JP2000117171A - Paste coating method and paste coater - Google Patents

Abstract

PROBLEM TO BE SOLVED: To draw a paste pattern different in width or height of a coating paste with high accuracy. SOLUTION: A nozzle 13a is supported on a paste housing cylinder 13 through a nozzle support jig 13b and a communication passage 13e for sending paste 33 to the nozzle 13a from the paste housing cylinder 13 is provided in the nozzle support jig 13b. Further, a valve part 13d is provided in the nozzle support jig 13b and moved in the direction shown by an arrow by an actuator 13c to change the paste passing area of the communication passage 13e to change the flow rate of the paste from the paste emitting orifice of the nozzle 13a. When the paste height or width of the paste pattern drawn on a substrate is changed, the flow rate of the paste and at least one of nozzle height and a drawing speed are changed synchronously.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste applying method and a paste applying machine, and more particularly, to a method of mounting a substrate on a table so as to face a discharge port of a nozzle, Maintaining a predetermined relative distance between the nozzle and the substrate in the direction, and discharging the paste filled in the paste container from the discharge port onto the substrate, the main body of the substrate between the nozzle and the nozzle. The present invention relates to a paste applying method and a paste applying machine for drawing paste patterns having different widths and heights on a substrate by changing a relative positional relationship on a surface.

[0002]

2. Description of the Related Art In a conventional paste coating machine, the shape of a paste pattern formed on a substrate mounted on a table (ie, the height and width of the coating paste) depends on the coating pressure, the substrate and the tip of the nozzle. It is given by controlling the relative distance between the paste discharge port (hereinafter referred to as nozzle height) and the drawing speed (relative speed between the substrate and the nozzle).

[0003] Then, drawing of the paste on the substrate surface is performed as follows.
A pneumatic discharge method that applies a slight air pressure from the positive pressure source to the paste storage cylinder containing the paste via the positive pressure regulator and the valve unit, and discharges the paste onto the substrate from the paste discharge port at the tip of the nozzle And by changing the relative positional relationship between the substrate and the nozzle on the main surface of the substrate.

[0004]

SUMMARY OF THE INVENTION In a paste coating machine,
In order to draw paste patterns with different paste application widths and heights, it is necessary to control the flow rate of paste from the nozzle discharge port at high speed, high precision, and over a wide range, and control it in synchronization with the drawing speed and nozzle height. There is.

However, in the pneumatic discharge method, since the response of the paste flow rate from the paste discharge port to the air pressure applied to the paste storage cylinder is poor, the paste flow rate is synchronized with the drawing speed and the nozzle height during the paste application operation. Such control could not be performed.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem, to control the flow rate of paste at high speed and with high precision, and to draw a paste pattern having a different width and height of a coating paste with high precision. To provide a paste applying method and a paste applying machine.

[0007]

In order to achieve the above-mentioned object, a paste application method according to the present invention makes it possible to change a passage area of a paste in a communication passage between a paste storage cylinder and a nozzle to draw a paste pattern. The paste height of the paste pattern to be drawn on the substrate based on the paste flow rate at the discharge port of the nozzle, the relative distance between the substrate and the nozzle, and the drawing speed, which give a predetermined paste height or paste width on the substrate to be formed Alternatively, the paste flow rate is changed in proportion to the paste width change amount by adjusting the paste passage area of the communication passage, and at least one of the relative distance between the substrate and the nozzle and the drawing speed is changed. To do it.

Further, the paste applicator according to the present invention comprises a flow control means for controlling a paste flow rate at a discharge port of the nozzle by changing a passage area of the paste in a communication passage between the paste storage cylinder and the nozzle; The paste height of the paste pattern to be drawn on the substrate, based on the paste flow rate at the discharge port of the nozzle giving a predetermined paste height or paste width on the substrate, the relative distance between the substrate and the nozzle, and the drawing speed. Alternatively, a flow rate changing means for changing the paste flow rate by the flow rate control means in proportion to the change amount of the paste width, and changing the paste flow rate by the flow rate changing means and at least the relative distance between the substrate and the nozzle and the drawing speed. And changing means for changing one of them.

