JP2000295503A - Image pickup unit for endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an image pickup unit for an endoscope in which a tip of an endoscope with a smaller diameter can be adopted. SOLUTION: A printed circuit board 50 made of a ceramic or a glass epoxy or the like is placed behind a CCD bare chip 37 in parallel therewith. A side through-hole solder land 54 that is notched semi-cylindrically is placed to a side face of the printed circuit board 50 at a position opposite to each external lead 40 of a solid-state image pickup element 36. A signal line connection board 55 is placed behind the printed circuit board 50 in parallel with the CCD bare chip 37. A semi-cylindrical side through-hole solder land 56 that is a 1st connection section is placed to a side face of the signal line connection board 55 at a position opposite to each external lead 40 of the solid-state image pickup element 36 similarly to the case with the printed circuit board 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging unit used for an endoscope having a solid-state imaging device provided at the tip of an insertion portion.

[0002]

2. Description of the Related Art In recent years, a fiber type endoscope has an elongated insertion portion, so that the insertion portion can be inserted into a body cavity to observe an organ in the body cavity, or if necessary, a treatment instrument channel can be inserted. It is widely used in the medical field, such as performing various treatments by inserting a treatment tool into a medical device. Further, it is widely used as an industrial endoscope for observing and inspecting the inside of a body of a boiler, a gas turbine engine, a chemical plant, and the like, a pipe of an automobile engine, and the like.

[0003] An electronic endoscope having a built-in solid-state image sensor at the distal end of an insertion section is also used. The solid-state imaging device used in the electronic endoscope is provided with external leads for inputting a signal from the outside to the solid-state imaging device and outputting a signal from the solid-state imaging device to the outside. The external leads are electrically connected to a substrate on which electronic components electrically connected to the solid-state imaging device are mounted.

[0004]

However, as the number of electronic components increases or the size of the electronic components themselves increases, the size of the substrate on which the electronic components are mounted also increases. As described above, when the size of the substrate itself increases, the size of the imaging unit including the solid-state imaging device increases, and the end of the insertion section of the endoscope that houses the imaging unit increases in diameter.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an endoscope imaging unit capable of reducing the diameter of the end of the endoscope. .

[0006]

In order to achieve the above object, an imaging unit for an endoscope according to the present invention is provided with a solid-state imaging device and a notch-shaped side surface disposed in parallel with the solid-state imaging device. A plurality of substrates having through holes, and external leads connected to the solid-state imaging device and disposed in cutout through holes of the plurality of substrates are provided.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an embodiment according to the present invention. FIG. 1A is a cross-sectional view from above of an imaging unit according to the present embodiment, and FIG. 1B is a cross-sectional view from a side. FIG. 2 is a sectional view taken along the line AA in FIG. 1, FIG. 3 is a sectional view taken along the line BB in FIG. 1, and FIG. 4 is an overall view for explaining the entire endoscope system.

As shown in FIG. 4, the endoscope 1 includes an elongated and flexible insertion section 2 and a large-diameter operation section 3 connected behind the insertion section 2. A universal cord 4 is provided extending from a side of the operation unit 3, and a connector 5 is provided at an end of the universal cord 4. The connector 5 is connected to the light source device 6 and to the signal code 7. A connector 8 is provided at an end of the signal code 7, and the connector 8 is connected to a video processor 9. The video processor 9 comprises a monitor 10, a VTR deck 1
1, a video printer 12, a video disk 13, and the like.

The insertion portion 2 is composed of a rigid distal end portion 14, a bendable bending portion 15, and a flexible tube 16 having flexibility in this order from the distal end side. An observation optical system 17, an imaging unit 18 disposed behind the observation optical system 17, and a light guide (not shown) are fixed to the distal end portion 14. The light guide is inserted through the insertion section 2, the operation section 3, and the universal cord 4, and is connected to the connector 5. Light from a light source lamp (not shown) of the light source device 6 is incident from the base end of the light guide. The light incident into the light guide is transmitted through the light guide and travels to the distal end of the endoscope 1. It is emitted from 14. The emitted light illuminates the subject, and forms an image in the imaging unit 18 by the observation optical system 17. This subject image is converted into an electric signal by the imaging unit 18 and input to the video processor 9 via the universal code 4. The video processor 9 performs video signal processing, and outputs the video signal to a monitor 10, a VTR deck 11, a video printer 12, a video disk 13, and the like.

