JP2000022325A - Reflowing apparatus and heating method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflowing apparatus capable of heating a work at a uniform temp. a locally control the temp. to suppress the temp. rise of electronic components less resistive to heat. SOLUTION: The reflow apparatus for reflow-soldering a work 72 by heating it has a hot air flow rectifying mask 22 at an opening 15 for lowing a hot air 12 on the work 72, the mask 22 has a plurality of blow holes 31 for flowing the hot air 12 and a cover 32 closing part of the blow holes 31 to partly block the hot air 12 from passing. When electronic components less resistive to heat such as capacitors, etc., are mounted on a circuit board 73, the cover 32 closes only those blow holes 31 located above the capacitors 76 to reduce the quantity of the hot air blown on the capacitors 76, thereby suppressing the temp. rise of the capacitors 76.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow apparatus for heating a printed circuit board or the like on which electronic components are mounted and performing reflow soldering, and a heating method using the reflow apparatus.

[0002]

2. Description of the Related Art Conventionally, when an electronic circuit is formed, solder is applied to a printed circuit board by printing or the like, electronic components are mounted on the printed circuit board at a predetermined position, and then the printed circuit board is heated together with reflow soldering. There is a way to do that. As a heating means in such reflow soldering, conventionally, a heating means shown in FIG.
As shown in FIG. 1, there is an apparatus using an infrared heater 70.

That is, the infrared heater 70 generates infrared rays 71 and heats an object to be heated 72. The heater temperature is about 500 ° C. The object to be heated 72 includes, for example, a circuit board 73 to which solder has been applied in advance, a large package component 74 to be soldered to the circuit board 73, a chip component 75, an aluminum electrolytic capacitor 76, and the like.

When the infrared heater 70 is used as the heating means as described above, the difference in color of the large package component 74, the chip component 75, or the aluminum electrolytic capacitor 76 causes a difference in the absorptance of the infrared ray 71, resulting in temperature variation. There was a problem that occurs.

[0005] In order to solve the problem that the absorption rate of the infrared ray 71 is different as described above, as another heating means, there is a reflow device 81 using hot air 80 as shown in FIG. That is, in the heating reflow chamber 82, a heater 84 that heats the air blown by the blower 83 to generate hot air 80, a transport device 85 that supports and transports the object to be heated 72, and a transport device that is supported and transported by the transport device 85. An outlet nozzle 86 for blowing out the hot air 80 toward the heated object 72 to be heated is provided. The heater 84 uses a heating wire.

According to this, the air blown by the blower 83 is heated by the heater 84 so that
Hot air 80 of about 00 ° C. is obtained, and the hot air 80 is blown out from the blowing nozzle 86 toward the heated object 72 to heat the heated object 72. By using the hot air 80 heated by the heater 84 in this manner, the heating can be performed almost irrespective of the color of the object to be heated 72, so that the temperature variation can be reduced as compared with the case where the infrared heater 70 is used. .

[0007]

However, in the above-described conventional type, the hot air 80 is generated by the large package component 7.
4 and the chip component 75 and the aluminum electrolytic capacitor 76 are heated by wrapping around each surface. At this time, the large package component 74, the chip component 75, and the aluminum electrolytic capacitor 76 are more than the surface of the circuit board 73. The aluminum electrolytic capacitor 76 is small and has a large surface area for heat capacity. Therefore, the temperature of the aluminum electrolytic capacitor 76 increases with the large package component 74 and the chip component 7.
5 or the circuit board 73. For this reason, as shown in the graph of FIG. 13, during heating, the large package component 74 has a temperature c represented by a solid line.
And the temperature of the chip component 75 as indicated by a dashed line b
And the temperature of the aluminum electrolytic capacitor 76 rises to the temperature a indicated by the upper dotted line. Thus, the circuit board 73
Of the plurality of electronic components 74, 75, 76 mounted on the
The temperature of a specific electronic component such as the aluminum electrolytic capacitor 76 rises too much higher than the temperatures of the other electronic components 74 and 75, and there is a concern that weak heat-resistant electronic components such as the aluminum electrolytic capacitor 76 may be damaged by heat. was there.

Particularly, in recent years, the use of lead-free solder has been studied in order to reduce the effect on the environment. The conventional solder uses a eutectic solder of 63% tin and 37% lead, and its melting point is 183 ° C. On the other hand, in the case of a solder containing no lead, for example, a Sn-Ag alloy, its melting point temperature is at least 216 ° C. Since the temperature at which the solder melts increases as described above, there is a concern that weak heat-resistant electronic components such as the aluminum electrolytic capacitor 76 may be damaged by heat.

