JP2000340992A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently mount electronic components on two boards at once, with a simple mechanism. SOLUTION: Printed boards 7 are transferred to substrate mount tables 11, 12 from a transfer conveyer, a Y-table 17 moves in the direction Y in accordance with the same mounting data, mounting heads 38, 39 respectively pick up the same components from component feed units 14 at both sides of the conveyer, move the same distance, and mount them at the same positions on both boards 7 mounted on the board mounting tables 11, 12 on the Y-table 17 at the same time. Thus the components are mounted on both boards 7 according to the same mounting data.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. Hei 10-242697 discloses an example of an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. According to this conventional technique, component supply units are provided on both sides of a transport conveyor that transports a printed circuit board, and mounting heads that are also provided on both sides of the conveyor so that electronic components can be taken out from the both component supply units. The components taken out from the component supply unit are mounted on the printed circuit board transferred from the conveyor onto the mounting table.

[0003]

However, in the prior art, since the two mounting heads move onto the same substrate from both sides to mount electronic components, there is a possibility that the mounting heads may interfere with each other. Also, because of the possibility of this interference,
Although it is necessary to make the two heads move alternately into the substrate, it may not be possible to move them completely alternately depending on the mounting position. Such a problem is remarkable for a small substrate.

For this reason, a technique is conceivable in which two boards are arranged side by side in the direction orthogonal to the board conveying direction of the conveyor with the configuration of the mounting head as in the prior art, and components are simultaneously mounted on the two boards. In this way, if the mounting heads mount components only on the adjacent printed circuit boards and do not mount components on the other boards, there is no interference between the two heads, and the movement of the mounting heads is restricted. Absent. However, normally, components are mounted by arranging two identical printed circuit boards side by side, but if components are mounted by the same component mounting program, components are picked up by the mounting head even though the component mounting position on the board is the same In many cases, the distance from the position to the mounting position is different between the two substrates, and the control of the moving distance of the mounting head must be performed independently of each other even though the control is performed based on the same program.
The burden on the controlling CPU and the like was heavy.

In addition, the mounting of components on two boards often does not end at the same time, so that the transfer between the mounting table of the printed circuit board and the conveyor must be performed at different times, and the transfer mechanism must be complicated. Did not.

An object of the present invention is to enable efficient mounting of electronic components on two substrates simultaneously with a simple mechanism.

[0007]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board. A component supply unit that is provided on both sides of the component supply unit and supplies the electronic components to be taken out by the mounting head is disposed in the board transport direction of the transport conveyor, and is provided on both sides of the transport conveyor. The mounting head that moves in the same direction as the substrate transfer direction of the transfer conveyor,
Two mounting tables are provided in the direction orthogonal to the substrate transport direction, and the mounting table for mounting the printed circuit boards transported by the transport conveyor and the mounting table are moved in a direction orthogonal to the substrate transport direction of the conveyor. And table moving means.

[0008] With this configuration, the board can be guided into both mounting tables and components can be mounted at the same time. In addition, if the same component mounting program is used, it is possible to mount components while keeping the position of the mounting head for mounting components constant and the distance that both mounting heads move from the component supply unit, and worry about interference between heads. Disappears. Further, since the mounting table moves without changing the position of the transport conveyor, the substrate can be easily transferred to either mounting table. Further, if components are mounted on the same two boards, at least the control of the moving means in the direction orthogonal to the board transport direction is the same for the two boards. Also, since the component mounting is completed almost simultaneously, the substrate transfer operation can be performed without interrupting the component mounting.

In the present invention, preferably, the mounting head is movable in a direction orthogonal to the substrate transport direction.

[0010] By doing so, it is not necessary to provide a space for the board to move in a part of the component supply section in the board transport direction, and it is possible to mount many component supply units. Moreover, since the transfer table moves in a direction orthogonal to the substrate transport direction, the mounting head in the direction orthogonal to the substrate transport direction can be moved to a position where the two heads do not interfere with each other.

The present invention preferably further comprises an auxiliary table moving means for moving one of the two mounting tables with respect to the other mounting table in a direction orthogonal to the substrate transfer direction. is there.

With this configuration, fine adjustments different for each substrate can be performed without moving the mounting head in a direction perpendicular to the substrate transport direction.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings.

