JP2000100562A - Organic el element and its manufacture - Google Patents
Organic el element and its manufactureInfo
- Publication number
- JP2000100562A JP2000100562A JP10268489A JP26848998A JP2000100562A JP 2000100562 A JP2000100562 A JP 2000100562A JP 10268489 A JP10268489 A JP 10268489A JP 26848998 A JP26848998 A JP 26848998A JP 2000100562 A JP2000100562 A JP 2000100562A
- Authority
- JP
- Japan
- Prior art keywords
- sealing body
- transparent electrode
- light emitting
- adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims abstract description 26
- 239000007772 electrode material Substances 0.000 claims abstract description 7
- 239000011800 void material Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 238000004020 luminiscence type Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- -1 aluminum chelate complex Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 125000006617 triphenylamine group Chemical group 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- UHXOHPVVEHBKKT-UHFFFAOYSA-N 1-(2,2-diphenylethenyl)-4-[4-(2,2-diphenylethenyl)phenyl]benzene Chemical compound C=1C=C(C=2C=CC(C=C(C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)C=CC=1C=C(C=1C=CC=CC=1)C1=CC=CC=C1 UHXOHPVVEHBKKT-UHFFFAOYSA-N 0.000 description 1
- ZMLPKJYZRQZLDA-UHFFFAOYSA-N 1-(2-phenylethenyl)-4-[4-(2-phenylethenyl)phenyl]benzene Chemical group C=1C=CC=CC=1C=CC(C=C1)=CC=C1C(C=C1)=CC=C1C=CC1=CC=CC=C1 ZMLPKJYZRQZLDA-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000733 Li alloy Inorganic materials 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000004866 oxadiazoles Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、平面光源やディ
スプレイ、その他所定のパターン等の発光表示に用いら
れる有機ＥＬ素子とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic EL device used for light-emitting display of a flat light source, a display, and other predetermined patterns, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、有機ＥＬ（エレクトルミネッセン
ス）素子は、ガラス等からなる透明な基板に、透光性の
ＩＴＯ膜を一面に形成し、所定のストライプ状等の形状
にエッチングして透明電極を形成し、その表面に発光層
を全面蒸着して形成している。この発光層は、有機ＥＬ
材料であり、トリフェニルアミン誘導体（ＴＰＤ）等の
ホール輸送材料を有し、その上に発光材料であるアルミ
キレート錯体（Ａｌｑ３）等の電子輸送材料を積層した
ものや、これらの混合層からなる。そしてその表面にＡ
ｌ、Ｌｉ、Ａｇ、Ｍｇ、Ｉｎ等の背面電極が、上記透明
電極と対向して直交するストライプ状に蒸着等で設けら
れ、発光部を形成している。この有機ＥＬ素子は、透明
電極を正極とし、背面電極を負極として電圧を印加し、
これら各ストライプ状の電極の所定の交点を発光させ
る、いわゆるドットマトリックス方式により駆動され
る。2. Description of the Related Art Conventionally, an organic EL (electroluminescence) element is formed by forming a light-transmitting ITO film on one surface of a transparent substrate made of glass or the like and etching it into a predetermined stripe shape or the like to form a transparent electrode. Is formed, and a light emitting layer is formed on the entire surface by vapor deposition. This light emitting layer is made of an organic EL
A material having a hole transporting material such as a triphenylamine derivative (TPD) and a layer of an electron transporting material such as an aluminum chelate complex (Alq 3 ) as a light emitting material, or a mixed layer thereof. Become. And A on the surface
A back electrode of 1, Li, Ag, Mg, In, or the like is provided by vapor deposition or the like in a stripe shape orthogonal to the transparent electrode and forms a light emitting portion. This organic EL element applies a voltage with the transparent electrode as a positive electrode and the back electrode as a negative electrode,
Driving is performed by a so-called dot matrix method that emits light at a predetermined intersection of these stripe-shaped electrodes.