The present invention is directed to a reflow apparatus and a reflow apparatus capable of heating an object to be heated at a uniform temperature and performing local temperature control to suppress an increase in the temperature of weakly heat-resistant electronic components. An object of the present invention is to provide a heating method using an apparatus.

[0010]

In order to solve the above-mentioned problems, a reflow apparatus according to the present invention is provided with a mask for rectifying hot air at an opening for blowing hot air toward an object to be heated. Are provided from the upstream side to the downstream side, and a cover that closes some of the blowing holes and partially blocks the passage of hot air.

According to the present invention, the object to be heated can be heated at a uniform temperature, and the temperature of the weakly heat-resistant electronic component can be suppressed by performing local temperature control.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a reflow apparatus for heating an object to be heated constituted by a circuit board on which electronic components are mounted and performing reflow soldering, wherein the apparatus comprises a heating reflow chamber. A hot air supply means for supplying hot air for heating, an opening for blowing out the hot air supplied by the hot air supply means, and a support means for supporting an object to be heated on a downstream side of the opening, Hot air supply means,
It is composed of a heating means and a blowing means for blowing air heated by the heating means to the opening, and a mask for rectifying hot air is provided in the opening, and the mask is configured to send hot air from the upstream side to the downstream side. And a cover that closes some of the holes and partially blocks the passage of hot air.

According to this, the air heated by the heating means is blown to the opening by the blowing means, passes through the opening of the mask from the opening as hot air, and is directed to the object to be heated supported by the supporting means. Blow out. Here, when passing through the outlet, the hot air is rectified, so that the object to be heated can be heated at a uniform temperature, and can be heated almost independently of the color of the object to be heated. Variation can be reduced. When a weak heat-resistant electronic component is mounted on the circuit board, a cover is provided on the mask, and only the blow-off hole facing the weak heat-resistant electronic component is closed with the cover. Thus, the amount of hot air blown toward the weak heat-resistant electronic component can be reduced, and the temperature rise of the weak heat-resistant electronic component can be suppressed.

According to a second aspect of the present invention, the heating means includes a heater and an infrared heater, and the mask is formed of a transparent body that transmits infrared rays of the infrared heater.

According to this, the infrared rays generated from the infrared heater are transmitted through the mask and absorbed by the object to be heated without being blocked by the mask. Therefore, heating using both the heater and the infrared heater can be performed, and therefore,
Variations in temperature that occur when only an infrared heater is used can be prevented, and more heat is generated than when only a heater is used, so that sufficient heating can be performed in a short time. At this time, when a weak heat-resistant electronic component is mounted on the circuit board, a cover is provided on the mask, and only a blowout hole of a portion facing the weak heat-resistant electronic component is closed with the cover, so that a weak cover is provided. The temperature rise of the heat-resistant electronic component can be suppressed.

According to a third aspect of the present invention, the heating means is composed of a heater and an infrared heater, and the mask is provided with a plurality of outlets for passing hot air and infrared rays of the infrared heater from the upstream side to the downstream side. It is formed in a mesh shape.

According to this, the infrared ray generated from the infrared heater passes through the outlet of the mesh-shaped mask without being blocked by the mask and is absorbed by the object to be heated. For this reason, heating using both the heater and the infrared heater can be performed.

According to a fourth aspect of the present invention, the heating means includes a heater and an infrared heater, and the mask has a plurality of honeycomb-shaped outlet holes for passing hot air and infrared light from the infrared heater from upstream to downstream. It is arranged and provided.

According to this, the infrared ray generated from the infrared heater passes through the outlet of the mask and is absorbed by the object to be heated. For this reason, heating using both the heater and the infrared heater can be performed.

According to a fifth aspect of the present invention, the inside of some of the blowout holes is colored black to increase the heat absorption from the infrared heater. According to this, when there is a portion where the temperature hardly rises in the object to be heated, by coloring the inside of the blowing hole facing this portion black,
Since the heat absorption of this black colored outlet is greater than the heat absorption of the other outlets, the black colored outlet absorbs more infrared radiation and the temperature rises, The hot air passing through the blow-off holes colored in black is further heated, and as a result, the heating capacity for the portion of the object to be heated where the temperature is unlikely to rise can be locally enhanced.

