GB817074A - Insulating material - Google Patents
Insulating materialInfo
- Publication number
- GB817074A GB817074A GB2185756A GB2185756A GB817074A GB 817074 A GB817074 A GB 817074A GB 2185756 A GB2185756 A GB 2185756A GB 2185756 A GB2185756 A GB 2185756A GB 817074 A GB817074 A GB 817074A
- Authority
- GB
- United Kingdom
- Prior art keywords
- per cent
- resin
- metal powder
- rubber
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A heat-conducting electrical-insulating material consists of metal powder, e.g. copper or aluminium, embedded in a matrix of rubber, the particles of the metal powder each being coated with an electrically-insulating resin. According to an example, the material comprises 75 per cent by weight copper powder of 100 B.S.S. mesh, coated with 5 per cent silicone resin and embedded in a matrix of silicone rubber (20 per cent). A finely-divided ceramic material such as silica, calcium carbonate, aluminium oxide, china clay, or mica may be incorporated into the resin solution to produce a material for withstanding considerable mechanical pressure. In preparation the metal powder is mixed with a solution of the resin until the majority of the solvent has evaporated, the mixture is spread out in thin layers for the remainder of the solvent to evaporate, is lightly ground and then incorporated with the rubber, after which a vulcanizing catalyst may be added.ALSO:A heat-conducting electrical-insulating material consists of metal powder, e.g. copper or aluminium, embedded in a matrix of rubber, the particles of the metal powder each being coated with an electrically-insulating resin. According to an example, the material comprises 75 per cent. by weight copper powder of 100 B.S.S. mesh, coated with 5 per cent. silicone resin and embedded in a matrix of silicone rubber (20 per cent.). A finely-divided ceramic material such as silica, calcium carbonate, aluminium hydroxide, china clay or mica may be incorporated into the resin solution to produce a material for withstanding considerable mechanical pressure. In preparation the metal powder is mixed with a solution of the resin until the majority of the solvent has evaporated, the mixture is spread out in thin layers for the remainder of the solvent to evaporate, is lightly ground and then incorporated with the rubber after which a vulcanizing catalyst may be added.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB947257 | 1957-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB817074A true GB817074A (en) | 1959-07-22 |
Family
ID=9872624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2185756A Expired GB817074A (en) | 1957-03-22 | 1956-07-16 | Insulating material |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB817074A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2190087A (en) * | 1986-04-14 | 1987-11-11 | Toshiba Kk | Flywheels for cassette recorders |
| WO2007028798A1 (en) * | 2005-09-05 | 2007-03-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a metal powder and an electrically insulating polymer composite material, polymer composite material and electronic device |
| CN100407415C (en) * | 2003-04-03 | 2008-07-30 | 信越化学工业株式会社 | Heat conduction composite chip and its mfg. method |
| CN112649170A (en) * | 2020-12-04 | 2021-04-13 | 中国航天空气动力技术研究院 | Compound heat-proof structure in electric arc wind tunnel test cabin |
-
1956
- 1956-07-16 GB GB2185756A patent/GB817074A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2190087A (en) * | 1986-04-14 | 1987-11-11 | Toshiba Kk | Flywheels for cassette recorders |
| GB2190087B (en) * | 1986-04-14 | 1989-11-29 | Toshiba Kk | Flywheel and method of manufacturing the same |
| CN100407415C (en) * | 2003-04-03 | 2008-07-30 | 信越化学工业株式会社 | Heat conduction composite chip and its mfg. method |
| WO2007028798A1 (en) * | 2005-09-05 | 2007-03-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a metal powder and an electrically insulating polymer composite material, polymer composite material and electronic device |
| CN112649170A (en) * | 2020-12-04 | 2021-04-13 | 中国航天空气动力技术研究院 | Compound heat-proof structure in electric arc wind tunnel test cabin |
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