JP2000232149A - Placing and positioning mechanism for semiconductor wafer container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a placing and positioning mechanism which can improve the placing and positioning accuracy of a semiconductor wafer container over a long period. SOLUTION: A placing and positioning mechanism is provided with grooves 2 for positioning a semiconductor wafer container 1 is on the bottom face of a semiconductor wafer container 1, rotary bodies 3A which come into contact with the internal surfaces of the grooves 2, and supports 3B which rotatably support the rotary bodies 3A. The rotary bodies 3A quickly rotated upon coming into contact with the internal surfaces of the grooves 2 and can guide the container 1 to an accurate alignment position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting and positioning mechanism for a semiconductor wafer storage container, and more particularly to a mounting and positioning mechanism capable of positioning a semiconductor wafer storage container with high accuracy for a long period of time.

[0002]

2. Description of the Related Art A positioning mechanism is provided for accurately placing a semiconductor wafer container on a loader or unloader of a semiconductor wafer processing apparatus such as a CVD apparatus, a sputtering apparatus, an exposure apparatus, an etching apparatus, and a cleaning apparatus. I have. FIG. 9 is a schematic configuration diagram of a mounting / positioning mechanism of a semiconductor wafer storage container according to the related art. As shown in FIG. 9, the mounting positioning mechanism is provided at an inverted V-shaped positioning groove 11 provided on the bottom surface of the semiconductor wafer container 10 and at a mounting position of a loader or unloader. It is constructed with the positioning pins 12. Although not shown, the semiconductor wafer storage container 10
A plurality of unprocessed semiconductor wafers transported to the semiconductor wafer processing apparatus or a plurality of processed semiconductor wafers transported from the semiconductor wafer processing apparatus are accommodated in the inside.

FIGS. 10 (A) to 10 (C) are work process diagrams showing step by step the positioning operation procedure in the mounting and positioning mechanism. First, as shown in FIG. 10A, the semiconductor wafer container 1 is placed on the positioning pins 12 at the position where the loader or unloader of the semiconductor wafer processing apparatus is placed.
The semiconductor wafer storage container 10 is transported by a robot arm or an operator to a position corresponding to the zero positioning groove 11. At this point, rough positioning may be performed between the positioning pin 12 and the positioning groove 11.

Subsequently, as shown in FIG. 10B, the semiconductor wafer container 10 is lowered toward the positioning pins 12 so that the inclined inner wall of the positioning groove 11 and the tip of the positioning pins 12 contact each other. Touch Further, by lowering the semiconductor wafer storage container 10, it is guided by the positioning pins 12, and the inner wall of the positioning groove 11 slides at the tip of the positioning pins 12. FIG.
As shown in (C), when the center of the tip of the positioning pin 12 and the apex of the positioning groove 11 coincide with each other, the mounting position of the semiconductor wafer storage container 10 is determined, and the positioning operation can be completed.

[0005]

However, the following points have not been taken into consideration in the mounting and positioning mechanism of the semiconductor wafer container 10 described above. (1) As shown in FIGS. 10 (B) and 10 (C), contact and rubbing are repeatedly generated between the positioning groove 11 and the positioning pin 12 for each positioning operation. For this reason, there has been a problem in that the positioning groove 11 and the positioning pin 12 undergo a shape change due to wear over a long period of use, resulting in a decrease in positioning accuracy.

(2) Positioning groove 11 and positioning pin 1
Particles are generated due to contact or rubbing between them. For this reason, the amount of particles in the clean room is increased, and there is a problem in that the production yield is reduced.

(3) At the time of the contact shown in FIG. 10B, there is a possibility that an impact is applied to each of the positioning groove 11 and the positioning pin 12 depending on the descent speed of the semiconductor wafer container 10 and a defect in the alignment. In particular, when the transfer of the semiconductor wafer storage container 10 is performed manually by an operator, it is extremely difficult to make the transfer state constant, and there is a high possibility that an impact will be applied. When an impact is applied, the positioning groove 11 and the positioning pin 12 each have a change in shape or breakage, resulting in a problem that positioning accuracy is reduced.

(4) Further, the impact is applied to the entire semiconductor wafer storage container 10, and rubbing occurs between the inside of the semiconductor wafer storage container 10 and the semiconductor wafer stored therein, thereby generating particles. Therefore, there is a problem that the production yield is reduced.

