JP2000340635A - Substrate carrying means and mechanism, and pattern exposure system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make possible independently of the thickness of a substrate and without deforming the substrate the sucking and supporting of the substrate by an abutting pad of a sucking portion provided in a handler, by so protruding its substrate sucking and supporting portion from its horizontal rear surfaces when sucking the substrate as to constitute it as a substrate supporting and carrying means. SOLUTION: An abutting pad 3 of a sucking portion 2 provided in a handler comprises an annular body portion 3b and an annular sucking and supporting portion 3a, and the sucking and supporting portion 3a forms a sucking space 3d in the opposite position to the surface of a substrate. A plurality of sucking holes 3c are formed every predetermined interval along the circumferential direction of the body portion 3b to form the openings of the sucking holes 3c on the side of the sucking space 3d. Further, in the case wherein the sucking and supporting portion 3a sucks and supports the substrate, when it is inserted into a groove portion 2b, it is so protruded from horizontal rear surface 2a, 2c as to constitute it as a substrate supporting and carrying means. As a result, independently of the thickness of the substrate, a substrate carrying means scan such and support the substrate without deforming the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer means for a substrate formed by exposing a predetermined pattern such as a printed wiring board or a liquid crystal substrate, a transfer mechanism for the substrate, and an exposure apparatus. TECHNICAL FIELD The present invention relates to a transfer unit, a transfer mechanism, and an exposure apparatus capable of performing reliable and quick transfer without being affected by the above.

[0002]

2. Description of the Related Art Conventionally, when a predetermined pattern is formed on a substrate such as a printed wiring board or a liquid crystal substrate by exposing the substrate, the substrate is transferred to each work position by a transfer means, and alignment work and exposure work are performed at each work position. (Same position or different position). As shown in FIGS. 7 (a) and 7 (d), the configuration of the transporting means 50 includes a moving rail 51 disposed along each working position (the loading position 60, the alignment position and the exposure position 65, and the unloading position 70). , This moving rail 51
, A plurality of suction pads 53 supported by the moving skeleton 52, and an elevating mechanism 54 for moving the moving skeleton 52 up and down. In addition, the suction pad 53 is formed in a cup shape that diverges downwardly by rubber or the like that is an elastic member.

Therefore, when the transfer device 50 is operated to transfer the substrate W by the exposure apparatus, the following operation is performed. As shown in FIGS. 7A and 7D, the carry-in position 60
When the substrate W is carried into the feed roller 61, the carry-in position 6
The movable frame 52 that has been waiting above the moving pad 52 moves down through the elevating mechanism 54 to contact the suction pad 53 with the substrate W and perform a vacuum suction operation.
Is held by suction.

Then, the moving frame 5 is moved via the lifting mechanism 54.
2 is moved up, and the moving frame 52 is moved above the alignment exposure position 65 along the moving rail 51. Further, the moving body 52 holding the substrate W is lowered via the elevating mechanism 54, the substrate W is placed on the alignment table, and the vacuum suction operation of the suction pad 53 is stopped to transfer the substrate W. The moving frame 52 that has delivered the substrate W rises via the elevating mechanism 54 and moves to the carry-in position 60 again.

The substrate W transported to the alignment exposure position 65 is
An aligning operation is performed by the aligning mechanism 68, and an exposure operation is performed by irradiating light beams including ultraviolet rays from the light source devices 66 and 67. And when the exposure work is completed,
The moving frame 52 arranged on the unloading side moves and descends via the elevating mechanism 54, and the substrate W is moved by the suction pad 53.
, And rises again via the elevating mechanism 54 to move to the carry-out position 70. Then, an operation of lowering via the elevating mechanism 54 and placing the substrate W on the unloading roller 71 at the unloading position 70 is performed. In this way, the transfer work is always performed by either receiving or transferring the substrate W at the work position by moving the moving frame 52 horizontally and vertically.

