JP2000113954A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of effectively functioning a pressing member or radiating members in cooperation with a vertically moving actuator. SOLUTION: The socket main body 1 of this IC socket is provided with a pressing member 22 or radiating members 23, the external contacts 4 of an IC package 2 mounted on the socket body 1 are pressed into contact with the contacts 5 provided on the socket body 1 by the pressing member 22, or the radiating members 23 are pressed to the upper face of the IC package 2 for heat radiation. The pressing member 22 or the radiating members 23 are rotatably supported between a pair of arms 24, 25 extended in parallel, and the arms 24, 25 are rotatably supported on the socket body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC holding structure or an IC heat radiation structure attached to an IC socket.

[0002]

2. Description of the Related Art The above IC
As shown in Japanese Patent Publication No. 3-68513, a holding structure is known in which one end of a holding cover is rotatably attached to one end of a socket body, and a holding member is rotatably provided on the holding cover. .

However, in the above IC socket, the assembly of the cover and the pressing member widely covers the upper surface and the periphery of the IC package, hindering the heat radiation effect, and contributing to the problem of the warpage of the cover caused by this heat and reducing the pressing effect. I do. Further, it is necessary to prepare covers of different sizes for changing the size of the holding member.

[0004] These disadvantages can be effectively solved by the structure of the present invention in which the holding member is rotatably bridged between a pair of parallel extending rotating arms.

As a heat radiation structure of an IC package in an IC socket, as disclosed in Japanese Patent No. 2656901, one end of a holding cover is rotatably attached to one end of a socket body, and an opening formed in the center of the holding cover. A heat dissipating member is fixedly mounted inside, and a portion protruding inward from the opening is brought into contact with the upper surface of the IC package.

However, in the above IC socket, one end of the heat radiating member comes in contact with the upper surface of the IC package in advance with the downward rotation of the cover, so that the IC package moves up and down, resulting in a positional shift. The external contact or the deformation of the contact.

Further, the assembly of the holding cover and the heat radiating member is
The heat radiation effect is hindered by widely covering the upper surface and the periphery of the C package, and the problem of the warpage of the cover caused by this heat is promoted.
Poor contact of the heat dissipating member with the upper surface of the C package is caused, and the heat dissipating effect is deteriorated. In addition, different size covers must be prepared for the change in the size of the heat dissipating member.

These drawbacks can be effectively solved by the structure according to the present invention in which the heat radiating member is rotatably bridged between a pair of parallel extending arms.

[0009] As shown in Japanese Patent Publication No. Hei 6-105630,
A socket for vertically opening and closing an IC package positioning lever and a contact by providing an actuator that moves vertically up and down with respect to the socket body is often used, but the present invention cooperates with the actuator that moves vertically to form a pressing member or a heat radiating member. An IC socket capable of functioning effectively is provided.

[0010]

More specifically, according to the present invention, a holding member is provided on the socket body, and the external contact of the IC package mounted on the socket body is brought into press contact with the contact provided on the socket body by the holding member. In the above-described IC socket, there is provided an IC socket having a pressing structure in which the pressing member is rotatably supported between a pair of arms extending in parallel and the arm is rotatably supported by the socket body. I do.

With this holding structure, a sufficient heat radiating space is secured between the pair of arms, and the problem of the warping of the cover due to the heat and the holding failure due to the warping is effectively solved.

Also, the pair of arms can be assembled with an interval suitable for IC sockets of different sizes, and can be used to support pressing members of different sizes, which is economical.

The present invention further comprises an actuator vertically movable on the upper portion of the socket body, wherein the holding member is rotated upward when the actuator is lowered to form a holding release state, and is rotated downward when the actuator is raised. Provided is an IC socket that is pressed to form a holding state.

In the present invention, the actuator may be provided with a central opening for permitting the mounting of the IC package on the socket body, and the holding member may be rotated upward through the central opening when the actuator is lowered, so that the pressing is performed. Provided is an IC socket configured to form a release state and open a mounting space for an IC package.

