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IL234345A - Methods and systems for utilizing design data in combination with inspection data - Google Patents

Methods and systems for utilizing design data in combination with inspection data

Info

Publication number
IL234345A
IL234345A IL234345A IL23434514A IL234345A IL 234345 A IL234345 A IL 234345A IL 234345 A IL234345 A IL 234345A IL 23434514 A IL23434514 A IL 23434514A IL 234345 A IL234345 A IL 234345A
Authority
IL
Israel
Prior art keywords
data
systems
methods
combination
utilizing design
Prior art date
Application number
IL234345A
Other languages
Hebrew (he)
Inventor
Kekare Sagar
chang Ellis
Park Allen
Rose Peter
Zafar Khurram
Original Assignee
Kla-Tencor Tech Corp
Kekare Sagar
chang Ellis
Park Allen
Rose Peter
Zafar Khurram
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/561,659 external-priority patent/US7570796B2/en
Priority claimed from US11/561,735 external-priority patent/US7676077B2/en
Application filed by Kla-Tencor Tech Corp, Kekare Sagar, chang Ellis, Park Allen, Rose Peter, Zafar Khurram filed Critical Kla-Tencor Tech Corp
Publication of IL234345A publication Critical patent/IL234345A/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31718Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00Information retrieval; Database structures therefor; File system structures therefor
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Databases & Information Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
IL234345A 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data IL234345A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US73794705P 2005-11-18 2005-11-18
US73829005P 2005-11-18 2005-11-18
US11/561,659 US7570796B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
PCT/US2006/061113 WO2007120280A2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data
US11/561,735 US7676077B2 (en) 2005-11-18 2006-11-20 Methods and systems for utilizing design data in combination with inspection data

Publications (1)

Publication Number Publication Date
IL234345A true IL234345A (en) 2016-11-30

Family

ID=38610775

Family Applications (14)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234345A IL234345A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Family Applications Before (12)

Application Number Title Priority Date Filing Date
IL191527A IL191527A (en) 2005-11-18 2008-05-18 Methods and systems for utilizing design data in combination with inspection data
IL230235A IL230235A (en) 2005-11-18 2013-12-29 Methods and systems for utilizing design data in combination with inspection data
IL230260A IL230260A (en) 2005-11-18 2013-12-31 Methods and systems for utilizing design data in combination with inspection data
IL234290A IL234290A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234289A IL234289A (en) 2005-11-18 2014-08-25 Methods and systems for utilizing design data in combination with inspection data
IL234319A IL234319A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234316A IL234316A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234318A IL234318A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234317A IL234317A (en) 2005-11-18 2014-08-26 Methods and systems for utilizing design data in combination with inspection data
IL234343A IL234343A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234346A IL234346A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data
IL234344A IL234344A (en) 2005-11-18 2014-08-27 Methods and systems for utilizing design data in combination with inspection data

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL253189A IL253189B (en) 2005-11-18 2017-06-27 System and method for assigning classifications to defects detected on a wafer

Country Status (5)

Country Link
EP (1) EP1955225A4 (en)
JP (12) JP5465880B2 (en)
KR (11) KR101530456B1 (en)
IL (14) IL191527A (en)
WO (2) WO2007120279A2 (en)

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