JP2001007631A - Microstrip patch antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small-sized microstrip patch antenna of low loss. SOLUTION: A transmission system circuit of an antenna system consists of only a power distributor 12, transmission high frequency amplifiers 13a, 13b, isolators 14a, 14b and a patch antenna element 15. Since a signal with large power amplified by the two transmission high frequency amplifiers 13a, 13b is fed to the patch antenna element 15 not via a power combiner, the antenna system has a low loss. Furthermore, since the power distributor 12, the transmission high frequency amplifiers 13a, 13b, the isolators 14a, 14b and the patch antenna element 15 are integrated on a dielectric board 10, the antenna system can be miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a microstrip patch antenna used in a band, a UHF band, a microwave band, and a millimeter wave band.

[0002]

2. Description of the Related Art FIG. 7 shows a 1998 IEEE MTT-S.
Digest, "THE IMPLEMENTATORI
ON OF RTU AND RSU TRANSCE
IVER FOR WLL SYSTEM ", pp1
1 is a circuit configuration diagram showing a conventional antenna device shown in 93 to 196, in which 1 is an input terminal, 2 is a power divider for distributing a signal input from an input terminal 1, 3a,
3b is a transmitting high-frequency amplifier for amplifying the distributed signal,
4 is a power combiner for combining the amplified signals, 5
Is an isolator that isolates the combined signal, and 6 is a duplexer that is switched according to transmission and reception. Reference numeral 7 denotes an antenna element that emits a radio wave corresponding to the signal transmitted through the duplexer 6 or outputs a signal corresponding to the received radio wave to the duplexer 6. 9 is an output terminal. The input terminal 1, the power divider 2, the transmitting high-frequency amplifiers 3a and 3b, the power combiner 4, the isolator 5, the duplexer 6, and the antenna element 7 constitute a transmission system circuit for radiating radio waves from the antenna element 7. The element 7, the receiving high-frequency amplifier 8, and the output terminal 9 constitute a receiving circuit that receives a radio wave from the antenna element 7.

Next, the operation will be described. When a signal is input from the input terminal 1, the input signal is
, And the transmission high-frequency amplifiers 3a,
After being amplified by 3b, they are combined by the power combiner 4. Thus, the plurality of transmitting high-frequency amplifiers 3a, 3
By arranging b in parallel via the power divider 2 and the power combiner 4, the signal is amplified to a large power. The signal amplified in this way passes through the isolator 5 and the duplexer 6 is switched to the transmitting system circuit side, so that it is not output to the receiving high-frequency amplifier 8 side of the receiving system circuit but is fed to the antenna element 7 and Is radiated into the air. At this time, the isolator 5 is provided to prevent unnecessary reflected signals from the duplexer 6 from flowing into the transmitting high-frequency amplifiers 3a and 3b and deteriorating the transmitting high-frequency amplifiers 3a and 3b.

When a radio wave of a receiving frequency is incident on the antenna element 7, the incident radio wave is converted into an electric signal, and the duplexer 6 is switched to the receiving system circuit side. It is not output but is output to the receiving high-frequency amplifier 8. This signal is amplified by the receiving high-frequency amplifier 8 and then output to the output terminal 9.

[0005]

Since the conventional antenna device is configured as described above, in the transmission system circuit from the input terminal 1 to the antenna element 7, the loss of the power combiner 4, the isolator 5, etc. As a result, output and efficiency are reduced. Further, in the receiving system circuit from the antenna element 7 to the output terminal 9, the NF characteristic is deteriorated due to the loss of the duplexer 6. Further, the power combiner 4,
There were problems such as an increase in the size of the device due to the isolator 5 and the duplexer 6.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to obtain a small, low-loss microstrip patch antenna.