【０００３】ここで、この発光層を構成する有機ＥＬ材
料は、水分や化学溶媒の存在下で容易に劣化することか
ら、発光部を覆う大きさのガラスや金属からなる封止体
が、発光部の周囲に固定され、発光部を有する封止体内
の空間を密閉していた。この空間には、通常乾燥した窒
素ガス等が充填されている。Here, the organic EL material constituting the light emitting layer is easily degraded in the presence of moisture or a chemical solvent. The space inside the sealed body fixed to the periphery of the unit and having the light emitting unit was sealed. This space is usually filled with dry nitrogen gas or the like.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の場
合、発光層の有機ＥＬ材料は化学的に脆弱な材料であ
り、特に水分の存在下で容易に劣化することから、乾燥
窒素雰囲気下で、基板と封止体を接着剤等を介して固定
し、密閉する必要があった。特に封止体の接合幅が十分
に広くないと、接合面の微少な隙間から水分が浸入する
おそれがあった。In the case of the above prior art, the organic EL material of the light emitting layer is a chemically fragile material, and is easily deteriorated particularly in the presence of moisture. In addition, it is necessary to fix the substrate and the sealing body with an adhesive or the like, and to seal them. In particular, if the bonding width of the sealing body is not sufficiently large, there is a possibility that moisture may enter through a minute gap on the bonding surface.
【０００５】しかし、この封止体の接合部分を広くとる
と、表示面積に対する周縁部の大きさが大きくなり、小
型化の妨げとなっていた。さらに、接合のための接着剤
も有機ＥＬ材料に悪影響を与えるので、接着剤が発光層
側にはみ出さないように、接合面の幅を広くとる必要も
あり、ますます、表示部位外のいわゆる額縁部分が広く
なってしまうものであった。However, if the joining portion of the sealing body is widened, the size of the peripheral portion with respect to the display area becomes large, which hinders miniaturization. Furthermore, since the adhesive for bonding also has an adverse effect on the organic EL material, it is necessary to increase the width of the bonding surface so that the adhesive does not protrude to the light emitting layer side. The frame part became wide.
【０００６】この発明は上記従来の問題点に鑑みてなさ
れたものであり、表示部の面積が広く装置の小型化も可
能で、耐久性も高い有機Ｅｌ素子とその製造方法を提供
することを目的とする。The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide an organic EL device having a large display area, a small size of the device, and high durability, and a method of manufacturing the same. Aim.
【０００７】[0007]
【課題を解決するための手段】この発明の有機ＥＬ素子
は、ガラスや樹脂等の透明な基板表面にＩＴＯ等の透明
な電極材料により形成された透明電極と、この透明電極
に積層され、ＥＬ材料からなる発光層と、この発光層に
積層され、上記透明電極に対向して形成された背面電極
と、上記発光層が形成された部分を覆い外界から密封す
る封止体とを備える。この封止体の周縁部の上記基板に
接着される部分には、上記封止体周縁部に沿って延びた
複数の溝が形成され、この複数の溝間で挟まれる上記周
縁部全周に接着剤が塗布されて、上記封止体が上記基板
に接着されている有機ＥＬ素子である。上記複数の溝の
うちの内側に位置する溝には、接着剤が充満していない
空隙が形成されているものである。また、上記溝には上
記封止体の外側に通じる逃げ溝が形成されている。さら
に、上記溝は、上記封止体の周縁部に形成された複数の
突条からなるものでもよい。The organic EL device of the present invention comprises a transparent electrode formed of a transparent electrode material such as ITO on the surface of a transparent substrate such as glass or resin; The light-emitting device includes a light-emitting layer made of a material, a back electrode laminated to the light-emitting layer and formed to face the transparent electrode, and a sealing body that covers a portion where the light-emitting layer is formed and seals from the outside. A plurality of grooves extending along the periphery of the sealing body are formed in a portion of the periphery of the sealing body adhered to the substrate, and the entire periphery of the periphery sandwiched between the plurality of grooves is formed. An organic EL element to which an adhesive is applied and the sealing body is bonded to the substrate. A void that is not filled with an adhesive is formed in a groove located inside of the plurality of grooves. In addition, a relief groove communicating with the outside of the sealing body is formed in the groove. Further, the groove may be formed of a plurality of ridges formed on a peripheral portion of the sealing body.