The above-mentioned IC socket allows the actuator to be effectively moved up and down by the robot while effectively acting the actuator on the holding member so that the function thereof can be properly exerted. The purpose of mounting the package on the socket body can be achieved without any trouble.

According to the present invention, there is provided an IC socket provided with a heat radiating member for forming a heat radiating state by contacting an upper surface of an IC package mounted on a socket body, wherein the heat radiating member is turned between a pair of arms extending in parallel. An IC socket having a radiating member mounting structure movably supported and the arm rotatably supported by the socket body.

With this heat radiation structure, a sufficient heat radiation space is secured between the pair of arms, and the problem of the cover being warped due to the heat and the holding failure due to the warp is effectively solved.

Further, the pair of arms can be assembled with an interval suitable for IC sockets of different sizes, and can be used for supporting heat dissipating members of different sizes, which is economical.

The present invention further comprises an actuator vertically movable on the upper portion of the socket body, wherein the heat radiating member is rotated upward when the actuator is lowered to form a heat release state for the IC package, and is lowered when the actuator is raised. Provided is an IC socket that is rotated to form the heat radiation state.

In the present invention, the actuator may be provided with a central opening for allowing the mounting of the IC package on the socket body, and the heat radiating member is rotated upward through the central opening when the actuator is lowered, so that the heat radiating is performed. Provided is an IC socket configured to form a release state and open a mounting space for an IC package.

The above-mentioned IC socket allows the actuator to be effectively moved up and down by the robot, and the actuator to be effectively acted on the heat dissipating member so that the function thereof can be properly exerted. The purpose of mounting the package on the socket body can be achieved without any trouble.

[0022]

1 to 11, reference numeral 1 denotes a socket body made of an insulating material having a substantially rectangular shape in plan view, 2 denotes an IC package, and the IC package 2 is a socket body 1.
Is mounted in an IC mounting space 3 formed in the center of the upper surface of the IC package 2, and the external contacts 4 of the IC package 2 are brought into contact with the contacts 5 held by the socket body 1.

The IC package 2 has a large number of external contacts 4 on its bottom surface. The external contacts 4 are formed of conductive balls, conductive foils, conductive protrusions, or the like.

On the other hand, the contact 5 is implanted into the bottom wall of the socket body 1 by press-fitting or the like with an arrangement corresponding to the external contact 4, and a contact piece 6 extending upward from the implanted portion; And a terminal portion 7 protruding downward from the bottom wall.

The contact 5 is formed of an elongated conductive strip, and a contact piece 6 is formed at an upper portion thereof and a terminal portion 7 is formed at a lower portion thereof.

The contact piece 6 has a bent portion 8 protruding to one side, whereby the contact piece 6 can be elastically bent in the vertical direction.
Also, it can elastically bend to the side.

An IC mounting table 9 for mounting the IC package 2 is provided in the IC mounting space 3.
Is vertically movable by a spring 10. Therefore, the IC mounting table 9 descends against the spring 10 and rises by the restoring force of the spring 10 to form a standby state at a certain level.

A large number of through holes 11 corresponding to the contacts 5 and the external contacts 4 are provided in the IC mounting table 9, and the tip of the contact 5, that is, the tip of the contact piece 6 is inserted into the through hole 11 from below. While the insertion depth is set so that the tip of the contact piece 6 does not protrude from the upper surface of the IC mounting table 9, the position is regulated by the inner wall of the through-hole 11 to form an accurate correspondence state with the external contact 4.

The IC package 2 is mounted on the upper surface of the mounting table 9 while being guided by a ruler member 12 provided at each corner of the IC mounting table 9, whereby the tip of each contact 5 and each external contact 4 And exactly oppose each other.

As shown in FIGS. 2 to 4 and FIGS. 6 to 8, when the IC package 4 mounted on the mounting table 9 is pressed downward, the IC mounting table 9 is lowered together with the package 4. .