[0007]

A microstrip patch antenna according to the present invention includes a power divider for distributing an input signal, first and second transmitting high-frequency amplifiers for amplifying the distributed signal, and an amplifier for amplifying the signal. First and second isolators for isolating the separated signals and first and second feed points provided at positions symmetrical with respect to a line of symmetry formed by the surface conductor film, and the first and second isolators are provided. And an antenna element for inputting a signal via the first and second feeding points via the first and second power feeding points.
, The transmission high-frequency amplifier, the first and second isolators, and the antenna element.

In a microstrip patch antenna according to the present invention, a power distributor, first and second transmitting high-frequency amplifiers, and first and second isolators are provided on a grounding conductive film, and a back surface of a dielectric substrate is provided. To the first and second feeding points of the antenna element on the surface.

A microstrip patch antenna according to the present invention includes a first and a second connection lines connected to a first and a second transmission high-frequency amplifier, and a first and a second connection lines. A resistor connected between the first and second transmission lines and for isolating the signal amplified by the first and second transmitting high-frequency amplifiers;
First and second feed points are provided at positions symmetrical with respect to the line of symmetry, formed by the surface conductor film, and the first and second power supply points are provided.
Antenna element for inputting a signal from the first and second feed points via the first connection line, a power divider, first and second transmission high-frequency amplifiers, first and second connection lines, and a resistor. And an antenna element.

[0010] In the microstrip patch antenna according to the present invention, the phase difference between the signal input to the first feeding point and the signal input to the second feeding point is set to 180 degrees.

A microstrip patch antenna according to the present invention includes an antenna element formed of a surface conductor film and having first and second feed points provided at positions symmetrical with respect to a line of symmetry, and a feed signal. A first and a second high-frequency receiving amplifier for amplifying; and a power combiner for combining and outputting the amplified signals, wherein the first and second high-frequency receiving amplifiers and the power combiner are connected to a ground conductor. The antenna is provided on a film, and power is supplied from the first and second feeding points of the antenna element on the front surface of the dielectric substrate to the first and second high-frequency receiving amplifiers on the back surface.

The microstrip patch antenna according to the present invention has first and second feeding points and first and second feeding points.
First and second connection lines connected between the first and second connection lines, and the first and second connection lines together with the first and second connection lines.
A first and a second connection line, and a resistor provided on the ground conductor film, and a first and a second antenna element on the surface of the dielectric substrate. In this configuration, power is supplied from the second power supply point to the first and second connection lines on the back surface.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIG. 1 is a schematic configuration diagram showing a microstrip patch antenna according to Embodiment 1 of the present invention. In FIG.
A dielectric substrate having a surface conductor film provided on its surface; 11, an input terminal; 12, a power divider for distributing an input signal from the input terminal 11; 13 a and 13 b, transmission high-frequency amplifiers for amplifying each of the distributed signals (First and second transmission high-frequency amplifiers). 14a and 14b are isolator (first, 14b) for isolating each amplified signal.
The second isolators) and 15 have two feeding points (first and second feeding points) 15a and 15 at positions symmetrical with respect to the line of symmetry.
b is a rectangular patch antenna element (antenna element) for inputting respective signals via the isolators 14a and 14b from the two feeding points 15a and 15b. It should be noted that the power divider 12, the transmitting high-frequency amplifier 13
a, 13b, isolators 14a, 14b, and patch antenna element 15 are formed on the surface conductor film of the dielectric substrate 10.

Next, the operation will be described. Input terminal 11
Are distributed at equal amplitudes and phases by the power divider 12, and the distributed signals are amplified by the transmission high-frequency amplifiers 13a and 13b, respectively, and then passed through the isolators 14a and 14b, respectively. Power is supplied to two power supply points 15a and 15b. Since the two signals input to the feeding points 15a and 15b have the same amplitude and the same phase, the patch antenna element 1
5 causes a linearly polarized wave having a plane of polarization in the direction of the symmetry line to be radiated into the air.

