HRP20211378T1 - Spojna legura, spojna pasta i spojni zglob - Google Patents
Spojna legura, spojna pasta i spojni zglob Download PDFInfo
- Publication number
- HRP20211378T1 HRP20211378T1 HRP20211378TT HRP20211378T HRP20211378T1 HR P20211378 T1 HRP20211378 T1 HR P20211378T1 HR P20211378T T HRP20211378T T HR P20211378TT HR P20211378 T HRP20211378 T HR P20211378T HR P20211378 T1 HRP20211378 T1 HR P20211378T1
- Authority
- HR
- Croatia
- Prior art keywords
- solder
- alloy
- joint
- less
- paste
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title claims 7
- 239000000956 alloy Substances 0.000 title claims 7
- 229910000679 solder Inorganic materials 0.000 title 3
- 238000005219 brazing Methods 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Claims (3)
1. Legura za lemljenje koja ima sastav legure koji se u težinskim% sastoji od:
Ag: 1% do 4%;
Cu: 0,5% do 0,8%;
Bi: 4,9% ili više i 5,5% ili manje;
Sb: više od 1,5% i 5,5% ili manje;
Ni: 0,01% ili više i manje od 0,1%;
Co: više od 0,001% i 0,1% ili manje; i
ravnoteža je Sn,
pri čemu sastav legure zadovoljava sljedeće odnose (1) do (3):
[image]
pri čemu Ni, Co, Bi i Sb svaki predstavljaju sadržaj u masenim postocima u leguri za lemljenje.
2. Spojna pasta koja sadrži leguru za lemljenje prema zahtjevu 1.
3. Spoj za lemljenje koji sadrži leguru za lemljenje prema zahtjevu 1.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017073270 | 2017-03-31 | ||
| PCT/JP2018/013555 WO2018181873A1 (ja) | 2017-03-31 | 2018-03-30 | はんだ合金、ソルダペースト及びはんだ継手 |
| EP18774478.4A EP3603877B1 (en) | 2017-03-31 | 2018-03-30 | Solder alloy, solder paste, and solder joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HRP20211378T1 true HRP20211378T1 (hr) | 2021-12-24 |
Family
ID=63676469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HRP20211378TT HRP20211378T1 (hr) | 2017-03-31 | 2018-03-30 | Spojna legura, spojna pasta i spojni zglob |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US10967464B2 (hr) |
| EP (1) | EP3603877B1 (hr) |
| JP (1) | JP6447790B1 (hr) |
| KR (1) | KR102071255B1 (hr) |
| CN (1) | CN110430968B (hr) |
| BR (1) | BR112019020490B1 (hr) |
| DK (1) | DK3603877T3 (hr) |
| ES (1) | ES2887361T3 (hr) |
| HR (1) | HRP20211378T1 (hr) |
| HU (1) | HUE056341T2 (hr) |
| MX (1) | MX2019011465A (hr) |
| MY (1) | MY188597A (hr) |
| PH (1) | PH12019502148B1 (hr) |
| PT (1) | PT3603877T (hr) |
| TW (1) | TWI677580B (hr) |
| WO (1) | WO2018181873A1 (hr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6624322B1 (ja) | 2019-03-27 | 2019-12-25 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
| TWI742813B (zh) * | 2019-09-02 | 2021-10-11 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金 |
| WO2021205760A1 (ja) * | 2020-04-10 | 2021-10-14 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、ソルダペースト、はんだボール、ソルダプリフォーム及びはんだ継手 |
| JP6836040B1 (ja) | 2020-07-31 | 2021-02-24 | 千住金属工業株式会社 | はんだ合金 |
| JP6936926B1 (ja) * | 2021-03-10 | 2021-09-22 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手 |
| TWI778648B (zh) * | 2021-06-04 | 2022-09-21 | 岱暉股份有限公司 | 焊料合金 |
| JP7421157B1 (ja) | 2022-08-12 | 2024-01-24 | 千住金属工業株式会社 | はんだ合金、はんだペースト及びはんだ継手 |
| WO2024034689A1 (ja) * | 2022-08-12 | 2024-02-15 | 千住金属工業株式会社 | はんだ合金、はんだペースト及びはんだ継手 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7607047A (nl) | 1976-06-28 | 1977-12-30 | Stamicarbon | Werkwijze voor het winnen van epsilon-caprolac- tam uit een epsilon-caprolactam-zwavelzuur- -reactiemengsel. |
| JPS5349703A (en) | 1976-10-19 | 1978-05-06 | Nitto Tire | Pneumatic tire and rim assembly |
| JPS53117216A (en) | 1977-03-23 | 1978-10-13 | Sugie Seitou Kk | Roof structure |
| JPS5723056A (en) | 1980-07-17 | 1982-02-06 | Nippon Steel Corp | Preparation of molten lead-tin alloy plated steel plate with excellent plating appearance and corrosion resistance |
| JPS6053248B2 (ja) | 1981-03-27 | 1985-11-25 | 工業技術院長 | 軟鋼等超厚板の水中ガス切断法 |