As a result, the tip of the contact 5 is
As the IC package 2 and the IC mounting table 9 descend, a compressive force is applied to the contact piece portion 6 to expand the contact piece portion 6 into elasticity and bend laterally to accumulate the elasticity. Due to the restoring force of the piece 6, the tip of the contact piece 6 is elastically pressed into contact with the external contact 4.

As means for inducing and holding the pressure contact, a plurality of latches 13 are engaged with the upper surfaces of two opposite sides or four sides of the IC package 2, and the latches 13 are engaged and disengaged positions. Actuator 1 to be activated
4 is provided.

The actuator 14 is provided on the socket body 1.
And has a central opening 15 corresponding to the IC mounting space 3 in the center thereof.

In other words, the actuator 14 is formed by a frame member having a central opening 15 as shown in FIGS. 1 and 5, and the actuator 14 is elastically held by a spring 16 interposed between the socket body 1 and the actuator.

For example, each corner of the frame-shaped member forming the actuator 14 is held by the spring 16.
The actuator 14 descends vertically against the spring 16,
It rises vertically by the restoring force of the spring.

The latch 13 is connected to the actuator 14
In conjunction with the up and down movement of the arm, it operates to the engagement position and the disengagement position, and applies a pressing force to the pressing member 22 or the heat radiating member 23, the IC package 2 and the IC mounting table 9 described later in this engagement position, respectively. Is spread on the spring 10 and lowered.

As a specific example, the latch 13 is disposed inside the frame wall of the frame-shaped member as the actuator 14 and the latch 13
Is rotatably supported on the frame wall of the actuator 14 by the connecting shaft 17 and the inner end is movably supported by the slide 18 shown in FIGS.

As an example of this play supporting structure, a pin 20 is provided through the inner end of the latch 13, and both ends of the pin 20 are protruded from the side surface of the latch 13 to form the slide 18.
Both ends of the pin 20, that is, the slider 18 are fitted into the cam holes 21 provided in the socket body 1.

The slider 18 and the cam hole 21 form guide means for guiding the inner end of the latch 13 to move in and out.
The slider 18 is provided on the socket body 1 side, and the cam hole 21 is provided.
Can be provided on the latch 13 side.

As shown in FIGS. 4 and 8, when the actuator 14 is raised, the outer end of the latch 13 is pulled up by the connecting shaft 17 to follow this, and
The inner end is guided by the slider 18 and the cam hole 21 and pivots downward while moving into the IC mounting space 3, whereby the locking claw 19 is superimposed on the upper surface of the IC package 2, and a pressing member described later. While engaging with the upper surface edge of the heat dissipating member 22 or the heat dissipating member 23, the three members 22, 2, 9 or 23, 2, 9 are spread on the spring 10 and pushed down. can get.

As shown in FIGS. 12 and 13, the holding member 22 has a pair of arms 2 extending in parallel at the central portions thereof.
4 and 25 are rotatably bridged and supported by a shaft 26 between the free ends of the socket main body 1 and the base end of the arms 24 and 25.
Is rotatably supported by a shaft 27 at one end. Arm 24,
25 is urged by a spring 31 in the downward rotation direction.

As shown in FIG. 5 to FIG.
3 is rotatably supported by a shaft 26 between free ends of a pair of arms 24 and 25 extending in parallel.
5 is rotatably supported by a shaft 27 on one end of the socket body 1. The arms 24 and 25 are springs 3
1 urges in the downward rotation direction.

Preferably, the pressing member 22 and the heat radiating member 23 are movably supported by a shaft 26. For example, axis 26
At both ends of the arm 24, 25 at the free end of the arm 24, 25, so that the holding member 22 or the heat radiating member 23 can freely move within a range allowed by the hole 28. As shown in FIGS. 1 to 4, the actuator 14 includes the actuator 14, which is provided on the upper part of the socket body 1 so as to be movable up and down.
Numeral 2 is rotated upward when the actuator 14 is lowered to form a presser release state, and is rotated downward when the actuator 14 is raised to form a presser state.