As described above, according to the first embodiment, the power distributor 12, the transmitting high-frequency amplifiers 13a, 13
b, the isolator 14a, 14b, and the patch antenna element 15 alone constitute a transmission system circuit of the antenna device, and the high-power signal amplified by the two transmission high-frequency amplifiers 13a, 13b is transmitted without passing through the power combiner. Since power is supplied to the patch antenna element 15, the device can be reduced in loss. Further, the power divider 12, the transmitting high-frequency amplifiers 13a and 13b, the isolators 14a and 14
b, and the patch antenna element 15
Since the device is integrally formed on the upper portion, an effect that the device can be downsized can be obtained.

Embodiment 2 FIG. 2 is a schematic configuration diagram showing a microstrip patch antenna according to a second embodiment of the present invention. In the figure, a power divider 12, transmission high-frequency amplifiers 13a and 13b, and an isolator 14 are shown.
a and 14b are formed on the grounding conductor film on the back surface of the dielectric substrate 10, and two feeding points 15a and 15b of the patch antenna element 15 formed on the front surface conductor film from the back surface of the dielectric substrate 10 Power. The other configuration is the same as that of FIG. 1 and the operation is the same as that of the first embodiment, so that the description is omitted.

As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained. Since the two feeding points 15a and 15b are provided on the surface of the patch antenna element 15, the degree of freedom in selecting the positions of the two feeding points 15a and 15b is increased. Therefore, the patch antenna element 1 viewed from the two feeding points 15a and 15b
5 is selected so as to match the impedance on the output side of the transmission system circuit, the patch antenna element 15 and the transmission system circuit can be matched, and the design of the matching circuit in the transmission high-frequency amplifiers 13a and 13b can be improved. The degree of freedom increases. Further, the power divider 12, the transmitting high-frequency amplifiers 13a and 13b, and the isolator 14
By arranging a and b in the region directly below the patch antenna element 15 on the back surface of the dielectric substrate 10, an effect of reducing the occupied area of the entire antenna device can be obtained.

Embodiment 3 FIG. 3 is a schematic diagram showing a microstrip patch antenna according to a third embodiment of the present invention. In the figure, reference numerals 16a and 16b denote transmission high-frequency amplifiers 13a and 13b and a patch antenna element 15 respectively.
Connection lines (first and second connection lines) connected to the two feeding points 15a and 15b, respectively, and 17 is the connection line 1
6a, 16b, the connection lines 16a,
16b is a resistor for isolating the respective signals amplified by the transmission high-frequency amplifiers 13a and 13b together with the impedance of the connection lines 16a and 16b.
Resistance value of resistance 17, resistance 1 in connection lines 16a and 16b
The connection point 7 is determined according to the input impedance of the patch antenna element 15 and the impedance of the transmission system circuit so that isolation between the two connection lines 16a and 16b can be obtained. The power divider 12, the transmitting high-frequency amplifiers 13a and 13b, and the connection lines 16a and 16
b, and a resistor 17 are formed on the grounding conductor film on the back surface of the dielectric substrate 10, and two feed points 15a of the patch antenna element 15 formed on the front surface conductor film from the back surface of the dielectric substrate 10 , 15b. The other configuration is the same as that of FIG. 2 and the operation is the same as that of the first embodiment.

As described above, according to the third embodiment, the same effects as in the second embodiment can be obtained. Since unnecessary reflection signals from the patch antenna element 15 are consumed by the resistor 17, the transmission high-frequency amplifiers 13a and 13a
3b can be reduced. Therefore, it is possible to prevent deterioration of the transmission high-frequency amplifiers 13a and 13b. Further, since the isolators 14a and 14b are unnecessary, an effect that the apparatus can be downsized can be obtained.

Embodiment 4 FIG. 4 is a schematic configuration diagram showing a microstrip patch antenna according to a fourth embodiment of the present invention. In the figure, reference numeral 18 denotes a power divider that distributes an output signal so that the phase difference is 180 degrees, and 19 denotes a power divider. The phase shifter is connected to the distribution terminal side whose phase is delayed by 180 degrees by the device 18 and has a passing phase of 180 degrees.
The other configuration is the same as that of FIG.