According to a sixth aspect of the present invention, the mask is supported and guided by a guide member provided in the opening, is removably attached to the mask, and has an access port for taking the mask in and out of the heating reflow chamber. Is what it is.

According to this, by inserting the mask into the heating reflow chamber through the access port, the mask is supported and guided by the guide member and attached, so that the mask can be easily attached. In addition, the mask can be easily replaced by removing the mask from the guide member and taking it out through the opening.

According to a seventh aspect of the present invention, positioning means for positioning the mounting position of the mask supported by the guide member is provided between the mask and the heating reflow chamber.

According to this, when the mask is inserted into the heating reflow chamber from the access port, the mask is supported and guided by the guide member, and the mask is positioned at the mounting position by the positioning means. Therefore, the mask can be easily and accurately mounted at the mounting position.

An eighth aspect of the present invention is a heating method using a reflow apparatus for heating an object to be heated composed of a circuit board on which electronic components are mounted and performing reflow soldering, wherein hot air is applied to the object to be heated. A mask for rectifying hot air is provided at the opening that blows out toward the mask, a plurality of blow holes are formed in the mask to allow hot air to pass through, and only the blow hole at a portion facing the weak heat-resistant electronic component is closed with a cover. Another object of the present invention is to reduce the amount of hot air blown toward the weak heat-resistant electronic component.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
It will be described based on. (Embodiment 1) As shown in FIG.
This is a reflow apparatus for heating and reflow soldering.
The object to be heated 72 is the same article as the above-mentioned conventional one, and as shown in FIG. 1, a circuit board 73, a large package component 74, a chip component 75, and an aluminum electrolytic capacitor 76.
It is composed of

The configuration of the reflow device 1 will be described below. That is, the reflow device 1 includes a furnace body 2 for preheating the object to be heated 72 and then performing reflow soldering,
A cooling chamber 3 for cooling the object to be heated 72 heated in the furnace, a cooling chamber 3 for supporting the object to be heated 72 and
And a main transporting device 4 (an example of a supporting means) that carries out the rearward through the inside.

As shown in FIGS. 2 to 4, the main transfer device 4 is wound around a pair of left and right sprockets 5 and 6 provided at the front and rear ends of the reflow device 1, and between the front and rear sprockets 5 and 6. It comprises a pair of left and right transport chains 7 and a pair of left and right transport rails 8 for supporting and guiding the upper path section 7a of both transport chains 7. By rotating the front sprocket 5 (or the rear sprocket 6) with a motor or the like (not shown), the right and left transfer chains 7 are rotated, and the object 72 to be heated is transferred to both the transfer chains 7. It is transported along the transport path 23 while being supported between the chains 7.

Inside the furnace main body 2, a preheating chamber 9 for preheating the object 72 to be heated and a heating reflow chamber 10 for performing reflow soldering are provided separated by a partition wall 11.

FIG. 2 shows the inside of the heating reflow chamber 10.
As shown in FIG. 2, a hot air supply means 13 for supplying hot air 12 for heating, and a circulation flow path 14 through which the hot air 12 circulates
And an opening 15 for blowing the hot air 12 in the circulation flow path 14 toward the object to be heated 72 supported by the main transporting device 4. The circulation channel 14 is formed by furnace walls 16 a to 16 d constituting the furnace main body 2 and a plurality of partition plates 17. The upper furnace wall 16b of the furnace body 2 is hinged
1 is configured to be openable and closable in the vertical direction.

The hot air supply means 13 includes a heater 18 (an example of a heating means) provided in the circulation channel 14, and a blower 19 (for the air blowing means) for forcibly circulating the air heated by the heater 18 as the hot air 12. Example). The heater 18 uses a heating wire. A motor 20 for driving the blower 19 is provided below the furnace main body 2.

A flat mask 22 for rectifying hot air is detachably provided in the opening 15. That is,
As shown in FIGS. 3 and 5, the L-shaped guide member 2 which is long in the left-right direction A perpendicular to the transfer path 23 of the main transfer device 4.
A pair of front and rear members 4 are provided on a frame member (not shown) fixed to the partition plate 17 forming the opening 15. The mask 22 is supported and guided between the guide members 24 and is detachably attached in the left-right direction A.
Further, as shown in FIG. 2, an inlet / outlet 25 for taking in / out the mask 22 between the outside of the furnace main body 2 and the two guide members 24 is formed in the furnace wall 16 c on one side of the left and right sides.

