JP2000242755A - Manufacture of non-contact type ic card, and non-contact type ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a manufacturing method or the like, capable of detecting a cord having a defect in a coil or the like, without depending on a visual sense in the process of manufacturing a non-contact type IC card on a substrate in a multiple way. SOLUTION: This manufacturing method for a non-contact IC card includes a process where antenna coils 13 are formed on a card substrate, a process where a capacitor capable of constructing a resonance circuit resonating with the respective coils 13 in a specified frequency is formed while having an opening part 16 at a part of the circuit, a process where the existence/absence of defects of the respective coils 13 is detected, in a process in which electrically conductive material 31 is adhered or applied to the part 16 of the circuit of the capacitor where a defect is detected and a process where the existence/absence of a responsive wave is confirmed by radiating an electromagnetic wave including the specified frequency to respective resonance circuit parts after laminating an oversheet on a core sheet on which the antenna coils are formed in a manufacturing process in which the non-contact IC card having the antenna coil 13 in the substrate is manufacture in a multiple way. Such a resonance circuit can be provided independently of the antenna coil of a card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-contact type IC card having an antenna coil in a card base and a non-contact type IC card. About the technology that can be.

[0002]

2. Description of the Related Art A non-contact type I having a built-in antenna coil formed of a printed pattern or conductive ink.
The production of a C card is conventionally performed by the following steps. FIG. 3 is a perspective view showing a manufacturing process of a conventional non-contact type IC card. First, as shown in FIG. 3 (A), a plurality of antenna coils 53 are formed on one large resin sheet 521 by arranging them on multiple sides, or coils are formed in a row or a plurality of rows on a roll-shaped resin sheet. Supply the antenna sheet. This sheet-shaped or roll-shaped sheet with an antenna coil is heated together with an adhesive sheet and resin sheets 522 and 523 serving as oversheets of polyethylene terephthalate (PET) or vinyl chloride (PVC).
Lamination by press lamination under pressure (Fig. 3
(B)) Thereafter, punching is performed to the size of the card size to form the individual IC card bases 5 in which the antenna coils 53 are embedded (FIG. 3C). In the case of a non-contact IC card having no terminal board, the card is completed by the above steps except for a step of providing an additional function.

FIG. 4 is a sectional view showing a subsequent manufacturing process of the non-contact type IC card. It is a figure which shows the manufacturing process of what has a terminal board among non-contact type IC cards. Therefore, the present invention can be applied to a shared card with a contact type IC card. After laminating, as shown in FIG. 4 (C), the recess 58 for mounting the IC module 51 is cut, a conductive adhesive is applied to the antenna coil connection portion, and an insulating adhesive is applied to the other portions. The IC module 51 is mounted, the card base side antenna coil connection terminal 54 and the IC module side connection terminal 514 are connected, and the other parts are bonded to complete a non-contact type IC card.

In this sheet-shaped or roll-shaped sheet 521 with an antenna coil, if a part of the plurality of patterns becomes defective due to a defect during manufacturing, the punched hole 41 or the colored mark 4
Visual marking such as No. 2 is performed, and a non-defective product or a defective product is determined in a post-process to prevent wasteful mounting of an element such as an IC on the defective product. The defect during manufacture is, for example, a specific portion that is determined to be unusable due to a defect of the antenna coil such as disconnection or peeling, or a stain or scratch on the base material.

However, when a part of the plurality of coils of the sheet with the antenna coil becomes defective due to a defect during manufacturing, the visual marking (FIG. 3B) such as the punched hole 41 or the colored mark 42 is not obtained. Since the antenna sheet itself is laminated with another opaque resin sheet in a later process,
There is a problem that the identification marking attached to the sheet with the antenna coil is covered with the resin sheet and cannot be visually recognized. In order to identify this defect after lamination, visually mark the top layer of the card again before lamination, record the position of the defective product on a separate sheet, and remove the defect while looking at the separate sheet after lamination. Work is required. For this reason, the manufacturing process becomes complicated, resulting in the incorporation of defects and an increase in cost.