Next, the operation principle will be described. The signal input from the input terminal 11 has a phase difference of 180
The power divider 18 has the same amplitude and phase difference 18.
The signals are distributed at 0 degrees and input to the transmitting high-frequency amplifiers 13a and 13b. Assuming that the transmitting high-frequency amplifiers 13a and 13b operate in class B, the transmitting high-frequency amplifiers 13a and 13b
In the signal passing through b, the phase of the fundamental frequency is opposite, and the phase of the even harmonic is in phase. Furthermore, since one of the two signals passes through the phase shifter 19 having a passing phase of 180 degrees, the two signals eventually have the same phase of the fundamental frequency and the opposite phase of the even harmonic. The power is supplied to the patch antenna element 15.

As described above, according to the fourth embodiment, the same effects as in the second embodiment can be obtained. Also, at the fundamental frequency, a linearly polarized wave having a plane of polarization in the direction of the symmetry line is radiated into the air by the patch antenna element 15, and for even harmonics, the plane of polarization in a direction orthogonal to the linearly polarized wave at the fundamental frequency is changed. The linearly polarized wave which has it is radiated in the air. Therefore, an effect is obtained that radio waves of the fundamental frequency signal and the even harmonic signal can be separated.

Embodiment 5 FIG. 5 is a schematic configuration diagram showing a microstrip patch antenna according to a fifth embodiment of the present invention. In the figure, reference numeral 21 denotes a rectangular patch antenna element provided with two feeding points at positions symmetrical with respect to a line of symmetry. (Antenna elements), 22a and 22b are receiving high-frequency amplifiers (first and second receiving high-frequency amplifiers) for amplifying respective signals fed by the two feeding points,
23 is a power combiner for combining and outputting the amplified signals, and 24 is an output terminal. Note that the patch antenna element 21 is formed on the surface conductor film on the surface of the dielectric substrate 10, and the high-frequency receiving amplifiers 22 a and 22 b and the power combiner 23 are formed on the ground conductor film on the back surface of the dielectric substrate 10. The power is supplied from the two feeding points of the patch antenna element 21 on the front surface of the dielectric substrate 10 to the receiving high-frequency amplifiers 22a and 22b on the back surface.

Next, the operation will be described. The radio wave incident on the patch antenna element 21 is converted into an electric signal, amplified by the receiving high-frequency amplifiers 22a and 22b, then synthesized by the power synthesizer 23, and output to the output terminal 24.

As described above, according to the fifth embodiment, the patch antenna element 21, the receiving high-frequency amplifier 22
Since the receiving system circuit of the antenna device is constituted only by the a, 22b and the power combiner 23, and the duplexer is unnecessary, the device can be reduced in loss. Further, the reception high-frequency amplifiers 22a and 22b and the power combiner 23
Since the device is integrally formed on the back surface of the dielectric substrate 10, the device can be downsized. Further, the reception high-frequency amplifiers 22a and 22b and the power combiner 23
Since the two feeding points are provided on the back surface of the dielectric substrate 10 and are provided on the surface of the patch antenna element 21, the degree of freedom in selecting the positions of the two feeding points of the patch antenna element 21 is increased. Therefore, if the input impedance of the patch antenna element 21 as viewed from the two feeding points is selected so as to match the impedance on the input side of the receiving system circuit, the matching between the patch antenna element 21 and the receiving system circuit can be achieved, and the high frequency signal for reception can be obtained. The degree of freedom in designing a matching circuit in the amplifiers 22a and 22b is increased. Further, by arranging the receiving high-frequency amplifiers 22a and 22b and the power combiner 23 in a region directly below the patch antenna element 21 on the back surface of the dielectric substrate 10, an effect that the occupied area of the entire antenna device is reduced. can get.