【０００８】またこの発明は、ガラスや樹脂等の透明な
基板表面に、ＩＴＯ等の透明な電極材料により透明電極
を形成し、この透明電極にＥＬ材料からなる発光層を積
層し、この発光層にさらに上記透明電極に対向して背面
電極を設けるとともに、上記発光層が形成された部分を
覆い外界から密封する封止体の周縁部の上記基板に接着
される部分に、上記封止体周縁部に沿って延びた複数の
溝を形成し、この複数の上記溝間の上記周縁部全周にわ
たり接着剤を塗布して上記封止体を上記基板に接着する
有機ＥＬ素子の製造方法である。また、上記複数の溝に
接着剤を塗布する際に、内側の溝に接着剤が充満してい
ない空隙が形成されるようにし、塗布した接着剤がこの
溝空間に入り、上記発光層が形成された部分には上記接
着剤がはみ出さないようにする有機ＥＬ素子の製造方法
である。The present invention also provides a transparent electrode formed of a transparent electrode material such as ITO on the surface of a transparent substrate such as glass or resin, and a light emitting layer made of an EL material laminated on the transparent electrode. Further, a back electrode is provided so as to face the transparent electrode, and a portion of the peripheral portion of the sealing body that covers the portion where the light emitting layer is formed and seals from the outside is bonded to the substrate. Forming a plurality of grooves extending along a portion, applying an adhesive over the entire periphery of the peripheral portion between the plurality of grooves, and bonding the sealing body to the substrate. . Further, when applying the adhesive to the plurality of grooves, a gap in which the adhesive is not filled is formed in the inner groove, and the applied adhesive enters the groove space to form the light emitting layer. This is a method for manufacturing an organic EL element that prevents the adhesive from protruding into the portion where the adhesive has been applied.
【０００９】[0009]
【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図１は、この発明の有機Ｅ
Ｌ素子１０の一実施形態を示す。この実施形態の有機Ｅ
Ｌ素子１０は、ガラスや石英、樹脂等の透明な基板１２
の一方の表面にＩＴＯ等の透明な電極材料による透明電
極が形成され、この透明電極は、所定のピッチでストラ
イプ状に形成されている。また透明電極の表面には、５
００Å程度のホール輸送材料、及び５００Å程度の電子
輸送材料、その他発光材料によるＥＬ材料からなる発光
層が積層されている。そして発光層の表面には、Ｌｉを
０．０１〜０．０５％程度含む純度９９％程度のＡｌ−
Ｌｉ合金、その他Ａｌ、Ｌｉ、Ａｇ、Ｍｇ、Ｉｎ等また
はこれらの合金による背面電極が、適宜の５００Å〜１
０００Å程度の厚みで積層されている。この背面電極
は、透明電極と直交して対向し、ストライプ状に形成さ
れている。そして基板１２上に積層された透明電極から
背面電極までが発光部１６を形成する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the organic E of the present invention.
1 shows an embodiment of an L element 10. Organic E of this embodiment
The L element 10 is a transparent substrate 12 made of glass, quartz, resin, or the like.
A transparent electrode made of a transparent electrode material such as ITO is formed on one surface of the substrate, and the transparent electrodes are formed in a stripe shape at a predetermined pitch. Also, 5
A light emitting layer made of an EL material of a hole transporting material of about 00 °, an electron transporting material of about 500 °, and other light emitting materials is laminated. Then, on the surface of the light emitting layer, Al- having a purity of about 99% containing about 0.01 to 0.05% of Li is used.
