption rate is increased, the characteristics of the base 11 are significantly deteriorated, and the characteristics as an element are deteriorated. The density is 5 g / c
If it exceeds m ³ , the weight of the base will be heavy, and there will be a problem in mountability and the like. In particular, when the density is set within the above range, the water absorption rate is small, water hardly enters the base 11, the weight is reduced, and no problem occurs when mounting on a substrate by a chip mounter or the like.

By defining the volume resistivity, the coefficient of thermal expansion, the dielectric constant, the bending strength, and the density of the base 11 in this manner, the self-resonant frequency f0 and Q do not decrease, and thus the base 11 can be used as a high-frequency element. It is possible to suppress the occurrence of cracks or the like in the base 11 due to heat shock or the like, so that the defective rate can be reduced, and furthermore, the mechanical strength can be improved. Since it can be mounted on a circuit board or the like, excellent effects such as improvement in productivity can be obtained.

As a material for obtaining the above-mentioned various properties, a ceramic material containing alumina as a main component can be used. However, simply using a ceramic material mainly composed of alumina cannot obtain the above-mentioned characteristics. That is,
Since the above-mentioned various characteristics vary depending on the pressing pressure, the sintering temperature, and the additives at the time of producing the base 11, the production conditions and the like must be appropriately adjusted. Specific manufacturing conditions include a pressing pressure of 2 to 5 tons when processing the base 11, a firing temperature of 1500 to 1600 ° C., and a firing time of 1 to 3 hours. Specific examples of the alumina material include Al ₂ O ₃ of 92 wt% or more, SiO ₂ of 6 wt% or less, MgO of 1.5 wt% or less, and Fe ₂ O ₃ of 0.1 wt% or less.
% Or less, and Na ₂ O of 0.3% by weight or less.

The base 11 may be made of a magnetic material such as ferrite. When the base 11 is made of a magnetic material such as ferrite, an element having high inductance (about 18 nH to 50 nH) can be formed.

Next, the surface roughness of the base 11 will be described. The surface roughness described below means the average roughness of the center line, and the roughness described in the description of the conductive film 12 is also the average roughness of the center line.

The surface roughness of the base 11 is 0.15 to 0.5 μm.
m, preferably about 0.2 to 0.3 μm. FIG. 4 is a graph showing the surface roughness of the base 11 and the rate of occurrence of peeling. FIG. 4 shows the results of an experiment as described below. The base 11 and the conductive film 12 were made of alumina and copper, respectively, and samples with various surface roughnesses of the base 11 were prepared, and the conductive film 12 was formed on each sample under the same conditions. Each sample was subjected to ultrasonic cleaning, and thereafter, the surface of the conductive film 12 was observed to determine whether or not the conductive film 12 was peeled. The surface roughness of the base 11 was measured using a surface roughness measuring device (574A, manufactured by Tokyo Seimitsu Surfcom).
The one having a tip R of 5 μm was used. As can be seen from this result, if the average surface roughness is 0.15 μm or less,
The rate of occurrence of peeling of the conductive film 12 formed thereon is about 5%, and good bonding strength between the base 11 and the conductive film 12 can be obtained. Further, if the surface roughness is 0.2 μm or more, peeling of the conductive film 12 hardly occurs. Therefore, if possible, the surface roughness of the base 11 is preferably 0.2 μm or more. Since the peeling of the conductive film 12 is a major factor in deterioration of the characteristics of the element, the rate of occurrence is 5% in terms of yield and the like.
The following is preferred.

FIG. 5 is a graph showing the relationship between the frequency and the Q value with respect to the surface roughness of the base used for the inductance element according to one embodiment of the present invention. FIG. 5 shows the results of the following experiment. First, each sample of the base 11 having a surface roughness of 0.1 μm or less, the base 11 having a surface roughness of 0.2 to 0.3 μm, and the base 11 having a surface roughness of 0.5 μm or more was prepared. A conductive film 12 having the same thickness and the same material (copper) was formed on each sample. Then, in each sample, the Q value at a predetermined frequency F was measured. As can be seen from FIG. 5, the surface roughness of the base 11 is 0.5
When the thickness is not less than μm, a decrease in the Q value, which is considered to be caused by the deterioration of the film structure of the conductive film 12, is observed. Particularly in the high frequency region, the Q value is significantly deteriorated. In addition, the self-resonant frequency f0 (maximum value of each line) is such that the surface roughness of the base 11 is equal to 0.
Those of 5 μm are shifted to the low frequency side. Therefore Q
From the viewpoint of the value and the surface of the self-resonance frequency f0, the base 11
Is preferably 0.5 μm or less.

As described above, judging from the results of both the adhesion strength between the conductive film 12 and the base 11, the Q value of the conductive film 12, and the self-resonant frequency f0, the surface roughness of the base 11 is 0.1.
It is preferably from 15 μm to 0.5 μm, more preferably from 0.2 to 0.3 μm.

