GB8320246D0 - Heat transfer means - Google Patents
Heat transfer meansInfo
- Publication number
- GB8320246D0 GB8320246D0 GB8320246A GB8320246A GB8320246D0 GB 8320246 D0 GB8320246 D0 GB 8320246D0 GB 8320246 A GB8320246 A GB 8320246A GB 8320246 A GB8320246 A GB 8320246A GB 8320246 D0 GB8320246 D0 GB 8320246D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat transfer
- transfer means
- heat
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
- F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8222129 | 1982-07-30 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8320246D0 true GB8320246D0 (en) | 1983-09-01 |
GB2124742A GB2124742A (en) | 1984-02-22 |
GB2124742B GB2124742B (en) | 1986-02-19 |
Family
ID=10532039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8320246A Expired GB2124742B (en) | 1982-07-30 | 1983-07-27 | Promoting nucleate boiling in heat exchangers |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3327125A1 (en) |
GB (1) | GB2124742B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5283464A (en) * | 1989-06-08 | 1994-02-01 | The Furukawa Electric Co., Ltd. | Electrically insulated heat pipe type cooling apparatus for semiconductor |
EP0401743B1 (en) * | 1989-06-08 | 1998-01-07 | The Furukawa Electric Co., Ltd. | Electrically insulated heat pipe type cooling apparatus for semiconductor |
DE19722360A1 (en) | 1997-05-28 | 1998-12-03 | Bayer Ag | Method and device for improving heat transfer |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3512582A (en) * | 1968-07-15 | 1970-05-19 | Ibm | Immersion cooling system for modularly packaged components |
US3774677A (en) * | 1971-02-26 | 1973-11-27 | Ibm | Cooling system providing spray type condensation |
-
1983
- 1983-07-27 GB GB8320246A patent/GB2124742B/en not_active Expired
- 1983-07-27 DE DE19833327125 patent/DE3327125A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE3327125A1 (en) | 1984-02-02 |
GB2124742B (en) | 1986-02-19 |
GB2124742A (en) | 1984-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20000727 |