A back electrode made of a Li alloy, other Al, Li, Ag, Mg, In, or the like or an alloy thereof has an appropriate thickness of 500 to 1
It is laminated with a thickness of about 2,000 mm. The back electrode is orthogonally opposed to the transparent electrode and is formed in a stripe shape. Then, the light emitting portion 16 is formed from the transparent electrode laminated on the substrate 12 to the back electrode.
【００１０】ここで発光部１６の発光層は、母胎材料の
うちホール輸送材料としては、トリフェニルアミン誘導
体（ＴＰＤ）、ヒドラゾン誘導体、アリールアミン誘導
体等がある。一方、電子輸送材料としては、アルミキレ
ート錯体（Ａｌｑ３）、ジスチリルビフェニル誘導体
（ＤＰＶＢｉ）、オキサジアゾール誘導体、ビスチリル
アントラセン誘導体、ベンゾオキサゾールチオフェン誘
導体、ペリレン類、チアゾール類等を用いる。さらに適
宜の発光材料を混合してもよく、ホール輸送材料と電子
輸送材料を混合した発光層を形成してもよく、その場
合、ホール輸送材料と電子輸送材料の比は、１０：９０
乃至９０：１０の範囲で適宜変更可能である。Here, the light emitting layer of the light emitting section 16 includes a triphenylamine derivative (TPD), a hydrazone derivative, an arylamine derivative, etc. as the hole transport material among the mother material. On the other hand, as the electron transporting material, an aluminum chelate complex (Alq 3 ), a distyrylbiphenyl derivative (DPVBi), an oxadiazole derivative, a bistyrylanthracene derivative, a benzoxazolethiophene derivative, a perylene, a thiazole, or the like is used. Further, an appropriate light emitting material may be mixed, or a light emitting layer in which a hole transport material and an electron transport material are mixed may be formed. In this case, the ratio of the hole transport material to the electron transport material is 10:90.
It can be changed appropriately within a range of 90 to 90:10.
【００１１】そして、少なくとも発光部１６の全面を覆
い密封する封止体２０が基板１２に接着されている。封
止体２０は、アルミニウム等の金属や樹脂、その他無機
材料等により形成され、発光部１６を収容する空間部２
２と基板１２に接着される周縁部２４とからなる。周縁
部２４には、基板１２の接着面側に、溝２６が周縁部に
沿って平行に複数本形成されている。溝２６には、外側
に開口した逃げ溝２８が直交するように連通している。
この溝２６間には、内側の溝２６に空隙が残るようにし
て接着剤３０が塗布され、空間部２２を密閉し、発光部
１６を外界から封止している。A sealing body 20 that covers and seals at least the entire surface of the light emitting section 16 is adhered to the substrate 12. The sealing body 20 is formed of a metal such as aluminum, a resin, or another inorganic material, and the like.
2 and a peripheral portion 24 adhered to the substrate 12. In the peripheral portion 24, a plurality of grooves 26 are formed on the adhesive surface side of the substrate 12 in parallel along the peripheral portion. The groove 26 communicates with an escape groove 28 opened outwardly so as to be orthogonal to the groove 26.
An adhesive 30 is applied between the grooves 26 so as to leave a gap in the inner groove 26, thereby sealing the space 22 and sealing the light emitting unit 16 from the outside.
【００１２】この実施形態の有機ＥＬ素子１０の製造方
法は、ガラスや石英、透明樹脂等の透明な基板１２の表
面に、ＩＴＯ等の透明な電極材料により透明電極を、エ
ッチングまたはマスク蒸着等でストライプ状に形成す
る。次に、この透明電極が形成された面全面に、ホール
輸送材料及び電子輸送材料によるＥＬ材料からなる発光
層を、真空蒸着やその他真空薄膜形成技術により積層す
る。そして、発光層の表面に、透明電極と略直交するス
トライプ状の背面電極を真空蒸着等の真空薄膜形成技術
により積層して、発光部１６を形成する。In the method of manufacturing the organic EL device 10 of this embodiment, a transparent electrode made of a transparent electrode material such as ITO is formed on the surface of a transparent substrate 12 made of glass, quartz, transparent resin or the like by etching or mask evaporation. It is formed in a stripe shape. Next, a light emitting layer made of an EL material made of a hole transporting material and an electron transporting material is laminated on the entire surface on which the transparent electrode is formed by vacuum evaporation or other vacuum thin film forming techniques. Then, on the surface of the light emitting layer, a stripe-shaped back electrode substantially orthogonal to the transparent electrode is laminated by a vacuum thin film forming technique such as vacuum evaporation to form the light emitting section 16.