According to this structure, the flow rate of the paste at the discharge port of the nozzle can be changed quickly, so that paste patterns having different paste heights and paste widths can be formed on the substrate with high precision.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing one embodiment of a paste coating method and a paste coating machine according to the present invention, wherein 1 is a gantry, 2a and 2b are substrate transport conveyors, 3 is a support table, 4 is a substrate suction disk, and 5 is θ axis movement table, 6a,
6b is an X-axis movement table, 7 is a Y-axis movement table, 8
a and 8b are servomotors, 9 is a Z-axis movement table, 10
Is a servo motor, 11 is a ball screw, 12 is a servo motor, 13 is a paste storage cylinder (syringe), 14 is a distance meter, 15 is a support plate, 16a and 16b are image recognition cameras,
17 is a control unit, 18 is a monitor, 19 is a keyboard, 20
Is a personal computer having an external storage device, and 21 is a cable.

In FIG. 1, a gantry 1 has two board conveyors 2a parallel to the X-axis direction and capable of moving up and down.
2b is provided to convey a substrate (not shown) from the back of the drawing to the front, that is, horizontally in the X-axis direction. A support 3 is provided on the gantry 1.
The substrate suction board 4 is placed on the substrate via a θ-axis moving table 5. The θ-axis moving table 5 rotates the substrate suction plate 4 in the θ direction about the Z-axis.

On the gantry 1, there are further provided X-axis moving tables 6a and 6b outside the board transfer conveyors 2a and 2b and parallel to the X-axis. These X-axis moving tables 6a and 6b are provided.
A Y-axis moving table 7 is provided so as to extend between 6b. The Y-axis moving table 7 is horizontally moved in the X-axis direction by the forward or reverse rotation (forward / reverse rotation) of the servo motors 8a, 8b provided on the X-axis moving tables 6a, 6b. Conveyed. On the Y-axis moving table 7, there is provided a Z-axis moving table 9 which moves in the Y-axis direction by forward and reverse rotation of a ball screw 11 driven by a servo motor 10.
The Z-axis moving table 9 is provided with a support plate 15 for supporting and fixing the paste storage tube 13 and the distance meter 14. The servo motor 12 provides the paste storage tube 13 and the distance meter 14 on the support plate 15. Is moved in the Z-axis direction via a movable portion of a linear guide (not shown). The paste storage cylinder 13 is detachably attached to the movable portion of the linear guide. An image recognition camera 16 for positioning a substrate (not shown) is provided on the top plate of the gantry 1.
a, 16b are provided facing upward.

Inside the gantry 1, servo motors 8a, 8
b, 10, 12, 24 (not shown), etc., and a control unit 17 is provided.
The control unit 17 is connected to a monitor 18, a keyboard 19, and a personal computer main body 20 via a computer 1. Data for various processes in the control unit 17 is input from the keyboard 19, and the images and control captured by the image recognition cameras 16 a and 16 b The processing status of the unit 17 is displayed on the monitor 18. The data input from the keyboard 19 is stored in a storage medium such as a floppy disk in an external storage device of the personal computer 20.

FIG. 2 is an enlarged perspective view showing the paste storage cylinder 13 and the distance meter 14 shown in FIG.
a is a nozzle, 13b is a nozzle support, 13c is an actuator, 22 is a substrate, 23 is a paste pattern,
Parts corresponding to those in FIG. 1 are denoted by the same reference numerals.

In FIG. 1, the distance meter 14 has a triangular cutout at the lower end, and a light emitting element and a plurality of light receiving elements are provided in the cutout. Nozzle 13a supported by paste storage cylinder 13 by nozzle support 13b
Is located below this cut in the rangefinder 14. The distance meter 14 measures the distance (that is, nozzle height) from the paste discharge port at the tip of the nozzle 13a to the surface (upper surface) of the substrate 22 made of glass or the like by non-contact triangulation. That is, a light emitting element is provided on one side of the triangular cut portion, and the laser light L emitted from this light emitting element is reflected at the measurement point S on the substrate 22, and the other end of the cut portion. The light is received by any of the plurality of light receiving elements provided on the slope. The nozzle height is detected depending on which light receiving element receives the laser beam L. In this case, the laser light L is not blocked by the paste container 13 or the nozzle 13a.