In the present embodiment, the bonding strength between the conductive film 12 and the base 11 is improved by adjusting the surface roughness of the base 11.
2 to improve the adhesion strength between the conductive film 12 and the base 11 without adjusting the surface roughness by providing an intermediate layer composed of Cr alone or an alloy of Cr and another metal. Can be. Of course, when the surface roughness of the base 11 is adjusted and the intermediate layer and the conductive film 12 are laminated on the base 11, it is possible to obtain a stronger adhesion strength between the conductive film 12 and the base 11. it can.

Next, the conductive film 12 will be described.

The conductive film 12 preferably has a Q value of 35 or more for a high-frequency signal of 800 MHz or more, and has a self-resonant frequency of about 1 to 6 GHz. In order to obtain the conductive film 12 having such characteristics, a material, a manufacturing method, and the like must be selected.

Hereinafter, the conductive film 12 will be specifically described.

The constituent materials of the conductive film 12 include copper, silver,
Conductive materials such as gold and nickel can be used. This copper,
A predetermined element may be added to a material such as silver, gold, nickel or the like in order to improve weather resistance and the like. Alternatively, an alloy such as a conductive material and a nonmetallic material may be used. Copper and its alloys are often used as constituent materials in terms of cost, corrosion resistance, and ease of fabrication. When copper or the like is used as the material of the conductive film 12, first, a base film is formed on the base 11 by electroless plating, and a predetermined copper film is formed on the base film by electrolytic plating. The conductive film 12 is formed. Furthermore,
When the conductive film 12 is formed of an alloy or the like, it is preferable to form the conductive film 12 by a sputtering method or an evaporation method.

Further, as in the present embodiment, when the conductive film 12 is made of, for example, copper or the like and the film thickness is increased to suppress self-heating, the width K1 of the groove 13 formed in the conductive film 12 is reduced. The width K2 of the conductive film 12 between the grooves 13 preferably has the following relationship.

20 μm>K1> 15 μm 200 μm>K2> 100 μm In particular, as described above, the length L1, width L2, and height L3 are L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8
mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
(Note that the dimensional error of each of L1, L2, and L3 is 0.3 mm.)
It is preferably equal to or less than 02 mm. ), The above K1, K
2 is in the above range, the electric resistance can be reduced, and the groove 13 formed in the conductive film 12 can be reduced.
Can be formed with high precision, and the groove 13 can be reliably formed when the film thickness of the conductive film 12 is increased.

The conductive film 12 may be composed of a single layer, but may have a multilayer structure. That is, a plurality of conductive films 12 having different constituent materials may be stacked. For example, base 1
First, a copper film is formed on 1 and a metal film having good weather resistance (such as nickel) is laminated thereon, so that corrosion of copper having a problem in weather resistance can be prevented.

Examples of the method for forming the conductive film 12 include a plating method (such as an electrolytic plating method and an electroless plating method), a sputtering method, and a vapor deposition method. Among these forming methods,
A plating method with good mass productivity and small variations in film thickness is often used.

The surface roughness of the conductive film 12 is preferably 1 μm or less, more preferably 0.2 μm or less. When the surface roughness of the conductive film 12 exceeds 1 μm, the Q value at high frequencies decreases due to the skin effect. FIG. 6 shows a conductive film 1 used for an inductance element according to an embodiment of the present invention.
7 is a graph showing the relationship between the frequency and the Q value with respect to the surface roughness of No. 2; FIG. 6 was derived through the following experiment.
First, a conductive film 12 made of copper is formed on a base 11 having the same size and the same material with the same surface roughness while changing the surface roughness. Was measured. As can be seen from FIG.
If the surface roughness of is 1 μm or more, Q
It can be seen that the value is low. Further, it can be seen that when the surface roughness of the conductive film 12 is 0.2 μm or less, the Q value particularly in a high frequency region is extremely high.

As described above, the surface roughness of the conductive film 12 is 1.
The thickness is preferably 0 μm or less, and more preferably 0.2 μm or less, the skin effect of the conductive film 12 can be reduced, and the Q value particularly at high frequencies can be improved.

Further, the adhesion strength between the conductive film 12 and the base 11 is as follows:
After leaving the base 11 on which the conductive film 12 is formed at a temperature of 400 ° C. for a few seconds, it is preferable that the conductive film 12 be separated from the base 11 by a degree or more. When the element is mounted on a substrate or the like, a temperature of 200 ° C. or more may be applied to the element due to self-heating or heat from other members. Therefore, the conductive film 12 from the base 11 at 400 ° C.
If the adhesion strength is such that no peeling occurs, even if heat is applied to the element, the characteristics of the element do not deteriorate.

Next, the protective member 14 will be described.