【００１３】ここで蒸着条件は、例えば、真空度が６×
１０−６Ｔｏｒｒで、ＥＬ材料の場合５０Å／ｓｅｃの
蒸着速度で成膜させる。また発光層１４等は、フラッシ
ュ蒸着により形成してもよい。フラッシュ蒸着法は、予
め所定の比率で混合したＥＬ材料を、３００℃〜６００
℃好ましくは４００℃〜５００℃に加熱した蒸着源に落
下させ、ＥＬ材料を一気に蒸発させるものである。また
そのＥＬ材料を容器中に収容し、急速にその容器を加熱
し、一気に蒸着させるものでもよい。Here, the deposition conditions are, for example, that the degree of vacuum is 6 ×
At 10 −6 Torr, a film is formed at a deposition rate of 50 ° / sec in the case of an EL material. The light emitting layer 14 and the like may be formed by flash evaporation. In the flash evaporation method, an EL material previously mixed at a predetermined ratio is heated to 300 ° C. to 600 ° C.
C. Preferably, the EL material is dropped onto a deposition source heated to 400.degree. Alternatively, the EL material may be housed in a container, and the container may be rapidly heated and vapor-deposited at once.
【００１４】次に乾燥窒素雰囲気下で、発光部１６を覆
うように封止体２０を基板１２に接着する。このとき、
複数の溝２６の少なくとも一番内側の溝２６を除く周縁
部２４全周に接着剤３０を塗布して封止体２０を基板１
２に接着する。このとき、塗布した接着剤３０は、基板
１２への張り付けにより周縁部２４で広がり、内側の溝
２６の空隙に吸収され、発光部１６を収容した空間部２
２には入り込まない。また、図３に示すように、余分な
接着剤３０は、逃げ溝２８により周縁部２４からはみ出
し、封止体２０の外側に出てくる。Next, a sealing body 20 is adhered to the substrate 12 so as to cover the light emitting section 16 in a dry nitrogen atmosphere. At this time,
An adhesive 30 is applied to the entire periphery of the plurality of grooves 26 except at least the innermost groove 26 so that the sealing body 20 is formed on the substrate 1.
Adhere to 2. At this time, the applied adhesive 30 spreads at the peripheral edge portion 24 by being attached to the substrate 12, is absorbed by the gap of the inner groove 26, and is filled with the light emitting portion 16.
Do not enter 2. In addition, as shown in FIG. 3, the excess adhesive 30 protrudes from the peripheral portion 24 by the escape groove 28 and comes out of the sealing body 20.
【００１５】この実施形態のＥＬ素子とその製造方法に
よれば、発光部１６が封止体２０で密封され、周縁部２
４を固定する接着剤は、複数の溝２６により余分な量が
吸収されその封止体２０の周縁部２４の接着剤３０が確
実に基板１２に接着されるとともに、余った接着剤３０
が発光部１６の収容空間部２２に浸入することがない。
さらに複数の溝２６で区切られた周縁部２４は、基板１
２に全周にわたり確実に接着し、気密性を確保する。According to the EL device of this embodiment and the method of manufacturing the same, the light emitting portion 16 is sealed by the sealing body 20 and the peripheral portion 2 is sealed.
