IN2015DN01149A - - Google Patents
Info
- Publication number
- IN2015DN01149A IN2015DN01149A IN1149DEN2015A IN2015DN01149A IN 2015DN01149 A IN2015DN01149 A IN 2015DN01149A IN 1149DEN2015 A IN1149DEN2015 A IN 1149DEN2015A IN 2015DN01149 A IN2015DN01149 A IN 2015DN01149A
- Authority
- IN
- India
- Prior art keywords
- electrode
- substrate
- energy source
- segmented
- bringing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An apparatus (100..103) for the plasma coating of a substrate (2) in particular a press platen is provided comprising a vacuum chamber (3) and arranged therein an electrode (400..409) which is segmented wherein each of the electrode segments (500..512) has a dedicated connection (6) for an electrical energy source (700..702). Also provided is a method for operating said apparatus (100..103) in which a substrate (2) to be coated is positioned with respect to said electrode (400..409) and at least one energy source (700..706) that is assigned to an electrode segment (500..512) is activated. Moreover a gas is introduced with the effect of bringing about plasma enhanced chemical vapour deposition on the substrate (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATA877/2012A AT513190B9 (en) | 2012-08-08 | 2012-08-08 | Apparatus and method for plasma coating a substrate, in particular a press plate |
PCT/AT2013/050152 WO2014022872A2 (en) | 2012-08-08 | 2013-08-06 | Apparatus and method for the plasma coating of a substrate, in particular a press platen |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2015DN01149A true IN2015DN01149A (en) | 2015-06-26 |
Family
ID=49584535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1149DEN2015 IN2015DN01149A (en) | 2012-08-08 | 2013-08-06 |
Country Status (18)
Country | Link |
---|---|
US (1) | US9530624B2 (en) |
EP (1) | EP2882885B8 (en) |
JP (1) | JP6140286B2 (en) |
KR (1) | KR101742744B1 (en) |
CN (1) | CN104755653B (en) |
AT (1) | AT513190B9 (en) |
AU (1) | AU2013302202B2 (en) |
BR (1) | BR112015002657A8 (en) |
CA (1) | CA2881069C (en) |
CL (1) | CL2015000301A1 (en) |
DK (1) | DK2882885T3 (en) |
ES (1) | ES2587929T3 (en) |
IN (1) | IN2015DN01149A (en) |
MY (1) | MY176134A (en) |
NZ (1) | NZ704253A (en) |
PL (1) | PL2882885T3 (en) |
RU (1) | RU2615743C2 (en) |
WO (1) | WO2014022872A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017025389A (en) * | 2015-07-24 | 2017-02-02 | 株式会社ユーテック | Plasma cvd device and film deposition method |
US11251019B2 (en) * | 2016-12-15 | 2022-02-15 | Toyota Jidosha Kabushiki Kaisha | Plasma device |
CN107283551B (en) * | 2017-08-21 | 2018-07-24 | 阜南盛原木业有限公司 | A kind of glued board with good mildew and insect proof performance |
JP6863199B2 (en) | 2017-09-25 | 2021-04-21 | トヨタ自動車株式会社 | Plasma processing equipment |
CN109055917B (en) * | 2018-09-07 | 2020-09-08 | 信阳师范学院 | Single-chamber double-sided coating plasma chemical vapor deposition system |
DE102019127659A1 (en) * | 2019-10-15 | 2021-04-15 | Hueck Rheinische Gmbh | Press tool and method of making a press tool |
US11884426B2 (en) | 2020-07-08 | 2024-01-30 | Hamilton Sundstrand Corporation | Compression apparatus and methods of making and using the same |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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US3984043A (en) * | 1972-07-10 | 1976-10-05 | United Technologies Corporation | Method for bonding composite materials |
