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GB9902818D0 - Apparatus and method for grinding,lapping and polishing semiconductor wafers - Google Patents

Apparatus and method for grinding,lapping and polishing semiconductor wafers

Info

Publication number
GB9902818D0
GB9902818D0 GBGB9902818.5A GB9902818A GB9902818D0 GB 9902818 D0 GB9902818 D0 GB 9902818D0 GB 9902818 A GB9902818 A GB 9902818A GB 9902818 D0 GB9902818 D0 GB 9902818D0
Authority
GB
United Kingdom
Prior art keywords
lapping
grinding
semiconductor wafers
polishing semiconductor
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9902818.5A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Europe Ltd
Original Assignee
Shin Etsu Handotai Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Europe Ltd filed Critical Shin Etsu Handotai Europe Ltd
Priority to GBGB9902818.5A priority Critical patent/GB9902818D0/en
Publication of GB9902818D0 publication Critical patent/GB9902818D0/en
Priority to PCT/GB2000/000376 priority patent/WO2000047366A2/en
Priority to AU23110/00A priority patent/AU2311000A/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
GBGB9902818.5A 1999-02-10 1999-02-10 Apparatus and method for grinding,lapping and polishing semiconductor wafers Ceased GB9902818D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB9902818.5A GB9902818D0 (en) 1999-02-10 1999-02-10 Apparatus and method for grinding,lapping and polishing semiconductor wafers
PCT/GB2000/000376 WO2000047366A2 (en) 1999-02-10 2000-02-09 Apparatus and method for grinding, lapping and polishing semiconductor wafers
AU23110/00A AU2311000A (en) 1999-02-10 2000-02-09 Apparatus and method for grinding, lapping and polishing semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9902818.5A GB9902818D0 (en) 1999-02-10 1999-02-10 Apparatus and method for grinding,lapping and polishing semiconductor wafers

Publications (1)

Publication Number Publication Date
GB9902818D0 true GB9902818D0 (en) 1999-03-31

Family

ID=10847358

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9902818.5A Ceased GB9902818D0 (en) 1999-02-10 1999-02-10 Apparatus and method for grinding,lapping and polishing semiconductor wafers

Country Status (3)

Country Link
AU (1) AU2311000A (en)
GB (1) GB9902818D0 (en)
WO (1) WO2000047366A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719592A (en) * 2018-12-25 2019-05-07 无锡蓝智自动化科技有限公司 Pen core automatic grinding device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000055B (en) * 1977-06-14 1982-03-03 Inoue Japax Research Incorporated Method of and apparatus for shaping workpieces
TW222668B (en) * 1992-03-19 1994-04-21 Minnesota Mining & Mfg
JP2837342B2 (en) * 1993-12-13 1998-12-16 日本ミクロコーティング株式会社 Polishing equipment
JPH0976148A (en) * 1995-09-12 1997-03-25 Shin Etsu Handotai Co Ltd Device for polishing notch part of wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719592A (en) * 2018-12-25 2019-05-07 无锡蓝智自动化科技有限公司 Pen core automatic grinding device
CN109719592B (en) * 2018-12-25 2023-09-05 无锡蓝智自动化科技有限公司 Automatic pencil lead grinding device

Also Published As

Publication number Publication date
WO2000047366A3 (en) 2000-11-16
WO2000047366A2 (en) 2000-08-17
AU2311000A (en) 2000-08-29

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)