[0006]

However, the following problems exist in the conventional substrate transfer means and transfer mechanism and the exposure apparatus using the same. That is, in the conventional substrate transporting means, the structure of the suction pad for sucking the substrate is formed in a cup shape (see FIG. 7B) which is divergent with an elastic member such as rubber. In the case of, the substrate is deformed by the vacuum attraction force when the substrate is sucked (see FIG. 7C).

Further, in order to prevent the deformation of the substrate, there has been proposed a configuration in which the number of suction pads is increased to hold the substrate by suction. However, simply increasing the number of suction pads makes the substrate even. Therefore, it is difficult to adsorb the substrate, and on the contrary, the force of adsorbing and holding the substrate is reduced.

Further, when the substrate is deformed, it is necessary to predict the amount of deformation of the substrate in advance, and to increase the distance by which the movable frame and the suction pad are moved up and down, which requires extra time for transporting the substrate. Was.

[0009] Since the transfer means receives or transfers (transfers) the substrate by moving up and down, when the transfer means moves up and down while holding the substrate, the resistance of air to the substrate is large and the substrate falls. Was causing it.

In the case where the transfer means or the transfer mechanism having the above-described structure is used in the exposure apparatus, the substrate can drop from the transfer means particularly when the substrate is transferred at the position of the carry-in mechanism and the position of the alignment mechanism. This is inconvenient because if the substrate drops, it is necessary to stop and adjust a series of operations of the exposure apparatus. Further, in the case of a transport mechanism in which the moving frame and the suction pad move up and down to transfer the substrate from the working position, it is necessary to take a long distance to move the substrate up and down in consideration of the deformation of the substrate in advance. In both cases, it takes time to move the substrate, which is inconvenient as an exposure apparatus. In particular, when the substrate is a thin plate, when the substrate is lifted, the edge of the substrate hangs down due to the resistance of air, which hinders the next operation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can suction-hold a substrate without being deformed irrespective of the thickness of the substrate. It is an object of the present invention to provide a transporting unit, a transporting mechanism, and an exposure apparatus which can prevent the falling of the image.

[0012]

In order to solve the above-mentioned problems, the present invention relates to a conveying means comprising a moving rail for transferring a substrate formed by exposing a predetermined pattern to each work position and a handler, wherein the moving rail is provided. Is disposed above each of the working positions and over the respective working positions, and the handler is provided with a moving skeleton moving along a moving rail, a holding plate provided on the moving skeleton, and a mounting plate mounted on the holding plate. A suction portion, wherein the suction portion includes a groove formed on a horizontal lower surface, and a contact pad attached to the groove, and the contact pad is spaced apart along the axial direction. A body portion having a suction hole formed therein; and a suction support portion provided continuously with the body portion and having a suction space in which an opening of the suction hole is formed, and when the substrate is suctioned, the suction support portion is provided. But it configured as conveying means for supporting the substrate projects from the horizontal lower surface.

With this configuration, the substrate can be sucked and held by the suction force dispersed in the suction hole of the contact pad and equalized in the suction space. Therefore, even if the substrate is a thin plate, the substrate can be suction-held and transported without being deformed.

Further, the suction support portion is formed in an annular shape, and a convex portion is provided on the inner peripheral side from the suction support portion at a position on the horizontal lower surface of the suction portion. Is formed so as to protrude to a position where the substrate comes into contact with the substrate when the substrate is sucked.

[0015] With this configuration, in particular, when the substrate is a thin plate, the depression-like deformation of the substrate on the inner peripheral side of the suction support portion can be prevented.

Further, the transfer means may be provided with a buffer for reducing a shock in transferring the substrate at at least one position between the moving frame and the holding plate and between the holding plate and the suction portion. good. With this configuration, it is possible to minimize damage to the substrate when the substrate is transferred and received (transferred).