In the electronic component mounting apparatus shown in FIG. 2, component supply units 2 to 5 are provided on a base 1.
Transport conveyors 8 and 9 for transporting the printed circuit board 7 are provided between the component supply units 3 and the component supply units 4 and 5. Between the transfer conveyor 8 and the transfer conveyor 9, a substrate mounting table 11,
A printed circuit board 12 is provided in a direction (hereinafter, referred to as a Y direction) orthogonal to a board transfer direction (hereinafter, referred to as an X direction) of the conveyors 8, 9, and the transfer conveyor 8 is transferred from an upstream apparatus. The substrate 7 is transferred to the substrate mounting tables 11 and 12, and the substrate 7 on the substrate mounting tables 11 and 12 is transferred to the transport conveyor 9. In each of the component supply units 2 to 5, component supply units 14 are arranged in the board transfer direction.

Each of the component supply units 14 normally accommodates a large number of electronic components (not shown) of the same type and supplies the components to a predetermined supply position. Different component supply units 14 supply electronic components of different types. Since the components are stored, a large number of component supply units 14 collectively supply many types of components. The supply position of each component supply unit 14 is in a state where it is attached to the component supply units 2 to 5,
They are arranged on a straight line in the X direction.

A component recognition camera 16 is provided between the component supply unit 2 and the component supply unit 3 on a straight line in which the supply positions are arranged. Similarly, the component supply unit 4 and the component supply unit 5 are connected to each other. The part recognition camera 1 is located on a straight line on
6 are provided.

The substrate mounting tables 11 and 12 are mounted on a Y table 17 movable in the Y direction, and can be moved to a position where the substrate mounting tables 11 and 12 are connected to the conveyors 8 and 9 by moving the Y table 17. . The Y table 17 moves along a guide rail 19 as shown in FIG. 1, and the movement is driven by a screw shaft 21 rotated by a Y main motor 20. The substrate mounting table 11 is a Y table 17
The substrate mounting table 12 is fixed on the
A screw shaft 26 provided on the table 17 and rotated by a Y sub motor 25 along a guide rail 24 extending in the Y direction.
And is moved in the Y direction.

The fixed chute 2 is mounted on the substrate mounting table 11.
9 and a movable chute 30 are provided to support the printed circuit board 7 therebetween. The movable chute 30 moves in the Y direction within the range of the table 11 according to the width of the substrate 7. .

The substrate mounting table 12 is provided with a fixed chute 31 and a movable chute 32, which support the printed circuit board 7 between them. Is moved in the Y direction within the range of.

Each of the chutes 29, 30, 31, 32
3B, a portion (not shown) on which the substrate 7 can be placed in the case shown in FIG. 3B and a belt (not shown) that rotates so as to transport the substrate 7 are provided. Each shoot 2
9, 30, 31, 32 are a pair of chutes 29, 30 respectively.
And a large substrate 7 that cannot be supported by the chutes 31 and 32
3A, the movable chutes 30 and 32 which are inside and are adjacent to each other are moved outward and supported as shown in FIG. For this reason, a portion (not shown) on which the substrate 7 is placed and a belt (not shown) capable of transporting the substrate 7 are also wound on the opposite sides of the movable chutes 30 and 32 from the above.

The conveyors 8 and 9 also have a fixed chute 35 and a movable chute 36 which can move.

As shown in FIG. 1, the electronic component mounting apparatus picks up and removes electronic components from the supply position of the component supply unit 14 and mounts them on the printed circuit board 7.
Are provided on both sides of the conveyors 8 and 9 one by one. The mounting heads 38, 39 are moved in the X direction by screw shafts 40, 41 by the rotation of a motor (not shown), and are moved up and down along guide rails 44, 45. Also, the mounting units 46, 4 to which the mounting heads 38, 39 are mounted.
Reference numeral 7 is movable in the Y direction by a drive mechanism (not shown) (for example, a ball screw shaft rotated by a motor). However, since the movement in the Y direction may be performed by reciprocating between the position for picking up the component and the position for mounting the component, the mounting position may be set at a position where the mounting heads 38 and 39 do not collide with each other. Good. It may not move as a command in a direction approaching each other from the set mounting position, or may move only to a position where it does not mechanically collide with each other. Note that one mounting unit and one mounting head may be provided for each of the component supply units 2 to 5.

A space is provided below the component supply units 2 to 5 so that the mounting tables 11 and 12 can enter when the Y table 17 moves in the Y direction.