[0006]

Therefore, in the present invention,
In the manufacturing process of a non-contact type IC card, an antenna coil and an additional capacitor are provided to form a resonance circuit consisting of a coil and a capacitor, regardless of the visual marking of a defective mark. The resonant circuit should not function because there is an open part, and when a defective product is found, the open part is connected by a conductive seal or the like to make it conductive, and the defective part is not electrically operated in a later process. A non-defective product is detected to solve the above-described problem.

[0007]

That is, a first aspect of the present invention to solve the above-mentioned problems is to provide a non-contact type IC card having an antenna coil in a card base, a plurality of cards on a single sheet. In a manufacturing process of manufacturing with multiple impositions, a process of forming antenna coils according to the number of impositions of the plurality of cards on a base material serving as a core sheet of a card base, a resonance circuit that resonates with the respective antenna coils at a specific frequency Forming a capacitor in which a part of the circuit has open portions at close intervals, a step of detecting the presence or absence of a defect in each of the multiple-mounted antenna coils, and detecting the defect. A step of sticking or applying a conductive material to an open portion of the circuit of the capacitor in the antenna coil portion, and applying a conductive material to the core sheet on which the antenna coil is formed. A method of manufacturing a non-contact type IC card, comprising the steps of: laminating sheets; and radiating electromagnetic waves containing the specific frequency to each of the resonance circuit portions after lamination to check for the presence or absence of an electromagnetic wave that responds. ,It is in. With this manufacturing method, defective products can be easily detected during the manufacturing process.

A second aspect of the present invention for solving the above-mentioned problems is a manufacturing process for manufacturing a non-contact type IC card having an antenna coil in a card base by multiply attaching a plurality of cards to one sheet. Forming an antenna coil according to the number of impositions of the plurality of cards on a base material serving as a core sheet of a card base, and applying a specific frequency to each of the areas within one card close to the respective antenna coils. A step of forming a resonating antenna coil and a capacitor in a state in which a part of the circuit has an open portion at a close interval; a step of detecting the presence or absence of a defect in each of the multi-faced antenna coils; an antenna in which the defect is detected A step of sticking or applying a conductive material to the open part of the circuit of the capacitor in the coil part, and attaching the conductive material to the core sheet where the antenna coil is formed. A method of manufacturing a non-contact type IC card, comprising the steps of: laminating sheets; and radiating electromagnetic waves containing the specific frequency to each of the resonance circuit portions after lamination to check for the presence or absence of an electromagnetic wave that responds. ,It is in. With this manufacturing method, defective products can be easily detected during the manufacturing process.

A third aspect of the present invention to solve the above-mentioned problem is a non-contact type IC card manufactured by the above-mentioned manufacturing method, wherein a non-contact type IC card has a capacitor for detecting a defect in a laminated card base. A non-contact type IC card. Since the contactless IC card is used, a defective product can be easily detected during the manufacturing process.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The outline of an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a non-contact type I of the present invention.
1 shows a first embodiment of a method for manufacturing a C card. According to the present invention, as described above, a card is manufactured on a single sheet or a continuous roll of a single sheet in a multi-faced state. FIG. 1 shows the multi-faced antenna sheet. Is extracted and shown in FIG. As shown in FIG. 1, an antenna coil 13 is formed on a core sheet serving as an antenna sheet 121 </ b> A, and a defect detection capacitor 15 including capacitor patterns 151 and 152 is formed at a position close to the antenna coil 13. In FIG. 1, the capacitor pattern is formed opposite to the upper and lower surfaces of the antenna sheet 121A, but may be provided on the same surface via a dielectric layer. The antenna coil and the capacitor pattern form a parallel circuit, but a part of the circuit is formed to have a circuit open portion 16 intermittently at short intervals. The open portion 16 is formed so that the resonance circuit by the capacitor is originally used to detect a defective portion, and it is necessary that the completed card does not normally have the necessary functions but functions normally. Because there is no.

In FIG. 1, a hatched rectangular portion is a portion where an IC module is mounted on a laminated card substrate, and a concave portion for mounting an IC module is cut from the surface of the card substrate by an adhesive or the like. Attach and fix the IC module. Therefore, the connection terminals 141 and 142 of the antenna coil are formed at both ends of the IC module mounting portion 18 (FIG. 1A). The capacitor patterns 151 and 152 only need to be able to form a small-capacity capacitor on both sides of the sheet 121A.
It may be of the order of square, rectangular or circular. In addition, the interval between the open portions 16 of the circuit must be 1 to several mm because it is necessary to form a conductive portion by attaching a conductive seal or applying conductive ink.