Similarly, the heat radiating member 23 is rotated upward when the actuator 14 is lowered to form a heat release state for the IC package 2, and is rotated downward when the actuator 14 is raised to form the heat radiating state.

As described above, the actuator 14 has the central opening 15 for allowing the mounting of the IC package 2 in the IC mounting space 3 of the socket body 1, and the pressing member 22 shown in FIGS. When the actuator 14 is lowered, the actuator 14 is rotated upward through the central opening 15 to form the press release state, and the mounting space 3 of the IC package 2 is opened.

Similarly, the heat radiating member 23 shown in FIGS.
Is the central opening 15 when the actuator 14 is lowered.
Through which the heat radiation is released and the mounting space 3 of the IC package 2 is opened.

As described above, the arms 24 and 25 rotate up and down about the shaft 27 in conjunction with the vertical movement of the actuator 14, and at the same time, the holding member 22 or the heat radiating member 23 rotates up and down.

The actuator 14 and the arms 24, 2
As means for interlocking the pressure receiving portion 5 with the pressure receiving portion 29, for example, a pressure receiving portion 29 is protruded from the base ends of the arms 24 and 25, and a pressing portion 30 corresponding to the pressure receiving portion 29 is provided on the frame wall of the actuator 14. As shown in FIG. 3 and FIG. 7, when the frame wall of the actuator 14 is lowered by a pressing operation by a robot or a finger, the pressing unit 30 presses down the pressure receiving unit 29,
Thereby, as shown in FIG. 2 and FIG.
Rotates upward together with the holding member 22 and the heat radiating member 23 against the spring 31 to form a substantially upright state. The arm 2
The rotation angles of 4, 25 are set to approximately 90 degrees.

The outer surfaces of the arms 24 and 25 in the vicinity of the pivots abut against the inner surface of the central opening 15 of the actuator 14, that is, the inner surface of the frame wall forming the central opening, and are prevented from rotating, thereby maintaining the upright state. . As a result, the IC mounting space 3 is almost completely opened, and the IC package 2 can be easily mounted and removed in the vertical direction.

As shown in FIGS. 3 and 4 and FIGS. 7 and 8, when the pressing force of the robot or the finger applied to the frame wall of the actuator 14 is released, the actuator 16 is automatically raised by the spring 16, and Accompanying arm 2
4 and 25 are the pressing members 22 due to the tensile force of the spring 31 and its own weight.
And the heat dissipating member 23 is rotated downward together with the pressing member 22.
Alternatively, the heat radiating member 23 is overlaid on the upper surface of the IC package 2.

On the other hand, in conjunction with the elevation of the actuator 14, the outer end of the latch 13 is lifted upward, and the locking claw 19 provided at the inner end of the latch 13 protrudes into the IC mounting space 3 with this. It rotates downward and engages with the upper surface edge of the pressing member 22 or the upper surface edge of the heat radiating member 23.
2 or heat radiation member 23, IC package 2, and IC mounting base 9
To lower them against the spring 10. As a result, pressure contact between the external contact 4 and the contact 5 is obtained.

FIGS. 1 to 8 illustrate the case where one holding member 22 and one heat radiating member 23 are provided.
9 to 11 illustrate an IC socket including two pressing members 22 and two heat radiating members 23. in this case,
Two pairs of the arms 24 and 25 are used, and the base ends of the pair of arms 24 and 25 are rotatably supported on one end of the socket body 1 by a shaft 27, and the other pair of arms 24 and 2 are used.
5 is rotatably supported on the other end of the socket body 1 by a shaft 27, and a pair of holding members 22 or heat radiating members 23 are bridge-supported between the free ends of each pair of arms 24 and 25, respectively.

The arms 24 and 25 of each pair are pushed down or released by two opposite frame walls of the actuator 14 as the actuator 14 moves up and down, and rotate up and down. Arm structure and actuator 14 for each pair
The interlocking structure is as described above.

