JP2001064481A - Flexible epoxy putty composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a flexible epoxy putty composition suitable for forming a smooth surface by ironing by using a spatula into surfaces of various substrates such as bumper, wood, metal, lightweight concrete and the like which need flexibility. SOLUTION: This flexible epoxy putty composition is obtained by blending organic microballoons having <=100 μm particle size in an epoxy resin composition comprising an epoxy resin, a curing agent and an extender pigment. Preferably, 5-50 pts.wt. of organic hollow microspheres having 0.1-0.3 g/cm3 density or 0.5-5 pts.wt. of organic fine foamed powder having 0.01-0.05 g/cm3 density is blended with 100 pts.wt. of the sum total of the epoxy resin and the curing agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible epoxy putty composition, and more particularly, to a smooth surface by squeezing a bumper, wood, metal, mortar and other various grounds of an automobile with a spatula or the like. And a flexible epoxy putty composition suitable for use.

[0002]

2. Description of the Related Art Unsaturated polyester patties, epoxy patties, urethane patties, lacquer patties, and the like are used as repair putties for automobile bodies and bumpers. Also,
The above-mentioned patties and water-based patties are also used for wood and mortar.

[0003] Since these repair putties have a mission of smoothing the concave portions, it is necessary to incorporate a larger amount of extender pigments than paints, so that there is a problem that they have poor flexibility and are difficult to work. However, none of the conventional repair putties has improved flexibility, that is, flexibility.

On the other hand, Japanese Patent Application Laid-Open No. 2-294323 discloses a one-pack type thermosetting putty composition suitable for producing master models, jigs and the like comprising an epoxy resin, a thermoplastic resin, a dihydrazide curing agent and a filler. Proposed. In this patent, when an inorganic filler such as a glass microballoon or a shirasu balloon is used as a filler, the coefficient of thermal expansion of the cured product becomes small, and when a phenol resin microballoon or phenol resin powder is used, the cutability of the cured product is reduced. It is said to be improved, but not for the purpose of improving flexibility.

[0005] Also, Japanese Patent Application Laid-Open No. 4-59820 discloses that
There has been proposed an epoxy resin composition such as an epoxy compound comprising a low-viscosity epoxy resin at room temperature and an epoxy group-containing reactive diluent, and SMC comprising an expandable microcapsule and an epoxy resin curing agent, such as SMC. This is characterized in that the curing shrinkage of the molded article is reduced by blending the expandable microcapsules, but it is used for injection molding and has different uses.

Further, Japanese Patent Application Laid-Open No. 6-322236 proposes an epoxy resin composition for jigs and tools composed of a low-viscosity epoxy resin at room temperature, an epoxy resin hardener, hollow microspheres, and a specific silicon-based surfactant. Although this is, by blending a specific silicon-based surfactant,
The purpose of the present invention is to suppress the generation of air bubbles at the time of producing the jig and tool, and to mix the hollow microspheres in order to improve the workability of work and the workability of cutting.

[0007]

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an automobile bumper, xylem,
It is an object of the present invention to provide a flexible epoxy putty composition suitable for forming a smooth surface by squeezing with a spatula or the like on various grounds such as metal and lightweight concrete.

[0008]

As a result of various studies, the present inventors have found that the flexibility can be improved by blending an organic microballoon with an epoxy resin.
The present invention has been completed.

That is, the present invention is a flexible epoxy putty composition comprising an epoxy resin composition containing an epoxy resin, a curing agent and an extender pigment, wherein an organic microballoon having a particle size of 100 μm or less is blended. .

In the flexible epoxy putty composition of the present invention, the organic hollow microspheres having a density of 0.1 to 0.3 g / cm ³ are added to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
50 parts by weight or a density of 0.01 to 0.1.
It is preferable to add 0.5 to 5 parts by weight of an organic foamed fine powder of 05 g / cm ³ . Further, the flexible epoxy putty composition of the present invention is preferably used as a putty for repairing a bare ground requiring flexibility.

Hereinafter, the flexible epoxy putty composition of the present invention will be described in detail. Examples of the epoxy resin used in the flexible epoxy putty composition of the present invention include glycidyl ether-based epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, alicyclic epoxy resin,
Various epoxy resins such as a glycidyl ester-based epoxy resin, a glycidylamine-based epoxy resin, and a heterocyclic epoxy resin are exemplified. Of these epoxy resins, they are liquid at room temperature and have a viscosity of 15,000 at 25 ° C.
Epoxy resins having a low viscosity of about 0 cps or less are preferred. These epoxy resins may be used alone or in combination of two or more.

