JP2000151093A - Method for removing semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an apparatus and a method for easily removing a BGA/CSP (ball grid array/chip size package) semiconductor package from a printed wiring board. SOLUTION: A solder heating member 1 is inserted to a space S between a lower side plane of a semiconductor package and a printed wiring board 3, wherein the solder heating member 1 is capable of contacting a part of the soldered joints 4 to heat and melt the solder and is capable of moving along the space, and a solder removing member 5 which sucks and removes the molten solder of the solder joints moves further, to conduct melting and removal of the solder. Meanwhile, a suction tool 6 holds the semiconductor package 2, and after the solder is removed, transfers the semiconductor package 2 from the printed wiring board 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for removing a semiconductor package, and more particularly to a method for removing a ball grid array and a chip size package.

[0002]

2. Description of the Related Art A conventional device and method for removing a ball grid array and a chip size package (hereinafter abbreviated as BGA / CSP) type semiconductor package will be described with reference to FIGS. I do.

As shown in FIG. 6, a conventional BGA / CSP type semiconductor package removal apparatus and removal method employs a BGA / CSP type semiconductor package which is mounted on a printed circuit board 3 by soldering.
The heating between the BGA / CSP 2 and the printed wiring board 3 via the BGA / CSP 2 and the printed wiring board 3 by the heating by the nozzle heater 7 from the upper surface of the GA / CSP 2 and the heating by the bottom heater 8 from the back surface of the printed wiring board 3 Heat is transmitted to the solder joint group 4 existing in the gap, and the solder joint group 4 is melted.
As a result, the BGA / CSP 2 is removed from the printed wiring board 3.

In the conventional BGA / CSP type semiconductor package removing apparatus and removing method, the BG
In order to heat the solder joint group 4 to a temperature equal to or higher than the melting point of the solder via the A / CSP 2 and the printed wiring board 3,
BGA / CSP2 and printed wiring board 3, and B
Other components mounted in the vicinity of GA / CSP2 will be exposed to excessive heating. As a result, there is a drawback that the BGA / CSP 2 to be removed and the mounted components near the BGA / CSP 2 are thermally damaged, and further, the printed wiring board 3 is thermally damaged such as warpage or twisting.

As a means for solving this problem, BGA
The mounting interval between the / CSP2 and the neighboring mounting parts can be increased to a position not affected by the heat of the nozzle heater 17, or as shown in FIG.
Is firmly fixed to the warp preventing jig 9 with a threaded spacer 10 to prevent warping and twisting during heating.

Further, in the conventional apparatus and method for removing a BGA / CSP type semiconductor package, the BGA / CSP is removed from the printed wiring board by bonding to the BGA / CSP mounting pads on the printed wiring board. The solder used for the test remains in a disordered state. In order to mount the BGA / CSP again on the mounting pad with good quality, it is necessary to remove the surplus of the residual solder on the mounting pad and flatten the solder on the mounting pad.

[0007] Conventionally, as a method of removing the surplus of the residual solder and flattening the solder on the mounting pad, a flux is applied to the copper stranded wire in advance, and the flux is applied to an excess solder portion on the mounting pad. A method in which the solder is melted by heating with a soldering iron from above, and the molten solder is sucked into the stranded copper wire by capillary action has been generally used.

[0008]

In the conventional method of removing a semiconductor package shown in FIG.
Since the mounting interval between the A / CSP 2 and the nearby mounting component must be increased to a position not affected by the heat of the nozzle heater 7, the component mounting prohibited area on the printed wiring board 3 is increased, and therefore, an increase in mounting density is hindered. There is a drawback that it cannot contribute to the miniaturization of the electronic device, and the method shown in FIG.
It is necessary to create a dedicated jig according to the mounting position of P2 and the shape of the printed wiring board 3, and there is a disadvantage that complicated setup such as attachment and detachment of the printed wiring board 3 to and from the dedicated jig occurs.

Further, in the above-mentioned conventional methods of removing the surplus of the residual solder and flattening the solder on the mounting pads, the temperature control and the heating time control of the soldering iron tip of the soldering iron become complicated, and the work is difficult. Requires skill, BGA / C
The fine mounting pad on which the SP is mounted has disadvantages such as peeling of the mounting pad due to excessive heating and adverse effects such as damage to the wiring pattern.