Next, the imaging unit 1 according to the present embodiment
8 will be described in detail. The observation optical system 17 disposed in front of the imaging unit 18 is a cover lens 2 having an externally exposed cover glass function as shown in FIG.
0 and a plurality of lenses 21 disposed behind the cover lens 20. The observation optical system 17 is held by a lens frame 22. The lens frame 22 includes an element mounting frame 23 fixed to a not-shown distal end component main body.
Is held in. The element mounting frame 23 has a D-shaped cross section in which a cylinder is cut in parallel with the optical axis 24 of the observation optical system 17, and a small-diameter insertion hole 25 for inserting the lens frame 22 is provided at a front portion, and at a rear portion. It has a large-diameter filter mounting hole 26 with a missing bottom surface, and an abutting portion 27 is provided at the boundary between the transmission hole 25 and the filter mounting hole 26.

A rear end of the observation optical system 17 is abutted against the abutting portion 27, and a D-cut infrared cut filter 30 is bonded and fixed to the filter mounting hole 26. Behind the infrared cut filter 30, the front surface is bonded to the back surface 31 of the infrared cut filter 30, and a D-cut glass plate 32 having substantially the same shape as the infrared cut filter 30 is bonded and fixed to the filter mounting hole 26. I have. Behind the glass plate 32, the glass plate 3
The infrared cut filter 30 and the glass plate 3 are bonded such that the front surface is
2, a cover glass 35 is arranged. Further, behind the cover glass 35, a solid-state imaging device 36 is provided.
Is arranged.

The solid-state image pickup device 36 includes a cover glass 3
5 and a CCD bare chip 37 disposed behind the
And a polyimide film 38 disposed on the side of the CD bear chip 37. Polyimide film 3
8 has an inner lead 39 at one end and an outer lead 4 at the other end.
A plurality of conductive portions 41 made of a conductive thin film constituting 0 are formed.

Cover glass 35 and CCD bare chip 37
The inner lead 39 is connected to a bonding pad (not shown) which is an input / output terminal of each signal formed on the imaging surface 43 of the CCD bare chip 37. CCD from outer periphery 44
The external lead 40 is bent rearward of the bare chip 37 and extends rearward.

A cover glass 3 is provided on the outer periphery of the sealing resin 42.
5 is covered with a black light-blocking resin 45 so that light rays do not enter from the side surface. An adhesive layer 47 is formed on the back surface 46 of the CCD bare chip 37 for insulation.

Behind the CCD bare chip 37, this C
A circuit board 50 made of ceramic, glass epoxy, or the like is arranged in parallel with the CD bear chip 37. A capacitor 51 is mounted on a surface of the circuit board 50 on the side of the CCD bare chip 37, and an IC 52 for a CCD output buffer is provided on a surface of the circuit board 50 on a side opposite to the CCD bare chip 37.
And a resistor 53 are mounted.

The solid-state imaging device 3 on the side of the circuit board 50
6 is provided with a side through-hole solder land 54 cut out in a semi-cylindrical shape at a position facing each external lead 40, and the middle of the external lead 40 of the solid-state imaging device 36 is formed in the side through-hole solder land 54. It is electrically connected. The circuit board 50 is provided with a conductive pattern (not shown) for electrically connecting each side through-hole solder land 54 with the capacitor 51, the IC 52, and the resistor 53.

A signal line connection board 55 is arranged behind the circuit board 50 so as to be parallel to the CCD bare chip 37. As shown in FIG. 2, a semi-cylindrical side through-hole solder as a first connection portion is provided on a side surface of the signal line connection substrate 55 at a position facing the external lead 40 of the solid-state imaging device 36 similarly to the circuit substrate 50. A land 56 is provided and is electrically connected to the rear end of the external lead 40.

In the vicinity of the center of the signal connection board 55,
The through-hole lands 57 which are arranged in a row and are hole-shaped second connection portions are provided. On the surface of the signal line connection board 55, a conductive pattern 58 for electrically connecting the side land solder land 56 and the through hole land 57 is provided.

A copper wire 5 is connected to a side through-hole solder land 54a of the circuit board 50 which is electrically connected to the IC 52 and a side through-hole solder land 56a of the signal line connection board 55 at a position facing the side through-hole solder land 54a.
9.

