Nothing Special   »   [go: up one dir, main page]

HK1174477A1 - 用於將 芯片模塊附連到基底尤其是標籤上的安裝裝置 - Google Patents

用於將 芯片模塊附連到基底尤其是標籤上的安裝裝置

Info

Publication number
HK1174477A1
HK1174477A1 HK13101671.9A HK13101671A HK1174477A1 HK 1174477 A1 HK1174477 A1 HK 1174477A1 HK 13101671 A HK13101671 A HK 13101671A HK 1174477 A1 HK1174477 A1 HK 1174477A1
Authority
HK
Hong Kong
Prior art keywords
rfid
applying
substrate
mounting system
chip module
Prior art date
Application number
HK13101671.9A
Other languages
English (en)
Inventor
Stefan Bhler
Original Assignee
泰克斯蒂爾瑪股份公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 泰克斯蒂爾瑪股份公司 filed Critical 泰克斯蒂爾瑪股份公司
Publication of HK1174477A1 publication Critical patent/HK1174477A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
    • B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
    • B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
    • B65B61/065—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting by punching out
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Labeling Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
HK13101671.9A 2010-02-06 2013-02-06 用於將 芯片模塊附連到基底尤其是標籤上的安裝裝置 HK1174477A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10001244A EP2355645B1 (de) 2010-02-06 2010-02-06 Montageeinrichtung zum Aufbringen eines RFID-Chipmoduls auf ein Substrat, insbesondere eine Etikette
PCT/EP2010/068570 WO2011095241A1 (de) 2010-02-06 2010-11-30 Montageeinrichtung zum aufbringen eines rfid-chipmoduls auf ein substrat, insbesondere eine etikette

Publications (1)

Publication Number Publication Date
HK1174477A1 true HK1174477A1 (zh) 2013-06-07

Family

ID=42237212

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13101671.9A HK1174477A1 (zh) 2010-02-06 2013-02-06 用於將 芯片模塊附連到基底尤其是標籤上的安裝裝置

Country Status (10)

Country Link
US (1) US8776361B2 (zh)
EP (1) EP2355645B1 (zh)
JP (1) JP2013519220A (zh)
KR (1) KR20120130754A (zh)
CN (1) CN102742379B (zh)
BR (1) BR112012019278A2 (zh)
CA (1) CA2786765C (zh)
ES (1) ES2386614T3 (zh)
HK (1) HK1174477A1 (zh)
WO (1) WO2011095241A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102490501B (zh) * 2011-11-16 2014-04-16 李嘉善 一种用印章盖出可电子识别印迹的方法
WO2014096140A1 (de) * 2012-12-19 2014-06-26 Forster Rohner Ag Bauelement, verfahren zur herstellung eines bauelements, bauelementanordnung, sowie verfahren zum applizieren eines bauelements
DE102013215706A1 (de) * 2013-08-08 2015-02-12 Bielomatik Leuze Gmbh + Co. Kg Transfer-Stanzen
EP2886267A1 (fr) 2013-12-17 2015-06-24 Gemalto SA Procédé et dispositif de mise en place d'un insert dans une cavité formée dans un produit en feuille mince
US11334783B2 (en) 2018-02-26 2022-05-17 Avery Dennison Retail Information Services, Llc. Direct attachment of RFID chips to metallic structures as part of a fabric label
US11913143B2 (en) 2019-03-08 2024-02-27 Apple Inc. Fabric with electrical components
WO2022243432A1 (en) * 2021-05-21 2022-11-24 Zwipe As Manufacturing a smartcard
GB2607113A (en) * 2021-05-21 2022-11-30 Zwipe As Manufacturing a smartcard
CN114454550A (zh) * 2021-09-23 2022-05-10 中国海洋石油集团有限公司 满足海底恶劣工况条件下微型rfid标签热压装置及其微型rfid标签