An actuator 13c is provided on a side surface of the nozzle support 13b, so that a valve provided in a communication passage from the paste storage cylinder 13 to the nozzle 13a in the connecting portion 13b as described later. The opening degree of the portion is adjusted, and the discharge amount of the paste from the discharge port of the nozzle 13a is controlled.

The measurement point S of the laser beam L on the substrate 22 and the position on the substrate 22 just below the paste discharge port of the nozzle 13a are displaced by a small distance ΔX, ΔY. , ΔY, there is no difference in the undulation (irregularity) of the surface of the substrate 22, and there is almost no difference between the measurement result of the distance meter 14 and the nozzle height. Therefore, by controlling the servo motor 12 based on the measurement result of the distance meter 14, the nozzle height can be kept constant in accordance with the undulation of the surface of the substrate 22, and the paste applied on the substrate 22 The width and height of the application paste in the pattern 23 become uniform.

FIG. 3 is a block diagram showing the structure of the control unit 17 shown in FIG. 1, the control of the air pressure of the paste storage cylinder 13, and the system of control of the substrate 22, wherein 17a is a microcomputer, and 17b is a motor. -Tacon Controller, 17c1, 17
c2 is an X1, X2 axis driver, 17d is a Y axis driver,
17e is a θ axis driver, 17f is a Z axis driver, 17g
Is a data communication bus, 17h is an external interface, 2
4 is a servo motor for driving the .theta. Axis moving table 5 (FIG. 1), 25 to 29 are encoders, 30 is a positive pressure source, 30a is a positive pressure regulator, 31 is a negative pressure source, and 31a is a negative pressure regulator. , 32 are valve units, and portions corresponding to FIGS. 1 and 2 are denoted by the same reference numerals.

In FIG. 1, a control unit 17 includes a microcomputer 17a, a motor controller 17b, X,
Y, Z, and θ axis drivers 17c1 to 17f, an image processing device 17i for processing video signals obtained by the image recognition cameras 16a and 16b, an external device for transmitting signals to the keyboard 19, and the like. It has an interface 17h. The control unit 17 further controls the substrate transport conveyor 2
Although drive control systems a and 2b are included, they are not shown here.

Although not shown, the microcomputer 17a includes a main processing unit, a ROM storing a processing program for drawing a paste to be described later, processing results in the main processing unit, and an external interface. RAM for storing input data from the motor controller 17h and the motor controller 17b;
External interface 17h or motor controller 17
It has an input / output unit for exchanging data with b.
Each of the servomotors 8a, 8b, 10, 12, and 24 is provided with encoders 25 to 29 for detecting the amount of rotation, and outputs the detection results to the X, Y, Z, and θ axis drivers. 17
The position control is performed by returning to c1 to 17f.

The servomotors 8a, 8b and 10 are keyboads.
Input from the computer 19 and the R of the microcomputer 17a.
By rotating forward and backward based on the data stored in the AM, the nozzle 1 is moved to the substrate 22 vacuum-adsorbed to the substrate suction disk 4 (FIG. 1) by the negative pressure distributed from the negative pressure source 31.
3a (FIG. 2) is moved through a Z-axis movement table 9 (FIG. 1).
The microcomputer 17a moves an arbitrary distance in the X and Y axis directions, and during the movement, the microcomputer 17a controls the valve unit 32, so that the positive pressure source 30
A slight air pressure is applied to the paste container 13 through the valve support 32 and the valve unit 32, and the actuator 17c is driven from the microcomputer 17a via the data communication bus 17g and the external interface 17h. The opening of the valve portion in 13b (FIG. 2) is adjusted to control the amount of paste discharged from the nozzle 13a, and the paste is discharged from the paste discharge port of the nozzle 13a and the desired paste pattern is formed on the substrate 22.
Is drawn. During the horizontal movement of the Z-axis moving table 9 in the X and Y-axis directions, the distance meter 14
The servo motor 12 is controlled by a Z-axis driver 17f so as to measure the distance between a and the substrate 22 and to keep this distance constant.