SUMMARY OF THE INVENTION An object of the present invention is to increase the mounting density without increasing the area where parts are prohibited from being mounted on a printed wiring board, thereby contributing to the miniaturization of electronic equipment, and to achieve BGA / C
A BGA / CSP that does not require the creation of a dedicated jig according to the mounting position of the SP or the shape of the printed wiring board, and thus does not require complicated setup such as attaching and detaching the printed wiring board to and from the dedicated jig. An object of the present invention is to provide an apparatus and a method for removing a type semiconductor package.

[0011]

According to the present invention, there is provided an apparatus for removing a semiconductor package, which removes a group of solder joints between a lower surface of the semiconductor package and a printed wiring board on which the semiconductor package is mounted. A semiconductor package removal device, which is inserted into a gap between the lower surface of the semiconductor package and the printed wiring board and contacts a part of the solder joint group to heat and melt a part of the joint group. And a solder heating section movable along the gap, a solder removing section that enters a melted portion of the solder joint group in the gap and adsorbs and removes the melted portion, and melts and adsorbs and removes the solder. Holding means for holding the semiconductor package for a while and removing the solder from the printed wiring board after the solder is removed And

The solder heating part has dimensions and dimensions that can be inserted into the gap.
The heating part, which is formed into a shape and connected to the heating part, and the solder heating part, parallel to the printed wiring board along the gap,
And a drive source for moving the solder joint so as to face the solder joint. The desoldering part is formed by braiding a thin metal wire into an endless strip having dimensions and shapes that can be inserted into the gap. The thin metal wire forming the desoldered portion is preferably a copper wire, and the thin metal wire forming the desoldered portion is subjected to a flux for promoting a capillary phenomenon with respect to the molten solder. Further, the solder removing portion may be formed of a metal plate having a metal plating layer having good wettability to molten solder on the surface.

[0013] As described above, the semiconductor package removing apparatus of the present invention is provided with the heating section for melting the solder by directly contacting only the solder joint and the removing section for removing the molten solder. The BGA / CSP can be removed without causing thermal damage to other components already mounted on the board and the printed wiring board itself,
Furthermore, the solder melted by the heating unit is sucked out by a solder removing unit arranged in the same device as the heating unit, without directly contacting the mounting pad, by extracting an excess amount of the solder used for the bonding. Since the solder on the mounting pad can be flattened, no BGA / CSP is applied without applying a mechanical or thermal load to the mounting pad.
Can be performed in a continuous process by the same device at the same time as the removal of the device.

[0014]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view of a main part showing a configuration of a first embodiment of a semiconductor package removing device according to the present invention.

In FIG. 1, a semiconductor package BGA /
The CSP 2 is soldered and mounted on the printed wiring board 3 by the solder joint group 4. Solder joint group 4
The matrix is formed in a gap S between the lower surface of the BGA / CSP 2 and the upper surface of the printed wiring board 3. The size of the gap S is generally such that the terminal interval is 1.27 mm pitch B
In the case of the GA, the distance is less than 0.5 mm, and in the case of the CSP having the terminal spacing of 0.8 mm, the distance is less than about 0.3 mm.

The heating section 1 is formed of a long and thin linear conductor, and is vertically connected to the printed wiring board 3 and from a semiconductor package BG from a heating section provided in a driving source A to be described later.
It is formed by two vertical portions 1a held at a wider interval than the width of the A / CSP 2 and a horizontal portion 1b connecting the front end portions. The shape of the horizontal portion 1b has a shape and dimensions that allow it to be inserted into the gap S described above, and the BGA / CSP
It is heated by the heat generating portion to a temperature at which it can come into contact with the solder joint portion group 4 provided in the gap S between the substrate 2 and the printed wiring board 3 and melt, that is, the melting point of the solder or more.

FIG. 3 is a side view showing the details of the vicinity of the heating unit 1 viewed from a direction perpendicular to the traveling direction. The heating unit 1 is heated in a range of 250 ° C. to 300 ° C. by a heating unit 12 provided in a driving source A13. The heating unit 1 and the heating unit 12 are moved in the direction of the arrow by the driving source A to melt the solder joint group 4.

The heating unit 1 is driven by a driving source A to generate a BGA / C
The gap S between the SP 2 and the printed wiring board 3 is moved parallel to the BGA / CSP 2 and the printed wiring board 3 so as to face the solder joint group 4. Heating unit 1 is BGA / CSP
2 and the printed wiring board 3, the BGA / CSP 2
In the gap S formed between the semiconductor device and the printed wiring board 3, the solder joints 4 existing in a matrix are melted one by one.

