Nothing Special   »   [go: up one dir, main page]

GB2541336A - Method and apparatus for forming a wire structure - Google Patents

Method and apparatus for forming a wire structure Download PDF

Info

Publication number
GB2541336A
GB2541336A GB1620528.8A GB201620528A GB2541336A GB 2541336 A GB2541336 A GB 2541336A GB 201620528 A GB201620528 A GB 201620528A GB 2541336 A GB2541336 A GB 2541336A
Authority
GB
United Kingdom
Prior art keywords
wire
tube
forming
adhesive surface
wire structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1620528.8A
Other versions
GB201620528D0 (en
GB2541336B (en
Inventor
Peter Binstead Ronald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51168295&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB2541336(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of GB201620528D0 publication Critical patent/GB201620528D0/en
Publication of GB2541336A publication Critical patent/GB2541336A/en
Application granted granted Critical
Publication of GB2541336B publication Critical patent/GB2541336B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for forming a structure with wire elements (16) using a wire depositing device with a tube (26) for laying a wire (16), the method comprising: providing a substrate (22) with an adhesive surface (24); feeding a free end of the wire (16) through the tube (26) of the wire depositing device; and drawing the tube (26) laterally across the adhesive surface (34) in a pattern such that the free end of the wire (16) adheres to the adhesive surface (34) and the lateral movement causes the wire (16) to be drawn through the tube (26) and deposited as a trail in accordance with the pattern drawn by the tube (26) crossing the substrate (22).
GB1620528.8A 2014-06-03 2014-06-03 Method and apparatus for forming a wire structure Active GB2541336B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2014/051694 WO2015185879A1 (en) 2014-06-03 2014-06-03 Method and apparatus for forming a wire structure

Publications (3)

Publication Number Publication Date
GB201620528D0 GB201620528D0 (en) 2017-01-18
GB2541336A true GB2541336A (en) 2017-02-15
GB2541336B GB2541336B (en) 2017-07-05

Family

ID=51168295

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1620528.8A Active GB2541336B (en) 2014-06-03 2014-06-03 Method and apparatus for forming a wire structure

Country Status (2)

Country Link
GB (1) GB2541336B (en)
WO (1) WO2015185879A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023026062A1 (en) 2021-08-27 2023-03-02 Ronald Peter Binstead Element arrangement and associated method of manufacture

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110764637B (en) * 2018-07-27 2023-03-07 广州视源电子科技股份有限公司 Manufacturing device, manufacturing method and application of conductive mesh-type touch sensing layer
US12124784B2 (en) 2019-05-24 2024-10-22 Massachusetts Institute Of Technology Precision planar coil placement for three-dimensional inductive sensors
CN115038251B (en) * 2022-07-20 2024-02-02 江南大学 Method for manufacturing sensor by using metal wire-based direct writing process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1100296A1 (en) * 1999-05-07 2001-05-16 The Furukawa Electric Co., Ltd. Wiring method and wiring device
US20090218310A1 (en) * 2008-02-28 2009-09-03 Lijun Zu Methods of patterning a conductor on a substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9406702D0 (en) 1994-04-05 1994-05-25 Binstead Ronald P Multiple input proximity detector and touchpad system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1100296A1 (en) * 1999-05-07 2001-05-16 The Furukawa Electric Co., Ltd. Wiring method and wiring device
US20090218310A1 (en) * 2008-02-28 2009-09-03 Lijun Zu Methods of patterning a conductor on a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023026062A1 (en) 2021-08-27 2023-03-02 Ronald Peter Binstead Element arrangement and associated method of manufacture

Also Published As

Publication number Publication date
GB201620528D0 (en) 2017-01-18
WO2015185879A1 (en) 2015-12-10
GB2541336B (en) 2017-07-05

Similar Documents

Publication Publication Date Title
MX2022002141A (en) Seed delivery apparatus, systems, and methods.
PL3109056T5 (en) Method and device for producing a structure on a surface
EP3198651A4 (en) Scaled tfet transistor formed using nanowire with surface termination
GB201817166D0 (en) Multi-junction device production process
EP2960908A4 (en) Electroconductive nanowire network, and electroconductive substrate and transparent electrode using same, and method for manufacturing electroconductive nanowire network, electroconductive substrate, and transparent electrode
MY187191A (en) Surface features by azimuthal angle
EP2973757A4 (en) Two step transparent conductive film deposition method and gan nanowire devices made by the method
GB201301683D0 (en) Method of creating non-conductive delineations with a selective coating technology on a structured surface
FR3001160B1 (en) PROCESS FOR OBTAINING A SUBSTRATE WITH A COATING
HK1220776A1 (en) Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus
SG10201502129WA (en) MEMBRANE COMPRISING SELF-ASSEMBLED BLOCK COPOLYMER AND PROCESS FOR PRODUCING THE SAME BY SPRAY COATING (Ic)
EP3381569A4 (en) Coating unit, coating device, method for producing object to be coated, and method for producing substrate
EP3053184A4 (en) GaN ON Si(100)SUBSTRATE USING EPI-TWIST
FR3005878B1 (en) PROCESS FOR OBTAINING A SUBSTRATE WITH A COATING
SG10201503801WA (en) SELF-ASSEMBLED STRUCTURE AND MEMBRANE COMPRISING BLOCK COPOLYMER AND PROCESS FOR PRODUCING THE SAME BY SPIN COATING (IVa)
GB2541336A (en) Method and apparatus for forming a wire structure
PT3875248T (en) Method for producing a three-dimensional structure on a surface of a flat substrate, resulting substrate, and device for producing the substrate according to the method
GB2543968B (en) Coir substrate and apparatus and method for the production thereof
EP3268617A4 (en) Devices for producing vacuum using the venturi effect
EP3061865A4 (en) Method for applying coating material to fiber material, method for producing fiber material, and apparatus for processing fiber material
GB201817677D0 (en) Ultra-fine pattern deposition apparatus, ultra-fine pattern deposition method using the same, and light-emitting display device manufactured by ultra-fine
GB2520574B (en) Droplet deposition apparatus and method for manufacturing the same
SG11201509621VA (en) Device and method for coating a substrate
PH12016500265A1 (en) Forming a conductive image using high speed electroless plating
PL3135645T3 (en) Coating film-equipped glass substrate, and method for producing coating film-equipped glass substrate

Legal Events

Date Code Title Description
S72Z Claim or counterclaim for revocation before the court (sect. 72 patents act1977)

Free format text: COUNTERCLAIM LODGED; COUNTERCLAIM FOR REVOCATION LODGED AT THE INTELLECTUAL PROPERTY ENTERPRISE COURT ON 19 JULY 2018 (IP-2017-000218).

S72Z Claim or counterclaim for revocation before the court (sect. 72 patents act1977)