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GB2545155B - Assembly of semiconductor devices - Google Patents

Assembly of semiconductor devices Download PDF

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Publication number
GB2545155B
GB2545155B GB1515564.1A GB201515564A GB2545155B GB 2545155 B GB2545155 B GB 2545155B GB 201515564 A GB201515564 A GB 201515564A GB 2545155 B GB2545155 B GB 2545155B
Authority
GB
United Kingdom
Prior art keywords
assembly
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1515564.1A
Other versions
GB201515564D0 (en
GB2545155A (en
Inventor
Hughes Padraig
O'keeffe Joseph
Oyer Celine
Henry William
Massoubre David
Saketi Pooya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Starboard Acquisitions Sub LLC
Meta Platforms Technologies LLC
Original Assignee
Facebook Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Facebook Technologies LLC filed Critical Facebook Technologies LLC
Priority to GB1515564.1A priority Critical patent/GB2545155B/en
Publication of GB201515564D0 publication Critical patent/GB201515564D0/en
Priority to GB1609422.9A priority patent/GB2541970B/en
Priority to CN201680064111.6A priority patent/CN108352143B/en
Priority to JP2018511279A priority patent/JP2018531504A/en
Priority to KR1020187008607A priority patent/KR20180048812A/en
Priority to EP16778087.3A priority patent/EP3345178B1/en
Priority to EP21216481.8A priority patent/EP3996076A1/en
Priority to PCT/GB2016/052722 priority patent/WO2017037475A1/en
Priority to KR1020187010685A priority patent/KR20180041772A/en
Priority to US15/753,959 priority patent/US10878733B2/en
Priority to EP18188965.0A priority patent/EP3425618B1/en
Priority to CN201810504950.6A priority patent/CN108682370B/en
Publication of GB2545155A publication Critical patent/GB2545155A/en
Priority to US15/918,985 priority patent/US10600823B2/en
Priority to JP2018077594A priority patent/JP2018142713A/en
Application granted granted Critical
Publication of GB2545155B publication Critical patent/GB2545155B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/80003—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/80004—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding involving a temporary auxiliary member not forming part of the bonding apparatus being a removable or sacrificial coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GB1515564.1A 2015-09-02 2015-09-02 Assembly of semiconductor devices Active GB2545155B (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
GB1515564.1A GB2545155B (en) 2015-09-02 2015-09-02 Assembly of semiconductor devices
GB1609422.9A GB2541970B (en) 2015-09-02 2016-05-27 Display manufacture
KR1020187010685A KR20180041772A (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
CN201810504950.6A CN108682370B (en) 2015-09-02 2016-09-02 Display and method for manufacturing the same
KR1020187008607A KR20180048812A (en) 2015-09-02 2016-09-02 Assemblies of semiconductor devices
EP16778087.3A EP3345178B1 (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
EP21216481.8A EP3996076A1 (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
PCT/GB2016/052722 WO2017037475A1 (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
CN201680064111.6A CN108352143B (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
US15/753,959 US10878733B2 (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices using multiple LED placement cycles
EP18188965.0A EP3425618B1 (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
JP2018511279A JP2018531504A (en) 2015-09-02 2016-09-02 Assembly of semiconductor devices
US15/918,985 US10600823B2 (en) 2015-09-02 2018-03-12 Assembly of semiconductor devices
JP2018077594A JP2018142713A (en) 2015-09-02 2018-04-13 Assembly for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1515564.1A GB2545155B (en) 2015-09-02 2015-09-02 Assembly of semiconductor devices

Publications (3)

Publication Number Publication Date
GB201515564D0 GB201515564D0 (en) 2015-10-14
GB2545155A GB2545155A (en) 2017-06-14
GB2545155B true GB2545155B (en) 2020-04-01

Family

ID=54326685

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1515564.1A Active GB2545155B (en) 2015-09-02 2015-09-02 Assembly of semiconductor devices

Country Status (1)

Country Link
GB (1) GB2545155B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10998352B2 (en) 2016-11-25 2021-05-04 Vuereal Inc. Integration of microdevices into system substrate
US10978530B2 (en) * 2016-11-25 2021-04-13 Vuereal Inc. Integration of microdevices into system substrate
US10916523B2 (en) 2016-11-25 2021-02-09 Vuereal Inc. Microdevice transfer setup and integration of micro-devices into system substrate
US10490599B2 (en) 2017-07-13 2019-11-26 Applied Materials, Inc. Collimated, directional micro-LED light field display
US10325791B1 (en) 2017-12-13 2019-06-18 Facebook Technologies, Llc Formation of elastomeric layer on selective regions of light emitting device
US11005014B2 (en) * 2018-07-30 2021-05-11 Facebook Technologies, Llc Optics formation using pick-up tools
CN111863690B (en) * 2019-04-29 2023-10-20 成都辰显光电有限公司 Batch transfer head and processing method thereof
CN112687604B (en) * 2020-12-25 2023-01-31 厦门天马微电子有限公司 Mass transfer device of LED chips and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
US8426227B1 (en) * 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
WO2013110540A1 (en) * 2012-01-24 2013-08-01 Osram Opto Semiconductors Gmbh Luminaire and method for the production of a luminaire
US20140373898A1 (en) * 2007-01-17 2014-12-25 Semprius, Inc. Optical systems fabricated by printing-based assembly
US20150076528A1 (en) * 2013-09-16 2015-03-19 LuxVue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
US20140373898A1 (en) * 2007-01-17 2014-12-25 Semprius, Inc. Optical systems fabricated by printing-based assembly
US8426227B1 (en) * 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
WO2013110540A1 (en) * 2012-01-24 2013-08-01 Osram Opto Semiconductors Gmbh Luminaire and method for the production of a luminaire
US20150076528A1 (en) * 2013-09-16 2015-03-19 LuxVue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation

Also Published As

Publication number Publication date
GB201515564D0 (en) 2015-10-14
GB2545155A (en) 2017-06-14

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Legal Events

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COOA Change in applicant's name or ownership of the application

Owner name: OCULUS VR, LLC

Free format text: FORMER OWNERS: INFINILED LIMITED;STARBOARD ACQUISITIONS SUB, LLC

Owner name: STARBOARD ACQUISITIONS SUB, LLC

Free format text: FORMER OWNERS: INFINILED LIMITED;STARBOARD ACQUISITIONS SUB, LLC