The solder removing section 5 is provided behind the heating section 1 in the traveling direction, is formed by braiding a thin metal wire, and has a shape and dimensions that can be inserted into the gap S formed by the BGA / CSP 2 and the printed wiring board 3. Have. It is preferable that the thin metal wire of the solder removing section 5 is copper, in which the capillary phenomenon of the molten solder is more easily obtained. Further, it is preferable that the flux is applied or impregnated in advance in order to promote the capillary phenomenon of the molten solder. Similarly to the heating unit 1, the solder removing unit 5 is provided with a gap S formed between the BGA / CSP 2 and the printed wiring board 3 by a driving source B (not shown).
To the solder joint group 4 and BGA / CSP2
And moves in parallel with the printed wiring board 3. The solder removing section 5 moves the gap S formed between the BGA / CSP 2 and the printed wiring board 3 by the driving source B (not shown) while moving the gap S.
The solder of the solder joints 4 existing in a matrix and melted by the heating unit 1 is sucked one by one into the gap S formed by the A / CSP 2 and the printed wiring board 3 by utilizing the capillary phenomenon of the molten solder. The pads for mounting the BGA / CSP on the printed wiring board 3 are planarized while absorbing the solder joint group 4.

FIG. 4 is a side view showing the details of the periphery of the solder removing section 5 viewed from the traveling direction. The solder removing section 5
At the time when the solder absorption of a row of solder joints is completed, the holding unit 14 that guides the left and right of the endless, and the driving source C15 provided in the heating suction unit 7 endlessly form the belt. Is rotated in the direction of the arrow while maintaining the above shape, and the portion that has absorbed the solder is moved into the heating and suction unit 7. In the heating and suction unit 7, the portion of the solder removing unit 5 from which the solder has been sucked is heated at a temperature equal to or higher than the melting point of the solder to re-melt the solder and forcibly suck the molten solder by a forcible suction mechanism (not shown). Then, the solder removing section 5 is cleaned.

The suction tool 6 suctions the mold part of the BGA / CSP 2 and melts the solder joint part group 4 by the heating part 1 and the solder joint part group 4 by the solder removal part 5.
The BGA / CSP 2 is always kept horizontal and at the same time as the initial gap S with respect to the printed wiring board 3 during the separation and the suction. When the separation of all the solder joints is completed, the suction tool 6 is raised by the driving source D (not shown), and removes the BGA / CSP 2 from the printed wiring board 3.

FIG. 5 is a view similar to FIG. 1 showing a second embodiment of the solder removing section 5. The solder removing part 5a
It is formed of an elongated metal sheet having a shape and dimensions that can be inserted into the gap S formed by the BGA / CSP 2 and the printed wiring board 3, and its surface is plated with a metal having excellent solderability, for example, Au, Ag, Sn or the like. ing. In the present embodiment, the solder joint group 4 melted by the heating unit 1 is used to remove excess solder and flatten the solder on the mounting pad by using the spread of the solder on the surface of the solder removing unit 5a. Is what you do. Other configurations and operations are the same as those of the first embodiment.

Next, the operation of this embodiment will be described with reference to FIG. In FIG. 2A, the heating unit 1 is a BGA /
It is inserted into the gap S between the CSP 2 and the printed wiring board 3, and the solder joint group 4 existing in the gap S is heated to a temperature at which it can be melted. Specifically, heating is performed in a range of 250 ° C. to 300 ° C. The suction tool 6 uses the above-mentioned BGA / CSP
The size of the gap S formed between the printed wiring board 2 and the printed wiring board 3 is set to
GA / CSP2 is suction-held at a fixed position.

Next, in FIG. 2B, the heating unit 1 is moved in the direction of the arrow by the driving source A (not shown),
The first row of solder joints 4a in the first row starts melting by contacting and transferring heat to the first row of solder joints 4a present in the gap S formed by the CSP 2 and the printed wiring board 3. . The heating unit 1 controls the driving source A (not shown) to completely melt the solder joint group 4a in the first row, and sets the first row of solder joints 4a in the preset first row for a predetermined holding time. At the center position of the solder joint group 4a.