A nozzle stocker in which a large number of suction nozzles 50 are exchangeably mounted on the mounting heads 38 and 39 and accommodate various types of electronic components between the component supply units 2 to 5 and the conveyors 8 and 9. The nozzle stocker 51 is provided with the mounting heads 38 and 39.
Are located within the movement range in the Y direction.

The operation of the above configuration will be described below.

First, a case where two substrates 7 are simultaneously placed and components are mounted will be described. This is a case in which electronic components are mounted on a relatively small substrate 7, and the chutes 29, 30 and the chutes 3 of each of the substrate mounting tables 11, 12 are mounted.
This is a case where the substrate 7 having a width smaller than the width that can be placed when the first and the second members 32 are maximally opened is transferred.

The movable chutes 30, 32 are moved in accordance with the width of the substrate 7 carried by the carrying conveyor 8. The positions of the fixed chutes 29 and 31 are preferably set in the
The position closer to 5 is preferable because the moving distance of the heads 38 and 39 is reduced. In this way, shoot 3
When the positions of 0 and 32 are determined, the mounting heads 38 and 39 have the same spacing between the pair of chutes 29 and 30 and the chutes 31 and 32 of the mounting tables 11 and 12 because the same substrate is mounted thereon. When the Y table 17 is positioned such that the intermediate position of the movable chutes 30 and 32 coincides with the intermediate position between the component supply units 2 and 3 and the component supply units 4 and 5, The control device (not shown) is set so that the respective heads 38 and 39 move to the center position of the mounted substrate 7 in the Y direction to mount components. However, this is a case where there is no position correction, and the mounting head 3
If the position is corrected in the Y direction in steps 8 and 39, the correction amount is added to this position.

Next, the printed circuit board 7 is conveyed from the upstream device by the conveyor 8 and the chute 2
It is delivered to 9, 30 as shown in FIG. 4, positioned and fixed.

Next, the Y table 17 is moved to transfer the next printed circuit board 7 from the conveyor 8 to the chutes 31 and 32 of the table 12, as shown in FIG.

Next, the same component 4 to be sucked by the suction nozzle 50 of each of the mounting heads 38 and 39 according to the mounting data in which the mounting position of the substrate 3 and the type of the component to be mounted are specified for each mounting sequence (not shown). To adsorb. The arrangements of the component supply units 14 of the component supply units 2 and 3 and the component supply units 4 and 5 are the same as those facing each other. Therefore, the mounting heads 38 and 39 first move the same distance in the X direction from the position where the component is taken out, and perform component imaging on the component recognition camera 16 for component recognition.

Next, the movement is started at the same time, and the component recognition processing is completed. Both heads 38 and 39 simultaneously reach the above-described mounting position in the Y direction and simultaneously reach the position indicated by the data in the X direction. .

In the meantime, the Y table 17 moves and stops both substrates 7 so that the position indicated by the data becomes the position of both suction nozzles 50. When it is necessary to correct the component recognition result deviation, the mounting heads 38 and 39 perform the correction in the X direction, and the movement of the Y table 17 with respect to the substrate 7 of the mounting table 11 in the Y direction,
The rotation of the Y main motor 20 is corrected, and for the substrate 7 of the mounting table 12, the movement of the mounting table 12 itself, that is, the rotation of the Y sub motor is corrected in consideration of the amount of movement of the Y table 17. . Alternatively, the movement of the heads 38 and 39 may be corrected in the Y direction as described above.

Next, each of the mounting heads 38 and 39 supplies the next component to the component supply unit 1 for supplying the component.
Although it moves to the supply position of No. 4, since the movement distance is the same, it is possible to take out at the same time.

In this way, the same operation proceeds on both sides of the conveyors 8 and 9, and the component mounting on the two boards is completed at the same time.

Next, as shown in FIG.
The substrate 7 is delivered to the conveyor 9 from the
As a result, the substrate 7 is discharged and transported to a downstream device.

Next, the Y table 17 moves, and the substrate is transferred from the placing table 12 to the conveyor 9 in the state shown in FIG. 5, and the substrate 9 is discharged and conveyed to the downstream device by the conveyor 9.

Thus, the substrates 7 are processed two by two. In addition, the arrangement of the nozzle stocker 51 is also the conveyors 8, 9
If it is arranged symmetrically with respect to the conveyor on both sides of
The nozzle replacement can be performed at the same time and at the same time.