A signal cable 60 extending behind the signal line connection board 55 and electrically connected to the video processor 9.
Is configured by bundling a plurality of core wires 61 and shield wires 62 as signal lines and covering the outer periphery thereof with a total shield wire 63.

The core wire 61 is fixedly connected to the through-hole land 57 of the signal line connection board 55 by soldering the tip end thereof by soldering. On the other hand, the shield wires 62 are bundled and their tips are soldered to the copper wires 64, and the tips of the copper wires 64 are inserted into through-hole lands 57 a corresponding to the ground of the signal line connection board 55, and connected and fixed by soldering. ing.

A portion from the outer periphery of the signal line connection board 55 to the side end of the signal cable 60 is covered with a heat shrinkable tube 65, and the inside of the heat shrinkable tube 65 is sealed with a sealing resin 66. In addition, the CCD bare chip 37
A portion between the circuit board 50 and the circuit board 50 and the signal line connection board 55 is also sealed with the sealing resin 66.

As shown in FIGS. 1 and 3, the element mounting frame 2
A light-shielding plate 70 is provided in the bottom-side missing portion 67 of the third filter mounting hole 26 so that light does not enter from the cut surface 68 of the infrared cut filter 30 and the cut surface 69 of the glass plate 32. Further, the light shielding plate 70 and the cover glass 35
The gap is filled with a light shielding resin 71 so that no light beam enters through the gap, and a light shielding plate 72 is provided so as to cover the light shielding resin 71.

In order to adjust the focus of the observation optical system 17, the lens frame 22 holding the observation optical system 17 is moved back and forth in the insertion hole 25 of the element mounting frame 23, and is positioned on the imaging surface 43 of the CCD bare chip 37. A subject image of the observation optical system 17 is formed. Then, after the focus adjustment is completed, the lens frame 2
2 is fixed to the insertion hole 25 of the element mounting frame 23 with an adhesive or the like.

In order to connect the solid-state image pickup device 36 and the circuit board 50 to the core wire 61 and the shield wire 62, first, each of the external leads 40 of the solid-state image pickup device 36 and each side provided on the side surface of the circuit board 50 are connected. The side through-hole solder lands 54 are connected by soldering. Next, each external lead 4
0 and the respective side through-hole solder lands 56 provided on the side surfaces of the signal line connection board 55 are soldered.
Finally, the distal end of the core wire 61 and the shield wire 62
Is inserted, and each through-hole land 57 is connected to the core wire 61 and the shield wire 62 by soldering.

As described above, by connecting the external leads 40 to the side land solder holes 54 of the circuit board 50, the solid-state image sensor 36 and the capacitors 51, the IC 52, and the resistors 53 mounted on the circuit board 50 are electrically connected. Connected. Further, by connecting the external lead 40, the core wire 61 and the shield wire 62 to the side through-hole solder land 56 and the through-hole land 57 of the signal line connection board 55, respectively, the solid-state imaging device 36 and the circuit board 5 are connected.
Electrical components such as a capacitor 51, an IC 52, and a resistor 53 mounted on the core 0 are connected to signal lines such as a core wire 61 and a shield wire 62.

According to the present embodiment, the copper wire 64 connected to the distal end of the core wire 62 and the shield wire 62 as each signal line.
Are inserted into the through-hole lands 57, so that even if a certain amount of stress is applied, the respective core wires 61
Also, the tip of the copper wire 64 of the shield wire 62 does not fall out of the through-hole land 57. That is, the core wire 61
And a signal line such as a shield line 62 through the through-hole land 5.
7, the signal lines can be positioned, and the solid-state imaging device 36 and the circuit board 50 can be easily connected to the signal lines by sequentially bonding and fixing each signal line and the through-hole land 57 with solder. And the reliability of those connections can be increased.

In the embodiment, the circuit board and the signal line connection board are arranged in parallel with the CCD bare chip. Alternatively, each board may be arranged vertically or obliquely with respect to the CCD bare chip.

[0029] Among the through-hole solder lands of the circuit board, there may be side-through-hole solder lands that are not electrically connected to electric components mounted on the circuit board.

The order of connection of the solid-state imaging device, the circuit board, and the signal line connection board is not limited to the above.
For example, after inserting the tip portion of the signal line into the second connection portion of the signal line connection substrate in advance and bonding and fixing the same, the first connection portion of the signal line connection substrate is connected to the external lead or the circuit board. Is also good.