Next, in FIG. 2C, the heating unit 1 is moved in the direction of the arrow along the gap S by the driving source A (not shown) after the above-mentioned predetermined holding time has elapsed. To start. The solder removing unit 5 is moved in the direction of the arrow by the driving source B (not shown), comes into contact with the first row of solder joints 4a in the molten state in the gap S, and starts sucking the molten solder by capillary action. . in this case,
The point at which the solder removing unit 5 starts moving by the driving source B is after the point at which the stop of the heating unit 1 for a predetermined time is released by the control of the driving source A, and the heating unit 1 starts moving again.

Next, in FIG. 2 (d), the solder removing section 5 is provided with a drive source B (not shown) in order to more reliably absorb the first row of solder joints 4a in the molten state. After moving to the center position of the solder joint portion group 4a in the first row set in advance by the control, it stops for a predetermined fixed holding time. The heating unit 1 is controlled by a driving source A (not shown) to set a first preset
After moving to the intermediate position between the solder joint group 4a in the row and the solder joint group 4b in the second row, it stops for a predetermined holding time. In this case, the stop holding time of the heating unit 1 is at the maximum, and
This is a period until the stop holding is released by the control (not shown) and the movement is started again.

Next, in FIG. 2 (e), the solder removing section 5 removes the solder of the solder joint section group 4 a of the first row in the molten state and removes the BGA / BGA on the printed wiring board 3 during the stop holding time. After the solder flattening of the CSP2 mounting pad is completed, the solder joint portion group 4a in the first row and the second solder joint portion group 4a set in advance are controlled by the drive source B (not shown).
After the parallel movement to the intermediate position of the solder joint group 4b in the row, the movement is stopped for a predetermined fixed holding time. After stopping the movement in the parallel direction, the solder removing unit 5 moves the portion of the first row of the solder joints 4 a that has absorbed the solder by the driving source C (not shown) into the heating and suction unit 7. In the heating and suction unit 7, the portion of the solder removing unit 5 from which the solder has been sucked is heated at a temperature equal to or higher than the melting point of the solder to re-melt the solder and forcibly suck the molten solder by a forcible suction mechanism (not shown). Then, the solder removing section 5 is cleaned. By this operation, the portion of the solder removing section 5 which is in contact with the solder joint section group is always kept clean. The heating unit 1 starts moving in the direction of the arrow again under the control of the driving source A, comes into contact with the solder joint group 4b in the second row existing in the gap S, and starts melting.

Hereinafter, FIG. 2 (b) to FIG.
Are repeated until the solder joints 4n in the n-th column are melted / separated / absorbed and printed for all solder joints 4 present in the gap S formed by the BGA / CSP 2 and the printed wiring board 3. BGA on the wiring board 3
/ CSP2 solder pad flattening is completed (Fig. 2
(F)).

In FIG. 2F, the solder removing section 5
Gap S formed between BGA / CSP 2 and printed wiring board 3
After the suction of the molten solder of the solder joint portion group 4n in the n-th row existing in the above-mentioned is completed and moved by the drive source B (not shown), the suction tool 6 is controlled by the drive source D (not shown) to move the arrow. BGA for a preset distance in the direction
/ CSP2 rises while being adsorbed. Thereby, the BGA from the printed wiring board 3 according to the method of the present invention is
The removal of / CSP2 is completed.

[0030]

As described above, according to the present invention, in the gap between the lower surface of the semiconductor package and the printed wiring board, the heating section for directly contacting only the solder joint and melting the solder, and the removing section for removing the molten solder are provided. Parts, and these are alternately moved to melt and remove the solder joint group.As a first effect, the other parts already mounted on the printed wiring board and the printed wiring board itself are used. There is an effect that the BGA / CSP can be removed without causing thermal damage, so that it is not necessary to take measures to prevent thermal damage to other components or the printed wiring board itself. Specifically, BG is printed on a printed circuit board.
BGA / C on the periphery where A / CSP is mounted and on the back
It is not necessary to provide a component mounting prohibited area in consideration of thermal damage at the time of removing the SP, and it is possible to improve the mounting density of the printed wiring board, thereby contributing to downsizing of the electronic device. Further, there is an effect that warpage or pattern damage of the printed wiring board due to heating when the BGA / CSP is removed can be suppressed.