NL8602357A (en) * | 1985-10-07 | 1987-05-04 | Epsilon Ltd Partnership | APPARATUS AND METHOD FOR THE CHEMICAL VAPOR DISPOSAL USING AN AXIAL SYMMETRICAL GAS FLOW. |
US4885074A (en) | 1987-02-24 | 1989-12-05 | International Business Machines Corporation | Plasma reactor having segmented electrodes |
US5156820A (en) * | 1989-05-15 | 1992-10-20 | Rapro Technology, Inc. | Reaction chamber with controlled radiant energy heating and distributed reactant flow |
RU2176681C2 (en) * | 1989-11-22 | 2001-12-10 | Волков Валерий Венедиктович | Method of making coats in vacuum, device for making such coats and method of manufacture of said device |
JP2901317B2 (en) * | 1990-07-02 | 1999-06-07 | 株式会社日立製作所 | Sputtering apparatus and film forming method using the same |
US5244375A (en) | 1991-12-19 | 1993-09-14 | Formica Technology, Inc. | Plasma ion nitrided stainless steel press plates and applications for same |
DE4202425C2 (en) | 1992-01-29 | 1997-07-17 | Leybold Ag | Method and device for coating a substrate, in particular with electrically non-conductive layers |
US5273588A (en) * | 1992-06-15 | 1993-12-28 | Materials Research Corporation | Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means |
DE4443608C1 (en) | 1994-12-07 | 1996-03-21 | Siemens Ag | Plasma reactor for integrated circuit fabrication |
DE19757141A1 (en) * | 1997-12-20 | 1999-06-24 | Philips Patentverwaltung | Array of diamond / hydrogen electrodes |
US6190514B1 (en) | 1997-12-30 | 2001-02-20 | Premark Rwp Holdings, Inc. | Method for high scan sputter coating to produce coated, abrasion resistant press plates with reduced built-in thermal stress |
JP3595853B2 (en) * | 1999-03-18 | 2004-12-02 | 日本エー・エス・エム株式会社 | Plasma CVD film forming equipment |
JP4718093B2 (en) * | 2000-03-28 | 2011-07-06 | 東京エレクトロン株式会社 | Method and system for controlling power supplied to a composite segment electrode |
US20020155957A1 (en) * | 2001-02-14 | 2002-10-24 | Danly, James C. | Sintered anti-friction bearing surface |
US6741446B2 (en) * | 2001-03-30 | 2004-05-25 | Lam Research Corporation | Vacuum plasma processor and method of operating same |
DE20113503U1 (en) * | 2001-08-14 | 2002-01-17 | Espe, Oliver, 44799 Bochum | Press tool with highly abrasion-resistant surface |
US7217471B2 (en) * | 2002-05-17 | 2007-05-15 | 3M Innovative Properties Company | Membrane electrode assembly with compression control gasket |
DE10337117A1 (en) * | 2003-08-11 | 2005-03-17 | Dieffenbacher Gmbh + Co. Kg | Process and single or multi-daylight press for the production of wood-based panels, especially OSB panels |
TWI283651B (en) * | 2004-04-23 | 2007-07-11 | Bobst Sa | Device for transferring a foil matter from outside to inside of a machine |
RU2285742C2 (en) * | 2004-07-27 | 2006-10-20 | Евгений Владимирович Берлин | Method of application of metallic coat on dielectric substrate and device for realization of this method |
DE602005026220D1 (en) * | 2004-10-22 | 2011-03-17 | Dow Global Technologies Inc | VERBUNDROHRE AND MANUFACTURING METHOD THEREFOR |
JP4704088B2 (en) | 2005-03-31 | 2011-06-15 | 東京エレクトロン株式会社 | Plasma processing equipment |
US20070042131A1 (en) | 2005-08-22 | 2007-02-22 | Applied Materials, Inc., A Delaware Corporation | Non-intrusive plasma monitoring system for arc detection and prevention for blanket CVD films |
CN101268375B (en) * | 2005-09-22 | 2011-01-19 | 皇家飞利浦电子股份有限公司 | Two-dimensional adaptive accelerometer based on dielectrophoresis |
CN101605851B (en) * | 2007-02-08 | 2013-05-08 | 亨斯迈先进材料(瑞士)有限公司 | Thermosetting composition |