As the protective material 14, an organic material having excellent weather resistance, for example, an insulating material such as an epoxy resin or an electrodeposition film is used. Further, as the protective material 14, the groove 13
It is preferable to have transparency so that the situation can be observed. Further, it is preferable that the protective material 14 has a predetermined color while having transparency. By coloring the protective material 14 with a color such as red, blue, or green, which is different from the conductive film 12 and the terminal portions 15 and 16, it is possible to distinguish each element portion, and to easily inspect each element portion. . Also, the size of the element,
By changing the color of the protective material 14 depending on the difference in characteristics, product numbers, etc., it is possible to reduce errors such as mounting of elements having different characteristics, product numbers, etc. on erroneous parts.

In particular, when the protective member 14 is formed of an electrodeposition film, the protective member 14 is very thin, can secure insulation, and can have improved heat resistance. That is, when the method of applying an epoxy resin, a resist, or the like is applied, a portion of the protective material 14 rises greatly, and when mounted on a circuit board or the like, a gap may be generated between the terminal portion of the element and the wiring of the circuit board. In some cases, sufficient electrical bonding cannot be performed. However, by forming the protective material 14 with an electrodeposition film, a thin and uniform protective material 14 can be formed. In addition, the gap between the terminal portion and the wiring becomes very small, and the electrical connection between the wiring and the terminal of the substrate can be sufficiently performed.

Further, in the method of applying a resist or the like, each element must be applied using a tape or the like, so that the number of steps is increased, productivity is not improved, and manufacturing cost is reduced. Although it is not possible, as in the present embodiment, by forming the protective material 14 with an electrodeposition film, the protective material 14 can be provided to many elements at once, so that productivity is improved and cost is reduced. Can be done.

As a specific constituent material of the protective material 14, an electrodeposition resin film made of at least one resin material such as an acrylic resin, an epoxy resin, a fluorine resin, a urethane resin, and a polyimide resin is used. It is configured. In the case where the protective material 14 is formed of an electrodeposited film, and when either the cation type or the anion type is selected, the constituent material of the conductive film 12, the constituent material of the electrodeposited film, and the usage of the inductance element are used. It is preferable to determine in consideration of the above. The protective material 14 may be formed by laminating electrodeposited films made of different materials, or may be formed by laminating the same material. Further, a plurality of electrodeposited films may be stacked on the groove 13 in parallel. It may be provided.

When the protective member 14 is formed of an electrodeposited film, the protective member 14 preferably has a thickness of several tens of microns and a withstand voltage of 20 V or more, and has a melting point of 183 ° C., which is the melting point of solder.
It is preferable to use a material having characteristics of not burning or evaporating. In the case where the protective material 14 is softened at 183 ° C., no problem occurs.

As shown in FIG. 7A, it is preferable that the protective material 14 made of an electrodeposition film be provided so as to cover both the conductive film 12 and at least a part of the base 11. By providing the protective material 14 in this manner, the conductive film 12 can be substantially covered, and the probability of contact between the conductive film 12 and outside air can be extremely reduced.
2 can be prevented, current leakage, and the like can be prevented. FIG.
In the case where the protective material 14 is provided only on the conductive film 12 as shown in (b), there is a high possibility that the corner 12z of the conductive film 12 is exposed, which may cause corrosion of the conductive film 12.

Therefore, as shown in FIG.
By configuring the corners 12z of the second to cover at least a part of the base 11 with the protective material 14, the conductive film 12 can be reliably protected.

Further, as shown in FIG. 7A, a portion 14 of the protective material 14 formed on the outer corner 12p of the conductive film 12 is formed.
It is preferable that z is thicker than other portions. By increasing the thickness of the portion 14z, it is possible to prevent the corner portion 12p from being discharged with other portions, and to prevent deterioration of characteristics as an inductance element.

In some cases, it is important for an inductance element used for a special purpose to have an adhesion strength between the conductive film 12 and the protective material 14. In this case, it is preferable to roughen the surface of the conductive film 12 by chemical etching, and to provide a protective material 14 made of an electrodeposition film on the roughened surface. As described above, if the surface of the conductive film 12 is roughened, there is a risk of lowering the Q value. However, in a special use or the like, the adhesion strength between the protective material 14 and the conductive film 12 is improved more than the Q value. In this case, it is necessary to appropriately determine the roughness of the conductive film 12 in consideration of the application and the like.

When the conductive film 12 is made of a material containing copper, the protective material 14 which is an electrodeposition film may be formed with an uneven film thickness. A metal film such as Ni is formed thereon, and a protective material 1 is formed on the metal film.
4 may be formed.

Next, a method of forming the protective member 14 composed of an electrodeposition film will be described.

As shown in FIG. 8, reference numeral 100 denotes a container.
0 contains a solution 101 in which an adjusting agent such as water, an electrodeposition resin, a pH adjusting agent, and other additives are mixed. 102 is an electrode plate, 103 is an inductance element, 1
Reference numerals 04 and 105 denote holding members, respectively.
105 is provided with holes into which both ends of the inductance element 103 fit. The conducting member 10 is
6 are provided, and the current-carrying portion 106 is in contact with the inductance element 103.