The second effect is that BG is printed on the printed circuit board.
The planarization on the mounting pad where the A / CSP was soldered can be performed without applying mechanical or thermal load to the mounting pad, without causing pad peeling or damage to the wiring pattern, and removing the BGA / CSP. The point is that it can be performed simultaneously in a continuous process by the same apparatus. The reason is that the solder melted in the heating unit, by the solder removal unit arranged in the same device as the heating unit,
This is because the solder on the mounting pad can be flattened by sucking an excess amount of the solder used for bonding without directly contacting the mounting pad.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a main part showing a configuration of a first embodiment of a semiconductor package removing device of the present invention.

FIG. 2 is a schematic side view illustrating a method of removing a semiconductor package according to the present invention.

FIG. 3 is a schematic side view showing details of components of a semiconductor package removing device of the present invention.

FIG. 4 is a schematic side view taken in a direction perpendicular to FIG. 3 showing details of components of the semiconductor package removal apparatus of the present invention.

FIG. 5 is a schematic perspective view of a main part showing a configuration of a second embodiment of a semiconductor package removing device of the present invention.

FIG. 6 is a schematic partial cross-sectional view showing a conventional semiconductor package removing apparatus and method.

FIG. 7 is a schematic partial sectional view showing another conventional semiconductor package removing apparatus and method.

[Description of Signs] 1 Heating section 1a Vertical section 1b Horizontal section 2 BGA / CSP 3 Printed wiring board 4 Solder joint section group 4a First row solder joint section group 4b Second row solder joint section group 4n nth Solder joint part group 5 in the row 5, 5a Solder removal part 6 Suction tool 7 Heat suction part 8 Bottom heater 9 Warp prevention jig 10 Threaded spacer 11 Backside heating port 12 Heating part 13 Drive source A 14 Holder 15 Drive source C 16 Backup pin 17 Nozzle heater S Clearance

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[Procedure amendment]

[Submission Date] October 6, 1999 (1999.10.
6)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Name of invention

[Correction method] Change

[Correction contents]

Patent application title: Method of removing semiconductor package

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

1. A method of removing a semiconductor package, comprising removing a group of solder joints between a lower surface of a semiconductor package and a printed wiring board on which the semiconductor package is mounted, and moving the package after the removal. The semiconductor package is held by package holding means, and a part of the joint group is brought into contact with the solder joint group arranged in a matrix in a gap between the lower surface of the semiconductor package and the printed wiring board. A solder heating unit for heating and melting is inserted, and the solder heating unit is moved along the gap to make contact with the first row of the solder joint group and melt the first row. Starting, holding the solder heating section in the first row of the solder joint section group for a certain period of time and completely melting the first row; After the start of the movement after the elapse, a part of the endlessly formed solder removing portion formed by braiding a thin metal wire into a band shape, in order to adsorb and remove the molten solder in the first row by capillary action, After entering the melted portion in the gap to start adsorption and removal of the melted portion, the solder removing portion is stopped for a predetermined time after moving to the position of the melted solder joint portion group in the first row. Then, the melted portion is sucked and removed, and the solder heating section moves to between the first row and the second row of the solder joint section group, and at least the solder removing section moves for a predetermined time. After the stop is released and stopped until the movement is started again, after the solder removing section flattens the mounting pad on the printed wiring board by suction removal of the melted portion,
Moved to a position between the first row and the second row of the solder joint section group and stopped for a certain period of time, and further, the solder removing section moves the portion where the molten solder is adsorbed into the heat suction section, The heating suction unit heats the solder adsorbed in the solder removing unit to re-melt the solder, forcibly sucks the molten solder by a forced suction mechanism to clean the solder removing unit, and further repeats each of the steps. After sucking the molten solder of the solder joint portion group in the n-th row, the solder heating portion and the solder removing portion are moved out of the semiconductor package, and the semiconductor package is moved by the package holding means. How to remove a semiconductor package from a printed circuit board.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing a semiconductor package, and more particularly to a method for removing a ball grid array and a chip size package.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

SUMMARY OF THE INVENTION An object of the present invention is to increase the mounting density without increasing the area where parts are prohibited from being mounted on a printed wiring board, thereby contributing to the miniaturization of electronic equipment, and to achieve BGA / C
A BGA / CSP that does not require the creation of a dedicated jig according to the mounting position of the SP or the shape of the printed wiring board, and thus does not require complicated setup such as attaching and detaching the printed wiring board to and from the dedicated jig. An object of the present invention is to provide a method for removing a type semiconductor package.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

