JP2000049460A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the electric conductivity of via hole conductors which are formed by filling copper-containing metallic powder in via holes, and the heat resistance of the via hole conductors in a wiring board. SOLUTION: A wiring board is provided with an insulating board 1 containing at least an organic resin, a plurality of conductor wiring layers 2 formed in the surfaces of the board 1 and/or in the interior of the board 1, and via hole conductors 3 which are provided in the board 1 for connecting electrically the layers 2 with each other and are filled with copper-containing metallic powder. In this case, tin(Sn) is contained in the conductors 3 at a rate that the weight ratio of the tin(Sn) to the above copper(Cu) shown by the ratio of Sn/(Cu+Sn) becomes the weight ratio of 1 to 0.25 to 0.75. At the same time, an intermetallic compound 5 which is shown by at least a Cu3Sn is produced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring board having at least an insulating substrate containing an organic resin and a via-hole conductor filled with a conductive paste. It is related to the improvement of.

[0002]

2. Description of the Related Art In recent years, a so-called printed circuit board having a conductor wiring layer formed on the surface of an insulating board containing a thermosetting resin such as an epoxy resin or a phenol resin has been applied to a package or the like on which a circuit board or a semiconductor element is mounted. . As a method of forming a conductor wiring layer on such a printed circuit board, a method of forming a wiring circuit by bonding a copper foil to the surface of an insulating substrate and then etching the same, or a method of forming a copper foil on a wiring circuit A method of transferring to an insulating substrate, a method of forming a circuit on a surface of the insulating substrate by a metal plating method, and the like are used.

[0003] Further, with the increase in the number of wiring layers, conductor wiring layers between different layers are also electrically connected by via-hole conductors. In general, the via-hole conductor is formed by drilling a via-hole in a predetermined portion of an insulating substrate of a multilayer wiring board with a drill or the like, and then plating the inner wall in the via-hole.

[0004] However, in the above-mentioned method, the chemicals used for performing the chemical plating treatment are expensive and the processing time is long. In addition, via-hole conductors whose inner walls are plated are difficult to form between arbitrary layers in a multilayer structure, and there is a problem that the density of conductor wiring layers cannot be improved.

To cope with such a problem, recently, a conductor wiring layer is formed by using a conductor paste obtained by mixing a metal powder such as silver, copper, solder, etc. with a thermosetting resin or an activator, and using the conductor paste on the surface of an insulating substrate. Or a method of filling in via holes and laminating to form a multilayer is proposed in Japanese Patent No. 2603053, Japanese Patent Publication No. 5-39360, Japanese Patent Application Laid-Open No. 55-160072, and the like.

[0006]

However, in the conventional method of forming a via-hole conductor by filling a conductive paste, the amount of the thermosetting resin component in the conductive paste is large, and the metal powder is contained in the via-hole conductor. There is a problem that the conductivity of the via-hole conductor is low due to insufficient contact between them.

[0007] In order to solve such a problem, a paste containing a low melting point solder such as Pb-Sn together with a powder such as copper in the paste is used to connect the copper powders by solder to increase the conductivity of the via-hole conductor. Has also been proposed.

However, if the solder itself such as Pb-Sn exists in the via-hole conductor in the wiring board,
When the wiring board is heated to a high temperature during the reflow process or reliability test, the solder component in the via-hole conductor melts, and the connection state between the wiring layer made of copper foil and the via-hole conductor changes, and the conductive state changes. There is a problem that the performance is deteriorated.

The present invention solves such a drawback, and comprises an insulating substrate containing at least an organic resin, is formed by filling a conductive paste containing copper, has high conductivity and high heat resistance, and has It is an object of the present invention to provide a wiring board provided with a via-hole conductor having high connection reliability with a wiring layer.

[0010]

The inventor of the present invention has conducted studies on increasing the conductivity of via-hole conductors. As a result, the present inventors have found that an insulating substrate containing at least an organic resin and a substrate formed on the surface and / or inside of the insulating substrate are provided. And a via-hole conductor provided in an insulating substrate for electrically connecting the conductor wiring layers and filled with a metal powder containing at least copper as a metal component. The via hole conductor contains tin (Sn), and the amount of Sn / (Cu +
By increasing the weight ratio represented by (Sn) to 0.25 to 0.75 and forming an intermetallic compound of Cu ₃ Sn in the via-hole conductor, the conductivity of the via-hole conductor can be increased. The heat resistance can be improved, so that the volume resistivity of the via-hole conductor is 1 × 10 ⁻⁴ even after the heat test after holding at 260 ° C. for 2 minutes.
Excellent heat resistance of Ω-cm or less can be provided.