Further, the transport means according to any one of claims 1 to 3 for transporting a substrate formed by exposing a predetermined pattern to each work position, and transferring the substrate to the transport means. Alternatively, the transfer mechanism includes a transfer unit that performs at least one of receiving, wherein the transfer unit is disposed at each of the work positions, and a mounting plate on which the substrate is mounted, and a lifting / lowering unit that moves the mounting plate up and down. And a transfer mechanism.

With this configuration, the substrate mounted on the mounting plate is raised via the elevating portion of the transfer means, transferred to the suction portion of the handler, and the handler is moved along the moving rail to the next work position. , And raises the mounting plate via the elevating part of the transfer means arranged at the next work position, receives the substrate held by the handler onto the mounting plate, and lowers it to perform the next work on the substrate . Therefore, the transporting means can move the substrate in the horizontal direction, and can lift and lower the substrate by the elevating unit while the substrate is placed on the mounting plate arranged at each work position, thereby transporting the substrate. It does not fall when giving and receiving. In addition, it is possible to improve the substrate transfer speed.

Further, the placing plate has a structure in which a separating means is formed on the placing surface on which the substrate is placed to release the close contact between the substrate and the placing surface due to reduced pressure when the substrate is separated. And Therefore, when the substrate is transferred to and from the transfer means, the substrate is reliably received.

Also, a loading mechanism for loading the substrate, an alignment mechanism for positioning the substrate, a light source mechanism for exposing the substrate, a loading mechanism for unloading the substrate, and a transport mechanism for transporting the substrate to each mechanism. In an exposure apparatus including a mechanism along a transport path of the substrate, the transport mechanism is configured as an exposure apparatus having the configuration described in claim 4 or 5.

With this configuration, when the substrate is transported to each mechanism of the exposure apparatus, it is possible to prevent the substrate from dropping and to stop a series of operations performed in the exposure apparatus. Can be. In addition, the transfer unit moves the substrate in the horizontal direction, and transfers the substrate by moving the mounting plate arranged in each mechanism up and down, so that the substrate is not deformed during transfer and the transfer speed of the substrate is improved. Thus, the number of substrates to be processed by the exposure apparatus can be improved.

[0022]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a conveying means,
2 (a), 2 (b) and 2 (c) are longitudinal sections of the buffer section and the suction section of the conveying means, a bottom view of the suction section, and FIGS. 3 (a) and 3 (b) show application examples of the suction section. FIG. 4 is a schematic view showing the entire transport mechanism, FIG. 5 is a schematic view showing the entire exposure apparatus, and FIGS. 6 (a), (b), (c) and (d) are transport mechanisms. FIG. 14 is a perspective view showing an application example of the mounting plate of FIG.

As shown in FIG. 1, the transport means 1 comprises a moving rail 7 arranged in a horizontal direction and a handler 8 moving along the moving rail 7. The handler 8 includes a moving frame 6, a buffer 5 provided at the center of the moving frame 6, a holding plate 4 supported by the buffer 5,
And a plurality of (four in the drawing) suction portions 2 supported by the holding plate 4.

As shown in FIG. 1, the moving rail 7 is composed of a cylinder rail 7a and a driven rail 7b arranged in parallel on the left and right. The moving frame 6 that moves along the moving rail 7 includes a moving body 6a that is bridged between the left and right cylinder rails 7a and the driven rails 7b, and a cylinder rail 7a provided at one end of the moving body 6a. It has a driving unit 6a that moves in the inside, and a sliding unit 6b that is provided at the other end of the moving main body 6a and moves by being guided by a driven rail 7b.

As shown in FIG. 2A, a plurality of buffer portions 5 connecting the moving frame 6 and the holding plate 4 are provided over the moving body 6a and the holding plate body 4b of the holding plate 4 (see FIG. 2A). (4 places in FIG. 3) and a coil spring 5b as an elastic member provided in parallel with the cylinder 5a. The holding plate 4 includes a holding plate main body 4b and the holding plate main body 4b.
b. The mounting plates 4a, 4a are movably engaged in the longitudinal direction of FIG. Adjustment slots are also formed in the longitudinal direction of the mounting plates 4a, 4a so that the suction section 2 can be freely arranged.