FIGS. 14 and 15 show the arms 24 and 2 turned downward when the holding members 22 or the heat radiating members 23 act on the IC package 2 by turning the arms 24 and 25 downward.
The free end of the socket body 1 is locked by the lock lever 32.
2 shows an example in which the holding state by the holding member 22 or the heat radiation state by the heat radiation member 23 is maintained by engaging with the second member.

The lock lever 32 is connected to the arms 24, 25
Or pivotally supported by the socket body 1 and urged in the engaging direction by a spring.
5 is expanded to a spring 34 and the lock lever 32 is
Is automatically formed.

The lock lever 32 presses the pressure receiving portion 33 when the actuator 14 described above descends to release the lock. As a result, the arms 24 and 25
4 to rotate upward according to the elasticity of the opening 4 to open the IC mounting space 3.

14 and 15, the arms 24 and 25 and the holding member 22 or the heat radiating member 23 can have a structure in which the arms 24 and 25 rotate vertically through the central opening 15 of the actuator 14.

FIGS. 5 to 9 show the holding member 22 with the heat radiating member 2.
3 is provided as an example. In other words, the holding member 2
2 illustrates a case where both the heat radiation member 2 and the heat radiating member 23 are attached to the socket body 1 via the arms 24 and 25 so as to be vertically rotatable. Each corner of the heat radiating member 23 is integrally assembled to each corner of the pressing member 22 by a screw 35, and the screw 3
The heat radiating member 23 is held down by the spring 36 wound around the pressing member 2.
2 while being pressed so that the heat radiating member 23 is movable upward in a direction away from the pressing member 22 against the spring 36.

The pressing member 22 has a central opening 37,
The heat dissipating member 23 has a central opening 37 at the center of the lower surface thereof.
A heat receiving land portion 38 is provided so as to be in pressure contact with the central portion of the upper surface of the IC package 2 through the hole.

As shown in FIG. 8, when the arms 24 and 25 are rotated downward, as shown in FIGS. 2 to 4, the pressing member 22 is rotated downward to move the peripheral edge of the upper surface of the IC package 2 downward. At the same time, the heat receiving land portion 38 of the heat radiating member 23 comes into pressure contact with the central portion of the upper surface of the IC package 2 in which the IC chip is embedded.

That is, when the latch 13 engages with the upper edge of the pressing member 22 and presses the pressing member 22 downward by the restoring force of the spring 16, the pressing member 22 is applied to the upper edge of the IC package 2. The heat receiving land portion 38 of the heat radiating member 23 comes into pressure contact with the central portion of the upper surface of the IC package 2 by the spring 36 at the same time. At this time, the heat radiating member 23 is
6 is moved upward while compressing it, and the restoring force of the spring 36 causes I
The pressure contact force on the upper surface of the C package 2 is increased.

Next, FIGS. 16 and 17 show a case where the arms 24 and 25 for supporting the holding member 22 or the heat radiating member 23 and the actuator 14 are connected via a link 39 so as to interlock with each other.

As shown, the arms 24 and 25 are
Are pivotally supported by the socket body 1 through the
9 is rotatably supported via a shaft 40 at one end of the link 39.
The other end of the shaft is engaged with a long hole 42 provided in a frame wall of the actuator 14 by a shaft 41.

As shown in FIG. 16, the actuator 14
Is raised, the link 41 is pulled up through the shaft 41 while the shaft 41 is pulled up by the lower end of the elongated hole 42, and the rear ends of the arms 24 and 25 are pulled up accordingly. As a result, the free ends of the arms 24 and 25 and the holding member 22 or the heat radiating member 23 are rotated downward about the shaft 27 as a fulcrum, and come into pressure contact with the upper surface of the IC package 2.