[0011] In the X-ray diffraction measurement, the via-hole conductor is formed of a Cu existing at about 2θ = 57.5 °.
_When the peak height of ₃ Sn is H ₁ and the peak height of Cu ₆ Sn ₅ existing near 2θ = 60 ° is H ₂ , H ₁ /
When H ₂ is 0.5 or more, more excellent heat resistance can be provided.

The via-hole conductor may contain Pb at a ratio of 35% by weight or less based on all the metal components.

According to the wiring board of the present invention, the conductor wiring layer is formed of copper foil, and a Cu ₃ Sn intermetallic compound is formed on the surface of the copper foil in the via-hole conductor, whereby the copper is formed. The conductor wiring layer made of foil and the via-hole conductor can be firmly connected.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic sectional view showing an example of a wiring board according to the present invention. The wiring board of the present invention has an insulating substrate 1 formed by laminating a plurality of insulating layers 1a to 1d containing at least an organic resin. The conductor wiring layer 2 is formed by deposition. A via-hole conductor 3 is provided to connect the conductor wiring layers 2 between different layers.

The via-hole conductor 3 is filled with a powder containing at least copper such as a copper powder, a copper powder having a silver-coated surface, and a silver-copper alloy powder. The via-hole conductor 3 further contains tin (Sn), and the via-hole conductor 3 contains at least an intermetallic compound represented by Cu ₃ Sn.

Cu ₃ Sn is a crystalline compound composed of copper (Cu) and tin (Sn) in a ratio of 3: 1.
The intermetallic compound u) and tin (Sn), said Cu ₃
In addition to Sn, there is Cu ₆ Sn _5. According to the present invention,
The presence of at least Cu ₃ Sn with a high Cu content can provide the via hole conductor with heat resistance and high electrical conductivity. In the present invention, Cu ₆ Sn ₅ may be present together with Cu ₃ Sn.

As shown in the schematic diagram showing the structure of the via-hole conductor in FIG.
The intermetallic compound 5 is present between the conductor wiring layer 2 and
The copper-containing powder and the copper-containing powder and the conductive wiring layer 2 are firmly connected.

In the present invention, in order to promote the generation of Cu ₃ Sn, copper (Cu) in the via-hole conductor is used.
And the weight ratio expressed as Sn / (Cu + Sn) with tin (Sn) is 0.25 to 0.75, particularly 0.30 to 0.7.
0, more preferably 0.35 to 0.65.

If the weight ratio is less than 0.25, the amount of the intermetallic compound produced is reduced, and the connectivity between the copper-containing powder and between the copper-containing powder and the conductive wiring layer is reduced. The conductivity between the two conductor wiring layers via the via-hole conductor is low, and the heat resistance during reflow is poor, that is, when reflowing at a temperature of 240 to 260 ° C., between metal powder in the via-hole conductor, This is because the contact state between the via-hole conductor and the conductor wiring layer easily changes, and the conductivity between the two conductor wiring layers via the via-hole conductor decreases.

On the other hand, if the weight ratio is larger than 0.75, the absolute amount of copper is reduced, so that the amount of the intermetallic compound formed is small, and the unreacted component which cannot form an intermetallic compound with Cu is formed. Of tin remains in the via-hole conductor as tin or a tin alloy having a low melting point, similarly deteriorating the heat resistance during reflow (240 to 260 ° C.). That is, unreacted tin or a low-melting tin alloy is melted during reflow, and the contact state between the metal powder in the via-hole conductor and the contact state between the via-hole conductor and the conductor wiring layer is easily changed to cause the via-hole conductor to intervene. This is because the conductivity between the two conductor wiring layers tends to decrease.

According to the present invention, at least Cu ₃ Sn is present in the via-hole conductor and may coexist with Cu ₆ Sn ₅ as another intermetallic compound.
₃ Sn is higher conductivity than Cu ₆ Sn _5. Therefore, it is desirable that a large amount of the Cu ₃ Sn compound be present as the intermetallic compound and that the Cu ₆ Sn ₅ compound be scattered between the Cu ₃ Sn compounds or not be present.

More specifically, in the X-ray diffraction measurement of the via-hole conductor, the C existing near 2θ = 57.5 °
When the peak height of u ₃ Sn is H ₁ and the peak height of Cu ₆ Sn ₅ existing near 2θ = 60 ° is H ₂ , H ₁ /
It is desirable that H ₂ is 0.5 or more, particularly 1.0 or more.

