JP2001007479A - Manufacture of flexible printed wiring board - Google Patents
Manufacture of flexible printed wiring boardInfo
- Publication number
- JP2001007479A JP2001007479A JP11178365A JP17836599A JP2001007479A JP 2001007479 A JP2001007479 A JP 2001007479A JP 11178365 A JP11178365 A JP 11178365A JP 17836599 A JP17836599 A JP 17836599A JP 2001007479 A JP2001007479 A JP 2001007479A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- wiring board
- insulating base
- openings
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 13
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 7
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 4
- 235000011089 carbon dioxide Nutrition 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 2
- 230000002411 adverse Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高密度の回路設計
を精度良く複雑な工程を必要とせず製造でき、且つ実装
時の歩留まり向上を可能にした、フレキシブル配線板の
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible wiring board, which can manufacture a high-density circuit design accurately and without the need for complicated steps, and can improve the yield during mounting. .
【０００２】[0002]
【従来の技術】従来から、フレキシブル配線板を半田ペ
ーストを用いて、ヒートバーにより一括溶融し他の配線
板の接続部と導通接続する場合、フレキシブル配線板の
接続部は、図２に示すように絶縁基材の両面に銅箔を接
着剤により貼り合わせた両面銅箔板にドリルによりスル
ーホール穴明けを行い、表裏の銅箔及び穴明けされたス
ルーホール内壁部に銅メッキを施すことによって、表裏
の導通接続を行い、所定の回路をエッチング処理により
形成した後、接続部回路の両面を現像型ソルダーレジス
ト等で表裏被覆しスルーホール部に半田ペーストを溶融
充填させて、他の配線板と導通接続する方法が採用され
ている。しかし、これらの加工方法ではポリイミド樹脂
フィルム等の絶縁基材の両面に接着剤で銅箔を貼り合わ
せた両面銅箔板を使用し、スルーホール穴明け、銅メッ
キ等の多数の工程を必要とし、且つ接続部回路の両面を
現像型ソルダーレジストで被覆するため、表裏を各々被
覆する毎にソルダーレジストの乾燥時の影響を受け材料
寸法収縮が発生し、位置合わせ精度バラツキによるソル
ダーレジスト開口部の不良が発生し、半田ペーストの溶
融導通接続後の部品の接続信頼性低下やパターン設計及
び製造工程が煩雑になり製品歩留低下等の問題もあっ
た。2. Description of the Related Art Conventionally, when a flexible wiring board is melted at once by a heat bar using a solder paste and electrically connected to a connection section of another wiring board, the connection section of the flexible wiring board is connected as shown in FIG. By drilling through holes in the double-sided copper foil plate where copper foil is bonded to both sides of the insulating base material with an adhesive, by applying copper plating on the front and back copper foil and the drilled through hole inner wall part, After conducting conductive connection on the front and back and forming a predetermined circuit by etching, both sides of the connection circuit are covered with development type solder resist etc., and the solder paste is melt-filled in the through hole part, and the other wiring board A method of conducting connection is adopted. However, these processing methods use a double-sided copper foil plate in which copper foil is attached to both sides of an insulating base material such as a polyimide resin film with an adhesive, and require a number of steps such as through-hole drilling and copper plating. In addition, since both sides of the connection circuit are covered with the development-type solder resist, the size of the material shrinks due to the influence of drying of the solder resist each time the front and back are coated, and the solder resist opening due to uneven positioning accuracy. Failure occurred, and there were also problems such as a decrease in connection reliability of components after the melting and conduction connection of the solder paste, a complicated pattern design and manufacturing process, and a decrease in product yield.
【０００３】通常、フレキシブル配線板の回路の被覆
は、絶縁樹脂フィルムに接着剤が塗布された絶縁樹脂被
覆層となる絶縁樹脂フィルムを金型により、所定の形状
に打ち抜いたものを使用しているが金型による打ち抜き
加工の場合、最小加工打ち抜きできる開口部の直径は精
度の点から０．６ｍｍ程度が限界である。上記のフレキ
シブル配線板より、更に回路密度が高いフレキシブル配
線板の場合、開口部の開口直径は０．４ｍｍ程度が要求
されるため前記した現像型ソルダーレジストが採用され
ているが、印刷、プレキュア、露光、現像、ポストキュ
ア等の工程が表裏合わせて２回必要となり工数、管理項
目の増加、更に製品の取り扱い工程の増加によるオレ、
シワ等による歩留低下が発生しコストアップの要因とな
る。In general, a circuit of a flexible wiring board is formed by punching an insulating resin film, which is an insulating resin coating layer obtained by applying an adhesive to an insulating resin film, into a predetermined shape using a mold. In the case of punching using a die, the diameter of the opening which can be punched by the minimum processing is limited to about 0.6 mm in terms of accuracy. In the case of a flexible wiring board having a higher circuit density than the above flexible wiring board, the development type solder resist described above is employed because the opening diameter of the opening is required to be about 0.4 mm, but printing, pre-curing, Exposure, development, post-curing, etc., are required twice, front and back, which increases man-hours, management items, and the number of product handling processes.