FIG. 4 is a flowchart showing the operation of the embodiment shown in FIG.

In FIG. 1, when the power is turned on (step 100), first, the initial setting of the paste applying machine is executed (step 200).
In FIG. 1, by driving servo motors 8a, 8b, 10, 12, the Z-axis moving table 9 is moved to X, Y, Z.
The nozzle 13a (FIG. 2) is moved to a predetermined reference position, and the nozzle 13a (FIG. 2) is set at a predetermined origin position such that the paste discharge port is at a position where paste drawing is started (ie, a paste drawing start point). , And
This sets the paste pattern data, the substrate position data, the paste discharge end position data, and the measured position data of the drawn paste pattern. The input of such data is performed from the keyboard 19 (FIG. 1), and the input data is transmitted to the microcomputer 17 as described above.
a (FIG. 3).

When the initial setting process (step 200) is completed, the actual substrate on which the paste is to be applied and drawn in a desired pattern is mounted on the substrate suction plate 4 (FIG. 1) and held by suction (step 200). 300). This board mounting process is performed by the board transfer conveyors 2a and 2b (FIG. 1).
2 is transported in the X-axis direction to a position above the substrate suction plate 4, and FIG.
The substrate 22 is mounted on the substrate suction plate 4 by lowering the substrate transport conveyors 2a and 2b by a lifting means (not shown).

Next, a substrate pre-positioning step (step 4)
00). In this step, the positioning of the substrate 22 in the X and Y directions is performed by a positioning chuck (not shown) in FIG. Further, the mark for positioning the substrate 22 mounted on the substrate suction plate 4 is photographed by the image recognition cameras 16a and 16b, and the position of the center of gravity of the mark for positioning is determined by image processing to determine the position of the substrate 22 in the θ direction. The inclination is detected, and the servomotor 24 (FIG. 3) is driven in accordance with the inclination.
The inclination in the θ direction is also corrected.

When the amount of the remaining paste in the paste container 13 is small, the paste container 13 and the nozzle 13a are previously moved together with the nozzle 13a so that the paste is not interrupted during the drawing operation of the next paste. When the nozzle 13a is replaced in this manner, the nozzle 13a may be displaced. For this reason, cross drawing is performed using a new nozzle 13a that has been replaced with a portion where a paste pattern is not formed on the substrate 22, and the center of gravity of the intersection of the cross drawing is determined by image processing.
The distance between the center of gravity of the positioning mark and the center of gravity of the mark is calculated, and the calculated distance is stored in the RAM incorporated in the microcomputer 17a as the positional displacement dx, dy of the paste discharge port of the nozzle 13a. Thus, the substrate pre-positioning step (Step 400) is completed. The positional deviation amounts dx and dy of the nozzles 13a are used to correct the positional deviation during a paste pattern drawing operation performed later.

Next, a paste pattern drawing step (step 500) is performed. In this step, in order to position the paste discharge port of the nozzle 13a at the drawing start position, the Z-axis moving table 9 is moved, and the nozzle position is compared and adjusted.

For this purpose, first, the micro-computer obtained in the preceding substrate pre-positioning step (step 400) is used.
It is determined whether or not the positional deviation amounts dx and dy of the nozzle 13a stored in the RAM of the data 17a are within the allowable ranges ΔX and ΔY of the positional deviation amount of the nozzle 13a shown in FIG. And within the allowable range (△ X ≧ dx and △ Y ≧ dy)
If it is out of the permissible range (△ X <dx or △ Y <dy), the Z-axis moving table 9 is moved based on the positional deviation amounts dx and dy, and the paste storage cylinder 13 is moved.
Is moved in the X and Y axis directions, so that the nozzle 13a
And the nozzle 13a is positioned at the desired position.

Next, the nozzle height is set. When the paste container 13 has not been replaced, the nozzle 13
Since there is no data of the displacement amounts dx and dy of a, the nozzle height is set immediately upon entering the paste pattern drawing step (step 500). This set height is such that the distance from the paste discharge port of the nozzle 13a to the substrate 22 is equal to the height of the application paste.