As shown in FIGS. 5 and 6, the mask 2
A pair of front and rear notches 26 each having a triangular shape in a plan view are formed on the left and right end sides of the pair 2. Are formed. The positioning pins 27 are provided on the frame member 35 fixed to the partition plate 17 so as to be opposed to each other.
The notch 26, the positioning pin 27, and the fitting hole 28 are members that constitute positioning means 29 for positioning the mounting position of the mask 22 supported by both guide members 24.

As shown in FIG. 1, the mask 22 has
A large number of blowout holes 31 for passing the hot air 12 from above (upstream side) to below (downstream side) and a cover 32 for closing only a part of the blowout holes 31 and partially blocking the passage of the hot air 12 are provided. Have been.

Similarly, as shown in FIG. 4, a heater 18 (not shown) and a blower 19 are also provided in the preheating chamber 9. A cooling fan 33 is provided in the cooling chamber 3. Further, the reflow device 1 includes an object 72 to be heated which has been preheated in the preheating chamber 9.
In addition to the main transfer device 4, there is provided a sub-transport device 34 for transferring the pre-heating chamber 9 from the preheating chamber 9 to the heating reflow chamber 10 and unloading the heating reflow chamber 10 to the cooling chamber 3.

As shown in FIG.
A first pusher 36a which pushes the circuit board 73 conveyed to the rear part of the preheating chamber 9 by the main conveying device 4 in the conveying direction and carries the circuit board 73 into the heating reflow chamber 10; and the circuit board 73 in the heating reflow chamber 10 To the cooling direction by pushing
A second pusher 36b that can be moved up and down to be carried out to the first
First to move the pusher 36a along the transport path 23
It comprises a moving device 37a and a second moving device 37b for moving the second pusher 36b along the transport path 23.

The first and second moving devices 37a, 37
b is constructed by winding belts 40 and 41 between a pair of front and rear pulleys 38 and 39, respectively, and one of the front and rear pulleys 38 and 39 is rotated by a motor or the like. The first
The lower portion of the pusher 36a is connected to one belt 40 via a first lifting device 42 that raises and lowers the first pusher 36a, and the lower portion of the second pusher 36b is a second lifting device that raises and lowers the second pusher 36b. It is connected to the other belt 41 via 43.

The operation of the above configuration will be described. The object to be heated 72 is slowly transported along the transport path 23 while being supported between the two transport chains 7 of the main transport device 4, and is first preheated to about 150 ° C. in the preheating chamber 9. Then, when the heated object 72 is transported to the rear part of the preheating chamber 9, as shown in FIG. 7, the pulley 38 of the first moving device 37a of the sub-transport device 34 rotates to rotate the belt 40, The one pusher 36a moves from the front to the rear and pushes the circuit board 73 toward the heating reflow chamber 10. Thereby, the object to be heated 7
2 is carried into the heating reflow chamber 10 by the sub-transport device 34 at a transport speed higher than that of the main transport device 4, and is stopped in the heating reflow chamber 10 for a predetermined time.

At this time, as shown in FIG.
The air heated by the blower 19 is blown to the opening 15 by the blower 19, passes through the opening 31 of the mask 22 from the opening 15 as the hot air 12 as shown in FIG. Blow down from Here, the hot air 12 is rectified when passing through the blowout holes 31, so that the object to be heated 72 can be heated at a uniform temperature.
Since heating can be performed almost irrespective of the color of the object to be heated 72, variation in temperature can be reduced.

Since the aluminum electrolytic capacitor 76 is an electronic component having low heat resistance, a cover 32 is provided on the mask 22, and only the blowout hole 31 in a portion facing above the aluminum electrolytic capacitor 76 is closed by the cover 32. I do. As a result, the amount of the hot air 12 blown out toward the aluminum electrolytic capacitor 76 is reduced, and as shown in the graph of FIG. 12, the temperature rise of the aluminum electrolytic capacitor 76 is represented by the lower dotted line from the temperature a represented by the upper dotted line. Temperature a ′. Therefore, it is possible to prevent a weak heat-resistant electronic component such as the aluminum electrolytic capacitor 76 from being damaged by heat.

When the object 72 is heated in this way and exceeds the melting temperature of the solder, the solder is melted, and the large package component 74, the chip component 75 and the aluminum electrolytic capacitor 76 are soldered to the circuit board 73, respectively. Attached.