[0011]

Means for Solving the Problems] Removal method of a semiconductor package of the present invention, the lower surface of the semiconductor package, half
Between the printed circuit board on which the conductor package is mounted
Remove the solder joints and remove the package after removal.
A method of removing a semiconductor package to be moved,
Holding the conductor package by package holding means,
The gap between the lower surface of the semiconductor package and the printed wiring board
Contact between solder joints arranged in matrix between
To heat and melt a part of the joint group
Insert the heating section and move the soldering section along the gap.
And contact the first row of the solder joint group to melt the first row.
Starts melting and sets the solder joints for a certain period of time
In the first row, completely melt the first row,
After the heating unit starts moving after a certain period of time,
Endlessly formed braid of thin wires in a band shape
A part of the removal part removes the molten solder in the first row by a capillary tube.
Melted in the gap to be adsorbed and removed by the elephant
Enters the area to start adsorption and removal of the molten part,
To the position of the molten solder joint group in the first row
After moving, stop for a certain period of time and adsorb and remove the melted part
The solder heating section is connected to the first row and the second row of the solder joint section group.
Move to between the rows and make sure that at least
Stop until the fixed time is released and movement starts again
And the solder removal section removes and removes the melted portion by suction.
After flattening the mounting pads on the lint wiring board,
Between the first row and the second row of the
Stop for a certain time, and then remove the solder
Move the sucked part into the heating and suction part, and heat and suck
The part heats the solder adsorbed by the solder removal part and
Is re-melted, and the molten solder is forcibly sucked by the forced suction mechanism.
To clean the desoldered area and repeat each process.
To remove the molten solder in the solder joints in the nth row
After that, connect the solder heating part and the solder removal part to the semiconductor package.
Move out of the package,
Including the step of removing the package from the printed wiring board
In.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Deleted

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

[0013] Removing the semiconductor package of the present invention
Law, as described above, the heating unit in direct contact with only the solder joint to melt the solder, molten by the removal unit for removing the solder, other components and printed that have already been mounted on the printed circuit board The BGA / CSP can be removed without causing thermal damage to the wiring board itself, and the solder melted by the heating unit is directly removed by the solder removal unit arranged in the same device as the heating unit. By absorbing excess solder used for bonding without contacting the solder, it is possible to flatten the solder on the mounting pad, so that no mechanical or thermal load is applied to the mounting pad, and It can be performed in a continuous process by the same device at the same time as the removal of the BGA / CSP.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

[0014]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view of a main part showing a configuration of a first embodiment of an apparatus used for a method of removing a semiconductor package according to the present invention.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0030

[Correction method] Change

[Correction contents]

[0030]

As described above, according to the present invention, in the gap between the lower surface of the semiconductor package and the printed wiring board, the heating section for directly contacting only the solder joint and melting the solder, and the removing section for removing the molten solder are provided. As a first effect, thermal damage is caused to other components already mounted on the printed wiring board and the printed wiring board itself because the parts are alternately moved to melt and remove the solder joint group. There is an effect that the BGA / CSP can be removed without giving it, so that it is not necessary to take measures to prevent thermal damage to other components and the printed wiring board itself. Specifically, BGA / CSP on the printed wiring board
There is no need to provide a component mounting prohibition area in the vicinity of and on the back surface where thermal damage when removing a BGA / CSP is taken into consideration, and it is possible to improve the mounting density of printed wiring boards, and as a result, to reduce the size of electronic devices. Can contribute. Further, there is an effect that warpage or pattern damage of the printed wiring board due to heating when the BGA / CSP is removed can be suppressed.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 illustrates a method for removing a semiconductor package according to the present invention.
1 is a schematic perspective view of a main part of an apparatus to be used , showing a configuration of a first embodiment.

FIG. 2 is a schematic side view illustrating a method of removing a semiconductor package according to the present invention.

FIG. 3 illustrates a method for removing a semiconductor package according to the present invention;
Of you use apparatus, a schematic representation of a side showing details of components.

FIG. 4 illustrates a method for removing a semiconductor package according to the present invention.
FIG. 4 is a schematic side view of the device used, taken in a direction perpendicular to FIG. 3, showing details of the components;

FIG. 5 illustrates a method for removing a semiconductor package according to the present invention;
Of use for apparatus, a schematic perspective view of the main part showing a configuration of a second embodiment.