According to the present invention, the via-hole conductor may contain Pb in addition to the above-mentioned copper, tin, and silver. In this case, CuSnP is produced together with the formation of Cu ₃ Sn.
intermetallic compound b ₃ is easily formed. This CuS
Since nPb ₃ has a high resistance and lowers the conductivity of the via-hole conductor, the content of Pb is 35% by weight or less, preferably 30% by weight or less, and more preferably 2% by weight of all metal components.
It is desirable that the content be 5% by weight or less.

In the wiring board according to the present invention, since the via-hole conductor is constituted by the above-described composition and structure, the volume resistivity of the via-hole conductor is 1 × 10 even after the heat test at 260 ° C. for 2 minutes. ^-4 Ω−
cm or less, particularly 5 × 10 ⁻⁵ Ω-cm or less.

The via-hole conductor may contain a thermosetting resin such as an epoxy resin, a phenol resin, or an unsaturated polyester resin, or a resin such as cellulose.

The insulating layer 1a in the multilayer wiring board of the present invention
To 1d are made of an insulating material containing at least an organic resin. Specifically, as the organic resin, for example, PPE
(Polyphenylene ether), BT resin (bismaleimide triazine), epoxy resin, polyimide resin, fluororesin, phenol resin, and other resins are desirable. In particular, it is desirable that the raw material is a thermosetting resin having a glass transition point of 180 ° C. or higher. . Also, in this organic resin,
In order to increase the strength of the entire substrate, a filler component can be compounded. As the filler, SiO ₂ , A
l ₂ O ₃ , ZrO ₂ , TiO ₂ , AlN, SiC, Ba
Inorganic fillers such as TiO ₃ , SrTiO ₃ , zeolite and CaTiO ₃ are preferably used. Further, a nonwoven fabric or a woven fabric made of glass or aramid resin may be used by impregnating the above resin. When compounding with the filler component as described above, the organic resin and the filler have a volume ratio of 30:
It is desirable to composite at a ratio of 70 to 70:30.

Further, the conductor wiring layer 2 is desirably made of at least one or two or more alloys selected from the group consisting of copper, aluminum, gold and silver.
Alternatively, a via-hole conductor formed by filling a conductor paste with a metal foil having a thickness of 5 to 40 μm, which is made of an alloy containing copper, can seal the via-hole conductor at both ends to prevent the influence of the outside air. It is most desirable because it has excellent electrical connectivity with the device.

(Preparation Method of Paste) The preparation method of the conductor paste when filling the via-hole conductor of the wiring board of the present invention will be described. First, copper powder, silver-coated copper powder and copper powder are used as metal components. In contrast to a copper-containing powder such as a silver alloy powder, a tin powder or a solder powder composed of an alloy such as Pb-Sn is added to tin (Sn) in a metal component and copper (C).
u) and Sn / (Cu + Sn) in a weight ratio of 0.1.
It mix | blends in the ratio used as 25-0.75. And, with respect to 100 parts by weight of the metal component, 1 to 6 parts by weight of the resin component,
The solvent is added in a proportion of 1 to 4 parts by weight.

The copper-containing powder to be used is most preferably an electrolytic copper powder having excellent conductivity and good dispersibility.
５5 μm is desirable. This is because if it is smaller than 0.5 μm, the surface is oxidized and the conductivity between the powders is reduced. If it is larger than 5 μm, the filling rate of the powder into the via-hole conductor is reduced and the resistance is increased. The average particle size of the tin powder or the solder powder is preferably 1 to 15 μm. This means that if it is smaller than 1 μm, the surface will oxidize and increase resistance,
If it is larger than 15 μm, the filling rate is reduced, and tin is localized to impair heat resistance.

As the resin component, bisphenol A which reacts with an amine-based curing agent or an acid anhydride from the viewpoints of dispersibility, adhesion, heat resistance, storage stability, weather resistance and the like of a copper-containing powder or a tin-containing powder, or In addition to thermosetting resins such as bisphenol F, epoxy resin and triallyl isocyanurate resin,
Cellulose can also be used.

The solvent may be any solvent as long as it is a resin or a solvent that can be dissolved, for example, isopropyl alcohol,
Terpineol, 2-octanol, butyl carbitol acetate and the like are used.

A paste can be prepared by kneading the composition prepared as described above with a stirring deaerator or a three-roll mill. In this kneading, the metal powder and the thermosetting resin are mixed, and oxidation of the tin-based powder during curing can be prevented.

