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IT1159135B - Rapid etching soln. for printed circuit boards - contg. molybdenum cpd. and peroxide providing synergistic effect - Google Patents

Rapid etching soln. for printed circuit boards - contg. molybdenum cpd. and peroxide providing synergistic effect

Info

Publication number
IT1159135B
IT1159135B IT2815178A IT2815178A IT1159135B IT 1159135 B IT1159135 B IT 1159135B IT 2815178 A IT2815178 A IT 2815178A IT 2815178 A IT2815178 A IT 2815178A IT 1159135 B IT1159135 B IT 1159135B
Authority
IT
Italy
Prior art keywords
molybdenum
contg
printed circuit
circuit boards
soln
Prior art date
Application number
IT2815178A
Other languages
Italian (it)
Other versions
IT7828151A0 (en
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/822,002 external-priority patent/US4130454A/en
Application filed by Shipley Co filed Critical Shipley Co
Publication of IT7828151A0 publication Critical patent/IT7828151A0/en
Application granted granted Critical
Publication of IT1159135B publication Critical patent/IT1159135B/en

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  • ing And Chemical Polishing (AREA)

Abstract

The acid soln. comprises molybdenum together with sufficient peroxide to oxidise the molybdenum and provide sustained etching. The molybdenum content is sufficient to provide an etch rate greater than that achievable by peroside alone. Pref. the peroxide concn. is 0.5-2.5 moles/l and the Mo concn. 0.02-0.5 moles/l. H2O2 is pref. in an H2SO4-contg. soln. for etching Cu, or an HCl-contg. soln. for Ti. The soln. is used partic. for etching Cu in the prodn. of printed circuit boards. Mo is not consumed and replenishment only of peroxide is required.
IT2815178A 1977-09-30 1978-09-27 Rapid etching soln. for printed circuit boards - contg. molybdenum cpd. and peroxide providing synergistic effect IT1159135B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/822,002 US4130454A (en) 1976-01-05 1977-09-30 Etchant and process of etching with the same

Publications (2)

Publication Number Publication Date
IT7828151A0 IT7828151A0 (en) 1978-09-27
IT1159135B true IT1159135B (en) 1987-02-25

Family

ID=25234839

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2815178A IT1159135B (en) 1977-09-30 1978-09-27 Rapid etching soln. for printed circuit boards - contg. molybdenum cpd. and peroxide providing synergistic effect

Country Status (2)

Country Link
CA (1) CA1092009A (en)
IT (1) IT1159135B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102321908A (en) * 2011-09-02 2012-01-18 广州市天承化工有限公司 Recycling and regenerating process method and metal copper recovery system of acid chloride etching solution

Also Published As

Publication number Publication date
IT7828151A0 (en) 1978-09-27
CA1092009A (en) 1980-12-23

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