The present invention has been made to solve the above problems. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a mounting and positioning mechanism capable of improving the mounting and positioning accuracy of a semiconductor wafer storage container over a long period of time. It is a further object of the present invention to provide a mounting and positioning mechanism capable of preventing generation of particles due to mounting and positioning of a semiconductor wafer storage container and improving a manufacturing yield. Further, an object of the present invention is to reduce the impact caused by the positioning of the semiconductor wafer storage container, to prevent the generation of particles inside the semiconductor wafer storage container, and to improve the manufacturing yield. It is an object of the present invention to provide a mounting positioning mechanism that can perform the positioning.

[0010]

In order to solve the above-mentioned problems, a first feature of the present invention is that a positioning groove on a bottom surface of a semiconductor wafer storage container and a positioning groove on the bottom surface of the semiconductor wafer storage container are provided. A rotatable rotator abutting on the inner wall of the positioning groove and a support for supporting the rotator are provided. The positioning groove on the bottom surface of the semiconductor wafer storage container has a wide opening that can easily perform rough positioning with the rotating body, and performs smooth and accurate positioning after rough positioning is performed. It is preferably formed in a V-shaped cross section having an inner wall guided by a rotating body. Preferably, the rotator is disposed at the top tip or side of the support. It is practical that one or a plurality of rotating bodies are rotatably supported on the support. The support is provided at a mounting position of a semiconductor wafer container of a loader or an unloader of a semiconductor wafer processing apparatus such as a CVD apparatus, a sputtering apparatus, an exposure apparatus, an etching apparatus, and a cleaning apparatus. In the semiconductor wafer container mounting / positioning mechanism configured as described above, when the rotating body comes into contact with the inner wall of the positioning groove on the bottom surface of the semiconductor wafer container, the rotating body quickly rotates, and the rotating body rotates. Accordingly, the semiconductor wafer storage container can be guided to a position for accurate positioning. Therefore, wear due to friction of the inner wall of the positioning groove at the time of positioning and change in the shape of the inner wall surface due to the wear can be reduced, so that highly accurate positioning can be performed over a long period of time.
Of course, since the rotating body contacts the inner wall of the positioning groove while rotating, there is almost no change in shape due to rubbing or abrasion of the rotating body itself. Furthermore, since the amount of particles generated due to the rubbing of the inner wall of the positioning groove can be reduced, an environment with a small amount of particles can be constructed, and the production yield can be improved.

According to a second feature of the present invention, in the mounting / positioning mechanism for a semiconductor wafer storage container, a positioning groove on the bottom surface of the semiconductor wafer storage container, a contact member abutting on the inner wall of the positioning groove, and An elastic body that supports and has elasticity in at least a vertical direction or at least a horizontal direction,
It is to have. A coil spring can be practically used for the elastic body. The coil spring has elasticity in the vertical and horizontal directions. In the semiconductor wafer storage container mounting / positioning mechanism configured as described above, when the contact body comes into contact with the inner wall of the positioning groove on the bottom surface of the semiconductor wafer storage container, the impact at this time can be absorbed by the elastic body. After the shock is absorbed, the semiconductor wafer container is guided by the contact body to a position for accurate positioning. Therefore, it is possible to reduce the shape change and damage due to the impact on the inner wall surface of the groove to be positioned and the shape change and damage of the contact body itself, so that highly accurate positioning can be performed for a long period of time. Furthermore, the impact between the inner wall of the groove to be positioned and the contact body is absorbed by the elastic body, thereby reducing the amount of particles generated due to friction between the inside of the semiconductor wafer storage container and the semiconductor wafer stored therein. Therefore, an environment with a small amount of particles can be constructed, and the production yield can be improved.

According to a third feature of the present invention, in the mounting / positioning mechanism for a semiconductor wafer storage container, a positioning groove on a bottom surface of the semiconductor wafer storage container, a rotatable rotating body abutting on the inner wall of the positioning groove, And an elastic body that supports the rotating body and has elasticity in at least the vertical direction or at least the horizontal direction. In the mounting and positioning mechanism of the semiconductor wafer container configured as described above,
The effects obtained by combining the effects obtained by the placing and positioning mechanism according to the first aspect of the present invention and the placing and positioning mechanism according to the second aspect of the present invention can be obtained.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) An embodiment of the present invention will be described below with reference to the drawings. FIG.
(A) is a schematic configuration diagram (a cross-sectional configuration diagram corresponding to a portion cut along the abcd cutting surface illustrated in FIG. 2) of the mounting and positioning mechanism of the semiconductor wafer storage container according to the first embodiment of the present invention;
FIG. 1B is an enlarged configuration diagram of a main part of the mounting and positioning mechanism, and FIG.
FIG. 3 is a perspective view of a semiconductor wafer storage container. First of the present invention
The mounting and positioning mechanism according to the first embodiment supports the positioning groove 2 on the bottom surface of the semiconductor wafer container 1, a rotatable rotator 3A abutting on the inner wall of the positioning groove 2, and supports the rotator 3A. And a supporting member 3B.