When the soldering in the heating reflow chamber 10 is completed, the second moving device 37b of the sub-transport device 34
The pulley 39 rotates to rotate the belt 41, and the second pusher 36b moves from the front to the rear to push the circuit board 73 toward the cooling chamber 3. Thus, the object to be heated 72 is
By the sub-transport device 34, it is carried into the cooling chamber 3 at a transport speed higher than that of the main transport device 4, cooled in the cooling chamber 3, and then carried out.

Incidentally, as shown in FIG.
The first and second pushers 36a, 36b are returned from the rear to the front in a state of being lowered by the first and second lifting devices 42, 43, and the first and second lifting devices 42, 4
The subsequent circuit board 73 is pushed in a state where it has risen by 3.

According to experiments and the like, the wind velocity of the warm air 12 blown out from each blowout hole 31 is set to 3 m / sec or more to give directivity to the hot air 12, and as shown in FIG. By setting P to be about 1.5 to 2 times the diameter d of the blowout hole 31, the heating efficiency is improved. The distance between the mask 22 and the circuit board 73 is defined as h, and 4 <h /
When the dimension is set to satisfy the relationship d <9, an effect of increasing the heat transfer coefficient from the hot air 12 can be obtained. Based on such conditions, the diameter d of the blowout hole 31 is 2 mm,
The pitch P of the blowing holes 31 is 3 mm, and the distance h is 8 to 18 mm.
By setting to, even in hot air heating with good temperature uniformity, heating with more directivity of heating and suppression of local temperature rise can be performed.

When replacing the mask 22 with another mask 22, as shown in FIGS. 2 and 5, the mask 22 already mounted in the heating reflow chamber 10 is removed from both guide members 24. The mask 22 can be easily taken out by pulling it out of the furnace main body 2 from the inlet / outlet 25 to one side and outside. Thereafter, another mask 22 is inserted into the heating reflow chamber 10 through the inlet / outlet 25. At this time, the other mask 22 is supported and guided by both guide members 24,
Further, as shown in FIGS. 5 and 6, since the positioning pin 27 is fitted into the fitting hole 28 along the cutout 26, another mask 22 is easily positioned at the mounting position. Thereby, the upper furnace wall 16 of the furnace main body 2 as shown by the phantom line in FIG.
The mask 22 can be easily exchanged through the inlet / outlet 25 while the upper furnace wall 16b is closed without performing a troublesome operation such as opening the b upward.
2 can be mounted at the correct mounting position. (Embodiment 2) As shown in FIG. 8, the heating means includes a heater 18 (same as in Embodiment 1) using a heating wire,
An infrared heater 45 is provided. The infrared heater 45 is provided in the circulation channel 14 and includes a mask 46.
Is located just before. The mask 46 is made of a transparent material such as quartz glass that transmits the infrared rays 47 of the infrared heater 45.

According to this, the heater 18 and the blower 19
The hot air 12 thus obtained is blown out toward the object to be heated 72 through the blowout holes 31 in the same manner as in the first embodiment. Further, the infrared ray 4 generated from the infrared heater 45
7 is transmitted through the mask 46 and absorbed by the object to be heated 72 without being blocked by the mask 46. For this reason, heating using both the heater 18 and the infrared heater 45 can be performed, so that the temperature variation that occurs when only the infrared heater 45 is used can be prevented. Further, only the heater 18 is used. The amount of heat generated is larger than in the case, so that sufficient heating can be performed in a short time.

At this time, as in the first embodiment, a cover 32 is provided on the mask 22 so as to cover only the blowout hole 31 in a portion facing above the aluminum electrolytic capacitor 76 which is a weak heat-resistant electronic component. By closing at 32, an increase in the temperature of aluminum electrolytic capacitor 76 can be suppressed. (Embodiment 3) As shown in FIG. 9, the heating means includes a heater 18 (same as in Embodiment 1) and an infrared heater 45. Further, the mask 50 is formed in a mesh shape (a mesh shape) in which a plurality of wires are vertically and horizontally crossed, and the hot air 12 obtained by the heater 18 and the blower 19 and the infrared rays 47 of the infrared heater 45 are both upstream (upward). ) To a downstream side (downward).

According to this, the heater 18 and the blower 19
The hot air 12 thus obtained is blown out toward the object to be heated 72 through the blowout holes 51 in the same manner as in the first embodiment.
7 is also absorbed by the object to be heated 72 through the outlets 51 together with the hot air 12 without being blocked by the mask 50. For this reason, heating using both the heater 18 and the infrared heater 45 can be performed.