If necessary, a reactive diluent having 1 to 3 epoxy groups per molecule may be added to the epoxy resin. The reactive diluent is a compound that is generally used in combination with a high-viscosity liquid epoxy resin to lower the viscosity of the resin composition, and has an epoxy group in its molecule and thus contributes to curing. Examples of such a reactive diluent include n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, p-sec-butylphenyl glycidyl ether, and glycidyl. Methacrylate, vinylcyclohexene monoepoxide, α-
Compounds having one epoxy group in one molecule such as pinene oxide, glycidyl tertiary carboxylate, hexanediol, diglycidyl ether, (poly) ethylene glycol diglycidyl ether, (poly) propylene glycol diglycidyl ether, Butanediol diglycidyl ether, vinylcyclohexene dioxide, neopentyl glycol diglycidyl ether,
Examples thereof include compounds having two epoxy groups in one molecule such as diglycidylaniline, and compounds having three epoxy groups in one molecule such as trimethylolpropane triglycidyl ether and glycerin triglycidyl ether. These reactive diluents may be used alone or 2
More than one type may be used in combination.

The curing agent for epoxy resin used in the flexible epoxy putty composition of the present invention includes, for example, aliphatic polyamines such as diethylenetriamine, triethylenetetramine, isophoronediamine, m-xylenediamine, metaphenylenediamine, diaminodiamine and the like. Examples thereof include aromatic polyamines such as diphenylmethane and diaminodiphenylsulfonic acid, and polymercapto compounds. These curing agents may be used alone or in combination of two or more. In addition, as a curing accelerator, for example, tertiary amine,
Organic metals and the like can be blended.

The extender used in the flexible epoxy putty composition of the present invention is not particularly limited as long as it has been conventionally used as an extender (filler) of the putty composition. Examples of such an extender include calcium carbonate, clay, talc, kaolin, fine mica, and barium sulfate. These extenders may be used alone or in combination of two or more. The particle size of the extender is 100 μm or less, preferably 50 μm or less from the viewpoint of smoothness. The compounding amount is preferably about 40 to 70% by weight of the flexible epoxy putty composition.

[0015] The flexible epoxy putty composition of the present invention is characterized in that organic microballoons of 100 µm or less are blended as a filler. The organic microballoon is made of a flexible and strong material, and is hardly cracked or cracked during processing. Such organic microballoons include, for example, organic hollow microspheres having a density of 0.1 to 0.3 g / cm ³ and organic foamed fine powders (foamed microcapsules) having a density of 0.01 to 0.05 g / cm ^3. Is mentioned.
The particle diameter of the organic microballoons is about 20 to 100 μm for organic hollow microspheres and 4 for organic foamed fine powder.
It is preferably about 0 to 100 μm. If the particle size of the organic microballoon exceeds 100 μm, the tactile feel of the putty becomes rough and the smoothness of the construction surface is impaired. As these organic microballoons, organic hollow microspheres or organic foamed fine powder may be used alone, or both may be used in combination.

Examples of the organic high molecular substance used for these organic microballoons include a vinylidene chloride resin, an acrylonitrile resin, a styrene resin, an epoxy resin, a phenol resin, and a urea-formaldehyde resin. In addition, when organic microballoons whose surfaces are coated with inorganic fine powder such as calcium carbonate, talc, and titanium oxide are used, the affinity with the epoxy resin and the curing agent is improved, so that the workability is improved.

The organic microballoon is blended with the epoxy resin and / or the curing agent. If it is blended in a small amount, it may be blended in any of them, and if it is blended in a large amount, it may be blended in both. When the organic microballoon reacts with the epoxy resin or the curing agent, it is added to a component that does not react. Total amount of epoxy resin and curing agent 100
The mixing ratio of the organic microballoon to the weight part is
5 is a organic hollow microspheres density 0.1 to 0.3 g / cm ³
In the case of 50 parts by weight and an organic foamed fine powder having a density of 0.01 to 0.05 g / cm ³ , the flexibility can be improved at 0.5 to 5 parts by weight. When both are used together, the mixing ratio may be determined according to the mixing ratio.

The flexible epoxy putty composition of the present invention comprises:
As long as the object of the present invention is not impaired, an appropriate amount of inorganic microballoons can be blended in addition to organic microballoons. Examples of such an inorganic microballoon include a silica balloon, a shirasu balloon, a glass balloon, a fly ash balloon, and the like. These inorganic microballoons may be used alone or in combination of two or more.

The flexible epoxy putty composition of the present invention comprises:
Conventionally known additives can be blended as additives for the putty composition. Such additives include, for example, dispersants such as polymeric polycarboxylic acids, defoaming agents such as modified silicones and acrylate copolymers, polyethylene oxides, amide waxes, and hydrogenated casters. One or more kinds of anti-sagging / sedimentation agents such as oil-based and organic bentonite-based can be used.

The flexible epoxy putty composition of the present invention is produced as a two-pack type of a base and a curing agent by blending an organic microballoon, an extender pigment, etc. with either or both of an epoxy resin and a curing agent, The base and the curing agent may be mixed at a predetermined ratio when used.

The flexible epoxy putty composition of the present invention can be used for various purposes such as automobile bumpers, automobile parts, wood parts, metals, mortar parts, etc., and because it is flexible, it can follow deformation. It does not peel even when used in places with vibration.