Embodiment 6 FIG. FIG. 6 is a schematic configuration diagram showing a microstrip patch antenna according to a sixth embodiment of the present invention. In the drawing, reference numerals 25a and 25b denote a portion between two feeding points of a patch antenna element 21 and high-frequency receiving amplifiers 22a and 22b. , Connection lines (first and second connection lines) respectively connected to the connection lines 25a, 2a
5b, which is a resistor for isolating the respective signals fed by the two feeding points together with the connection lines 25a, 25b.
5b impedance, resistance value of resistor 26, connection line 2
The connection point of the resistor 26 in 5a, 25b is determined according to the output impedance of the patch antenna element 21 and the impedance of the receiving circuit so that isolation between the two connection lines 25a, 25b can be obtained. In addition,
The patch antenna element 21 is formed on the surface conductor film on the surface of the dielectric substrate 10, and the connection lines 25a and 25b, the resistor 26,
The receiving high-frequency amplifiers 22a and 22b and the power combiner 23 are formed on the grounding conductor film on the back surface of the dielectric substrate 10, and the two antennas 21 on the front surface of the dielectric substrate 10 are fed back from two feeding points. Connection lines 25a, 25b
Power. The other configuration is the same as that of FIG. 5, and the operation is similar to that of the fifth embodiment.
Since this is the same as that obtained by adding the isolation action by the resistor 5b and the resistor 26, the description is omitted.

As described above, according to the sixth embodiment, the same effects as in the fifth embodiment can be obtained. Unnecessary reflected signals from the receiving high-frequency amplifiers 22a and 22b are consumed by the resistor 26, so that reflected signals flowing into the patch antenna element 21 can be reduced. Therefore, the multiple reflection between the receiving high-frequency amplifiers 22a and 22b and the patch antenna element 21 can be suppressed, and the effect of preventing the deterioration of the reception signal frequency characteristics and the deterioration of the receiving high-frequency amplifiers 22a and 22b can be obtained.

[0028]

As described above, according to the present invention, a power divider for distributing an input signal, first and second transmission high-frequency amplifiers for amplifying the distributed signal, and The first and second isolators to be isolated and the surface conductor film are provided, and the first and second feeding points are provided at positions symmetrical with respect to the symmetry line, and the first and second isolators are provided. The signal is first and second
And a power divider, the first and second transmitting high-frequency amplifiers, the first and second isolators, and the antenna element are integrally formed. Since it is a configuration that is not required,
The device can have low loss. Further, since the device is integrally formed on the dielectric substrate, an effect that the device can be downsized can be obtained.

According to the present invention, the power divider, the first and second transmitting high-frequency amplifiers, and the first and second isolators are provided on the grounding conductor film, and the antenna from the back surface to the front surface of the dielectric substrate is provided. Since the first and second feed points of the element are configured to feed power, the first and second feed points are provided on the surface of the antenna element, and thus the positions of the first and second feed points are set. Has a greater degree of freedom for selection. Therefore, if the input impedance of the antenna element viewed from the first and second feed points is selected so as to match the impedance on the output side of the transmission system circuit, the antenna element and the transmission system circuit can be matched. 1st and 2nd
In this case, the degree of freedom in designing a matching circuit in the transmitting high-frequency amplifier increases. Further, the effect of reducing the occupied area of the entire antenna device can be obtained.

According to the present invention, the first and second connection lines connected to the first and second transmission high-frequency amplifiers are connected between the first and second connection lines. , A resistor for isolating the signal amplified by the first and second transmission high-frequency amplifiers together with the first and second connection lines, and the first conductor at a position symmetrical with respect to the line of symmetry formed by the surface conductor film. And an antenna element for inputting a signal via the first and second connection lines from the first and second power supply points,
Since the power divider, the first and second transmission high-frequency amplifiers, the first and second connection lines, the resistor, and the antenna element are integrated, an unnecessary reflected signal from the antenna element side is consumed by the resistor. Therefore, the first and second
The reflected signal flowing into the transmitting high-frequency amplifier can be reduced. Therefore, it is possible to prevent the first and second transmission high-frequency amplifiers from deteriorating. Further, since the first and second isolators are not required, an effect that the device can be downsized can be obtained.