Also, as shown in FIG.
When the arm 41 is lowered against the spring 16, the shaft 41 is pushed down by the upper end of the long hole 42, and the link 39 is pushed down through the shaft 41. As a result, the free ends of the arms 24 and 25 and the holding member 22 are pressed. Alternatively, the heat dissipating member 23 rotates around the shaft 41 against the spring 31 and rises through the central opening 15 of the actuator 14 to open the mounting space 3 for the IC package.

[0066]

As described above, in the conventional IC socket, the assembly of the cover and the pressing member or the heat radiating member widely covers the upper surface and the periphery of the IC package and hinders the heat radiating effect. And reduce the presser effect. In addition, it is necessary to prepare covers of different sizes for changing the size of the holding member or the heat radiating member.

These disadvantages can be effectively solved by the structure of the present invention in which the holding member or the heat radiating member is rotatably bridged between a pair of parallel extending rotating arms.

That is, a sufficient heat radiating space is secured between the pair of arms, and the problem of the warp of the cover due to the heat, the press-down failure or the heat radiation failure accompanying the warp is effectively solved.

The arms to be paired can be assembled at intervals suitable for IC sockets of different sizes, so that they can be used to support holding members or heat dissipating members of different sizes. is there.

As a heat dissipation structure of an IC package in an IC socket, as disclosed in Japanese Patent No. 2656901, one end of a holding cover is rotatably attached to one end of a socket body, and an opening formed in the center of the holding cover. A heat dissipating member is fixedly mounted inside, and a portion protruding inward from the opening is brought into contact with the upper surface of the IC package.

However, in the above-mentioned IC socket, one end of the heat radiating member comes in contact with the upper surface of the IC package in advance due to the downward rotation of the cover, the IC package goes up, the accompanying positional shift, and furthermore, the IC package is displaced. The external contact or the deformation of the contact.

This disadvantage can be effectively solved by the structure according to the present invention in which the heat radiating member is rotatably bridged between a pair of parallel extending arms.

As described above, as shown in Japanese Patent Publication No. Hei 6-105630, an actuator that vertically moves with respect to the socket body is provided, and a socket for opening and closing a positioning lever of the IC package and a contact are often used. According to the invention, the holding purpose and the heat dissipation purpose are effectively achieved by the holding member or the heat dissipating member, while the mounting and dismounting of the IC package through the central opening of the actuator are properly performed in cooperation with the vertically moving actuator. .

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket provided with a pressing member.

FIG. 2 is a cross-sectional view of the IC socket showing an open state of a pressing member.

FIG. 3 is a cross-sectional view illustrating a state before pressing and a state immediately before engagement of a latch, in which a pressing member is rotated downward and overlapped on an upper surface of an IC package.

FIG. 4 is a cross-sectional view of the IC socket showing a state where the latch is engaged with the pressing member and the pressing member presses the IC package.

FIG. 5 is a plan view of an IC socket provided with a pressing member and a heat radiating member.

FIG. 6 is a cross-sectional view of the IC socket showing an open state of the holding member and the heat radiation member.

FIG. 7 is a cross-sectional view illustrating a state in which the pressing member and the heat radiating member are pivoted downward and overlap the upper surface of the IC package, and a state immediately before engagement of the latch.

FIG. 8 is a sectional view of the IC socket showing a state where the latch is engaged with the assembly of the pressing member and the heat radiating member, and the heat radiating member and the pressing member press the IC package.

FIG. 9 shows an example in which a pair of holding members or heat radiating members are provided.
The top view of a C socket.

FIG. 10 is a sectional view of the IC socket showing an open state of the pressing member or the heat radiation member in FIG. 9;

FIG. 11 is a sectional view of the IC socket showing a holding state in FIG. 10;

FIG. 12 is a perspective view showing an arm structure that supports a pressing member or a heat radiating member.

FIG. 13 is a cross-sectional view of a supporting portion of a holding member or a heat radiating member in the arm structure.

FIG. 14 is a side view showing an example of the arm lock structure.

FIG. 15 is a side view showing another example of the arm lock structure.

FIG. 16 is a cross-sectional view showing another example of the interlocking structure between the arm and the actuator, showing a state in which the arm is turned.