| JPS6047254A (ja) | 1983-08-26 | 1985-03-14 | Hitachi Ltd | 光デイスクの作製方法 |
| JPS6053248A (ja) | 1983-08-31 | 1985-03-26 | Daido Kogyo Co Ltd | スチ−ルベルト |
| JP2005340275A (ja) | 2004-05-24 | 2005-12-08 | Denso Corp | 電子部品接合体、その製造方法、およびそれを含む電子装置 |
| WO2014002304A1 (ja) | 2012-06-29 | 2014-01-03 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| WO2014013632A1 (ja) | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP2015077601A (ja) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP5730354B2 (ja) * | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
| MY188657A (en) | 2014-04-30 | 2021-12-22 | Nihon Superior Co Ltd | Lead-free solder alloy |
| JP5723056B1 (ja) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| JP6200534B2 (ja) | 2015-03-24 | 2017-09-20 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| CN106001978B (zh) * | 2015-03-24 | 2020-02-07 | 株式会社田村制作所 | 无铅软钎料合金、电子电路基板和电子控制装置 |
| MY186064A (en) * | 2015-05-05 | 2021-06-18 | Indium Corp | High reliability lead-free solder alloys for harsh environment electronics applications |
| US10518362B2 (en) * | 2015-07-24 | 2019-12-31 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| MY188659A (en) | 2015-07-24 | 2021-12-22 | Harima Chemicals Inc | Solder alloy, solder paste, and electronic circuit board |
| JP2016107343A (ja) * | 2015-12-24 | 2016-06-20 | 千住金属工業株式会社 | 鉛フリーはんだ合金と車載電子回路 |
| JP6052381B2 (ja) | 2015-12-24 | 2016-12-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| BR112018068596A2 (pt) | 2016-03-22 | 2019-02-12 | Tamura Corporation | liga de soldas sem chumbo, composição de fluxo, composição de pasta de solda, placa de circuito eletrônico, e controlador eletrônico |
| JP6047254B1 (ja) | 2016-03-22 | 2016-12-21 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| JP2018083211A (ja) | 2016-11-24 | 2018-05-31 | ハリマ化成株式会社 | ソルダペースト、フラックスおよび電子回路基板 |
-
2018
- 2018-03-30 KR KR1020197027240A patent/KR102071255B1/ko active IP Right Grant
- 2018-03-30 ES ES18774478T patent/ES2887361T3/es active Active
- 2018-03-30 PT PT187744784T patent/PT3603877T/pt unknown
- 2018-03-30 MX MX2019011465A patent/MX2019011465A/es active IP Right Grant
- 2018-03-30 JP JP2018538810A patent/JP6447790B1/ja active Active
- 2018-03-30 US US16/498,843 patent/US10967464B2/en active Active
- 2018-03-30 HR HRP20211378TT patent/HRP20211378T1/hr unknown
- 2018-03-30 TW TW107111117A patent/TWI677580B/zh active
- 2018-03-30 CN CN201880018715.6A patent/CN110430968B/zh active Active
- 2018-03-30 EP EP18774478.4A patent/EP3603877B1/en active Active
- 2018-03-30 WO PCT/JP2018/013555 patent/WO2018181873A1/ja active Application Filing
- 2018-03-30 BR BR112019020490-3A patent/BR112019020490B1/pt active IP Right Grant
- 2018-03-30 DK DK18774478.4T patent/DK3603877T3/da active
- 2018-03-30 HU HUE18774478A patent/HUE056341T2/hu unknown
- 2018-03-30 MY MYPI2019005323A patent/MY188597A/en unknown
-
2019
- 2019-09-19 PH PH12019502148A patent/PH12019502148B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP6447790B1 (ja) | 2019-01-09 |
| PT3603877T (pt) | 2021-09-09 |
| EP3603877B1 (en) | 2021-08-11 |
| US10967464B2 (en) | 2021-04-06 |
| TW201842206A (zh) | 2018-12-01 |
| WO2018181873A1 (ja) | 2018-10-04 |
| EP3603877A4 (en) | 2020-02-05 |
| PH12019502148B1 (en) | 2021-08-27 |
| CN110430968A (zh) | 2019-11-08 |
| BR112019020490B1 (pt) | 2023-03-28 |
| TWI677580B (zh) | 2019-11-21 |
| JPWO2018181873A1 (ja) | 2019-04-04 |
| KR102071255B1 (ko) | 2020-01-31 |
| EP3603877A1 (en) | 2020-02-05 |
| US20200114475A1 (en) | 2020-04-16 |
| ES2887361T3 (es) | 2021-12-22 |
| MY188597A (en) | 2021-12-22 |
| DK3603877T3 (da) | 2021-09-06 |
| BR112019020490A2 (pt) | 2020-04-28 |
| CN110430968B (zh) | 2021-07-16 |
| HUE056341T2 (hu) | 2022-02-28 |
| KR20190112166A (ko) | 2019-10-02 |
| MX2019011465A (es) | 2019-11-01 |
| PH12019502148A1 (en) | 2020-06-08 |
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