Although the internal configuration of the semiconductor wafer container 1 is omitted, a plurality of unprocessed semiconductor wafers to be supplied to the semiconductor wafer processing apparatus are processed by the processing apparatus supplied from the semiconductor wafer processing apparatus. A plurality of completed semiconductor wafers are stored. Although not limited to this number, in the first embodiment, the positioning groove 2 is
(A) and as shown in FIG. 2, the semiconductor wafer storage container 1
In three places on the bottom surface of the substrate, a total of three grooves 21, 22 and 23 are provided. The positioning groove 2 has a wide opening that can easily perform rough positioning with the rotating body 3A, and performs smooth and accurate positioning after rough positioning is performed.
It is formed in a V-shaped cross section having an inner wall guided by.
In the first embodiment, the positioning groove 2 is formed by a groove having a V-shaped cross section. Note that the positioning groove 2 may be formed by either a pyramidal hole or a conical hole.

The rotator 3A is rotatably mounted on an upper portion of the support 3B so as to rotate by contact with the inner wall of the groove 2 to be positioned. A roller,
Any of the balls can be used practically.

The support 3B is disposed at a mounting position 4 where accurate positioning of the semiconductor wafer container 1 is to be performed. The mounting position 4 is, for example, a semiconductor wafer processing apparatus, and more specifically, a semiconductor wafer storage container 1 of a loader or unloader of a semiconductor wafer processing apparatus such as a CVD apparatus, a sputtering apparatus, an exposure apparatus, an etching apparatus, and a cleaning apparatus. It is a position to do. The support 3B is formed in the shape of a pin in the first embodiment, and corresponds to the number of the positioning grooves 2 of the semiconductor wafer container 1 in the first embodiment. 3B2 and 3B3 are provided in total. The rotating body 3A includes three support bodies 3
B1, 3B2, 3B3, respectively, the rotating body 3A1,
3A2 and 3A3 are provided, and a total of three are provided.

FIGS. 3A to 3C show a first embodiment of the present invention.
It is an operation | work process figure which shows the positioning operation procedure in the mounting positioning mechanism which concerns on embodiment of this invention step by step. First, FIG.
As shown in (A), at the mounting position 4 of the loader or unloader of the semiconductor wafer processing apparatus, up to a position where the positioning groove 2 of the semiconductor wafer storage container 1 corresponds on the rotating body 3A (and the support 3B). The semiconductor wafer storage container 1 is transported by a robot arm or an operator. At this point, rough alignment between the rotating body 3A and the positioning groove 2 is sufficient.

Subsequently, as shown in FIG. 3B, the semiconductor wafer storage container 1 is lowered downward toward the rotating body 3A, so that the inclined inner wall of the positioning groove 2 and the rotating body 3 are rotated.
A contacts. Further, by lowering or lowering the semiconductor wafer container 1 by its own weight, the rotating body 3A
Starts rotating quickly, and the rotating body 3A guides the semiconductor wafer container 1 to a position for accurate alignment while rotating. As shown in FIG. 3 (C), when the rotation center axis of the rotating body 3A coincides with the apex of the positioning groove 2, the mounting position of the semiconductor wafer storage container 1 is determined, and the positioning operation can be completed. it can.

In the mounting / positioning mechanism of the semiconductor wafer container 1 thus configured, when the rotating member 3A comes into contact with the inner wall of the positioning groove 2 on the bottom surface of the semiconductor wafer container 1, the rotating member 3A rotates quickly. Then, the rotating body 3A can guide the semiconductor wafer container 1 to an accurate positioning position while rotating. Therefore, wear due to friction of the inner wall of the positioning groove 2 during positioning and a change in the shape of the inner wall surface due to the wear can be reduced, so that highly accurate positioning can be performed over a long period of time. Further, since the rotating body 3A is in contact with the inner wall of the positioning groove 2 while rotating, there is almost no change in shape due to rubbing or abrasion of the rotating body 3A itself. Furthermore, since the amount of particles generated due to the rubbing of the inner wall of the positioning groove 2 can be reduced, an environment with a small amount of particles can be constructed, and the production yield can be improved.