When a predetermined voltage is applied to the electrode plate 102 and the current-carrying portion 106, an electrodeposition film is formed on a portion except for both ends of the inductance element 103. This is because the terminals 15 and 16 of the inductance element 103 are connected to the holding members 104 and 1.
This is because they have entered the liquid crystal 05 and are not in contact with the solution 101 much. In the present embodiment, the holding member 1
Although the terminal portions 15 and 16 are inserted into the terminal portions 04 and 105, another mask member such as a photoresist may be provided on the terminal portions 15 and 16.

As described above, the protective material 1 composed of the electrodeposition film
After manufacturing the inductance element having No. 4, it is preferable to apply heat treatment to the element. By this heat treatment,
The surface of the protection member 14 becomes gentle, the surface roughness becomes small, and the protection member 14 is surely covered. Further, when heat treatment is applied, the protective material 14 at the corner 12 p of the conductive film 12 is formed.
May be thin, but in this case, the solution 1
01 is mixed with insulating particles (for example, a metal oxide), and the insulating particles are held in the protective material 14 made of an electrodeposited film. Can be prevented from becoming thinner.

Next, the terminals 15 and 16 will be described.

As shown in FIG. 2, the terminal portions 15 and 16 are
The base 11 is provided on the exposed end face and on the protection member 14, and thus, the terminal portion 1 is directly provided on the base 11.
By forming 5 and 16, the terminal portion 1 is formed.
The joining strength between the bases 5 and 16 and the base 11 can be improved. In addition, the conductive film 12 is formed up to the end face of the base 11,
The terminal portions 15 and 1 are formed on the conductive film 12 formed on the end face.
When the terminal portions 15 and 16 are formed on the relatively flat conductive film 12 by such a configuration, the terminal portions 15 and 16 may be formed by plating or coating. Since the crystallinity and film quality of the terminal portions 15 and 16 are improved, the characteristics of the terminal portions are improved.

The terminal portions 15 in the longitudinal direction of the base 11,
It is preferable that the lengths P5 and P6 of the respective 16 satisfy the following relationship. Note that L1 represents the entire length of the element as described above.

0.07 <P5 ÷ L1 <0.3 0.07 <P6 ÷ L1 <0.3 When P5 ÷ L1 and P6 ÷ L1 were 0.1 or less, the element was mounted on a circuit board. In this case, the bonding area with an electrode or the like provided on the circuit board may be reduced, and the bonding strength may be degraded or the Manhattan phenomenon may occur. 16 are close to each other, and when mounted on a circuit board or the like, the terminal 1
There is a possibility that a short circuit occurs between 5 and 16 on a circuit board or the like.

Next, the surface roughness of the terminals 15 and 16 is 1 μm.
m to 10 μm (preferably 1 μm to 5 μm). That is, the surface roughness of the terminal portions 15 and 16 is 1
If it is less than μm, the bonding area with an electrode provided on a circuit board or the like will be small, and the bonding strength will be small. If the surface roughness is 10 μm or more, the terminal 1
When another conductive film or the like is formed on the layers 5 and 16, the characteristics of the conductive film deteriorate.

The specific resistance value of the terminal portions 15 and 16 is 1 ×
10 ⁻⁴ Ωcm or more (preferably 5 × 10 ⁻⁴ Ωcm or more)
It is effective to improve the electrical characteristics.

Further, the crystal grain size of the terminal portions 15 and 16 is 1 to 5 μm (preferably 2 to 5 μm) in the case of a flake.
3 μm) is effective in terms of crystallinity or electrical characteristics, and in the case of a spherical body, 0.1 μm to 0.8 μm
(Preferably 0.2 μm to 0.5 μm)
It is effective in terms of crystallinity or electrical characteristics.

The maximum thicknesses P1, P2 of the terminal portions 15, 16 formed on the end face of the base 11 are each 10 μm.
To 30 μm (preferably 18 μm to 25 μm). If P1 and P2 are 10 μm or less, there is a possibility that a problem that the electrode erosion time of the terminal portions 15 and 16 is shortened. This is because if the reflow is not performed in a short time when the element is mounted on a circuit board or the like and the reflow is not performed in a short time, the electrode portions are eroded at the terminal portions 15 and 16 and a failure occurs in the connection between the element and the circuit. Occurs. Therefore,
The heating time for reflow or the like must be shortened, but if the heating time is shortened, the bonding material for bonding the element and the circuit board is not sufficiently melted, which causes a problem in bonding strength and the like.

In the solder dip test (350 ° C.)
The relationship between the electrode erosion time T and P1, P2 (t) is shown in FIG.
It is shown as follows. As can be seen from FIG.
1, if the film thickness of P2 is 10 μm or less, 7.5 seconds
Since the solder erosion phenomenon occurs below, as described above,
Since the bonding material does not melt sufficiently, it is not possible to obtain a sufficient bonding strength. Therefore, the film thickness of P1 and P2 is preferably set to 10 μm or more. If P1 and P2 are 30 μm or more, the length of the base 11 is shortened, and the Q value is deteriorated. As shown in FIG.
Assuming that the thickness of P1 and P2 is ta and that ta increases, the length of the base 11 inevitably becomes shorter.
The value will be degraded. Therefore, P1 and P2 are 3
If it exceeds 0 μm, the length of the base 11 itself becomes short, and Q
P1 and P2 are preferably set to 30 μm or less, since this would cause value deterioration.