An excess amount of the adhesive for fixing the adhesive 4 is absorbed by the plurality of grooves 26, the adhesive 30 on the peripheral portion 24 of the sealing body 20 is securely bonded to the substrate 12, and the excess adhesive 30
Does not enter the accommodation space 22 of the light emitting section 16.
Further, the peripheral portion 24 divided by the plurality of grooves 26 is
2 is securely adhered over the entire circumference to ensure airtightness.
【００１６】なお、この発明の有機ＥＬ素子は、上記実
施形態に限定されるものではなく、溝の本数や形状は適
宜設定されるものであり、逃げ溝を設けずに、複数の溝
により余分な接着剤を吸収するものでもよい。また、逃
げ溝の位置や本数も基板の大きさ等に合わせて適宜設定
される。The organic EL device of the present invention is not limited to the above embodiment, but the number and shape of the grooves are appropriately set. Any material that absorbs a suitable adhesive may be used. Also, the position and number of the escape grooves are appropriately set according to the size of the substrate and the like.
【００１７】さらに、複数の溝は、複数の突条により囲
まれる部分で形成されても良く、例えば、板状の封止体
の周縁部に突条を全周にわたり形成して、その突条で囲
まれる部分が発光部の収容空間であり、突条の表面が基
板に接着され、余分な接着剤は突条間の溝に吸収される
ようにしてもよい。Further, the plurality of grooves may be formed at a portion surrounded by the plurality of ridges. For example, a ridge may be formed on the peripheral edge of the plate-shaped sealing body over the entire circumference, and the ridge may be formed. The portion surrounded by is a space for accommodating the light emitting section, the surface of the ridge may be adhered to the substrate, and excess adhesive may be absorbed in the groove between the ridges.
【００１８】[0018]
【発明の効果】この発明の有機ＥＬ素子とその製造方法
は、発光部を密封する封止体の周縁部の接着幅を狭くし
ても確実に接着可能であるとともに、余分な接着剤が発
光部の収容空間にしみこまないものである。これによ
り、表示部分の面積に対して周縁部の幅を狭くすること
ができ、表示装置の小型化に寄与し、耐久性も高いもの
にすることができる。According to the organic EL device of the present invention and the method for manufacturing the same, even if the bonding width of the peripheral portion of the sealing body for sealing the light emitting portion is narrowed, the bonding can be surely performed, and excess adhesive emits light. It does not penetrate into the accommodation space of the department. Accordingly, the width of the peripheral portion can be reduced with respect to the area of the display portion, which contributes to downsizing of the display device and high durability.
【図１】この発明の一実施形態の有機ＥＬ素子の縦断面
図である。FIG. 1 is a longitudinal sectional view of an organic EL device according to an embodiment of the present invention.
【図２】この実施形態の有機ＥＬ素子の封止体の背面で
ある。FIG. 2 is a rear view of a sealing body of the organic EL element of this embodiment.
【図３】この実施形態の有機ＥＬ素子の封止体の他の接
着状態を示す縦断面図である。FIG. 3 is a longitudinal sectional view showing another state of adhesion of the sealing body of the organic EL element of this embodiment.