As shown in FIGS. 2 (b) and 2 (c), the suction portion 2 has an annular groove 2b which is a groove on the horizontal lower surface, and the contact pad 3 is attached to the groove 2b. I have. The suction section 2 is formed of a hard member such as metal or plastic, and the contact pad 3 is formed of an elastic member such as rubber or synthetic rubber.

The contact pad 3 comprises an annular body 3b inserted into the groove 2b, and an annular suction support 3a formed by constricting the distal end of the body 3b. . The suction support 3a has a suction space 3c at a position facing the substrate surface.
Then, a plurality of suction holes 3c (six places including those omitted in the drawing) are formed at predetermined intervals along the circumferential direction (axial direction) of the body portion 3b, and the openings of the suction holes 3a are sucked. It is formed on the space 3d side. Further, when holding the substrate W by suction, the suction support portion 3a is formed so as to protrude from the horizontal lower surfaces 2a and 2c (in consideration of the thickness and the protruding position) even if it enters the groove portion 2b. Have been.

Therefore, when the substrate W is sucked and held by the suction unit 2, the suction support unit 3a is less deformed during the suction operation, and the suction openings 3c are formed at predetermined intervals along the circumferential direction. Since the air in the space surrounded by the suction space 3d and the substrate W is evenly sucked, the suction operation is not concentrated, and the substrate can be surely sucked and held in a flat state. Further, since the horizontal lower surfaces 2a and 2c guide the substrate W, deformation such as dripping when the substrate W is sucked is prevented, and the horizontal state is maintained. Note that the connection hose, the on-off valve, and the vacuum suction mechanism such as the vacuum pump used for holding the substrate W by suction can be any known one, and thus are omitted here.

Further, as an application example of the suction unit 2 shown in FIG. 2, the suction unit 2A will be described with reference to FIGS. The same components as those of the suction unit 2 are denoted by the same reference numerals, and description thereof will be omitted.
As shown in FIGS. 3A and 3B, the suction portion 2A has a convex surface portion 2e at the position of the horizontal lower surface 2a. When the suction support 3a sucks the substrate W, the convex surface 2e
The substrate W is configured to be in contact with and guided by the substrate W. Since the convex portion 2e serves as a guide when the substrate W is sucked, the depression of the substrate W can be prevented, particularly when the substrate W is thin.

When the substrate W is thin, the suction support 3a
When a dent-like deformation of the substrate W occurs on the inner peripheral side of the substrate W, the dent-like deformation is caused by providing a mounting surface on which the substrate W is mounted (in particular, providing a substrate separating means such as a glass plate or a mask). It serves as a pad for adsorbing the mounting surface that cannot be used. Therefore, the configuration of the convex portion 2e is not particularly limited as long as the convex portion 2e has a height and an area that do not cause the dent-like deformation of the substrate W. For example, the convex portion 2e may be formed by laminating a single-sided adhesive tape on the horizontal lower surface 2a shown in FIG. 2B.

Next, the transfer means 12 of the transport mechanism 29 will be described with reference to FIG. Note that the transport unit 1 has the same configuration as that described above, and a description thereof will be omitted. An operation of moving the substrate W up and down and transferring it to the handler 8 that moves in the horizontal direction, an operation of moving the substrate W held by the handler 8 up and down and receiving the same, and a transfer operation of both operations. The transmitting and receiving means 12 and 22 to be performed include: mounting plates 10 and 28 on which the substrate W is mounted;
The lifting section 14 and the lifting section 25 move up and down.

The placement plate 10 places the substrate W thereon and, when transferring the substrate W to the moving frame 1, increases the degree of adhesion between the substrate surface and the placement plate surface, thereby increasing the placement. In order to avoid a situation where it is difficult to transfer the substrate W from the plate 10, a plurality of through holes 13 are formed as separating means. And
The lifting unit 14 supports the lower end of the mounting plate 10
A moving plate 15 provided at the lower end of the support leg 11, a moving block 17 attached to the moving plate 15, a feed screw 16 for moving the moving block 17 up and down, And a drive motor 18 for rotating the motor through the motor.