Further, the maximum thickness P3 of the terminal portions 15 and 16 formed on the side surface of the base 11 and on the protective material 14
P4 is 10 μm to 25 μm (preferably 15 μm
m to 20 μm). P3, P4 is 10
When the diameter is smaller than μm, as shown in FIG. 10, the time during which the electrode erosion phenomenon occurs is shortened.
m or more. Further, as shown in FIG. 11, by increasing P3 and P4 (tb in FIG. 11), the thickness of the base 11 becomes thinner and the Q value deteriorates, so that P3 and P4 are 25 μm or less. Is preferred. Further, as can be seen from FIG. 11, when tb increases, the Q value deteriorates more remarkably than ta.
It is preferable that the thickness of each of P3 and P4 be smaller than P1 and P2 in order to prevent deterioration of the Q value. More specifically, when each of P1 and P2 has a thickness of 30 μm, it is preferable that each of P3 and P4 has a thickness smaller than 30 μm and a thickness of 10 μm or more.

The thicknesses P7, P8 of the terminal portions 15, 16 formed on the corners on the end face side of the base 11 are 10 μm to 20 μm.
When P7 and P8 are smaller than 10 μm, it is not preferable because the time during which the electrode erosion phenomenon occurs becomes short, and it is not preferable to make the thickness smaller than the film thicknesses P1 to P4. Since the portions 15 and 16 do not protrude, the mountability can be improved. Specifically, P7, P
8 is preferably 20 μm or less.

Further, it is preferable that the terminal portions 15 and 16 be entirely curved so that no edges are present on the terminal portions 15 and 16 so as to suppress generation of dust. .

In order to improve the weather resistance of the terminals 15, 16, Ti, N
A corrosion resistant film such as a metal film that is hardly corroded, such as i, W, and Cr, and an alloy film (such as Ni—Cr) of those metal materials is formed to a thickness of 0.5 to
It is preferable that the thickness be 3 μm. In particular, the use of Ni alone or a Ni alloy is excellent in characteristics, cost, and the like.

Further, in order to improve the bonding property between the terminal portions 15 and 16 and the circuit board or the like, solder or a lead-free bonding material (Sn alone or Ag on Sn) , Cu, Zn, Bi, In, or a lead-free solder containing at least one of them) may be formed to a thickness of 5 to 10 μm.

The corrosion-resistant film and the bonding film are connected to the terminal portions 15 and 16.
The lengths P1 to P8 related to the terminal portions 15 and 16 are determined on the assumption that the terminal portions 15 and 16 are formed above.
6, only the terminal portions 15, 1 are formed with the above-mentioned lengths P1 to P8, and at least one of the corrosion-resistant film and the bonding film is formed.
6, the thickness of the corrosion resistant film and the thickness of the bonding film are added to the lengths indicated by P1 to P8.

As one means for forming the terminal portions 15 and 16 as described above, there is a method in which a conductive paste is applied to the end surface of the base 11 and subjected to a heat treatment or the like to form the terminal portions 15 and 16. Hereinafter, a method of forming the coating type terminal portion will be described.

First, the conductive paste contains at least a conductive material, a resin material, and a solvent. As the conductive material, for example, conductive metal particles such as gold, silver, and copper can be used. The particles are particularly excellent in properties, workability, cost, and the like. When using flake-like metal particles, 1 to 5 μm (preferably 2 to 5 μm)
3 μm) is effective, and in the case of a spherical body,
0.1 μm to 0.8 μm (preferably 0.2 μm to 0.
5 μm) is preferred. Phenol,
At least one of an epoxy resin or the like is used, and butyl carbitol or the like is suitably used as the solvent.

The mixing ratio of the conductive paste is preferably 50 to 70% by weight of the conductive material, 10 to 20% by weight of the resin material, and 20 to 30% by weight of the solvent. Note that an adjusting material such as a viscosity adjusting material may be included in the conductive paste.

The conductive paste configured as described above is applied to the end of the base 11 by a dipping method, or the conductive paste is applied to the end of the base 11 via a roller or the like. At this time, in the case of the dipping method, the viscosity of the conductive paste is adjusted to about 10 to 30 PaS, and when a roller is used, the viscosity is adjusted to about 20 to 50 PaS.

After the conductive paste is applied to the base 11,
Heat treatment is performed at a temperature of about 150 ° C. to 230 ° C. for 30 to 60 minutes to form the terminal portions 15 and 16. At this time, the dimensions and the like of P1 to P8 of the terminal portions 15 and 16 are as described above, and a corrosion-resistant film, a bonding film, and the like are provided thereon as necessary.