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61280916A (ja) * 1985-06-07 1986-12-11 Somar Corp ラミネ−タ
JPH02191958A (ja) * 1988-09-22 1990-07-27 Somar Corp 薄膜の張付方法及びその実施装置
US5082439A (en) * 1989-10-05 1992-01-21 Owens-Illinois Plastic Products Inc. Apparatus for applying labels in the molds of a plastic blow molding machine
DE69507674T2 (de) * 1994-09-30 1999-06-10 Mitsubishi Cable Industries, Ltd., Amagasaki, Hyogo Verfahren zum Herstellen eines flachen Kabelbaumes
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
JP3692810B2 (ja) 1999-01-20 2005-09-07 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6982190B2 (en) 2003-03-25 2006-01-03 Id Solutions, Inc. Chip attachment in an RFID tag
TWI240210B (en) * 2003-10-24 2005-09-21 Claridy Solutions Inc Attachment of RFID modules to antennas
US7229018B2 (en) * 2004-08-03 2007-06-12 Kurz Arthur A Manufacture of RFID tags and intermediate products therefor
RU2333622C1 (ru) * 2004-11-29 2008-09-10 Хитроникс Корп. Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа
JP2006156880A (ja) 2004-12-01 2006-06-15 Shinko Electric Ind Co Ltd 打抜部品の貼着方法
ITMO20050017A1 (it) * 2005-01-28 2006-07-29 Windinglab S R L Apparato e metodo per realizzare un antenna per un dispositivo di identificazione a radiofrequenza.
JP4386023B2 (ja) 2005-10-13 2009-12-16 パナソニック株式会社 Ｉｃ実装モジュールの製造方法および製造装置
TW200905574A (en) 2007-07-03 2009-02-01 Textilma Ag Rfid transponder chip module with connecting means for an antenna, textile tag with an rfid transponder chip module, and use of an rfid transponder chip module

Also Published As

Publication number Publication date
EP2355645B1 (de) 2012-06-13
CA2786765C (en) 2016-08-02
ES2386614T3 (es) 2012-08-23
EP2355645A1 (de) 2011-08-10
CN102742379B (zh) 2016-01-20
CA2786765A1 (en) 2011-08-11
WO2011095241A1 (de) 2011-08-11
JP2013519220A (ja) 2013-05-23
KR20120130754A (ko) 2012-12-03
BR112012019278A2 (pt) 2018-05-08
CN102742379A (zh) 2012-10-17
US20130074327A1 (en) 2013-03-28
US8776361B2 (en) 2014-07-15

Similar Documents

Publication Publication Date Title
HK1174477A1 (zh) 用於將 芯片模塊附連到基底尤其是標籤上的安裝裝置
HK1177299A1 (en) Rfid chip module rfid
ZA201108890B (en) Clamp for a panel element, in particular for a photovoltaic module
PL2768919T3 (pl) Masa klejąca, w szczególności do hermetyzacji układu elektronicznego
SG11201401153SA (en) A dongle device with communication module for a secure electronic transaction
IL198527A0 (en) Chip module for an rfid system
TWI371852B (en) Multiple phase change materials in an integrated circuit for system on a chip application
EP2415198A4 (en) DATA SYSTEM DIODES
EP2379410A4 (en) MODULE FOR AN INTEGRATED APPROACH TO A SEA FACILITY
PL2488989T3 (pl) Etykieta do identyfikacji za pomocą fal radiowych (rfid) montowana w krawędzi
EP2485244A4 (en) PRESSURE APPLICATION MODULE, PRINT APPLICATION DEVICE AND SUBSTRATE BINDING DEVICE
EP2406718A4 (en) SECURE CARD ACCESS MODULE FOR INTEGRATED CIRCUIT BOARD APPLICATIONS
ZA201209626B (en) Systems and processes for applying shrink labels
EP2406439A4 (en) MOUNTING SYSTEM OF PHOTOVOLTAIC ROOF MODULE
EP2529339A4 (en) RFID LABEL, METHOD FOR PRODUCING AN RFID LABEL AND PACKAGE
TWI371774B (en) An rfid real-time information system accommodated to semiconductor supply chain
EP2286598A4 (en) METHOD AND SYSTEMS FOR TRACKING RFID DEVICES
ZA201106915B (en) Method for conductively connecting a component on a transparent substrate
EP2616762A4 (en) VISUALIZATION SYSTEM FOR PRODUCT LABELING
EP2790215A4 (en) SUBSTRATE FOR A HIGH CAPACITY MODULE AND METHOD FOR MANUFACTURING THE SUBSTRATE
HK1157072A1 (zh) 無接觸 標籤
PL2499001T3 (pl) Nośnik danych w kształcie karty
ZA201104432B (en) An rfid tag
EP2321588A4 (en) SYSTEM AND METHOD FOR FIXING A SOLAR MODULE ON A SUBSTRATE
ZA201200589B (en) Markless registration system for labels in labelling machines

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20201202