When the above steps are completed, the servo motors 8a, 8b, and 10 are driven based on the paste pattern data stored in the RAM of the microcomputer 17a. The nozzle 13 moves in the X and Y directions in accordance with the paste pattern data while facing the nozzle 22, and applies a pressure based on the data set in the paste storage cylinder 13 to apply a pressure to the paste discharge port of the nozzle 13 a. Of the paste from the paste discharge port is controlled by operating a valve unit (not shown) by the actuator 13c (FIG. 3) according to the set paste pattern data. Start drawing the paste pattern to the.

At the same time, as described above, the microcomputer 17a inputs the actual measurement data of the nozzle height from the distance meter 14, measures the undulation of the surface of the substrate 22, and calculates the measured value. By driving the servomotor 12 accordingly, the nozzle height is maintained at a desired constant value.

As described above, the drawing of the paste pattern proceeds. It is determined whether or not the drawing operation of the paste pattern has been completed based on the above-mentioned paste pattern data. It is determined whether or not to continue the discharge.

In this paste pattern drawing step (step 500), the paste discharge port of the nozzle 13a is
By judging whether or not it is at the end of the paste pattern determined by the above paste pattern data, if it is not at the end, the process returns to the measurement of the surface undulation of the substrate again.
Thereafter, the above steps are repeated until the paste pattern formation reaches the end of the paste pattern. When the paste discharge port reaches the end of the paste pattern, the servo motor 12 is driven to raise the nozzle 13a, and the paste pattern drawing step (step 50) is performed.
0) is ended.

FIG. 5 is a sectional view showing a specific example of a control mechanism for adjusting the flow rate of the paste from the paste discharge port, wherein 13d is a valve section, 13e is a communication path, and 33 is a paste. The same reference numerals are given to the portions corresponding to and the duplicate description will be omitted.

In FIG. 3, a communication passage 13e for the paste 33 extending from the bottom of the paste storage tube 13 to the nozzle 13a is provided in the nozzle support 13b. In this specific example, the communication passage for the paste storage tube 13 is provided. A control mechanism for adjusting a flow rate of the paste 33 (hereinafter, referred to as a paste flow rate) is provided near an outlet of the paste 33 to the paste 13e.

The flow rate control mechanism section includes an actuator 1
The actuator 13c is provided outside the nozzle support 13b, and the valve 13d is provided inside the nozzle support 13b. This valve portion 13d is provided with an actuator 13c
As shown by an arrow, the valve section 1 can be moved in a horizontal direction across the communication passage 13e.
By the movement of 3d, the passage area of the communication passage 13g changes (that is, the opening degree is adjusted), and the paste flow rate from the paste discharge port of the nozzle 13a is adjusted.

FIG. 6 is a cross-sectional view showing another specific example of the control mechanism for adjusting the flow rate of the paste from the paste discharge port. The parts corresponding to those in FIG. I do.

In this figure, this specific example shows a communication path 13
e, a valve portion 13d is provided near the outlet of the paste 33 to the nozzle 13a, and an actuator 13c is provided near the valve portion 13d and outside the nozzle support 13b. In this case, as indicated by an arrow, the valve portion 13d is movable in the longitudinal direction (horizontal direction) of the communication passage 13e by the action of the actuator 13c, and the valve portion 13d makes such a movement, whereby the valve 13d is moved to the nozzle 13a. The paste passage area at the inlet changes, and the paste flow rate from the paste discharge port of the nozzle 13a changes.

FIG. 7 is a cross-sectional view showing still another specific example of the control mechanism for adjusting the flow rate of the paste from the paste discharge port. Parts corresponding to those in FIG. Omitted.

In the same figure, this specific example shows a communication path 13
The valve part 13d is provided in the middle of e, and the actuator 13c is provided outside the nozzle support 13b near the valve part 13d. This valve part 13
As shown by an arrow, d can move in the vertical direction across the communication passage 13e by the action of the actuator 13c, and the movement of the valve portion 13d changes the passage area of the communication passage 13g. The paste flow rate from the paste discharge port of the nozzle 13a is adjusted.