The yield decreases due to wrinkles and the like, which causes a cost increase.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、高密度のフ
レキシブル配線板を半田ペーストを用いてヒートバーに
より一括導通接続を行う際に、該フレキシブル配線板の
接続用の回路の開口部を形成する際に発生する問題点を
解決するためになされたもので、その目的とするところ
は煩雑な加工工程を必要とせず、高密度の回路設計を精
度良く加工できるフレキシブル配線板の製造方法を提供
するものである。SUMMARY OF THE INVENTION According to the present invention, when a high-density flexible wiring board is collectively conductively connected by a heat bar using a solder paste, an opening of a connection circuit of the flexible wiring board is formed. The purpose of the present invention is to provide a method of manufacturing a flexible wiring board that can accurately process a high-density circuit design without requiring a complicated processing step. Things.
【０００５】[0005]
【課題を解決するための手段】本発明は、絶縁基材の片
面に銅箔を有する片面銅箔板に、所定の回路を形成した
後、回路間の間隔よりも絶縁基材間の開口部の間隔が大
きくなるように、回路を有する絶縁基材の反対面側から
エキシマ、又は炭酸ガスレーザーを用いて回路パッドの
表裏に開口部を設けた後、回路を有する絶縁基材面を液
状樹脂レジストで被覆することを特徴とするフレキシブ
ル配線板の製造方法、及び該フレキシブル配線板と他の
配線板の接続部とを半田ペーストで導通接続させること
を特徴とするフレキシブル配線板付モジュールの製造方
法である。SUMMARY OF THE INVENTION According to the present invention, after a predetermined circuit is formed on a single-sided copper foil plate having a copper foil on one side of an insulating base material, the opening between the insulating base materials is smaller than the interval between the circuits. After providing openings on the front and back of the circuit pad using an excimer or carbon dioxide laser from the opposite side of the insulating base having the circuit so that the distance between the insulating base having the circuit is large, the insulating base having the circuit is liquid resin A method for manufacturing a flexible wiring board, characterized by covering with a resist, and a method for manufacturing a module with a flexible wiring board, wherein the flexible wiring board and a connection portion of another wiring board are electrically connected with a solder paste. is there.
【０００６】[0006]
【発明の実施の形態】以下、本発明を具体的に説明す
る。本発明に用いる絶縁基材の片面に回路が形成された
フレキシブル配線板の素材は、ポリイミド樹脂フィルム
等の柔軟性を有する絶縁基材の片面に銅箔を加熱・加圧
して一体成形したものであり、従来から用いられている
フレキシブル配線板用のものと同一である。又、回路を
有する絶縁基材面を被覆する液状樹脂レジストについて
も同一のものを用いる。本発明に用いるフレキシブル配
線板は、絶縁基材の片面に銅箔を有する片面銅箔板に、
エッチングで所定の回路を形成した後、各回路間の間隔
よりも絶縁基材の各開口部の間隔が大きくなるように、
回路を有する絶縁基材の反対面側からエキシマ、又は炭
酸ガスレーザーを照射し絶縁基材を除去し開口部を明
け、デスミアにより回路裏面の接着剤層を除去した後、
回路を有する絶縁基材面を液状樹脂レジストで被覆する
方法で製造される。又、本発明は他の配線板と前記フレ
キシブル配線板を所定の位置にセットし、前記フレキシ
ブル配線板の所定の箇所にスクリーン印刷等で半田ペー
ストを載置し、ヒートバーで一括溶融しフレキシブル配
線板と他の配線板を導通接続させる製造方法である。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below. The material of the flexible wiring board having a circuit formed on one surface of the insulating base material used in the present invention is a material obtained by integrally molding a copper foil on one surface of a flexible insulating base material such as a polyimide resin film by heating and pressing. Yes, they are the same as those used for flexible wiring boards conventionally used. The same liquid resin resist is used for coating the insulating substrate surface having the circuit. The flexible wiring board used in the present invention is a single-sided copper foil plate having a copper foil on one side of an insulating base material,
After forming a predetermined circuit by etching, so that the interval between each opening of the insulating base material is larger than the interval between each circuit,
After excimer or carbon dioxide laser is irradiated from the opposite side of the insulating base having the circuit, the insulating base is removed and the opening is opened, and after removing the adhesive layer on the back side of the circuit by desmear,
It is manufactured by a method of coating the surface of an insulating substrate having a circuit with a liquid resin resist. In addition, the present invention sets another wiring board and the flexible wiring board at a predetermined position, places a solder paste on a predetermined portion of the flexible wiring board by screen printing or the like, and melts the flexible wiring board at a time using a heat bar. And another wiring board are electrically connected.