Further, as shown in FIG. 2, it is preferable that the heights Z1 and Z2 of the terminal portions 15 and 16 satisfy the following conditions.

| Z1-Z2 | ≦ 80 μm (preferably 50 μm) The difference in height between Z1 and Z2 is 80 μm (preferably 50 μm).
m or less), when the element is mounted on a circuit board and attached to a circuit board or the like with solder or the like, the element is pulled to one end by surface tension of the solder or the like, and the element stands up. The probability of occurrence is very high. This Manhattan phenomenon is shown in FIG. As shown in FIG. 9, an inductance element is arranged on a substrate 200,
Solder 20 between each of terminal portions 15 and 16 and substrate 200
Although the solders 201 and 202 are provided, when the solders 201 and 202 are melted by reflow or the like, the molten solders 201 and 202 are melted due to a difference in the application amount of each of the solders 201 and 202 and a difference in melting point due to a difference in material. The surface tension of the terminal 15 differs between the terminal 15 and the terminal 16, and as a result, as shown in FIG. 9, the terminal rotates about one terminal and the inductance element rises. If the difference between the heights of Z1 and Z2 exceeds 80 μm (preferably 50 μm or less), the elements are arranged on the substrate 200 in an inclined state, and the standing of the elements is promoted. In addition, the Manhattan phenomenon is particularly remarkable in small and lightweight chip-type electronic components (including chip-type inductance elements). One of the causes of the Manhattan phenomenon is the terminal portion 1.
The element is tilted due to the difference in height between 5 and 16 and the substrate 200
We paid attention to being placed in. As a result, by forming the base 11 by molding or the like so that the difference between the heights of Z1 and Z2 is 80 μm or less (preferably 50 μm or less), the occurrence of the Manhattan phenomenon could be significantly suppressed. . By setting the difference between the heights of Z1 and Z2 to 50 μm or less, the occurrence of the Manhattan phenomenon can be substantially suppressed.

The relationship between the terminals 15, 16 and the groove 13 will be described.

The terminal portions 15 and 16 and the end of the groove 13 are opposed to each other with the protective material 14 interposed therebetween, so that when the groove 13 is provided in a spiral shape, the formation length of the groove 13 is increased. This is effective for an inductance element requiring a high inductance. From another viewpoint, the coil-shaped conductor formed by the groove 13 is opposed to the terminal portions 15 and 16 via the protective member 14, so that the number of turns of the coil-shaped conductor can be increased, and the inductance can be reduced. Can be set higher.

The method of manufacturing the inductance element configured as described above will be described below.

First, a base for several to several tens of elements is formed by pressing or extruding an insulating material such as alumina, and then a conductive film 12 is formed on the entire base 11 by plating or sputtering. It is formed almost entirely. Next, the spiral groove 1 is formed on the base 11 on which the conductive film 12 is formed.
3 are provided at predetermined intervals, and the spiral groove 13 is provided.
Then, the base is cut so as to sandwich it, and a repellent element having the conductive film 12 and the groove 13 formed in the base 11 is manufactured. The groove 13 is formed by laser processing or cutting. Since the laser processing has very high productivity, the laser processing will be described below. First, the base 11 is attached to a rotating device, and the base 11 is rotated.
2 and the base 11 are removed to form a spiral groove. At this time, a laser such as a YAG laser, an excimer laser, or a carbon dioxide gas laser can be used.
Irradiation. Further, the depth and the like of the groove 13 can be adjusted by adjusting the power of the laser, and the width and the like of the groove 13 can be adjusted by exchanging a lens when narrowing down the laser beam. Also, the conductive film 12
Because the absorption rate of the laser varies depending on the constituent materials, etc.
It is preferable that the type of laser (wavelength of laser) be appropriately selected depending on the constituent material of the conductive film 12. The groove 13 may be formed using a grindstone or the like.

After the groove 13 is formed, a protective material 14 is formed on the portion (side surface portion of the base 11) except for both end surfaces of the base 11 by using an electrodeposition method or the like.

Next, the terminal portions 15 and 16 are formed by applying a conductive paste to both end surfaces of the base 11 and performing a heat treatment or the like.

At this point, the product is completed, but as described above, a corrosion-resistant film or a bonding film is provided according to the specifications and the like.

Although the present embodiment has been described with reference to an inductance element, the same effect can be obtained with an electronic component in which a conductive film is formed on a base made of an insulating material.

Further, by using the conductive film 12 as a resistive film, a small chip resistor can be manufactured. Instead of providing the spiral groove 13 in the conductive film 12, an annular groove or the like is provided. By dividing the conductive film 12 into at least two, the conductive film 12 can also be used as a chip capacitor.