The present invention also includes the inventions listed below. (Supplementary Note) (Supplementary Note 1) A solid-state imaging device arranged with its imaging surface positioned at an image forming position of an observation optical system, a circuit board connected to the solid-state imaging device and mounted with electric components, In an endoscope imaging unit including a plurality of signal lines electrically connected to the imaging device or the circuit board, a first connection unit connected to the solid-state imaging device or the circuit board,
A signal line connection comprising a hole-shaped second connection portion for inserting and connecting a tip end of the signal line, and a conductive pattern for electrically connecting the first connection portion and the second connection portion. An imaging unit for an endoscope, comprising a substrate. (Supplementary note 2) The imaging unit for an endoscope according to Supplementary note 1, wherein the signal line connection board is arranged in parallel with the solid-state imaging device. (Purpose of Supplementary Notes 1 and 2) The purpose of Supplementary Notes 1 and 2 is to facilitate the connection when connecting a plurality of signal lines to the external leads and the circuit board of the solid-state imaging device, and to enhance the reliability of the connection part. To provide an endoscope imaging unit. (Effects of Supplementary Notes 1 and 2) In Supplementary Notes 1 and 2, it is only necessary to insert and connect the distal end of the signal line to the hole-shaped second connection part of the signal line connection board, and to connect the plurality of signal lines to the connection part. Since the positioning can be performed, the signal lines are easily connected to the external leads and the circuit board, and the reliability of the connection portions is high. Furthermore, according to Appendix 2, the rigid length of the distal end portion of the endoscope can be reduced by arranging the signal line connection board in parallel with the solid-state imaging device. (Supplementary Note 3) A solid-state image sensor disposed with its imaging surface positioned at an image forming position of the observation optical system, and an external lead extending rearward from the solid-state image sensor in parallel with the optical axis of the observation optical system. A circuit board disposed in parallel with the solid-state imaging device, a circuit board connection portion provided on the circuit board and connected to a middle part of the external lead, and the solid-state imaging device behind the circuit board. A signal line connection board arranged in parallel,
A first connection portion provided on the signal line connection substrate and connected to a rear end of the external lead; and a hole-shaped second connection electrically connected to the first connection portion via a conductive pattern. An endoscope image pickup unit, comprising: a unit; and a signal line connected to the hole-shaped second connection unit by inserting a distal end thereof. (Supplementary Note 4) The circuit board connection portion is provided on a side surface of the circuit board, and has a shape in which the side surface is cut off in a cylindrical shape, and the first connection portion is a side surface of the signal line connection board. Characterized in that the side surface thereof is cut into a cylindrical shape. (Purposes of Supplementary Notes 3 and 4) In Supplementary Notes 3 and 4, in addition to the objects of Supplementary Notes 1 and 2, the ease of connection between the external lead and the circuit board and the connection between the external lead and the signal line connection board and their connection The purpose is to improve the reliability of the unit. (Effects of Supplementary Notes 3 and 4) In Supplementary Notes 3 and 4, the solid-state imaging device, the circuit board, the signal line connection board, and the signal line are all easily connected, and the connection portion has high reliability. In addition, in particular, in Supplementary Note 4, a cylindrical cutout portion is provided on the side surface of the circuit board, the portion is used as a circuit board connection portion, and the signal line connection board is similarly provided with a cylindrical cutout portion on the side surface, Since that portion is used as the first connection portion, the diameter of the distal end portion of the endoscope on which the imaging unit is provided can be reduced.

[0032]

According to the imaging apparatus of the present invention, the diameter of the distal end of the endoscope provided with the imaging apparatus can be reduced.

[0033]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an imaging unit according to an embodiment.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a sectional view taken along line BB in FIG. 1;

FIG. 4 is an overall view illustrating the entire endoscope system.

[Explanation of symbols]

 37 CCD bare chip 40 External lead 50 Circuit board 51 Capacitor 52 IC 53 Resistor 55 Signal line connection board 56 Side through hole solder land 57 Through hole land 58 Conductive pattern 61 Core wire 60 Signal cable 62 Shield wire

Claims (1)

[Claims] 1. A solid-state image sensor, a plurality of substrates arranged in parallel with the solid-state image sensor, and having cut-out through holes on side surfaces, a plurality of substrates connected to the solid-state image sensor and cutting the plurality of substrates An imaging unit for an endoscope, comprising: an external lead provided in a notched through hole.