FIG. 8 is a timing chart showing the operation when the height and width of the coating paste are varied in the paste pattern drawing step (step 500) of FIG. The changes in the nozzle height and the drawing speed are shown.

At the start of drawing of a paste pattern (time t ₀ ), the nozzle height is set to an initial value H1, and thereafter, the paste flow rate is controlled using Q1 as a target value (that is, the microcomputer 17 (FIG. 3)). ) Is the actuator 13c
To control the passage area of the communication passage 13g (FIGS. 5 to 7) so that the paste flow rate becomes the target value Q1).
Is started, the drawing speed is controlled in synchronization with the start of the discharge of the paste with V1 as the target value, and the drawing speed is controlled so as to maintain this state until the paste height T1 changes. The width of the applied paste pattern (hereinafter, referred to as paste width) is W1.

Next, the case where the paste height is changed from T1 to T2 at time t _1, with the nozzle height is set to the setting value H2, paste flow starts controlling the Q2 as a target value, the drawing speed Is started at the same time as the paste flow rate control with V2 as the target value, and is controlled to maintain this state until the paste height changes to T2. The paste width at this time does not change and remains at the width W1.

Next, if at time t ₂ to change the paste height from T2 to T3, with the nozzle height is set to the set value H3, the paste flow rate Q3 starts controlling the target value, the drawing speed Starts the control in synchronization with the paste flow rate control with V3 as the target value, and the paste height becomes T3.
The state is controlled so as to maintain this state until it changes to.
The paste width at this time does not change and remains at the width W1.

Next, W paste width from W1 at time t ₃
When changing to 2, the nozzle height is kept at the set value H3, and the paste flow rate starts controlling with Q4 as a target value,
The drawing speed is controlled to be V3, and this state is maintained until the paste width changes to W2.

When the paste width is changed from W1 to W2, as shown by the dashed line, the nozzle height is kept at the set value H3, the paste flow rate is kept at Q3, and the target value of the drawing speed is changed from V3. The control may be started by changing to V4.

When the drawing of the paste pattern is finished (time t ₄ ), the nozzle height is kept at the immediately preceding set value (set value H3 in FIG. 8). Speed is assumed to be zero.

Further, although not shown in FIG. 8, the nozzle 13a is raised to a stand-by height after a set time,
A series of coating and drawing operations for changing the paste pattern shape during drawing is completed.

As described above, the flow rate of the paste, the nozzle height, and the drawing speed change every time the width and height of the coating paste are changed, that is, in synchronization with the change of the paste pattern into a desired shape. The change in the nozzle height and the drawing speed is triggered by the start of paste flow control. In addition, the control of the paste flow rate during drawing is performed by monitoring the position data of the paste pattern data and, when reaching the change point of the paste flow rate according to the position data, using this as a trigger.

Returning to FIG. 4, when the above-described paste pattern drawing step (step 500) is completed, the process proceeds to a substrate discharging step (step 600). In this step, FIG.
, The suction of the substrate 22 to the substrate suction disk 4 is released,
The substrate transport conveyors 2a and 2b are lifted, and the substrate 22 is placed thereon, and the substrate transport conveyors 2a and 2b are discharged from the apparatus by moving in the X-axis direction.

Then, it is determined whether or not all the above steps are to be stopped (step 700). When a paste film is formed on a plurality of substrates with the same pattern, the operation is repeated from the substrate mounting step (step 300) for another substrate, and the series of steps is completed for all substrates. Then (step 800), all the operations are completed.

In the above embodiment, the nozzle 13a is moved and the substrate 22 is fixed. However, the present invention is not limited to this, and the nozzle 13a is fixed and the substrate 22 is moved. You may do so.

As described above, in this embodiment, since the paste flow rate control mechanism with good responsiveness is provided as the paste discharging means, the paste flow rate can be controlled in synchronization with the nozzle height and the drawing speed. It becomes possible to draw paste patterns with different widths and heights of the application paste.

Since the paste flow control mechanism is provided in the communicating portion between the paste storage cylinder 13 and the nozzle 13a, the paste passage can be blocked while the paste application is stopped. It is possible to prevent dripping from the paste discharge port of the nozzle 13a, which has been generated due to the head difference of the paste inside, and it is sufficient to keep the discharge pressure of the paste applied. Become.