According to the present invention, the phase difference between the signal input to the first feeding point and the signal input to the second feeding point is set to 1
Since the angle is set to be 80 degrees, an effect is obtained that the antenna element can radiate linearly polarized light having a plane of polarization in the direction of the symmetry line into the air.

According to the present invention, the antenna element formed of the surface conductor film and provided with the first and second feed points at positions symmetrical with respect to the line of symmetry, and the first element for amplifying the fed signal And a second high frequency amplifier for reception, and a power combiner for combining and outputting the amplified signals,
And a second receiving high-frequency amplifier and a power combiner are provided on a grounding conductive film, and the first and second receiving high-frequency amplifiers on the back side from the first and second feeding points of the antenna element on the front surface of the dielectric substrate. Since the high-frequency amplifier is configured to supply power, a duplexer is not required, so that the device can have low loss. Further, the device can be downsized. Further, the first and second receiving high-frequency amplifiers and the power combiner are arranged on the back surface of the dielectric substrate,
Since the and the second feeding point are provided on the surface of the antenna element, the degree of freedom in selecting the positions of the first and second feeding points of the antenna element is increased. Therefore, if the input impedance of the antenna element viewed from the first and second feeding points is selected so as to match the impedance on the input side of the receiving system circuit, the matching between the antenna element and the receiving system circuit can be achieved. The degree of freedom in designing the matching circuit in the second high-frequency receiving amplifier is increased. Further, the effect that the occupied area of the entire antenna device is reduced can be obtained.

According to the present invention, the first and second connection lines connected between the first and second feeding points and the first and second high-frequency receiving amplifiers, and the first and second connection lines are provided. And a resistor for isolating a signal fed by the first and second feed points together with the first and second connection lines, the first and second connection lines; and Since the resistor is provided on the grounding conductor film and the first and second feed points of the antenna element on the front surface of the dielectric substrate are fed to the first and second connection lines on the back surface, the first and second connection lines are provided. Unnecessary reflected signals from the second receiving high-frequency amplifier are consumed by the resistors,
The reflected signal flowing into the antenna element can be reduced. Therefore, the multiple reflection between the first and second high-frequency receiving amplifiers and the antenna element can be suppressed, and the effect of preventing the deterioration of the frequency characteristics of the received signal and the first and second high-frequency receiving amplifiers can be prevented. can get.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a microstrip patch antenna according to a first embodiment of the present invention.

FIG. 2 is a schematic configuration diagram showing a microstrip patch antenna according to a second embodiment of the present invention.

FIG. 3 is a schematic configuration diagram showing a microstrip patch antenna according to a third embodiment of the present invention.

FIG. 4 is a schematic configuration diagram showing a microstrip patch antenna according to a fourth embodiment of the present invention.

FIG. 5 is a schematic configuration diagram showing a microstrip patch antenna according to a fifth embodiment of the present invention.

FIG. 6 is a schematic configuration diagram showing a microstrip patch antenna according to a sixth embodiment of the present invention.

FIG. 7 is a circuit configuration diagram showing a conventional antenna device.

[Explanation of symbols]

Reference Signs List 10 dielectric substrate, 12 power divider, 13a transmission high-frequency amplifier (first transmission high-frequency amplifier), 13b
Transmission high-frequency amplifier (second transmission high-frequency amplifier), 1
4a isolator (first isolator), 14b
Isolator (second isolator), 15, 21 patch antenna element (antenna element), 15a feed point (first feed point), 15b feed point (second feed point),
16a, 25a connection line (first connection line), 16
b, 25b connection line (second connection line), 17, 26
Resistor, 22a high-frequency receiving amplifier (first high-frequency receiving amplifier), 22b high-frequency receiving amplifier (second high-frequency receiving amplifier), 23 power combiner.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Andrei Andrenko 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Mitsubishi Electric Corporation (72) Inventor Yukio Ikeda 2-3-2 Marunouchi, Chiyoda-ku, Tokyo No. Mitsubishi Electric Corporation F-term (reference) 5J045 AA07 AB05 DA10 EA07 FA02 HA03 JA12 JA18 MA07 NA01