【０００７】本発明では、絶縁樹脂層を形成した後にレ
ーザーで開口部を開口し、液状樹脂レジストの被覆形成
を行っているため、従来方法の問題点であった、液状樹
脂レジストの表裏２回形成時に発生する熱影響による寸
法収縮等の悪影響がなくなり、その結果として回路パッ
ド上の開口面積及び容積が安定して得られ、電気接続信
頼性が向上し、且つ製品設計の簡素化が可能となる。更
に導通接続に半田ペーストを一括溶融するため、図２に
示すように、従来の構造ではスルーホール内部を溶融し
た半田ペーストが充填し配線板を固定する必要がある
が、本発明のフレキシブル配線板ではスルーホールが不
要で銅箔表裏に開口部を有しているため、導通接続に必
要な半田ペーストを少量にすることができ、従来の構造
で発生していた半田ペーストの過剰供給による近接する
パッドのショート等が改善され、接続工程の歩留まり向
上が可能となる。本発明の重要な点は、各回路間の間隔
よりも絶縁基材間の開口部の間隔が大きく、且つ絶縁基
材の各開口部の側面が各回路の側面より外側になるよう
にし、更に回路を有する絶縁基材面を被覆した液状樹脂
レジストの側面も前記各回路の側面より外側になるよう
に配置することにより、圧着後の断面形態がハトメ等で
押し圧着された時と同様の効果を得ることができる。In the present invention, since the opening is opened by laser after forming the insulating resin layer and the coating of the liquid resin resist is performed, the problem of the conventional method is that the liquid resin resist is coated on both sides twice. There is no adverse effect such as dimensional shrinkage due to thermal influence generated during formation, and as a result, the opening area and volume on the circuit pad can be obtained stably, electrical connection reliability is improved, and product design can be simplified. Become. Furthermore, since the solder paste is melted at a time for the conductive connection, as shown in FIG. 2, in the conventional structure, it is necessary to fill the inside of the through hole with the solder paste that has been melted and fix the wiring board. Since no through hole is required and the copper foil has openings on the front and back, the amount of solder paste required for conductive connection can be reduced, and close proximity due to excessive supply of solder paste generated in the conventional structure The short-circuit of the pad is improved, and the yield of the connection process can be improved. An important point of the present invention is that the distance between the openings between the insulating substrates is larger than the distance between the circuits, and the side surface of each opening of the insulating substrate is outside the side surface of each circuit, By arranging such that the side surfaces of the liquid resin resist covering the insulating base material surface having the circuits are also outside the side surfaces of the respective circuits, the cross-sectional shape after the pressure bonding is the same as that obtained by pressing and bonding with eyelets or the like. Can be obtained.
【０００８】以下、図面を用いて本発明を説明する。図
１（Ａ）〜（Ｅ）は、本発明の片面に回路を有するフレ
キシブル配線板の接続部断面模式図を示す。図１（Ａ）
は、絶縁基材１に銅箔２を一体成形した銅箔板素材であ
る。図１（Ｂ）は、エッチングにより所定の回路を形成
した状態を示す。図１（Ａ）及び図１（Ｂ）の工程は、
従来と同一で特に限定されるものではない。図１（Ｃ）
は、回路を有する絶縁基材の反対面側から炭酸ガスレー
ザーで絶縁基材に開口部３を明け、次いでデスミアによ
り回路２裏面の接着剤層を除去した状態を示す。図１
（Ｄ）は、絶縁基材１と回路２の表面に液状樹脂レジス
ト４を塗布し、現像処理を行い回路２の表面に開口部を
形成した状態を示す。図１（Ｅ）は、半田ペーストを開
口部に充填し、他の配線板の接続部と導通接続した状態
を示す。Hereinafter, the present invention will be described with reference to the drawings. 1A to 1E are schematic cross-sectional views of a connection portion of a flexible wiring board having a circuit on one side according to the present invention. FIG. 1 (A)
Is a copper foil plate material obtained by integrally forming a copper foil 2 on an insulating base material 1. FIG. 1B shows a state where a predetermined circuit is formed by etching. The steps in FIGS. 1A and 1B are as follows:
It is the same as the conventional one and is not particularly limited. FIG. 1 (C)
Shows a state in which the opening 3 is opened in the insulating base material from the opposite side of the insulating base material having the circuit by the carbon dioxide laser, and then the adhesive layer on the back surface of the circuit 2 is removed by desmearing. FIG.