KR101297711B1 (en) | 2007-02-09 | 2013-08-20 | 한국과학기술원 | Plasma processing apparatus and plasma processing method |
JP4707693B2 (en) | 2007-05-01 | 2011-06-22 | 株式会社アルバック | Sputtering apparatus and sputtering method |
JP5429771B2 (en) | 2008-05-26 | 2014-02-26 | 株式会社アルバック | Sputtering method |
US20100252744A1 (en) * | 2009-04-06 | 2010-10-07 | Koninklijke Philips Electronics N.V. | Radiation detector with a plurality of electrode systems |
WO2011005879A2 (en) * | 2009-07-09 | 2011-01-13 | Incube Labs, Llc | Ring electrode assembly and applications thereof |
EP2459767A1 (en) | 2009-07-26 | 2012-06-06 | Leybold Optics GmbH | Cleaning of a process chamber |
JP5496073B2 (en) | 2010-12-21 | 2014-05-21 | 三菱電機株式会社 | Microcrystalline semiconductor thin film manufacturing apparatus and microcrystalline semiconductor thin film manufacturing method |
US20120247543A1 (en) * | 2011-03-31 | 2012-10-04 | Integrated Photovoltaic, Inc. | Photovoltaic Structure |
-
2012
- 2012-08-08 AT ATA877/2012A patent/AT513190B9/en not_active IP Right Cessation
-
2013
- 2013-08-06 IN IN1149DEN2015 patent/IN2015DN01149A/en unknown
- 2013-08-06 AU AU2013302202A patent/AU2013302202B2/en not_active Ceased
- 2013-08-06 EP EP13791714.2A patent/EP2882885B8/en not_active Not-in-force
- 2013-08-06 CA CA2881069A patent/CA2881069C/en not_active Expired - Fee Related
- 2013-08-06 RU RU2015107784A patent/RU2615743C2/en not_active IP Right Cessation
- 2013-08-06 MY MYPI2015700347A patent/MY176134A/en unknown
- 2013-08-06 US US14/420,194 patent/US9530624B2/en active Active
- 2013-08-06 WO PCT/AT2013/050152 patent/WO2014022872A2/en active Application Filing
- 2013-08-06 BR BR112015002657A patent/BR112015002657A8/en not_active IP Right Cessation
- 2013-08-06 PL PL13791714.2T patent/PL2882885T3/en unknown
- 2013-08-06 DK DK13791714.2T patent/DK2882885T3/en active
- 2013-08-06 ES ES13791714.2T patent/ES2587929T3/en active Active
- 2013-08-06 NZ NZ704253A patent/NZ704253A/en not_active IP Right Cessation
- 2013-08-06 KR KR1020157006106A patent/KR101742744B1/en active IP Right Grant
- 2013-08-06 JP JP2015525690A patent/JP6140286B2/en not_active Expired - Fee Related
- 2013-08-06 CN CN201380042267.0A patent/CN104755653B/en not_active Expired - Fee Related
-
2015
- 2015-02-06 CL CL2015000301A patent/CL2015000301A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
NZ704253A (en) | 2016-08-26 |
RU2015107784A (en) | 2016-09-27 |
MY176134A (en) | 2020-07-24 |
DK2882885T3 (en) | 2016-09-05 |
EP2882885A2 (en) | 2015-06-17 |
CA2881069C (en) | 2017-11-07 |
JP6140286B2 (en) | 2017-05-31 |
US9530624B2 (en) | 2016-12-27 |
CN104755653B (en) | 2017-09-19 |
AT513190B1 (en) | 2014-03-15 |
CL2015000301A1 (en) | 2015-09-21 |
RU2615743C2 (en) | 2017-04-11 |
CN104755653A (en) | 2015-07-01 |
WO2014022872A2 (en) | 2014-02-13 |
AU2013302202A1 (en) | 2015-02-26 |
US20150255254A1 (en) | 2015-09-10 |
PL2882885T3 (en) | 2016-11-30 |
WO2014022872A3 (en) | 2014-05-15 |
EP2882885B1 (en) | 2016-05-25 |
AU2013302202B2 (en) | 2015-12-03 |
ES2587929T3 (en) | 2016-10-27 |
JP2015531820A (en) | 2015-11-05 |
AT513190A1 (en) | 2014-02-15 |
KR20150042817A (en) | 2015-04-21 |
BR112015002657A2 (en) | 2017-07-04 |
AT513190B9 (en) | 2014-05-15 |
KR101742744B1 (en) | 2017-06-01 |
BR112015002657A8 (en) | 2019-07-30 |
EP2882885B8 (en) | 2016-08-31 |
CA2881069A1 (en) | 2014-02-13 |
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