At this time, as in the first embodiment, the cover 32 is provided on the mask 50 to cover only the blowout hole 51 in a portion facing above the aluminum electrolytic capacitor 76 which is a weak heat-resistant electronic component. By closing at 32, an increase in the temperature of aluminum electrolytic capacitor 76 can be suppressed. (Embodiment 4) As shown in FIG. 10, the heating means includes a heater 18 (same as in Embodiment 1) and an infrared heater 45.
It is composed of The mask 54 is provided with a plurality of blowout holes 55 arranged in a honeycomb shape in a plan view. The surface color of the mask 54 is coated with aluminum paint or the like that reflects infrared rays 47. Hot air 12 obtained by blower 19 and infrared heater 4
5 is passed from the upstream side (above) to the downstream side (below).

Further, the blow-out hole 55 at a portion facing above the aluminum electrolytic capacitor 76 which is a weak heat-resistant electronic component is closed by the cover 32 attached to the mask 54. Further, the inside of only the blowout hole 55 in a portion facing above the large package component 74 is coated with a black paint 56, and the black paint 56
The rate of absorption of heat from is increased over other parts.

According to this, the heater 18 and the blower 19
The hot air 12 obtained as described above is blown out toward the object to be heated 72 through each blowout hole 55 in the same manner as in the first embodiment.
7 is also absorbed by the object to be heated 72 through the outlets 55 together with the hot air 12 without being blocked by the mask 54. For this reason, heating using both the heater 18 and the infrared heater 45 can be performed.

At this time, as in the first embodiment, only the blow-out hole 55 of the portion facing above the aluminum electrolytic capacitor 76, which is a weak heat-resistant electronic component, is closed by the cover 32, so that the aluminum electrolytic capacitor is closed. The temperature rise of the capacitor 76 can be suppressed.

Further, the blowout hole 5 coated with the black paint 56
5 has a higher heat absorption rate than the other blowout holes 55, so that the blowout hole 55 coated with the black paint 56 absorbs more infrared rays 47 and rises in temperature. The hot air 12 passing through the blow-out hole 55 coated with is further heated, and as a result, the heating capacity of the large package component 74, which is an electronic component whose temperature hardly rises, can be locally enhanced.

In each of the above embodiments, the large package component 74 and the chip component 75 to be soldered to the circuit board 73 are used.
To be heated 7 composed of an aluminum electrolytic capacitor 76 and
2, but may be constituted by other electronic components.

[0055]

As described above, according to the first aspect of the present invention, since the hot air is rectified when passing through the outlet, the object to be heated can be heated at a uniform temperature. Since heating can be performed almost irrespective of color, variation in temperature can be reduced. Further, when a weak heat-resistant electronic component is mounted on the circuit board, only a portion of the blowing hole facing the weak heat-resistant electronic component is closed with a cover, so that the electronic component is directed toward the weak heat-resistant electronic component. The amount of hot air to be blown is reduced, and a rise in temperature of the weak heat-resistant electronic component can be suppressed.

According to the second aspect, the infrared rays generated from the infrared heater are transmitted through the mask and absorbed by the object to be heated without being blocked by the mask. For this reason, heating using both the heater and the infrared heater can be performed, and therefore, it is possible to prevent a temperature variation that occurs when only the infrared heater is used, and further, compared with the case where only the heater is used. A large amount of heat is generated, so that sufficient heating can be performed in a short time.

According to the third aspect of the present invention, the infrared rays generated from the infrared heater pass through the outlets of the mesh-shaped mask without being blocked by the mask and are absorbed by the object to be heated. For this reason, heating using both the heater and the infrared heater can be performed.

According to the fourth aspect of the present invention, the infrared rays generated from the infrared heater pass through the outlet of the mask and are absorbed by the object to be heated. For this reason, heating using both the heater and the infrared heater can be performed.

According to the fifth aspect of the present invention, since the heat absorption of the blow-off hole colored in black is higher than the heat absorption of the other blow-out holes, the blow-out hole colored in black emits more infrared rays. Absorbs and raises the temperature. Thereby, the hot air passing through the blow-off holes colored in black is further heated, and as a result, the heating capacity of the portion of the object to be heated which is unlikely to increase in temperature can be locally enhanced.