１０ 有機ＥＬ素子 １２ 基板 １６ 発光部 ２０ 封止体 ２２ 空間部 ２４ 周縁部 ２６ 溝 ２８ 逃げ溝 ３０ 接着剤 DESCRIPTION OF SYMBOLS 10 Organic EL element 12 Substrate 16 Light emitting part 20 Sealing body 22 Space part 24 Peripheral part 26 Groove 28 Escape groove 30 Adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 好雄 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 (72)発明者 坂井 規裕 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 Ｆターム(参考） 3K007 AB00 BB01 CA01 CA02 CA05 CB01 DA00 DB03 EB00 FA01 FA03 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yoshio Sato 3158, Shimo-Okubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Inside Hokuriku Electric Industry Co., Ltd. F term in Industrial Co., Ltd. (reference) 3K007 AB00 BB01 CA01 CA02 CA05 CB01 DA00 DB03 EB00 FA01 FA03
Claims (6)
形成された透明電極と、この透明電極に積層されＥＬ材
料からなる発光層と、この発光層に積層され上記透明電
極に対向して形成された背面電極と、上記発光層が形成
された部分を覆い外界から密封する封止体とを備え、こ
の封止体の周縁部の上記基板に接着される部分に、上記
封止体周縁部に沿って延びた複数の溝が形成され、この
複数の溝の間の部分に上記周縁部全周にわたる接着剤が
塗布されて上記封止体が上記基板に接着されていること
を特徴とする有機ＥＬ素子。1. A transparent electrode formed of a transparent electrode material on a transparent substrate surface, a light emitting layer laminated on the transparent electrode and made of an EL material, and laminated on the light emitting layer and formed opposite to the transparent electrode. And a sealing body that covers the portion where the light emitting layer is formed and seals from the outside world, and a portion of the peripheral portion of the sealing body that is bonded to the substrate has a peripheral portion of the sealing body. Are formed, and an adhesive is applied to a portion between the plurality of grooves over the entire periphery of the peripheral portion, and the sealing body is bonded to the substrate. Organic EL element.
には、接着剤が充満していない空隙が形成されているこ
とを特徴とする請求項１記載の有機ＥＬ素子。2. The organic EL device according to claim 1, wherein a void not filled with an adhesive is formed in a groove located inside of the plurality of grooves.
げ溝が形成されていることを特徴とする請求項１または
２記載の有機ＥＬ素子。3. The organic EL device according to claim 1, wherein an escape groove communicating with the outside of the sealing body is formed in the groove.
れた複数の突条からなることを特徴とする請求項１，２
または３記載の有機ＥＬ素子。4. The groove according to claim 1, wherein the groove comprises a plurality of ridges formed on a peripheral portion of the sealing body.
Or the organic EL device according to 3.
透明電極を形成し、この透明電極にＥＬ材料からなる発
光層を積層し、この発光層にさらに上記透明電極に対向
して背面電極を設けるとともに、上記発光層が形成され
た部分を覆い外界から密封する封止体の周縁部の上記基
板に接着される部分に、上記封止体周縁部に沿って延び
た複数の溝を形成し、この複数の溝を含む上記周縁部全
周にわたり接着剤を塗布して上記封止体を上記基板に接
着することを特徴とする有機ＥＬ素子の製造方法。5. A transparent electrode is formed of a transparent electrode material on a surface of a transparent substrate, a light emitting layer made of an EL material is laminated on the transparent electrode, and a back electrode is further formed on the light emitting layer so as to face the transparent electrode. A plurality of grooves extending along the peripheral portion of the sealing body are formed in a portion of the peripheral portion of the sealing body that covers the portion where the light emitting layer is formed and seals from the outside, and is adhered to the substrate. A method of manufacturing the organic EL element, wherein an adhesive is applied over the entire periphery of the peripheral portion including the plurality of grooves, and the sealing body is adhered to the substrate.
内側の溝に接着剤が充満していない空隙を形成し、この
溝空隙により上記発光層が形成された部分に上記接着剤
がはみ出さないようにすることを特徴とする請求項４記
載の有機ＥＬ素子の製造方法。6. When applying an adhesive to the plurality of grooves,
5. The organic material according to claim 4, wherein a gap not filled with an adhesive is formed in the inner groove, and the adhesive does not protrude into a portion where the light emitting layer is formed by the groove. Manufacturing method of EL element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10268489A JP2000100562A (en) | 1998-09-22 | 1998-09-22 | Organic el element and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10268489A JP2000100562A (en) | 1998-09-22 | 1998-09-22 | Organic el element and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000100562A true JP2000100562A (en) | 2000-04-07 |
Family
ID=17459216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10268489A Pending JP2000100562A (en) | 1998-09-22 | 1998-09-22 | Organic el element and its manufacture |
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| Country | Link |
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