FIG. 17 is a cross-sectional view showing the upward rotation state of the arm in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket body 2 IC package 3 IC mounting space 4 IC external contact 5 Contact 6 Contact contact piece part 7 Contact terminal part 8 Contact bending part 9 IC mounting base 10 IC mounting base support spring 11 IC mounting base through hole 12 IC mounting base ruler Member 13 Latch 14 Actuator 15 Central opening 16 Actuator support spring 17 Latch connection shaft 18 Slider 19 Locking claw 20 Pin 21 Cam hole 22 Pressing member 23 Heat radiating member 24 Arm 25 Arm 26 Axle (for rotating holding member and heat radiating member) 27 axis (for arm rotation) 28 long hole 29 arm pressure receiving part 30 pressurizing part 31 spring 32 lock lever 33 lock lever pressure receiving part 34 open spring 35 screw 36 spring 37 central opening 38 heat receiving land part 39 link 40 axis 41 axis 42 length Hole

Claims (8)

[Claims] An IC socket in which a holding member is provided on a socket body and an external contact of an IC package mounted on the socket body is brought into press contact with a contact provided on the socket body by the holding member. An IC socket having a pressing structure rotatably supported between a pair of arms extending in parallel, and the arm rotatably supported by the socket body. 2. An actuator, which is provided on the upper portion of the socket body so as to be vertically movable, wherein the presser member is turned upward when the actuator is lowered to form a presser release state, and is turned downwardly when the actuator is raised. 2. The IC socket according to claim 1, wherein the IC socket forms a state. 3. The actuator has a central opening for permitting mounting of the IC package on the socket body, and the pressing member is rotated upward through the central opening when the actuator is lowered to release the pressing. 3. The IC socket according to claim 2, wherein a state is formed and a mounting space for the IC package is opened. 4. An IC having a heat dissipating member which contacts a top surface of an IC package mounted on a socket body to form a heat dissipating state.
In a C socket, an IC socket having a heat dissipating member mounting structure in which the heat dissipating member is rotatably supported between a pair of arms extending in parallel and the arm is rotatably supported on the socket body. 5. An actuator which is provided on the upper portion of the socket body so as to be movable up and down, wherein the heat radiating member is rotated upward when the actuator is lowered to form a heat release state for the IC package, and is rotated downward when the actuator is raised. The IC socket according to claim 4, wherein the heat radiation state is formed by performing the heat radiation. 6. The actuator has a central opening for permitting mounting of the IC package on the socket body, and the heat radiating member is rotated upward through the central opening when the actuator is lowered to release the heat radiation. 6. The IC according to claim 5, wherein a state is formed and a mounting space for the IC package is opened.
socket. 7. An IC socket in which a holding member is provided on a socket body, and the holding member presses an external contact of an IC package mounted on the socket body to a contact provided on the socket body. An actuator that is rotatably supported by the socket body and that is vertically movable on the upper part of the socket body,
The presser member is rotated upward when the actuator is lowered to form a presser released state, and is rotated downward when the actuator is raised to form a presser state. The actuator allows the IC package to be mounted on the socket body. Wherein the holding member is pivoted upward through the center opening when the actuator is lowered to form the holding release state and open the mounting space for the IC package. IC socket. 8. An IC having a heat dissipating member that contacts a top surface of an IC package mounted on a socket body to form a heat dissipating state.
In the C socket, the heat dissipating member is rotatably supported by the socket body, and an actuator is provided on the upper portion of the socket body so as to be vertically movable, and the heat dissipating member is turned upward when the actuator is lowered to dissipate heat. A release state is formed, the lower part is pivoted downward at the same time to form a heat radiation state, the actuator has a central opening for permitting mounting of the IC package on the socket body, and the heat radiation member is provided on the actuator. At the time of descending, it is rotated upward through the central opening to form a heat release state and
An IC socket characterized in that a space for mounting a C package is opened.