As shown in FIG.
The structure of the substrate W may be changed depending on the work content of the substrate W. For example, the elevating unit 25 moves the support legs 27, 27 provided below both sides of the mounting plate 28 and the support legs 27, 27. Feed screw 2 to move up and down via block 26
4, 24, and drive motors 23, 23 for rotating the feed screws 24, 24. The mounting plate 28
Are formed in a square annular frame. Since the work of irradiating light from below the substrate W is performed at the position of the mounting plate 28, the elevating unit cannot be arranged directly below the mounting plate 28.

Next, the operation of the transport mechanism 29 for transporting the substrate W will be described. As shown in FIG. 4, a substrate W formed by exposing a predetermined pattern is processed at each work position, and is sucked and held by the suction unit 2 of the handler 8 which moves in the horizontal direction between the work positions. It is transported along the rail 7. Then, the substrate W is placed on the suction section 2 of the handler 8.
Is carried out or the substrates W are received, the mounting plates 10 and 28 at the respective working positions are moved up and down by the elevating units 14 and 25.

Therefore, when the substrate W is to be moved in the vertical direction when the substrate W is transported to each work position, the substrate W is placed on the mounting plates 10 and 28, so that the substrate W is prevented from dropping. can do. Further, the handler 8 performs an operation of moving the substrate W in the horizontal direction and does not move up and down.
The transfer of the substrate W can be performed quickly.

Next, the exposure apparatus E will be described with reference to FIG. Note that the transport mechanism 29 including the transport unit 1 and the transfer units 12 and 22 has the same configuration, and a description thereof will be omitted. The exposure apparatus E includes a loading mechanism A for the substrate W, an alignment mechanism B for the substrate W, a light source mechanism C for the substrate W,
The transport mechanism 29 includes a transport mechanism D for unloading the substrate W and a transport mechanism 29 for transporting the substrate to the working position of each of the mechanisms A, B and D.

The loading mechanism A includes a feed roller 13a for receiving the substrate W, a mounting plate 10 having a through hole 13 from which the upper end of the feed roller 13a can protrude, and an elevating unit 14 for raising and lowering the mounting plate 10. 12 and a preliminary positioning mechanism 9 movably provided between the feed rollers 13a.
And

The aligning mechanism B includes a positioning mechanism 21A for aligning a mask (not shown) provided on the fixed reference firing frame 21 and a mounting plate that can freely contact and separate from the reference firing frame 21. A mask (not shown) provided on the underfire frame 28,
It comprises a CCD camera 37 for imaging an alignment state (positioning mark) of a mask (not shown) of the reference upper frame 21. The transfer means in the aligning mechanism B includes a lower firing frame 28 as a mounting plate, and an elevating unit 25 that moves the lower firing frame 28 up and down. In addition, the burning frame mechanism 20 includes a reference upper burning frame 21 and a lower burning frame 28.

The light source mechanism C includes an ultraviolet irradiation lamp 31 and
An elliptical reflecting mirror 32 for condensing and reflecting the light beam from the ultraviolet irradiation lamp 31; and a flat plate reflecting mirror 33 for reflecting the light beam from the ultraviolet irradiation lamp 31 and the elliptical reflecting mirror 32.
A fly-eye lens 34 for adjusting the illuminance distribution of the light beam from the flat-plate reflecting mirror 34 and transmitting the light beam; and a flat-plate reflecting mirror 35 for reflecting the light beam from the fly-eye lens 34
And a reflecting mirror 36 that reflects the light from the flat plate reflecting mirror 35 as parallel light toward the reference upper grilling frame 21 (lower grilling frame 28). The light source mechanism C shown in this example is
Since this is a type in which both surfaces of the substrate W are exposed at the same time, the components (the ultraviolet irradiation lamps 31 to the reflecting mirror 36) are arranged symmetrically above and below.