FIG. 6 is a schematic partial cross-sectional view showing a conventional semiconductor package removing apparatus and method.

FIG. 7 is a schematic partial sectional view showing another conventional semiconductor package removing apparatus and method.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

[Description of Signs] 1 Heating section 1a Vertical section 1b Horizontal section 2 BGA / CSP 3 Printed wiring board 4 Solder joint section group 4a First row solder joint section group 4b Second row solder joint section group 4n nth th column of solder joints group 5,5a desoldering unit 6 suction tool 7 heated suction unit 8 bottom heater 9 warp preventing jig 10 threaded spacers 11 backside pressurized hot inlet 12 heating unit 13 driving source a 14 holding portion 15 drive source C 16 Backup pin 17 Nozzle heater S Clearance

Claims (7)

[Claims] 1. A semiconductor package removal apparatus for removing a group of solder joints between a lower surface of a semiconductor package and a printed wiring board on which the semiconductor package is mounted, and further moving the package after the removal. It is inserted into a gap between the lower surface of the semiconductor package and the printed wiring board, contacts a part of the solder joint group, heats and melts a part of the joint group, and along the gap. A movable solder heating unit, a solder removing unit that enters the molten portion of the solder joint group in the gap, and adsorbs and removes the molten portion, while the melting and adsorption removal of the solder are performed, Package holding means for holding the semiconductor package and moving the semiconductor package from a printed wiring board after the solder is removed. , Semiconductor package removal equipment. 2. The printed wiring board according to claim 2, wherein the solder heating section is formed in a size and a shape that can be inserted into the gap, and a heating section connected to the heating section and the solder heating section are arranged along the gap. 2. The apparatus for removing a semiconductor package according to claim 1, further comprising: a driving source configured to move the semiconductor package in parallel with the solder joint portion. 3. The semiconductor package removing apparatus according to claim 1, wherein the solder removing section is formed by braiding a thin metal wire into an endless strip having a size and shape insertable into the gap. 4. The semiconductor package removing device according to claim 3, wherein the thin metal wire forming the solder removing portion is a copper wire. 5. The semiconductor package removing apparatus according to claim 3, wherein a flux for promoting a capillary phenomenon with respect to the molten solder is applied to the thin metal wire forming the solder removing portion. 6. The semiconductor package removing apparatus according to claim 1, wherein the solder removing section is formed of a metal plate having a metal plating layer having a good wettability to molten solder on a surface thereof. 7. A method of removing a semiconductor package, comprising removing a group of solder joints between a lower surface of a semiconductor package and a printed wiring board on which the semiconductor package is mounted, and moving the package after the removal. The semiconductor package is held by package holding means, and a part of the joint group is brought into contact with the solder joint group arranged in a matrix in a gap between the lower surface of the semiconductor package and the printed wiring board. A solder heating unit for heating and melting is inserted, and the solder heating unit is moved along the gap to make contact with the first row of the solder joint group and melt the first row. Starting, holding the solder heating section in the first row of the solder joint section group for a certain period of time and completely melting the first row; After the start of the movement after the elapse, a part of the endlessly formed solder removing portion formed by braiding a thin metal wire into a band shape, in order to adsorb and remove the molten solder in the first row by capillary action, After entering the melted portion in the gap to start adsorption and removal of the melted portion, the solder removing portion is stopped for a predetermined time after moving to the position of the melted solder joint portion group in the first row. Then, the melted portion is sucked and removed, and the solder heating section moves to between the first row and the second row of the solder joint section group, and at least the solder removing section moves for a predetermined time. After the stop is released and stopped until the movement is started again, after the solder removing section flattens the mounting pad on the printed wiring board by suction removal of the melted portion,
Moved to a position between the first row and the second row of the solder joint section group and stopped for a certain period of time, and further, the solder removing section moves the portion where the molten solder is adsorbed into the heat suction section, The heating suction unit heats the solder adsorbed in the solder removing unit to re-melt the solder, forcibly sucks the molten solder by a forced suction mechanism to clean the solder removing unit, and further repeats each of the steps. After sucking the molten solder of the solder joint portion group in the n-th row, the solder heating portion and the solder removing portion are moved out of the semiconductor package, and the semiconductor package is moved by the package holding means. How to remove a semiconductor package from a printed circuit board.