Such an antenna sheet 121A is
It is formed on a card base material that becomes a core sheet. Generally, a pattern is formed by photo-etching technology using a glass epoxy, polyimide, or vinyl chloride substrate with copper foil on both sides, or printing of conductive ink on a substrate without copper foil, embedding of windings, etc. Thereby, the antenna coil 13, the antenna coil connection terminals 141 and 142, and the capacitor patterns 151 and 152 are formed. The antenna coil is usually formed with a line width of about 0.1 to 1.0 mm and two to five turns along the outer periphery of the card.
In FIG. 1, reference numerals 131 and 132 denote through-hole portions, and when circuits are provided on both surfaces, they are connected to the other conductor through the back surface of the substrate via the through-holes.

When a double-sided copper foil-bonded base material is used as described above, it is necessary to provide a conductive circuit on the other surface of the base material through the through hole in order to avoid crossing of antenna coils. In the process, the other pattern of the capacitor is formed at the same time.
The provision of 2 does not increase the number of steps. Similarly, the provision of the capacitor patterns 151 and 152 and their circuits can be formed simultaneously on the same photomask as the antenna coil, so that no special material is required. Also, in the case where the capacitor is formed in two layers by providing an insulating layer (dielectric layer) on the same surface as the antenna coil, the intersecting portion (jumping wire portion) of the antenna coil is similarly formed and no through hole is formed. In that case, there is no special process increase.

The presence or absence of a defective portion is examined by visual or electrical testing of the antenna coil provided on the patterned antenna sheet. That is, when a defective portion is detected, a conductive material, for example, a conductive seal 31 is applied to the open portion 16 or a conductive ink is applied (FIG. 1B). FIG. 1 shows a state where a conductive seal is attached. As a result, the open portion conducts, and even before the IC module is mounted, the antenna coil 13 and the capacitor 15 form a parallel resonance circuit, so that the antenna coil 13 and the capacitor 15 have a characteristic of resonating with respect to an electromagnetic wave having a specific resonance frequency. become. As the conductive seal, a label formed by applying a conductive adhesive to a conductive metal foil such as aluminum or the like is commercially available or can be specially manufactured.

FIG. 1C is a diagram in which an electromagnetic wave is emitted from the reading device 20 to detect the presence or absence of a response electromagnetic wave. Since the response frequency from the resonance circuit is in a substantially constant range, although there is some variation, if the electromagnetic wave in a certain range including the resonance frequency is scanned from the head unit 21 of the reader and sequentially output, any one of the frequencies is obtained. Response wave is detected. Such a response wave can be detected in the same manner even after the oversheets are stacked, so that the defective portion can be easily detected even if the seal 31 cannot be seen. Therefore, after cutting into individual cards or before cutting, defective cards are eliminated by passing through such a detecting section, and unnecessary post-processing such as cutting of an IC module mounting section or mounting of an IC module. Need not be performed.

FIG. 2 shows a second embodiment of the method for manufacturing a non-contact type IC card according to the present invention. Similarly, this is a method for detecting a defective product, but the resonance circuit is formed separately and independently from the antenna coil 13 of the card body. That is, the detection coil 17 is provided separately from the antenna coil 13, and this and the capacitor patterns 151 and 152 constitute a resonance circuit. The provision of the circuit opening 16 is the same as that of FIG. 1 (FIG. 2A). FIG. 2 (B)
5 shows a state in which the conductive ink 32 is applied to the circuit opening 16. As a result, an independent resonance circuit is formed by the coil 17 and the capacitor patterns 151 and 152, and similarly, the detection of a defective card by the reader 20 becomes possible (FIG. 2C).