The unloading mechanism D includes a mounting plate 1 for receiving the substrate W.
0, and a transfer unit 12 including a lifting unit 14 for lifting and lowering the mounting plate 10. In addition, the conveying means 1
Of the moving rail 7 between the loading mechanism A and the aligning mechanism B, and
The handler 8 is disposed between the alignment mechanism B and the unloading mechanism D, and the handler 8 is provided on each of the moving rails 7 so that each of the mechanisms A to D is operated according to the work situation. In particular, when the substrate W is a thin plate, it is convenient to adopt the configuration of the suction unit 2A having the configuration shown in FIG.

Next, the operation of the exposure apparatus E will be described with reference to FIG. The mounting plate 10 is initially lowered to a position where the upper end of the feed roller 13a projects, and when the substrate W is loaded onto the feed roller 13a, the feed roller 13a
a rotates to feed the substrate W to a predetermined position of the feed roller 13a and stop. Then, the mounting plate 10 is moved by the feed roller 13a.
And rises via the elevating unit 14 so as to receive the substrate W from. The pre-positioning mechanism 9 pushes the end surface of the substrate W of the mounting plate 10 at the position of the mounting plate 10 which has been raised, and the pre-positioning operation is performed.

When the preliminary positioning operation is completed, the mounting plate 1
0 further moves up and down via the elevating unit 14 to transfer the substrate W to the handler 8. At this time, an impact is generated due to the contact of the substrate W with the handler 8, but the shock to the substrate W can be minimized by the buffer unit 5 (see FIG. 2) provided in the handler 8. In the following, when transferring and receiving (transferring) the substrate W, the buffer unit 5 (FIG.
) Makes it possible to reduce the impact.

The handler 8 having received the substrate W moves in the horizontal direction along the moving rail 7 and moves up to the upper part of the lower frame 28 of the alignment mechanism B. When the handler 8 stops, the lower firing frame 28 rises by the elevating unit 25, receives the substrate W from the handler 8, and descends. Then, when the handler 8 moves to the loading mechanism A side, the lower sintering frame 28 rises again via the elevating unit 25, contacts the reference upper sintering frame 21 side, and via the vacuum suction mechanism (not shown). The two firing frames 21 and 28 are brought into close vacuum contact.

Further, the alignment state of the mask (not shown) is imaged by the CCD camera 37, and if the alignment state is outside the allowable alignment range, the vacuum contact state is released and the lower grilling frame 28 is lowered, and the reference upper grilling frame 21 is lowered. The position of a mask (not shown) is aligned in the X, Y, and θ directions using the positioning mechanism 21A. Again, the lower firing frame 28 is raised, the two firing frames 21 and 28 are brought into vacuum contact with each other, the alignment state is checked by the CCD camera 37, and if the alignment is within the allowable alignment range, the ultraviolet irradiation lamp 31 of the light source mechanism C is used.
Irradiates a light beam including ultraviolet rays from each of the reflecting mirrors 32, 33,
Substrate W via 35, 36 and fly-eye lens 34
Exposure is performed via a mask (not shown) on the front and back of the device.

During the exposure operation, the carry-in mechanism A has already performed the preliminary positioning operation for the next substrate W. Then, when the exposure operation is completed, both the burning frames 21 and
8, release the vacuum contact state, lower the lower grilling frame 28,
The handler 8 on the carry-out side is moved to arrive above the lower firing frame 28. Then, the lower printing frame 28 is raised to transfer the substrate W to the handler 8, and the lower printing frame 28 is lowered. Substrate W
Is transferred to the upper part of the unloading mechanism D along the moving rail 7. Further, the mounting plate 10 of the transfer unit 12 is lifted by the elevating unit 14 to move the substrate W to the mounting plate 10.
Receive on top. When the exposed substrate W is transported,
The next substrate W is transported by the handler 8, and a series of operations are continuously performed.