(Method of Manufacturing Wiring Board) Next, a method of manufacturing a wiring board using the conductive paste will be described. First, as shown in FIG. 3A, via holes 12 are formed in an uncured or semi-cured soft insulating sheet 11 by laser processing, micro drilling, or the like. Then, as shown in FIG. 3B, the via holes 12 are filled with the conductor paste prepared as described above to form via-hole conductors 13. The filling of the conductor paste can be performed by screen printing.

Next, the conductor wiring layer 14 is formed on the surface of the insulating sheet 11. The formation of the conductor wiring layer 14 is performed by a)
A method of forming a circuit pattern by attaching a metal foil to the surface of an insulating sheet and then performing an etching treatment; b) a method of forming a resist on the surface of the insulating sheet and forming a metal layer by plating; c) a surface of the transfer sheet After attaching a metal foil to the metal sheet, an etching process is performed to form a circuit pattern, and then the circuit pattern of the metal foil is transferred to the surface of the insulating sheet. It is not necessary to immerse in the liquid or the like, and the transfer method c) is the most desirable in order to prevent invasion of chemicals into the via-hole conductor.

Therefore, c) a description will be given below of an example of a conductor wiring layer formed by a transfer method. As shown in FIG. 3C, the conductor wiring layer 14 made of a metal foil is formed on the surface of the transfer sheet 15. The conductive wiring layer 14 is formed by bonding a metal foil to the surface of the transfer sheet 15 with an adhesive, applying a resist on the surface of the metal foil in a circuit pattern, and performing an etching process and a resist removal. . At this time, the exposed surface of the conductive wiring layer 14 made of a metal foil has a surface roughness (Ra) of 0.1 to 5 μm, particularly 0.1 μm by etching or the like.
It is desirable that the surface is roughened to about 2 to 4 μm.

Next, as shown in FIG. 3C, the transfer sheet 15 on which the conductor wiring layer 14 is formed is aligned with the surface of the soft insulating sheet 11 on which the via-hole conductor 13 is formed, and added. After the pressure lamination, the transfer sheet 15 is peeled off, and the conductor wiring layer 14 is transferred to the insulating sheet 11, whereby one unit of the wiring layer a is formed.

At this time, since the insulating sheet 11 is in a soft state, the conductor wiring layer 14 is buried in the surface of the insulating sheet 11 and substantially covers the surface of the insulating sheet 11 and the conductor wiring layer 1.
The layers are pressed and laminated so that the surfaces of No. 4 are flush with each other. The pressure lamination conditions at this time were as follows: a pressure of 20 kg / cm ² or more;
A temperature of 60-140 ° C is suitable.

Then, one unit of the wiring layer a manufactured as described above and one unit of the wiring layers b and c manufactured in the same manner are laminated and pressed as shown in FIG. By heating to the temperature to completely cure the thermosetting resin in the insulating sheet, a multilayered wiring board can be manufactured.

The heat curing temperature at this time is a temperature sufficient to completely cure the thermosetting resin in the insulating sheet, and at the same time, reacts the copper and tin in the via-hole conductor to form a Cu.
It is required that the temperature be such that ₃ Sn and Cu ₆ Sn ₅ can be generated, and the temperature is set to 150 ° C. or higher.

More specifically, when tin powder is used, the melting point of the tin powder is 232 ° C.
Heat above 90 ° C. When a solder powder such as Pb-Sn is used, the melting point differs depending on the ratio of Pb and Sn. Therefore, according to the ratio, the tin powder or the solder powder is heated to a temperature at which the tin powder or the solder powder is semi-melted or completely melted. However, the temperature is desirably 180 ° C. or higher for the generation of Cu ₃ Sn.

By this heating, the molten tin component reacts with the copper component in the copper-containing powder to form Cu ₃ Sn, Cu ₆ Sn ₅
However, the amount of the intermetallic compound generated by this reaction is determined by the heating temperature and the heating time. For example, when Sn powder is blended as the Sn component, unreacted Sn is When observed by an electron micrograph, it is confirmed as an aggregated portion of Sn. Similarly, when solder powder is used, agglomerated portions of Sn and Pb are also confirmed, but according to the present invention, finally, most of the Sn component in the via-hole conductor is converted to the intermetallic compound. It is desirable that the unreacted Sn and the solder portion do not substantially exist.

