GB2417038B - Low-temperature unleaded alloy - Google Patents
Low-temperature unleaded alloyInfo
- Publication number
- GB2417038B GB2417038B GB0418003A GB0418003A GB2417038B GB 2417038 B GB2417038 B GB 2417038B GB 0418003 A GB0418003 A GB 0418003A GB 0418003 A GB0418003 A GB 0418003A GB 2417038 B GB2417038 B GB 2417038B
- Authority
- GB
- United Kingdom
- Prior art keywords
- low
- alloy
- temperature
- temperature unleaded
- unleaded alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000956 alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0418003A GB2417038B (en) | 2004-08-12 | 2004-08-12 | Low-temperature unleaded alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0418003A GB2417038B (en) | 2004-08-12 | 2004-08-12 | Low-temperature unleaded alloy |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0418003D0 GB0418003D0 (en) | 2004-09-15 |
GB2417038A GB2417038A (en) | 2006-02-15 |
GB2417038B true GB2417038B (en) | 2006-08-02 |
Family
ID=33017406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0418003A Expired - Fee Related GB2417038B (en) | 2004-08-12 | 2004-08-12 | Low-temperature unleaded alloy |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2417038B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114058899A (en) * | 2022-01-17 | 2022-02-18 | 中机智能装备创新研究院(宁波)有限公司 | Preparation method of tin-based babbitt alloy |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1273384A1 (en) * | 2001-06-28 | 2003-01-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
-
2004
- 2004-08-12 GB GB0418003A patent/GB2417038B/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1273384A1 (en) * | 2001-06-28 | 2003-01-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
Also Published As
Publication number | Publication date |
---|---|
GB2417038A (en) | 2006-02-15 |
GB0418003D0 (en) | 2004-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20140812 |