(Second Embodiment) FIG. 4 shows a second embodiment of the present invention.
It is a principal part enlarged block diagram of the mounting positioning mechanism of the semiconductor wafer storage container concerning embodiment. The mounting and positioning mechanism according to the second embodiment of the present invention includes a positioning groove 2 (see FIGS. 1A and 1B) on the bottom surface of a semiconductor wafer container 1.
reference. ), A plurality of rotatable rotators 3Aa and 3Ab abutting on the inner wall of the positioning groove 2, and a support 3B for supporting the rotators 3Aa and 3Ab at the upper part. The structure of the mounting and positioning mechanism according to the second embodiment is different from the structure of the mounting and positioning mechanism according to the first embodiment in that a plurality of rotating bodies 3Aa and 3Ab are provided on one support 3B. The difference is in the arrangement.

In the mounting / positioning mechanism of the semiconductor wafer container 1 configured as described above, when one of the rotating bodies 3Aa or 3Ab comes into contact with the inner wall of the positioning groove 2 on the bottom surface of the semiconductor wafer container 1. Rotating body 3A in contact
a or 3Ab rotates quickly, and the rotating body 3Aa or 3A
b can guide the semiconductor wafer container 1 to an accurate positioning position while rotating. Therefore, wear due to friction of the inner wall of the positioning groove 2 during positioning and a change in the shape of the inner wall surface due to the wear can be reduced, so that highly accurate positioning can be performed over a long period of time. Furthermore, since all of the rotating bodies 3Aa and 3Ab are in contact with the inner wall of the positioning groove 2 while rotating, the shapes of the rotating bodies 3Aa and 3Ab are hardly changed by rubbing or abrasion of the rotating bodies 3Aa and 3Ab. further,
Since the amount of particles generated due to the rubbing of the inner wall of the positioning groove 2 can be reduced, an environment with a small amount of particles can be constructed, and the production yield can be improved.

(Third Embodiment) FIG. 5 shows a third embodiment of the present invention.
It is a principal part enlarged block diagram of the mounting positioning mechanism of the semiconductor wafer storage container concerning embodiment. The mounting and positioning mechanism according to the third embodiment of the present invention includes a positioning groove 2 (FIGS. 1A and 1B) on the bottom surface of a semiconductor wafer container 1.
reference. ), A plurality of rotatable rotating bodies 3Ac and 3Ad abutting on the inner wall of the positioning groove 2, and a supporting body 3B that supports the rotating bodies 3Ac and 3Ad on the side. The structure of the mounting and positioning mechanism according to the third embodiment is different from the structure of the mounting and positioning mechanism according to the second embodiment in that a plurality of rotating bodies 3Ac and 3Ad are provided on the side of the support 3B. The difference is in the arrangement.

In the mounting / positioning mechanism for the semiconductor wafer container 1 thus configured, when one of the rotating bodies 3Ac or 3Ad comes into contact with the inner wall of the positioning groove 2 on the bottom surface of the semiconductor wafer container 1, the contact is made. Rotating body 3A in contact
c or 3Ad rotates quickly, and the rotating body 3Ac or 3A
d can guide the semiconductor wafer container 1 to an accurate positioning position while rotating. Therefore, wear due to friction of the inner wall of the positioning groove 2 during positioning and a change in the shape of the inner wall surface due to the wear can be reduced, so that highly accurate positioning can be performed over a long period of time. Further, since the rotating bodies 3Ac and 3Ad are in contact with the inner wall of the positioning groove 2 while rotating, the shapes of the rotating bodies 3Ac and 3Ad hardly change due to rubbing or abrasion of the rotating bodies 3Ac and 3Ad, respectively. further,
Since the amount of particles generated due to the rubbing of the inner wall of the positioning groove 2 can be reduced, an environment with a small amount of particles can be constructed, and the production yield can be improved.

(Fourth Embodiment) FIG. 6 shows a fourth embodiment of the present invention.
It is a principal part enlarged block diagram of the mounting positioning mechanism of the semiconductor wafer storage container concerning embodiment. The mounting and positioning mechanism according to the fourth embodiment of the present invention includes a positioning groove 2 (FIGS. 1A and 1B) on the bottom surface of a semiconductor wafer container 1.
reference. ), A contact body 3C abutting on the inner wall of the positioning groove 2, and an elastic body 3D supporting the contact body 3C and having elasticity in at least a vertical direction or at least a horizontal direction.
And is constructed with.