According to the above-described manufacturing method, the formation and lamination of via holes in the insulating sheet and the step of forming the conductor wiring layer can be performed in parallel, so that the manufacturing time in the wiring board is greatly reduced. be able to. Further, according to the multilayer wiring board of the present invention, it is also possible to form a through hole using a drill and form a metal plating layer on the inner wall of the hole.

In the above manufacturing method, the insulating sheet is completely cured and Cu ₃ Sn in the via-hole conductor is removed.
Heat treatment for an intermetallic compound such as Cu ₆ Sn ₅ was collectively performed after forming the multilayer, but this heat treatment was applied to each insulating sheet before lamination, and then laminated to form a multilayer. It is also possible.

According to the present invention, the Cu ₃ Sn, Cu ₆ Sn ₅ intermetallic compound produced by heat treatment in the copper-containing via-hole conductor in the wiring board has excellent conductivity and a copper-containing powder. Or between the copper powder and the conductor wiring layer. In addition, since this intermetallic compound has excellent heat resistance as compared with tin powder and solder powder, even if a heat test of holding at 260 ° C. for 2 minutes is performed, the intermetallic compound can be used between copper-containing powder or between copper powder and conductor wiring layer. Thus, it is possible to manufacture a wiring board having a stable and high conductivity via-hole conductor without a change in the bonding state with the via hole conductor.

[0045]

EXAMPLES In order to evaluate the characteristics of via-hole conductors in the present invention, a single-layer wiring board was manufactured as follows.

First, a silver-coated copper powder (average particle size 5 μm, silver content 6% by weight) and a Pb—Sn alloy (average particle size 10 μm) were used.
m, Pb: Sn weight ratio = 38: 62, melting point = about 183
C) at a ratio shown in Table 1, 4.0 parts by weight of an epoxy resin composed of bisphenol F as a thermosetting resin and an amine-based curing agent, and 2.0 parts of 2-octanol as a solvent. A conductive paste was prepared by adding parts by weight and kneading with three rolls.

On the other hand, a B-stage insulating sheet composed of 40% by volume of polyphenylene ether resin and 60% by volume of silica was 200 micron diameter drilled.
A μm via hole was formed, and the conductive paste prepared as described above was filled in the via hole.

Then, a conductive wiring layer made of a copper foil having a thickness of 12 μm is bonded to both sides of the insulating sheet in a B-stage state in which the conductive paste is embedded by a transfer method so as to hold both ends of the via-hole conductor. The heat treatment was performed under the conditions shown in Table 1.

Then, the volume resistivity of the via-hole conductor after the heat treatment was measured. Further, a heat resistance test in which the via hole conductor was held in a solder atmosphere at 260 ° C. for 2 minutes was performed, and the volume resistivity of the via-hole conductor after this test was measured.
The measurement of the volume specific resistance is obtained by measuring the resistance between the conductor wiring layers made of metal foil sandwiching the via-hole conductor from both sides.

Further, X-ray diffraction measurement was performed on the via-hole conductor of each wiring board, and the peak height of Cu ₃ Sn existing near 2θ = 57.5 ° was set to H ₁ and 2θ = 60 °. seeking H ₁ / H ₂ peak ratio when the peak height of Cu ₆ Sn ₅ that is present was H _2, are shown in Table 1. In Table 1, X of the via-hole conductors of Sample Nos. 5, 6, 7, and 9 are shown.
The line diffraction chart is shown in FIG.

[0051]

[Table 1]

As shown in the results of Table 1, Sn / (Cu
+ Sn) when the weight ratio is lower than 25% by weight (Sample No.
1-4), no or little Cu ₃ Sn compound is generated, and the Ω-cm after the heat resistance test is 2.6 × 10 ⁻⁴ Ω.
−cm or more, and the heat resistance was low.
Further, even when the Sn / (Cu + Sn) weight ratio exceeded 75% by weight, generation of Cu ₃ Sn was not recognized, and the resistance after the heat test was high.

Further, the heat treatment temperature is too low and Cu ₃ Sn
In the case where the formation of was not observed, excellent conductivity and heat resistance were not exhibited. In the case of the X-ray peak intensity ratio, when the peak ratio of H ₁ / H ₂ is 0.5 or more, it shows excellent heat resistance and high conductivity of 3 × 10 ⁻⁵ Ω-cm or less even after the heat resistance test. Was.