FIGS. 12 and 13 are a perspective view and a block diagram, respectively, showing a wireless terminal device according to an embodiment of the present invention. 12 and 13, reference numeral 29 denotes a microphone for converting a voice into a voice signal, 30 denotes a speaker for converting a voice signal into a voice, 31 denotes an operation unit including dial buttons and the like, and 32 denotes a display unit for displaying an incoming call and the like. Reference numeral 33 denotes an antenna, and reference numeral 34 denotes a transmission unit for demodulating an audio signal from the microphone 29 and converting it into a transmission signal. The transmission signal produced by the transmission unit 34 is emitted to the outside through the antenna 33. Three
A receiving unit 5 converts a received signal received by the antenna 33 into an audio signal. The audio signal created by the receiving unit 35 is converted into audio by the speaker 30. 36 is a transmitting unit 34,
The control unit controls the receiving unit 35, the operation unit 31, and the display unit 32.

Hereinafter, an example of the operation will be described.

First, when there is an incoming call, the receiving unit 35
Sends an incoming signal to the control unit 36, the control unit 36 displays a predetermined character or the like on the display unit 32 based on the incoming signal, and further presses a button or the like for receiving an incoming call from the operation unit 31. And a signal is sent to the control unit 36,
The control unit 36 sets each unit to the incoming call mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, the audio signal is output as audio from the speaker 30, and the audio input from the microphone 29 is converted into an audio signal, Through the antenna 33 to the outside.

Next, a case of transmitting a call will be described.

First, when making a call, a signal to the effect that a call is made from the operation unit 31 is input to the control unit 36. Subsequently, when a signal corresponding to the telephone number is transmitted from the operation unit 31 to the control unit 36, the control unit 36 transmits a signal corresponding to the telephone number from the antenna 33 via the transmission unit 34. When the transmission signal establishes communication with the other party,
When a signal to that effect is sent to the control unit 36 via the reception unit 35 via the antenna 33, the control unit 36 sets each unit to the transmission mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, the audio signal is output as audio from the speaker 30, and the audio input from the microphone 29 is converted into an audio signal, Through the antenna 33 to the outside.

In the present embodiment, an example in which voice is transmitted and received has been described. However, the same effect can be obtained not only for voice but also for a device for transmitting or receiving at least one of data other than voice such as character data. Can be obtained.

The electronic components described above (shown in FIGS. 1 to 11) include at least one of the parts requiring a high Q, such as a transmitting circuit, a filter circuit, an antenna unit, and a peripheral circuit of a matching circuit with each stage. The number is about several to 40 for one wireless terminal device. By using the electronic components as described above, the size of the substrate and the like inside the device can be reduced, and the phenomenon of standing up of the elements can be suppressed. Therefore, the defective rate of the circuit board and the like becomes extremely small, and the productivity becomes very good.

[0127]

According to the present invention, there is provided an electronic component in which a conductive film is provided on a base, grooves are provided in the conductive film, and terminals are provided at both ends of the base. By defining the thickness, the type of crystal grains, and the like, at least one of the ease of production, the mountability, and the characteristics can be realized.

Further, by mounting the above electronic components in the wireless terminal device, the mountability and characteristics of the electronic components can be prevented from deteriorating, so that the productivity is greatly improved and the deterioration of the terminal characteristics can be suppressed. .

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an inductance element according to an embodiment of the present invention.

FIG. 2 is a side sectional view showing an inductance element according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a base.

FIG. 4 is a graph showing the surface roughness of the base and the rate of occurrence of peeling.

FIG. 5 is a graph showing a relationship between a frequency and a Q value with respect to a surface roughness of a base used for an inductance element according to an embodiment of the present invention.

FIG. 6 shows a relationship between the frequency and Q with respect to the surface roughness of a conductive film used for an inductance element according to an embodiment of the present invention.
Graph showing value relationships

FIG. 7 is an enlarged cross-sectional view of a part provided with a protective material for an inductance element as an example of an electronic component according to an embodiment of the present invention.

FIG. 8 is a view showing a step of providing a protective material for an inductance element as an example of an electronic component according to an embodiment of the present invention.

FIG. 9 illustrates the Manhattan phenomenon.

FIG. 10 is a graph showing a relationship between a film thickness of a terminal portion of an electronic component and a time at which an electrode erosion phenomenon occurs in one embodiment of the present invention.

FIG. 11 is a graph showing a relationship between a film thickness of a terminal portion of an electronic component and a Q value of an element according to an embodiment of the present invention.

FIG. 12 is a perspective view showing a wireless terminal device according to one embodiment of the present invention;

FIG. 13 is a block diagram showing a wireless terminal device according to an embodiment of the present invention;

FIG. 14 is a side view showing a conventional inductance element.

