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IT1212780B - Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione. - Google Patents

Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.

Info

Publication number
IT1212780B
IT1212780B IT8323385A IT2338583A IT1212780B IT 1212780 B IT1212780 B IT 1212780B IT 8323385 A IT8323385 A IT 8323385A IT 2338583 A IT2338583 A IT 2338583A IT 1212780 B IT1212780 B IT 1212780B
Authority
IT
Italy
Prior art keywords
fastening
manufacture
metal
semiconductor device
device suitable
Prior art date
Application number
IT8323385A
Other languages
English (en)
Other versions
IT8323385A0 (it
Inventor
Luigi Romano'
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT8323385A priority Critical patent/IT1212780B/it
Publication of IT8323385A0 publication Critical patent/IT8323385A0/it
Priority to NL8403177A priority patent/NL8403177A/nl
Priority to KR1019840006511A priority patent/KR910009781B1/ko
Priority to FR8416055A priority patent/FR2559956B1/fr
Priority to DE3438435A priority patent/DE3438435C2/de
Priority to JP59219399A priority patent/JPS60121744A/ja
Priority to GB08426633A priority patent/GB2148597B/en
Priority to US07/391,674 priority patent/US5001547A/en
Application granted granted Critical
Publication of IT1212780B publication Critical patent/IT1212780B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT8323385A 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione. IT1212780B (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT8323385A IT1212780B (it) 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
NL8403177A NL8403177A (nl) 1983-10-21 1984-10-17 Houder van metaal en kunsthars voor een halfgeleider-inrichting ter bevestiging aan een dissipator, die niet geheel vlak is, alsmede een werkwijze voor de vervaardiging ervan.
KR1019840006511A KR910009781B1 (ko) 1983-10-21 1984-10-19 반듯하지 못한 방열기에 반도체장치를 고정시키기 위한 금속 및 수지홀더 및 그 제작방법
FR8416055A FR2559956B1 (fr) 1983-10-21 1984-10-19 Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication
DE3438435A DE3438435C2 (de) 1983-10-21 1984-10-19 Gehäuse aus Metall und Kunststoff für eine Halbleiter-Vorrichtung, das zur Befestigung an einem nicht genau ebenen Wärmeableiter geeignet ist, sowie Verfahren zu dessen Herstellung
JP59219399A JPS60121744A (ja) 1983-10-21 1984-10-20 半導体装置のホルダ−及びその製造方法
GB08426633A GB2148597B (en) 1983-10-21 1984-10-22 Packages and mountings for semi-conductor devices and methods of manufacture thereof
US07/391,674 US5001547A (en) 1983-10-21 1989-08-07 Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8323385A IT1212780B (it) 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.

Publications (2)

Publication Number Publication Date
IT8323385A0 IT8323385A0 (it) 1983-10-21
IT1212780B true IT1212780B (it) 1989-11-30

Family

ID=11206617

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8323385A IT1212780B (it) 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.

Country Status (8)

Country Link
US (1) US5001547A (it)
JP (1) JPS60121744A (it)
KR (1) KR910009781B1 (it)
DE (1) DE3438435C2 (it)
FR (1) FR2559956B1 (it)
GB (1) GB2148597B (it)
IT (1) IT1212780B (it)
NL (1) NL8403177A (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
US5175610A (en) * 1990-05-09 1992-12-29 Kabushiki Kaisha Toshiba Resin molded type semiconductor device having a metallic plate support
JP2001035977A (ja) * 1999-07-26 2001-02-09 Nec Corp 半導体装置用容器
US7187548B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US7187568B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7061775B2 (en) 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US7142434B2 (en) 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US7032695B2 (en) * 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1016728A (en) * 1911-07-26 1912-02-06 New Haven Electrical Mfg Co Electrical fitting.
FR75277E (fr) * 1959-03-06 1961-06-05 Prec Mecanique Labinal Perfectionnements apportés aux prises de courant
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL6903229A (it) * 1969-03-01 1970-09-03
FR2233732B1 (it) * 1973-06-15 1976-04-30 Unelec
IT7823238V0 (it) * 1978-11-08 1978-11-08 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore.
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57149754A (en) * 1981-03-12 1982-09-16 Nec Corp Semiconductor device
FR2503932A1 (fr) * 1981-04-08 1982-10-15 Thomson Csf Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS59152653A (ja) * 1983-02-21 1984-08-31 Hitachi Ltd レジンパツケ−ジ型半導体装置
GB2147457A (en) * 1983-09-28 1985-05-09 Philips Electronic Associated Encapsulated semiconductor device with composite conductive leads

Also Published As

Publication number Publication date
FR2559956A1 (fr) 1985-08-23
KR850003065A (ko) 1985-05-28
GB2148597A (en) 1985-05-30
DE3438435A1 (de) 1985-05-02
FR2559956B1 (fr) 1987-12-18
US5001547A (en) 1991-03-19
GB2148597B (en) 1987-05-28
GB8426633D0 (en) 1984-11-28
KR910009781B1 (ko) 1991-11-30
NL8403177A (nl) 1985-05-17
IT8323385A0 (it) 1983-10-21
JPS60121744A (ja) 1985-06-29
DE3438435C2 (de) 1994-06-01

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971030