According to the sixth aspect, the work of exchanging the mask can be easily performed. According to the seventh aspect, the mask can be easily and accurately mounted at the mounting position.

[Brief description of the drawings]

FIG. 1 is a sectional view of a mask of a reflow apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a front view of a heating reflow chamber of the reflow apparatus.

FIG. 3 is a view taken along the line XX in FIG. 2;

FIG. 4 is a side view showing a main configuration of the reflow device.

FIG. 5 is a perspective view showing attachment and detachment of a mask of the reflow device.

FIG. 6 is a plan view of a mask positioning means of the reflow apparatus.

FIG. 7 is a diagram showing a configuration of a sub-transport device of the reflow device.

FIG. 8 is a sectional view of a mask of the reflow device according to the second embodiment of the present invention.

FIG. 9 is a sectional view of a mask of a reflow device according to Embodiment 3 of the present invention.

FIG. 10 is a sectional view of a mask of a reflow apparatus according to Embodiment 4 of the present invention.

FIG. 11 is a diagram of a conventional infrared heating type reflow device.

FIG. 12 is a diagram of a conventional hot air heating type reflow device.

FIG. 13 is a graph showing the temperature of each electronic component when a plurality of types of electronic components are heated by the reflow device.

[Explanation of symbols]

 Reference Signs List 1 reflow device 4 main transport device (supporting means) 10 heating reflow chamber 12 hot air 13 hot air supply means 15 opening 18 heater (heating means) 19 blower (blowing means) 22 mask 24 guide member 25 access port 29 positioning means 31 blowing hole 32 Cover 45 Infrared heater (heating means) 46 Mask 47 Infrared 50 Mask 51 Blow-out hole 54 Mask 55 Blow-out hole 56 Black paint 72 Heated object 73 Circuit board 74 Large package component (electronic component) 75 Chip component (electronic component) 76 Aluminum Electrolytic capacitors (electronic components)

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masahiro Taniguchi 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Koichi Nagai 1006 Odaka Kadoma, Kadoma City, Osaka Matsushita Electric Industrial F Terms (reference) 5E319 CC33 CC45 CC49

Claims (8)

[Claims] 1. A reflow apparatus for heating an object to be heated composed of a circuit board on which electronic components are mounted and performing reflow soldering, wherein hot air supply means for supplying hot air for heating into a heating reflow chamber; An opening for blowing out the hot air supplied by the hot air supply means and a support means for supporting an object to be heated downstream of the opening are provided. The hot air supply means is heated by the heating means and heated by the heating means. Blower means for blowing the air to the opening,
A mask for hot air rectification is provided in the opening, and the mask has a plurality of outlets for passing hot air from the upstream side to the downstream side, and some of the outlets are closed to partially block the passage of hot air. A reflow device, comprising: 2. The reflow apparatus according to claim 1, wherein the heating means includes a heater and an infrared heater, and the mask is formed of a transparent body that transmits infrared light of the infrared heater. 3. The heating means comprises a heater and an infrared heater, and the mask is formed in a mesh shape having a plurality of blowout holes for passing hot air and infrared light from the infrared heater from an upstream side to a downstream side. The reflow apparatus according to claim 1, wherein: 4. The heating means is composed of a heater and an infrared heater, and the mask is provided with a plurality of outlets arranged in a honeycomb shape for passing hot air and infrared rays of the infrared heater from the upstream side to the downstream side. 2. The method according to claim 1, wherein
The reflow device as described. 5. The reflow apparatus according to claim 4, wherein the inside of some of the outlets is colored black to increase the rate of absorption of heat from the infrared heater. 6. The mask is supported and guided by a guide member provided in the opening, is removably attached to the mask, and has an outlet for taking the mask in and out of the heating reflow chamber. A reflow apparatus according to any one of claims 1 to 5. 7. The reflow apparatus according to claim 6, wherein positioning means for positioning a mounting position of the mask supported by the guide member is provided between the mask and the heating reflow chamber. 8. A heating method using a reflow apparatus for heating an object to be heated constituted by a circuit board on which electronic components are mounted and performing reflow soldering, wherein a hot air is blown toward the object to be heated. A mask for rectifying hot air is provided, a plurality of blowout holes for passing hot air through the mask are formed, and only a blowout hole in a portion facing the weak heat-resistant electronic component is closed with a cover, and the weak heat-resistant electron A heating method using a reflow device, characterized in that the amount of hot air blown toward components is reduced.