[Explanation of symbols]

 Reference Signs List 11 base 12 conductive film 13 groove 14 protective material 15, 16 terminal unit 30 speaker 31 operation unit 32 display unit 33 antenna 34 transmission unit 35 reception unit 36 control unit

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Kazuhiro Takeda 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E070 AA01 AB02 BA07 BB01 CB03 CB15 CC03 DB02 EA01

Claims (26)

[Claims] 1. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component provided with a terminal portion, wherein when a total length in a direction in which the pair of terminal portions face each other is L1, a length P5 of the pair of terminal portions in a direction in which the pair of terminal portions face each other; P6 is an electronic component characterized by having a relationship of 0.07 <P5 ÷ L1 <0.3 0.07 <P6 ÷ L1 <0.3. 2. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component comprising a terminal portion, wherein the surface roughness of the terminal portion is 1 μm to 10 μm as a center line average roughness. 3. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component comprising a terminal portion, wherein the crystal grain constituting the terminal portion is formed in a flake shape, and the crystal grain size is 1 to 5 μm. 4. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component comprising a terminal portion, wherein the crystal grains constituting the terminal portion are spherical, and the crystal grain size is 0.1 μm to 0.8 μm. 5. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component comprising a terminal portion, wherein a film thickness on an end surface of a base of the terminal portion is 10 μm to 30 μm. 6. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component comprising a terminal portion, wherein the terminal portion is provided on an end surface of the base and a side surface adjacent to the end surface, and the thickness of the terminal portion formed on the side surface is 10 μm to 25 μm. And electronic components. 7. A base, a conductive film provided on the base, a groove provided in the conductive film, and a pair of bases provided on an end face of the base so as to sandwich the base. An electronic component provided with a terminal portion, wherein when a total length in a direction in which the pair of terminal portions face each other is L1, a length P5 of the pair of terminal portions in a direction in which the pair of terminal portions face each other; Each of P6 has a relationship of 0.07 <P5１L1 <0.3 0.07 <P6 ÷ L1 <0.3, and the surface roughness of the terminal portion is 1 μm to 10 μm as a center line average roughness, The terminal portion has a thickness of 10 μm to 30 μm on the end surface of the base, and the terminal portion is provided on the end surface of the base and on a side surface adjacent to the end surface, and the thickness of the terminal portion formed on the side surface 1
An electronic component having a thickness of 0 μm to 25 μm. 8. The electronic component according to claim 1, wherein a conductive film is provided also on an end surface of the base, and a terminal portion is provided via the conductive film. 9. The electronic component according to claim 1, further comprising a protective material for covering the groove. 10. The electronic component according to claim 1, wherein at least one of a corrosion-resistant film and a bonding film is provided on the terminal portion. 11. The electronic component according to claim 1, wherein the terminal portion is formed by solidifying a conductive paste. 12. The conductive paste includes a conductive material, a resin material,
The electronic component according to claim 11, further comprising a solvent. 13. The electronic component according to claim 12, wherein a thermosetting resin is used as the resin material, and the resin is cured at 150 ° C. to 230 ° C. 14. The electronic component according to claim 12, wherein silver particles are used as the conductive material. 15. The silver particles in the conductive paste are 50% by weight.
The electronic component according to claim 14, wherein the content is set to 70 to 70% by weight. 16. The electronic component according to claim 11, wherein a conductive paste is applied to the terminal portion by a dipping method or a roller. 17. The electronic component according to claim 9, wherein the protection member is formed of an electrodeposition film. 18. The electronic component according to claim 1, wherein the base has a prism shape with a substantially square bottom surface. 19. A length L1, a width L2, and a height L3, wherein L1 = 0.2 to 2.0 mm (preferably 0.3 to 0.8 mm).
mm) L2 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
mm) L3 = 0.1 to 1.0 mm (preferably 0.1 to 0.4 mm)
The electronic component according to any one of claims 1 to 18, wherein the electronic component has a size of (mm). 20. A semiconductor device comprising: a terminal portion extending from an end surface of a base to a protective material provided on a side surface of the base; and a protective material interposed between the terminal portion and the conductive film. The electronic component according to any one of claims 1 to 19, characterized by: 21. A base, a conductive film provided on the base, a spiral groove provided in the conductive film, a protective material provided so as to cover the groove, A terminal portion provided on the conductive film and the protective material provided at an end of the groove, and the terminal portion and the extreme end of the groove face each other with the protective material interposed therebetween. Electronic components. 22. The electronic component according to claim 1, wherein an end of the groove on the terminal portion side and the terminal portion face each other via a protective material. 23. The electronic component according to claim 1, wherein an inductance component is formed by the conductive film and the groove. 24. The electronic component according to claim 1, wherein a resistive film is used in place of the conductive film. 25. A groove for dividing the conductive film into at least two,
The electronic component according to claim 1, further comprising a capacitance component. 26. Display means, conversion means for converting at least one of a data signal and a voice signal into a transmission signal or converting a reception signal into at least one of a data signal and a voice signal, and wherein said transmission signal and said reception signal are converted. 26. A wireless terminal device comprising: an antenna for transmitting and receiving signals; and control means for controlling each unit, wherein at least one of a transmitting circuit, a filter circuit, an antenna unit, a matching circuit for each stage, and the like is included. A wireless terminal device using the electronic component according to any one of the above.