The upper end portion of the contact body 3C which contacts the groove 2 to be positioned is formed in a spherical shape in the fourth embodiment, and at any position on the inner wall of the groove 2 to be positioned,
Even if C contacts, smooth contact can be performed.

One end of the elastic body 3D is connected to the lower bottom surface of the contact body 3C, and the other end of the elastic body 3D is connected to the mounting position 4. The elastic body 3D is formed by the contact body 3C and the positioning groove 2.
It has a function to reduce the impact generated when it comes into contact with the inner wall of the vehicle. In the fourth embodiment, the elastic body 3D includes
A coil spring having elasticity in many directions including a vertical direction and a horizontal direction (capable of releasing an impact in multiple directions) is used.

The positioning operation procedure in the mounting and positioning mechanism according to the fourth embodiment is substantially the same as the positioning operation procedure according to the above-described first embodiment, and a description thereof will be omitted.

In the mounting / positioning mechanism of the semiconductor wafer container 1 thus configured, when the contact body 3C comes into contact with the inner wall of the positioning groove 2 on the bottom surface of the semiconductor wafer container 1, the impact at this time is elastically applied. It can be absorbed by the body 3D. In particular, the operator places the semiconductor wafer storage container 1 on a carrier and transfers the semiconductor wafer storage container 1 to the mounting position 4 by the operator.
However, it is difficult to perform high-precision positioning compared with the transfer by the robot arm, and it is easy to generate an impact when the inner wall of the groove 2 to be positioned contacts the contact body 3C. The impact can be effectively reduced by the elastic body 3D. After the shock is absorbed, the semiconductor wafer container 1 is moved to a position for accurate positioning by the contact body 3C.
Is guided. Therefore, a change in shape or damage due to an impact on the inner wall surface of the positioning groove 2 and a change in shape or damage of the contact body 3C itself can be reduced, so that highly accurate positioning can be performed over a long period of time. Further, the impact between the inner wall of the positioning groove 2 and the contact body 3C is absorbed by the elastic body 3D, so that the inside of the semiconductor wafer storage container 1 and the semiconductor wafer (not shown) stored therein are rubbed. Can reduce the amount of generated particles, so that an environment with a small amount of particles can be constructed, and the production yield can be improved.

(Fifth Embodiment) FIG. 7 shows a fifth embodiment of the present invention.
It is a principal part enlarged block diagram of the mounting positioning mechanism of the semiconductor wafer storage container concerning embodiment. The mounting and positioning mechanism according to the fifth embodiment of the present invention is constructed by combining the mounting and positioning mechanism according to the first embodiment and the mounting and positioning mechanism according to the fourth embodiment. . That is,
The mounting and positioning mechanism according to the fifth embodiment includes a positioning groove 2 (see FIGS. 1A and 1B) on the bottom surface of a semiconductor wafer container 1 and an inner wall of the positioning groove 2. , A support 3Ba and 3Bb rotatably supporting the rotary 3A and movably supporting at least vertically or at least horizontally, and one end connected to the support 3Ba and the other end An elastic body 3D connected to the mounting position 4 and having elasticity in at least a vertical direction or at least a horizontal direction. Support 3
Ba rotatably supports the rotator 3A below the rotator 3A, and the support 3Bb rotatably supports the rotator 3A on the side of the rotator 3A.

In the thus configured mounting and positioning mechanism according to the fifth embodiment, the effect obtained by the mounting and positioning mechanism according to the first embodiment and the mounting and positioning mechanism according to the fourth embodiment are described. An effect obtained by combining the effect obtained by the positioning mechanism can be obtained.

(Sixth Embodiment) FIG. 8 shows a sixth embodiment of the present invention.
It is a principal part enlarged block diagram of the mounting positioning mechanism of the semiconductor wafer storage container concerning embodiment. The mounting and positioning mechanism according to the sixth embodiment of the present invention is constructed by combining the mounting and positioning mechanism according to the third embodiment and the mounting and positioning mechanism according to the fourth embodiment. . That is,
The mounting and positioning mechanism according to the sixth embodiment includes a positioning groove 2 (see FIGS. 1A and 1B) on the bottom surface of a semiconductor wafer container 1 and an inner wall of the positioning groove 2. A plurality of rotators 3Ac and 3Ad that abut against each other; a plurality of supports 3Ba to 3Bd that rotatably support each of the rotators 3Ac and 3Ad, respectively, and that support at least the vertical direction or at least the horizontal direction; Elastic bodies 3D1 and 3 having elasticity at least in the horizontal direction
D2 and a contact body 3C.