[0022]

EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples. In the following, "part" indicates "part by weight".

Example 1 Low-viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.] 380 parts, polyacrylonitrile hollow fine particles [Microsphere MFL-80GCA manufactured by Matsumoto Yushi Seiyaku Co., Ltd., particle size 20 μm, density 0.2] 1
00 parts, 10 parts of aluminum stearate and 10 parts of titanium dioxide were mixed with a mixer to obtain [Base 1] 500 parts. 330 parts of modified aliphatic polyamine compound [Fujicure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.], modified aliphatic polyaminoamide compound [Tomide HR manufactured by Fuji Kasei Kogyo Co., Ltd.]
-11] 60 parts, polyacrylonitrile hollow fine particles [Microsphere MFL-80G manufactured by Matsumoto Yushi-Seiyaku Co., Ltd.]
CA], 50 parts of aluminum stearate and 50 parts of calcium carbonate were mixed with a mixer.
500 parts were obtained. Then, [Base 1] and [Curing Agent 1] were stirred and mixed at a ratio of 1: 1 to prepare a flexible epoxy putty. Using this flexible epoxy putty, the spatula was squeezed into the concave part of the curved surface of the plastic bumper, and the adhesion to the substrate was good. did it.

Example 2 435 parts of low viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.], fine powder of organic foam
[Nippon Philite Expancel 551DE, particle size 30-50 μm, density 0.036 g / cm ³ ] 15 parts, titanium dioxide 25 parts and solvent 25 parts were mixed with a mixer,
[Base 2] 500 parts were obtained. Modified aliphatic polyamine compound [Fuji Cure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.] 380
Parts, modified aliphatic polyaminoamide compound [Tomide HR-11 manufactured by Fuji Kasei Kogyo Co., Ltd.] 65 parts, aluminum stearate 10 parts, calcium carbonate 35 parts and organic bentonite 10 parts were mixed with a mixer, and [Curing agent 2] 50
0 parts were obtained. Then, [Base 2] and [Curing Agent 2] were added as 1:
Stir and mix at a ratio of 1 to prepare a flexible epoxy putty,
As in Example 1, when the spatula was squeezed into the concave portion of the curved surface of the plastic bumper, the adhesiveness to the base material was good, and putty could be filled even at a small scratch, and the concave portion could be repaired smoothly. Was.

Comparative Example 1 Low-viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.] 218 parts, 110 parts of talc, 110 parts of calcium carbonate, 25 parts of zinc white, 25 parts of organic bentonite and 12 parts of additives were mixed with a mixer. By mixing, 500 parts of [Base 3] were obtained. 190 parts of modified aliphatic polyamine compound [Fujicure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.], modified aliphatic polyaminoamide compound [Fuji Kasei Kogyo Co., Ltd.
Tomide HR-11] 33 parts, talc 135 parts, calcium carbonate 90 parts, additives 12 parts and solvent 40 parts were mixed with a mixer to obtain 500 parts of [hardening agent 3]. Then
[Base 3] and [Curing agent 3] were stirred and mixed at a ratio of 1: 1 to prepare a normal epoxy putty. As in Example 1, a spatula was squeezed into the concave portion of the plastic automobile bumper. Was hard and did not finish smoothly.

[0026]

The flexible epoxy putty composition of the present invention comprises:
Because it has excellent flexibility, it does not stably adhere and peel off even in areas with a lot of vibration such as automobile bumpers, and putty is also filled neatly into parts with curved surfaces and irregularities,
It can be finished to a smooth surface. In addition, the workability and performance are not inferior to conventional epoxy putty.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09D 201/00 C09D 201/00 F term (Reference) 4J002 BC032 BD102 BG102 CC032 CC162 CD002 CD021 CD041 CD051 CD081 CD131 DE237 DG047 DJ037 DJ047 DJ057 EN026 EN036 EN046 EN076 EV026 EV216 FA102 FB072 FD012 FD097 FD146 FD200 GJ02 4J038 CC022 CD082 CG162 DA032 DA142 DB002 DB041 DB061 DB151 DB221 DB251 HA166 HA266 HA286 HA526 HA536 HA546 JA13 JB04 JB07 J02

Claims (4)

[Claims] 1. A flexible epoxy putty composition comprising an epoxy resin composition containing an epoxy resin, a curing agent and an extender pigment, wherein organic microballoons having a particle size of 100 μm or less are blended. 2. The method according to claim 1, wherein the particle size is 100 μm or less and the density is 0.1 to 0.3 with respect to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
flexible epoxy putty composition of claim 1 blended with organic hollow microspheres 5-50 parts by weight of g / cm ^3. 3. A particle size of 100 μm or less and a density of 0.01 to 0.1 with respect to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
Organic foaming claim 1 flexible epoxy putty composition according compounded with fine powder 0.5 to 5 parts by weight of 05g / cm ^3. 4. The flexible epoxy putty composition according to claim 1, wherein the flexible epoxy putty composition is a putty for repairing various ground surfaces.