Next, the manufacturing process of the non-contact IC card will be described in more detail. <Formation of Antenna Sheet> First, the antenna coil 13,
A glass epoxy board, polyimide, vinyl chloride, or the like in which the antenna coil connection terminal 14 and the capacitor pattern 151 are drawn by photo-etching copper foil, printing conductive ink such as silver or aluminum, or a combination thereof.
An antenna sheet 121A made of a base material such as polyethylene terephthalate (PET) is prepared (FIG. 1A).
In addition to the above, the antenna coil is formed by transferring the transfer foil on which the antenna pattern is formed to the core sheet, embedding the winding coil, and drawing while fusing the conductor with the coated resin to the base material with a weld bonder. And the like.

<Formation of Capacitor> In the case of the embodiment of FIG. 1, the capacitor pattern 151 can be formed as a rectangular pattern or the like branched from one of the antenna coil connection terminals 141.
2 can be simultaneously etched on the surface opposite to the capacitor pattern 151 when a double-sided copper foil-bonded substrate is used. Conduction with the antenna coil connection terminal 142 can be performed by through-hole / plating or the like. In this case, the core sheet 121 itself becomes a dielectric layer of the capacitor 15. In the case of the embodiment shown in FIG. 2, the detection coil 17 and the capacitor patterns 151 and 152 are used.
Is provided independently of the antenna coil of the card body,
The manufacturing process in the case of using a double-sided copper foil substrate is different from that of FIG. 1 only by changing the shape of the photomask.

When the capacitor is formed on the same side of the core sheet, that is, when the other pattern 152 is formed on the capacitor pattern 151 via a dielectric layer,
After forming the capacitor pattern 151, an insulating layer which is a dielectric is formed on the pattern. For this purpose, a thin insulating film can be transferred or an insulating layer can be formed by printing using an epoxy resist printing. In order to obtain stable capacitance, it is desirable that the capacitor can always be formed to have a uniform thickness. It may be based on the steps of spin coating, exposure and development of a resist. Subsequently, a planar capacitor pattern 152 is provided on the insulating layer 152 by conductive printing, transfer of copper foil, or the like. Through the above steps, the capacitor patterns 151 and 152 are formed on the antenna sheet.

As described above, the capacitor pattern may be formed through a base material sheet or may be formed by providing a dielectric layer on the same surface side of the base material. (Usually 100 μm or more). As a result, in the former case where the base material sheet is a dielectric layer, the capacitor capacity is generally smaller and the resonance frequency is higher than in the latter case where the dielectric layer can be made thinner. Will be. The resonance frequency f is represented by the following equation (1). f = 1 / (2π (LC) ^1/2 ) (1)

<Card substrate lamination> After the above steps,
A defect inspection of the antenna coil is performed, and when a defect is detected, a conductive material is stuck or applied to an open portion of the circuit. Then, the antenna coil 1 is placed on the base sheet 121.
3. After the antenna coil connection terminals 141 and 142 and the capacitor 15 are formed, an oversheet is laminated on the upper and lower surfaces of the antenna sheet 121A to produce an integrated card base. After hot pressing, punching is performed into individual card shapes based on the hit rule. After stacking and punching, an inspection is performed by the reading device 20 to remove a card that has a conductive seal or the like and resonates.

<Recessed part cutting / IC module mounting> Thereafter, the IC module mounting concave part is formed by cutting, by counterbore processing, NC processing, or the like, on a card having no defect. A conductive adhesive is applied to the antenna coil connection portion in the mounting concave portion, and a normal insulating adhesive is applied to a portion where the IC module comes into contact with the card base, or is applied to the IC module substrate side or the first concave portion. The insulating adhesive sheet cut into a predetermined shape is temporarily placed, and the IC module is temporarily placed in the mounting recess so that the antenna coil connection terminal of the IC module is in contact with the sheet, and module sealing is performed.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A non-contact type IC card according to an embodiment of the present invention will be described below with reference to FIGS. Reference numerals in the embodiments correspond to reference numerals in the drawings referred to. (Example 1) A non-contact type IC card having a three-layer sheet structure was prototyped according to the first embodiment. As shown in FIG. 1A, a core sheet 121 serving as an antenna sheet has a thickness of 25%.
A substrate was used in which a 35 μm thick copper foil was laminated on both sides of a 0 μm white rigid vinyl chloride substrate. The antenna coil 1 was formed on the copper foil using photo-etching technology.
3. The antenna coil connection terminals 141 and 142 and the capacitor patterns 151 and 152 were formed with 3 × 3 = 9 impositions, and the open portion 16 of the circuit was formed so that the distance between both ends of the circuit was 2 mm. The antenna coil 13 has an outer shape 70.
× 48 mm, line width 1.0 mm, pitch 2.0 mm,
Formed so as to be wound approximately four times around the outer periphery of the card base,
The capacitor pattern was formed in a rectangular shape of 4 × 5 mm via the above-mentioned white rigid vinyl chloride base material. In this case, the measured value of the capacitance of the capacitor was 18 pF, and the self-inductance of the antenna coil was 1.2 μH. The resonance frequency f was 34.24 MHz, which coincided with the calculated value.