Separating means for preventing close contact with the substrate W is provided on the mounting plates 10 and 28 used in the transport mechanism 29 and the exposure apparatus E, but they are constructed as shown in FIG. Is also good. That is, as shown in FIG. 6A, the mounting plate 10A has an uneven surface 10a on the mounting surface of the substrate W. Therefore, the contact area between the substrate W and the mounting plate 10A is reduced, and the close contact can be prevented. The uneven surface 10a does not need to be provided on the entire surface and may be partial.

As shown in FIG. 6B, the mounting plate 10
The close contact with the substrate W may be prevented by forming the long concave groove 10b on the surface of B. Although not shown, the same result can be obtained by forming a long convex portion on the mounting plate. The long convex portion can be formed by attaching a single-sided adhesive tape.

Further, as shown in FIG. 6C, by providing a plurality of through-holes 10c in the mounting plate 10C, the close contact with the substrate W can be prevented. In addition, as shown in FIG. 6D, even if a through hole 10d is formed in the mounting plate 10D and air is discharged from the pump 10e to the through hole 10d, the close contact with the substrate W can be prevented. .

The groove formed on the horizontal lower surface of the suction portion used in each of the above-described embodiments is formed in an annular shape. However, the groove may be formed in a square shape, or the annular shape or the square shape may be used. The groove may be formed in a state of being divided into two or more. Further, the contact pad may be formed in a square ring shape corresponding to the groove portion, or may be in a state of the contact pad corresponding to the divided groove portion. Then, the suction holes formed in communication with the suction space of the suction support portion of the contact pad may be formed at two or more locations, and preferably, if arranged evenly, a suction force for sucking the substrate in the suction space. Is even and convenient.

The elevating portion of the transfer means may be a cylinder mechanism or another configuration, and is not limited as long as the mounting plate can be raised and lowered. Further, in the exposure apparatus, the alignment work position and the exposure work position are illustrated as the same position, but may be in different positions. The exposure type may be one-sided exposure, two-sided exposure, parallel light exposure, or scattered light exposure. Further, when performing the alignment work and the exposure work, the arrangement of the mask and the substrate may be in a horizontal state, a vertical state, or an inclined state. The configuration of the substrate may be a single-wafer type or a roll-to-roll type.

[0051]

The present invention having the above-described structure exhibits the following excellent effects. Since the transfer means suction-holds the substrate by a linear groove-shaped suction support portion having a concave suction space with respect to the contact surface of the substrate, the suction force is uniform with respect to the contact surface of the substrate. Since the suction operation can be performed and the substrate is held in a state in which the suction support portion protrudes from the horizontal lower surface of the contact portion, even if the substrate is a thin plate, it can be appropriately held without being deformed. Further, since the transporting unit includes the buffer unit, it is possible to minimize the impact on the substrate when transferring the substrate. Furthermore, when the substrate is a thin plate,
By providing the convex surface portion on the inner peripheral side of the suction support portion, it is possible to reliably prevent the substrate from being deformed in a concave shape.

The transfer mechanism transfers the substrate from the work position to the transfer means, and the transfer means moves up and down with the substrate placed on the mounting plate to perform at least one of transfer and reception. In the movement between them, the handler is moving in the horizontal direction while holding the substrate by suction. for that reason,
It does not drop when transferring the substrate. In addition, it is possible to improve the substrate transfer speed. In addition, since the mounting plate is provided with a separating means for preventing close contact with the substrate,
There is no possibility that the substrate cannot be delivered in close contact with the mounting plate.

The exposure apparatus has a configuration in which, when a substrate is transported to each mechanism, the handler moves in the horizontal direction, and a transfer unit that places the substrate on the mounting plate and transfers it after processing the substrate by each mechanism is moved up and down. And Therefore, the transfer speed of the substrate can be improved, and since there is no cause for dropping the substrate, the processing capability of the exposure apparatus can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a conveying means of the present invention.