Further, since the dripping can be prevented as described above, it is not necessary to raise the nozzle and apply a negative pressure to the paste container when drawing to the end of the paste pattern, which has been performed as a measure against dripping. Therefore, the tact time, that is, the productivity can be improved.

[0056]

As described above, according to the present invention,
A desired paste pattern composed of application pastes having different widths and heights can be drawn with high accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a paste applicator according to the present invention.

FIG. 2 is an enlarged perspective view showing a paste storage cylinder and a distance meter in FIG. 1;

FIG. 3 is a block diagram showing a configuration of a control unit and its control system in FIG. 1;

FIG. 4 is a flowchart showing an overall operation of the embodiment shown in FIG. 1;

FIG. 5 is a cross-sectional view showing a specific example of a paste flow control mechanism of the embodiment shown in FIG. 1;

FIG. 6 is a cross-sectional view showing another specific example of the paste flow control mechanism of the embodiment shown in FIG. 1;

FIG. 7 is a cross-sectional view showing still another specific example of the paste flow control mechanism of the embodiment shown in FIG. 1;

FIG. 8 is a timing chart showing an operation in a paste pattern drawing step of FIG. 4;

[Explanation of symbols]

 5 θ-axis moving table 6a, 6b X-axis moving table 7 Y-axis moving table 9 Z-axis moving table 13 Paste storage cylinder 13a Nozzle 13b Nozzle support 13c Actuator 13d Valve section 13e Communication path 14 Distance meter 17 Control unit 22 Substrate 23 Paste pattern 30 Positive pressure source 30a Positive pressure regulator 32 Valve unit 33 Paste

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Fukuo Yoneda 5-2-2 Koyodai, Ryugasaki-city, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. (72) Inventor Haruo Mikai 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki F-term (Reference) 4D075 AC06 AC84 AC88 AC92 AC93 AC94 CA48 DA06 DB14 DC22 EA14 4F041 AA06 AB01 BA05 BA22 BA34 BA38 BA56 4F042 AA06 BA03 BA04 BA08 BA12 BA25 CB07

Claims (2)

[Claims] 1. A substrate is placed on a table so as to face a discharge port of a nozzle, and a relative distance between the nozzle and the substrate in a direction perpendicular to a main surface of the substrate is maintained as desired. And
By changing the relative positional relationship between the substrate and the nozzle on the main surface of the substrate while discharging the paste filled in the paste storage tube from the discharge port onto the substrate, a paste pattern having a desired shape is formed on the substrate. In a paste application method for drawing a pattern, a paste flow rate at a discharge port of the nozzle that gives a predetermined paste height or a paste width on the substrate, a relative distance between the substrate and the nozzle, and a drawing speed are used as references. The paste flow rate is changed in proportion to the change amount of the paste height or the paste width of the paste pattern to be drawn by adjusting the paste passage area provided in the communication passage between the paste storage cylinder and the discharge port. And applying at least one of the relative distance between the substrate and the nozzle and the drawing speed. Method. 2. A substrate is placed on a table so as to face a discharge port of a nozzle, and a relative distance between the nozzle and the substrate in a direction perpendicular to a main surface of the substrate is maintained as desired. And
By changing the relative positional relationship between the substrate and the nozzle on the main surface of the substrate while discharging the paste filled in the paste storage tube from the discharge port onto the substrate, a paste pattern having a desired shape is formed on the substrate. A flow rate controlling means for controlling a paste flow rate at a discharge port of the nozzle by changing a paste passage area of a communication path between the paste storage cylinder and the discharge port; The paste flow rate at the discharge port of the nozzle, which gives a predetermined paste height or an arbitrary paste width at
Flow rate changing means for changing a paste flow rate by the flow rate control means in proportion to a change amount of a paste height or a paste width of a paste pattern to be drawn on the substrate with reference to a relative distance and a drawing speed between the substrate and the nozzle; And a changing means for changing at least one of the relative distance between the substrate and the nozzle and the drawing speed while changing the paste flow rate by the flow rate changing means.