At the stage when the antenna coil pattern and the capacitor pattern were formed, a test was visually conducted to determine whether there was any defect in the circuit pattern on the entire surface of the sheet. As a result, 9
Since a broken portion of the coil was detected at one place in the plane, a conductive seal 31 was attached to the open portion 16 of the circuit (FIG. 1).
(B)). As the conductive seal, a seal obtained by applying a conductive adhesive to an aluminum foil having a thickness of 25 μm was used. Thereafter, a white oversheet made of hard vinyl chloride having a thickness of 280 μm was laminated on both surfaces of the antenna sheet 121A, and pressed with heat and pressure to form an integral card base.

After the hot pressing, punching was performed for each card size based on the hitting rule provided in advance. At this stage, the oscillator of the reading device (prototype device) is
When a 34.5 MHz electromagnetic wave was emitted, a response wave was obtained from the card to which the conductive seal was attached.

Next, for a card having no defect, the IC module mounting portion of the card base having the antenna coil embedded therein is subjected to NC cutting to a depth corresponding to the thickness of the external device connection terminal of the IC module and the adhesive sheet. Cut. Subsequently, the both antenna coil connection terminals were further cut to have a size and a depth at which the mold resin portion of the IC module could be embedded. On the other hand, an IC chip having both functions of a contact type and a non-contact type was separately fitted into the concave portion and temporarily placed, and then module sealing was performed. As a result, a contact-type non-contact type common IC card having a card thickness of 800 μm was obtained.

(Example 2) A non-contact type IC card having a three-layer sheet structure was prototyped according to the second embodiment. That is, as shown in FIG. 2 (A), as the core sheet 121 serving as the antenna sheet, a base material in which a white hard vinyl chloride base material having a thickness of 250 μm and a copper foil having a thickness of 35 μm were laminated on both sides was used. The antenna coil 13, the detection coil 17, the antenna coil connection terminals 141, 142, and the capacitor patterns 151, 152 are formed on a copper foil portion of the sheet using a photoetching technique by 3 × 3 = 9 imposition, and a circuit is formed. The open portion 16 was formed such that the distance between both ends of the circuit became 2 mm. The antenna coil 13 has an outer shape of 55 × 48
mm, a line width of 1.0 mm, and a pitch of 2.0 mm, and were formed so as to be wound substantially four times around the outer periphery of the card base.

The capacitor patterns 151 and 152 have an outer shape of 10 mm × 10
mm, and the detecting coil 17 has a line width of 1 m.
m, one turn, formed into a circular shape of φ20 mm. In this case, the measured value of the capacitance of the capacitor was 60 pF, and the self-inductance of the detection coil was 83 nH. The resonance frequency f was 71.32 MHz, which coincided with the calculated value.

At the stage when the antenna coil pattern and the capacitor pattern were formed, a test was visually conducted to determine whether there was any defect in the circuit pattern on the entire surface of the sheet. As a result, 9
Since a broken portion of the coil was detected at one place on the surface, conductive ink 32 was applied to the open portion 16 of the circuit (FIG. 2).
(B)). As the conductive ink, a conductive ink for silk screen printing made of a silver paste was used. afterwards,
A white oversheet made of hard vinyl chloride having a thickness of 280 μm is laminated on both sides of the antenna sheet 121A, and heat is applied thereto.
It was pressed to form an integral card base.