2 (a), 2 (b) and 2 (c) are buffer sections of a transport means,
It is a longitudinal section of a suction part, and a bottom view of a suction part.

FIGS. 3A and 3B are a cross-sectional view and a bottom view of a suction unit showing an application example of the conveying means of the present invention.

FIG. 4 is a schematic view showing the entire transfer mechanism of the present invention.

FIG. 5 is a schematic diagram showing the entire exposure apparatus of the present invention.

FIGS. 6 (a), (b), (c), and (d) are perspective views showing an application example of a mounting plate of a transport mechanism.

FIG. 7A is a front view showing a conventional transport unit,
(B), (c) is a schematic diagram showing a state of a suction pad of a conventional transport unit, and (d) is a schematic diagram showing an exposure apparatus using a conventional transport mechanism.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conveying means 2 Suction part 2a Horizontal lower surface 2b Groove part 2c Horizontal lower surface 3 Contact pad 3a Suction support part 3b Body part 3c Suction hole 3d Suction space 4 Holding plate 5 Buffer part 6 Moving frame 7 Moving rail 8 Handler 9 Pre-positioning mechanism 10 Placement plate 11 Support leg 12 Transfer unit 13 Through hole 14 Elevating unit 15 Moving plate 16 Feed screw 17 Moving block 18 Drive motor 19 Transmission belt 20 Burning frame mechanism 21 Reference top firing frame 21A Positioning mechanism 22 Transfer unit 23 Drive motor 24 Feed screw 25 Elevating unit 26 Moving block 27 Support leg 28 Baking frame (mounting plate) 29 Transport mechanism A Loading mechanism B Alignment mechanism C Light source mechanism D Unloading mechanism E Exposure device W Substrate

Claims (6)

[Claims] 1. A transfer means comprising a moving rail and a handler for transferring a substrate formed by exposing a predetermined pattern to each working position, wherein the moving rail extends over each of the working positions above each of the working positions. Disposed, the handler includes a moving frame moving along a moving rail, a holding plate provided on the moving frame, and a suction unit attached to the holding plate, and the suction unit is disposed on a horizontal lower surface. A groove formed and a contact pad attached to the groove, the contact pad being continuous with the body having a suction hole formed at intervals along the axial direction. And a suction support portion having a suction space in which the opening of the suction hole is formed. When the substrate is sucked, the suction support portion projects from the horizontal lower surface and supports the substrate. Conveying means, characterized in that. 2. The suction support portion is formed in an annular shape, and a convex portion is provided on the inner peripheral side from the suction support portion at a position on a horizontal lower surface of the suction portion, wherein the suction support portion is a substrate. When adsorbing
2. The transport means according to claim 1, wherein the transport means is formed so as to protrude to a position where it comes into contact with the substrate. 3. A buffer for reducing a shock in transferring the substrate is provided between at least one of the moving frame and the holding plate and between the holding plate and the suction unit. The transporting means according to claim 1. 4. The method according to claim 1, wherein the substrate formed by exposing a predetermined pattern is transported to each work position.
A transfer mechanism comprising: the transfer unit according to any one of the above, and a transfer unit that performs at least one of delivery and reception of the substrate to the transfer unit, wherein the transfer unit is disposed at each of the work positions. A transfer plate, comprising: a mounting plate on which the substrate is mounted; and an elevating unit that moves the mounting plate up and down. 5. The mounting plate according to claim 1, wherein a separating means is formed on the mounting surface on which the substrate is mounted, for releasing the close contact between the substrate and the mounting surface under reduced pressure when the substrate is separated. The transport mechanism according to claim 4, wherein: 6. A loading mechanism for loading a substrate, an alignment mechanism for positioning the substrate, a light source mechanism for exposing the substrate, a loading mechanism for unloading the substrate, and a transport for transporting the substrate to each mechanism. An exposure apparatus comprising a mechanism along a substrate transport path, wherein the transport mechanism has a configuration according to claim 4 or 5.