(D) shows a state in which a liquid resin resist 4 is applied to the surfaces of the insulating base material 1 and the circuit 2, and a developing process is performed to form openings on the surface of the circuit 2. FIG. 1E shows a state where the opening is filled with a solder paste and is electrically connected to a connection portion of another wiring board.
【０００９】[0009]
【発明の効果】本発明は、煩雑な加工工程が不要で、高
密度の回路設計を精度良く加工でき、半田ペーストを用
いてヒートバーにより他の配線板と一括導通接続を行う
際に用いるフレキシブル配線板として最適である。According to the present invention, a complicated wiring process is not required, a high-density circuit design can be processed with high precision, and a flexible wiring used when conducting collective conductive connection with another wiring board by a heat bar using a solder paste. Ideal as a board.
【図１】本発明のフレキシブルプリント配線板の接続部
断面模式図。FIG. 1 is a schematic cross-sectional view of a connection portion of a flexible printed wiring board according to the present invention.
【図２】従来技術のフレキシブルプリント配線板の接続
部断面模式図。FIG. 2 is a schematic cross-sectional view of a connection portion of a conventional flexible printed wiring board.
Claims (2)
板に、所定の回路を形成した後、回路間の間隔よりも絶
縁基材間の開口部の間隔が大きくなるように、回路を有
する絶縁基材の反対面側からエキシマ、又は炭酸ガスレ
ーザーを用いて回路パッドの表裏に開口部を設けた後、
回路を有する絶縁基材面を液状樹脂レジストで被覆する
ことを特徴とするフレキシブル配線板の製造方法。After a predetermined circuit is formed on a single-sided copper foil plate having a copper foil on one side of an insulating base material, the interval between openings between the insulating base materials is larger than the interval between the circuits. After providing openings on the front and back of the circuit pad using excimer or carbon dioxide laser from the opposite side of the insulating base having the circuit,
A method for manufacturing a flexible wiring board, comprising: coating an insulating substrate surface having a circuit with a liquid resin resist.
板に、所定の回路を形成した後、回路間の間隔よりも絶
縁基材間の開口部の間隔が大きくなるように、回路を有
する絶縁基材面側からエキシマ、又は炭酸ガスレーザー
を用いて回路パッドの表裏に開口部を設けた後、回路を
有する絶縁基材面を液状樹脂レジストで被覆して得られ
たフレキシブル配線板と他の配線板の接続部とを半田ペ
ーストで導通接続させることを特徴とするフレキシブル
配線板付モジュールの製造方法。2. After a predetermined circuit is formed on a single-sided copper foil plate having a copper foil on one side of an insulating base material, an interval between openings between the insulating base materials is larger than an interval between the circuits. Flexible wiring obtained by providing an opening on the front and back of a circuit pad using an excimer or carbon dioxide laser from the insulating substrate surface side having a circuit, and then covering the insulating substrate surface having a circuit with a liquid resin resist. A method for manufacturing a module with a flexible wiring board, wherein the board and a connection portion of another wiring board are electrically connected by a solder paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17836599A JP4073579B2 (en) | 1999-06-24 | 1999-06-24 | Manufacturing method of flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17836599A JP4073579B2 (en) | 1999-06-24 | 1999-06-24 | Manufacturing method of flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001007479A true JP2001007479A (en) | 2001-01-12 |
| JP4073579B2 JP4073579B2 (en) | 2008-04-09 |
Family
ID=16047230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17836599A Expired - Fee Related JP4073579B2 (en) | 1999-06-24 | 1999-06-24 | Manufacturing method of flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4073579B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100384308C (en) * | 2006-01-12 | 2008-04-23 | 珠海元盛电子科技股份有限公司 | Method for making single-face hollowed-out board |
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
-
1999
- 1999-06-24 JP JP17836599A patent/JP4073579B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100384308C (en) * | 2006-01-12 | 2008-04-23 | 珠海元盛电子科技股份有限公司 | Method for making single-face hollowed-out board |
| CN107820362A (en) * | 2016-09-14 | 2018-03-20 | 鹏鼎控股(深圳)股份有限公司 | Hollow out flexible circuit board and preparation method |
| CN107820362B (en) * | 2016-09-14 | 2020-07-24 | 鹏鼎控股(深圳)股份有限公司 | Hollow flexible circuit board and manufacturing method thereof |
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| Publication number | Publication date |
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