After the hot press, punching was performed for each card size based on the hitting rule provided in advance. At this stage, when a microwave oscillator of a reading device (prototype device) radiated an electromagnetic wave of 71.0 to 71.5 MHz, a response wave was obtained from the card coated with the conductive ink. Thereafter, the IC module was sealed in the same manner as in Example 1 for the card having no defect.

[0031]

According to the method of manufacturing a non-contact type IC card of the present invention, a mark of a defective product can be obtained without relying on visual marking.
By installing an antenna coil and a capacitor in addition to this,
Alternatively, a resonant circuit consisting of a coil and a capacitor is formed independently, and the open part of the circuit is connected with a conductive seal or the like to mark the defective product, and the defective product can be detected by electrical operation in a later process. Therefore, it is possible to efficiently perform the extraction work without any trouble in detecting the defective product. Therefore, it is possible to prevent mixing of defective products and waste of post-process components, and to improve productivity.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of a method for manufacturing a non-contact type IC card according to the present invention.

FIG. 2 shows a second embodiment of the method for manufacturing a non-contact type IC card of the present invention.

FIG. 3 is a perspective view showing a manufacturing process of a conventional non-contact type IC card.

FIG. 4 is a sectional view showing a subsequent manufacturing process of the non-contact type IC card.

[Explanation of symbols]

 5 Card Base 10 IC Card 11 IC Module 12 Card Base 13 Antenna Coil 14 Antenna Coil Connection Terminal 15 Defect Detection Capacitor 16 Circuit Opening Part 17 Detection Coil 18 IC Module Mounting Part 20 Reading Device 21 Reading Device Head 31 Conductivity Seal 32 Conductive ink 41 Punch hole 42 Color mark 51 IC module 52 Card base 53 Antenna coil 54 Antenna coil connection terminal 121 Core sheet 131, 132 Through hole 141, 142 Antenna coil connection terminal 151, 152 Capacitor pattern

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA21 NA09 PA01 PA18 PA27 RA02 RA08 TA21 TA22 5B035 BB09 CA01 CA23 5K012 AA01 AA07 AB05 AC06 BA03

Claims (5)

[Claims] In a manufacturing process of manufacturing a non-contact type IC card having an antenna coil in a card base by laying a plurality of cards on one sheet, a plurality of base materials to be a core sheet of the card base are provided. Forming antenna coils in accordance with the number of card impositions; forming capacitors capable of forming a resonance circuit that resonates with the respective antenna coils at a specific frequency; Forming a state in which the antenna coil has multiple defects; detecting the presence / absence of a defect in each of the multiple antenna coils; adhering or applying a conductive material to an open portion of the circuit of the capacitor in the antenna coil portion where the defect has been detected; Laminating the oversheet on the core sheet on which the antenna coil is formed, and applying the specific frequency to the individual resonance circuit portions after lamination. A step of confirming the presence or absence of an electromagnetic wave that responds by emitting an electromagnetic wave including
A method for manufacturing a non-contact type IC card, comprising: 2. In a manufacturing process of manufacturing a non-contact type IC card having an antenna coil in a card base by arranging a plurality of cards on a single sheet, a plurality of cards are provided on a base material serving as a core sheet of the card base. Forming antenna coils in accordance with the number of card impositions; an antenna coil and a capacitor that resonate at a specific frequency are provided in each of the areas of one card close to the respective antenna coils; A step of forming a state having openings at close intervals; a step of detecting presence / absence of a defect in each of the multi-faced antenna coils; a conductive material in an opening of the circuit of the capacitor of the antenna coil part where the defect is detected; Attaching or coating the antenna sheet, laminating the oversheet on the core sheet on which the antenna coil is formed, and sharing the individual sheets after the lamination. A step of radiating an electromagnetic wave containing the specific frequency to the vibration circuit portion and confirming the presence or absence of an electromagnetic wave that responds;
A method for manufacturing a non-contact type IC card, comprising: 3. The non-contact type IC according to claim 1, wherein the conductive material is a conductive seal.
Card manufacturing method. 4. The non-contact type IC according to claim 1, wherein the conductive material is a conductive ink.
Card manufacturing method. 5. A non-contact type IC card manufactured by the manufacturing method according to claim 1 or 2, wherein a capacitor for detecting a defect is provided in the laminated card base. IC card.