Claims (6)

[Claims] 1. A power divider for distributing an input signal in a microstrip patch antenna having a conductor film for grounding provided on a back surface of a dielectric substrate and a surface conductor film for radiating radio waves on the surface, and the power divider. First and second transmission high-frequency amplifiers for amplifying respective signals distributed by the first and second transmission high-frequency amplifiers, and first and second transmission high-frequency amplifiers for isolating the respective signals amplified by the first and second transmission high-frequency amplifiers First and second feeding points are provided at positions symmetrical with respect to a line of symmetry, formed by the isolator and the surface conductor film, and each signal through the first and second isolators is transmitted to the first and second isolators. And the second
And an antenna element input from a feeding point of the above, wherein the power divider, the first and second transmitting high-frequency amplifiers, the first and second isolators, and the antenna element are integrally formed. Characterized microstrip patch antenna. 2. A power splitter, first and second transmitting high-frequency amplifiers, and first and second isolators are provided on a grounding conductive film, and the first and second antenna elements on the front to back surfaces of the dielectric substrate are provided. The microstrip patch antenna according to claim 1, wherein power is supplied to the second power supply point. 3. A power divider for distributing an input signal in a microstrip patch antenna provided with a ground conductor film on the back surface of a dielectric substrate and a surface conductor film for radiating radio waves on the surface, and the power divider. First and second transmission high-frequency amplifiers for amplifying respective signals distributed by the first and second transmission high-frequency amplifiers, and first and second connection lines respectively connected to the first and second transmission high-frequency amplifiers; The first and second transmission lines are connected between the first connection line and the second connection line, and are amplified together with the first and second connection lines by the first and second transmission high-frequency amplifiers. Resistance to isolate,
First and second feed points are provided at positions symmetrical with respect to the line of symmetry, formed by the surface conductor film, and the first and second power supply points are transmitted through the first and second connection lines. And an antenna element input from a second feeding point. The power divider, the first and second transmission high-frequency amplifiers, the first and second connection lines, the resistor, and the antenna element are integrated. A microstrip patch antenna, comprising: 4. The apparatus according to claim 1, wherein a phase difference between a signal input to the first power supply point and a signal input to the second power supply point is 180 degrees. Or 1
The microstrip patch antenna according to the item. 5. A microstrip patch antenna in which a ground conductor film is provided on the back surface of a dielectric substrate and a surface conductor film for receiving radio waves is provided on the front surface, wherein the microstrip patch antenna is formed by the surface conductor film and is symmetric with respect to a line of symmetry. An antenna element provided with first and second feeding points at different positions, first and second receiving high-frequency amplifiers for amplifying respective signals fed by the first and second feeding points, A power combiner that combines and outputs respective signals amplified by the first and second receiving high-frequency amplifiers, wherein the first and second receiving high-frequency amplifiers and the power combiner are combined with each other. The antenna is provided on a grounding conductor film, and power is supplied from the first and second feeding points of the antenna element on the front surface of the dielectric substrate to the first and second receiving high-frequency amplifiers on the back surface, respectively. A microstrip patch antenna. 6. A first and a second connection line respectively connected between a first and a second power supply point and a first and a second high-frequency receiving amplifier, the first connection line and the first connection line, respectively. A resistor connected between the second connection line and the first connection line and the second connection line, and a resistor for isolating respective signals supplied by the first and second power supply points together with the first connection line and the second connection line; The first and second connection lines and the resistor are provided on a grounding conductor film, and the first and second connection lines on the rear surface are provided from the first and second feeding points of the antenna element on the front surface of the dielectric substrate. 6. The microstrip patch antenna according to claim 5, wherein power is supplied to each of the lines.