The other end of the elastic body 3D1, one end of which is connected to the support 3Ba supporting the rotator 3Ac, the rotator 3Ad
Elastic body 3 having one end connected to a support 3bc that supports
The other end of D2 is connected to the mounting position 4. At the time of positioning, a contact body 3C is provided on the inner wall of the positioning groove 2.
Any one of the rotating bodies 3Ac and 3Ad is set to come in contact with the contact body 3C earlier than the rotating body 3Ac, and the contact body 3C itself is fixed to the mounting position 4 in a fixed state.

In the mounting / positioning mechanism according to the sixth embodiment configured as described above, the effects obtained by the mounting / positioning mechanism according to the third embodiment and the mounting / positioning mechanism according to the fourth embodiment are described. An effect obtained by combining the effect obtained by the positioning mechanism can be obtained.

[0034]

According to the present invention, it is possible to provide a mounting / positioning mechanism capable of improving the mounting / positioning accuracy of a semiconductor wafer storage container over a long period of time. Further, the present invention can provide a mounting / positioning mechanism capable of preventing the generation of particles due to the mounting / positioning of the semiconductor wafer storage container and improving the production yield. Further, according to the present invention, it is possible to reduce the impact caused by the positioning of the semiconductor wafer storage container, to prevent the generation of particles inside the semiconductor wafer storage container, and to improve the manufacturing yield. Thus, it is possible to provide a mounting positioning mechanism that can be used.

[Brief description of the drawings]

FIG. 1A is a schematic configuration diagram of a mounting and positioning mechanism of a semiconductor wafer storage container according to a first embodiment of the present invention;
FIG. 2B is an enlarged configuration diagram of a main part of the placing and positioning mechanism according to the first embodiment of the present invention.

FIG. 2 is a perspective view of the semiconductor wafer container according to the first embodiment of the present invention.

FIGS. 3A to 3C are work process diagrams showing step by step the positioning work procedure in the mounting and positioning mechanism according to the first embodiment of the present invention.

FIG. 4 is an enlarged configuration diagram of a main part of a mounting / positioning mechanism of a semiconductor wafer container according to a second embodiment of the present invention.

FIG. 5 is an enlarged configuration diagram of a main part of a mounting and positioning mechanism of a semiconductor wafer storage container according to a third embodiment of the present invention.

FIG. 6 is an enlarged configuration diagram of a main part of a mounting and positioning mechanism of a semiconductor wafer storage container according to a fourth embodiment of the present invention.

FIG. 7 is an enlarged configuration diagram of a main part of a mounting and positioning mechanism of a semiconductor wafer storage container according to a fifth embodiment of the present invention.

FIG. 8 is an enlarged configuration diagram of a main part of a mounting and positioning mechanism of a semiconductor wafer storage container according to a sixth embodiment of the present invention.

FIG. 9 is a schematic configuration diagram of a mounting and positioning mechanism of a semiconductor wafer storage container according to a conventional technique.

10 (A) to 10 (C) are work process diagrams showing step by step a positioning work procedure in a placing and positioning mechanism according to a conventional technique.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor wafer storage container 2, 21 to 23 positioning groove 3A, 3A1 to 3A3, 3Aa to 3Ad rotating body 3B, 3Ba to 3Bd support 3C contact 3D, 3D1, 3D2 elastic body 4 mounting position

Claims (3)

[Claims] 1. A semiconductor comprising: a positioning groove on a bottom surface of a semiconductor wafer storage container; a rotatable rotator abutting on an inner wall of the positioning groove; and a supporter supporting the rotator. A mounting and positioning mechanism for the wafer storage container. 2. A positioning groove on a bottom surface of a semiconductor wafer storage container, a contact body contacting an inner wall of the positioning groove, and an elastic body supporting the contact body and having elasticity in at least a vertical direction or at least a horizontal direction. A mounting and positioning mechanism for a semiconductor wafer storage container, comprising: 3. A groove to be positioned on the bottom surface of the semiconductor wafer container, a rotatable rotator abutting on an inner wall of the groove to be positioned, and an elasticity supporting the rotator and having elasticity in at least a vertical direction or at least a horizontal direction. A mounting mechanism for a semiconductor wafer storage container, comprising: a body;