Next, when the type of the substrate 7 is changed and becomes a size that cannot be placed on the mounting tables 11 and 12 alone, the movable chutes 30 and 32 are moved as shown in FIG. It is spread (in each of the mounting tables 11 and 12, the direction approaches the fixed chutes 29 and 31 respectively, and closes).

Next, when the production operation is started, the board 7 is delivered from the conveyor 8 as shown in FIG. 6, and as shown in FIG. Then, components are taken out from the component supply units 4 and 5 and mounted on the substrate 7. At this time, as in the case where components are mounted on the two substrates 7, the positions at which the heads 38 and 39 move in the Y direction are fixed, and the mounting operation is performed so as not to interfere with each other while moving the Y table 17. Alternatively, the components may be mounted on the board 7 alternately by the heads 38 and 39.

In the present embodiment, the mounting heads 38 and 39 are also moved in the Y direction. However, the heads 38 and 39 are moved only in the X direction without moving in the Y direction, and the mounting position is changed to the component supply unit. In the case where a space is provided between 2 and 3, when the width of the substrate 7 changes,
The components of the present embodiment are moved by moving the first and the second relative to each other or by moving the two pairs of chutes relative to each other so that the heads 38 and 39 face the center of the substrate 7 on both sides, respectively. Can be mounted simultaneously.

In this embodiment, the substrate supporting device is
Although described in the example of the electronic component mounting device, the present invention can be applied to, for example, a substrate supporting device employed in an adhesive coating device.

[0042]

As described above, according to the present invention, a board can be introduced into both mounting tables and components can be mounted at the same time, and the components can be mounted efficiently. In addition, if the same component mounting program is used, it is possible to mount components while keeping the position of the mounting head for mounting components constant and the distance that both mounting heads move from the component supply unit, and worry about interference between heads. Disappears.

Further, if the mounting head is moved in a direction orthogonal to the board transfer direction, it is not necessary to make a space for the board to move in a part of the component supply section in the board transfer direction.

Since one of the two mounting tables is moved relative to the other mounting table in a direction orthogonal to the substrate transport direction, the mounting head does not need to be moved in the direction orthogonal to the substrate transport direction. Different fine adjustments can be made for each substrate.

[Brief description of the drawings]

FIG. 1 is a side view showing an electronic component mounting apparatus.

FIG. 2 is a plan view showing the electronic component mounting device.

FIG. 3 is a plan view showing a case where the board mounting table supports a large printed board and a case where it supports a small printed board.

FIG. 4 is a plan view showing the electronic component mounting apparatus.

FIG. 5 is a plan view showing the electronic component mounting apparatus.

FIG. 6 is a plan view showing the electronic component mounting apparatus.

FIG. 7 is a side view showing the electronic component mounting device.

[Explanation of symbols]

 2 Component supply unit 3 Component supply unit 4 Component supply unit 5 Component supply unit 7 Printed circuit board 8 Transport conveyor 9 Transport conveyor 11 Board placement table 12 Board placement table 14 Component supply unit 17 Y table (table moving means) 20 Y main Motor (table moving means) 21 screw shaft (table moving means) 25 Y sub motor (auxiliary table moving means) 26 screw shaft (auxiliary table moving means) 38 mounting head 39 mounting head

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kenichi Morita 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. F-term (reference) 5E313 AA11 DD12 EE02 EE22 FF12 FF24

Claims (3)

[Claims] 1. An electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board, wherein the mounting head is provided on both sides of the transfer conveyor and the mounting head. A component supply unit for supplying an electronic component to be taken out is provided on both sides of the component conveyor and the component supply unit disposed in the substrate transport direction of the transport conveyor, and is in the same direction as the substrate transport direction of the transport conveyor. The mounting head that moves in the direction perpendicular to the substrate transport direction, a mounting table for mounting the printed circuit boards transported by the transport conveyor, and the mounting table And a table moving means for moving in a direction orthogonal to the substrate transport direction. 2. The apparatus according to claim 1, wherein the mounting head is movable in a direction orthogonal to the substrate transport direction.
An electronic component mounting device according to claim 1. 3. An auxiliary table moving means for moving one of the two mounting tables with respect to another mounting table in a direction orthogonal to the substrate transport direction. Or the electronic component automatic mounting apparatus according to 2.