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ITMI20092345A1 - MICROTECHNICAL SYSTEM AND PROCEDURE FOR THE MANUFACTURE OF A TECHNICAL-MECHANICAL SYSTEM - Google Patents

MICROTECHNICAL SYSTEM AND PROCEDURE FOR THE MANUFACTURE OF A TECHNICAL-MECHANICAL SYSTEM

Info

Publication number
ITMI20092345A1
ITMI20092345A1 ITMI20092345A ITMI20092345A1 IT MI20092345 A1 ITMI20092345 A1 IT MI20092345A1 IT MI20092345 A ITMI20092345 A IT MI20092345A IT MI20092345 A1 ITMI20092345 A1 IT MI20092345A1
Authority
IT
Italy
Prior art keywords
microtechnical
procedure
manufacture
technical
mechanical system
Prior art date
Application number
Other languages
Italian (it)
Inventor
Torsten Ohms
Carsten Raudzis
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20092345A1 publication Critical patent/ITMI20092345A1/en
Application granted granted Critical
Publication of IT1397526B1 publication Critical patent/IT1397526B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
ITMI2009A002345A 2009-01-07 2009-12-30 MICRO-TECHNICAL SYSTEM AND PROCEDURE FOR THE MANUFACTURE OF A MICRO-TECHNICAL SYSTEM IT1397526B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200910000048 DE102009000048A1 (en) 2009-01-07 2009-01-07 Micro-technical system has substrate and sealing, where substrate and sealing form two cavities, where different pressures are present in cavities

Publications (2)

Publication Number Publication Date
ITMI20092345A1 true ITMI20092345A1 (en) 2010-07-08
IT1397526B1 IT1397526B1 (en) 2013-01-16

Family

ID=42234661

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A002345A IT1397526B1 (en) 2009-01-07 2009-12-30 MICRO-TECHNICAL SYSTEM AND PROCEDURE FOR THE MANUFACTURE OF A MICRO-TECHNICAL SYSTEM

Country Status (3)

Country Link
DE (1) DE102009000048A1 (en)
FR (1) FR2940797B1 (en)
IT (1) IT1397526B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011085723A1 (en) * 2011-11-03 2013-05-08 Continental Teves Ag & Co. Ohg Component and method for manufacturing a device
DE102020209936A1 (en) 2020-08-06 2022-02-10 Robert Bosch Gesellschaft mit beschränkter Haftung Micromechanical system, method for setting a partial pressure, wafer arrangement

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001292884A1 (en) * 2000-09-20 2002-04-02 Molecular Reflections Microfabricated ultrasound array for use as resonant sensors
US6956268B2 (en) * 2001-05-18 2005-10-18 Reveo, Inc. MEMS and method of manufacturing MEMS
US6919231B1 (en) * 2004-03-24 2005-07-19 Intel Corporation Methods of forming channels on an integrated circuit die and die cooling systems including such channels
DE102004027501A1 (en) * 2004-06-04 2005-12-22 Robert Bosch Gmbh Micromechanical device with several caverns and manufacturing process
US7159459B2 (en) * 2005-01-06 2007-01-09 Freescale Semiconductor, Inc. Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor
DE102006016260B4 (en) * 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiple component with several components containing active structures (MEMS) for later separation, flat substrate or flat cap structure, component with active structures that can be used in microsystem technology, single substrate or cap structure with active structures and method for producing a multiple component
EP1977991A3 (en) * 2007-04-05 2013-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Micro-structured components with a substrate and a chip directly contacting the substrate, and method for its manufacture
DE102007022509B4 (en) * 2007-05-14 2015-10-22 Robert Bosch Gmbh Micromechanical device with thin-film capping and manufacturing process

Also Published As

Publication number Publication date
FR2940797A1 (en) 2010-07-09
IT1397526B1 (en) 2013-01-16
FR2940797B1 (en) 2016-02-19
DE102009000048A1 (en) 2010-07-08

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