[0054]

As described above in detail, according to the wiring board of the present invention, in a via-hole conductor formed by filling a powder containing copper, tin is contained in a specific ratio and a specific copper is contained. By generating an intermetallic compound of tin and tin, the conductivity of the via-hole conductor can be improved, and the copper-containing powder or the copper powder and the conductor wiring layer are firmly joined, and after the solder heat resistance test, Also,
Since it has stability without change in conductivity, the reliability as a wiring board can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a wiring board according to the present invention.

FIG. 2 is a schematic view showing a structure of a via-hole conductor in the wiring board of the present invention.

FIG. 3 is a process chart for explaining a method of manufacturing a wiring board according to the present invention.

FIG. 4 is a cross-sectional view of a via-hole conductor according to an embodiment of the present invention;
It is a figure showing a line diffraction measurement chart.

[Explanation of symbols]

1 insulating substrate 2 conductor interconnect layer 3 via hole conductor 4 copper-containing powder 5 intermetallic compound _{5a Cu 3 Sn 5b Cu 6 Sn} 5

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[Procedure amendment]

[Submission Date] October 25, 1999 (1999.10.
25)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

[0010]

The inventor of the present invention has conducted studies on increasing the conductivity of via-hole conductors. As a result, the present inventors have found that an insulating substrate containing at least an organic resin and a substrate formed on the surface and / or inside of the insulating substrate are provided. And a via-hole conductor provided in an insulating substrate for electrically connecting the conductor wiring layers and filled with a metal powder containing at least copper as a metal component. The via hole conductor contains tin (Sn), and the amount of Sn / (Cu +
The weight ratio represented by Sn) is 0.25 to 0.75, and the intermetallic compound of Cu ₃ Sn is generated between the copper-containing powders in the via-hole conductor. The conductivity and the heat resistance can be improved, whereby the volume resistivity of the via-hole conductor is 1 × 10 ⁻⁴ Ω-cm or less even after the heat test after holding at 260 ° C. for 2 minutes. Heat resistance can be imparted.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0015

[Correction method] Change

[Correction contents]

The via-hole conductor 3 is filled with a powder containing at least copper such as a copper powder, a copper powder having a silver-coated surface, and a silver-copper alloy powder. The via-hole conductor 3 further contains tin (Sn) and at least an intermetallic compound represented by Cu ₃ Sn between the copper-containing powders in the via-hole conductor 3.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0017

[Correction method] Change

[Correction contents]

As shown in the schematic diagram showing the structure of the via-hole conductor in FIG. 2, the intermetallic compound 5 exists between the copper-containing powder 4 and further between the copper-containing powder 4 and the conductor wiring layer 2, The copper-containing powder and the copper-containing powder and the conductive wiring layer 2 are firmly connected.

 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 4E351 AA01 BB01 BB23 BB26 BB31 BB35 BB49 CC11 CC17 DD04 DD05 DD12 DD21 DD52 EE02 EE03 GG04 GG06 5E346 AA02 AA12 AA15 AA35 AA43 BB01 CC02 CC08 CC31 DD33 DD33 DD33 DD33 DD EE31 FF18 GG02 GG19 GG22 GG28 HH01 HH07 HH18

Claims (5)

[Claims] An insulating substrate containing at least an organic resin, a plurality of conductive wiring layers formed on the surface and / or inside the insulating substrate, and an insulating substrate for electrically connecting the conductive wiring layers. And a via-hole conductor filled with a metal powder containing at least copper as a metal component, wherein tin (Sn) is contained in the via-hole conductor and Sn is mixed with the copper (Cu). / (C
a wiring board characterized by containing at a weight ratio of 0.25 to 0.75 represented by (u + Sn) and containing an intermetallic compound represented by Cu ₃ Sn. 2. In the X-ray diffraction measurement of the via-hole conductor, the peak height of Cu ₃ Sn existing at about 2θ = 57.5 ° is set to H ₁ , and the Cu ₆ S existing at about 2θ = 60 ° is obtained.
When the peak height of the n ₅ was H _2, H ₁ / H ₂ is 0.5
2. The wiring board according to claim 1, wherein: 3. The wiring board according to claim 1, wherein said via-hole conductor contains Pb at a ratio of 35% by weight or less based on all metal components. 4. The conductive wiring layer is formed of copper foil,
Cu ₃ Sn is formed on the surface of the copper foil in the via-hole conductor.
2. The wiring board according to claim 1, wherein the intermetallic compound is present. 5. The wiring according to claim 1, wherein a volume resistivity of the via-hole conductor after holding at 260 ° C. for 2 minutes is 1 × 10 ⁻⁴ Ω-cm or less. substrate.