GB2399945B - Methods of forming semiconductor structures - Google Patents
Methods of forming semiconductor structuresInfo
- Publication number
- GB2399945B GB2399945B GB0413750A GB0413750A GB2399945B GB 2399945 B GB2399945 B GB 2399945B GB 0413750 A GB0413750 A GB 0413750A GB 0413750 A GB0413750 A GB 0413750A GB 2399945 B GB2399945 B GB 2399945B
- Authority
- GB
- United Kingdom
- Prior art keywords
- methods
- semiconductor structures
- forming semiconductor
- forming
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28035—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities
- H01L21/28044—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer
- H01L21/28052—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being silicon, e.g. polysilicon, with or without impurities the conductor comprising at least another non-silicon conductive layer the conductor comprising a silicide layer formed by the silicidation reaction of silicon with a metal layer
-
- H01L29/40114—
-
- H01L29/4941—
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/478,975 US6372618B2 (en) | 2000-01-06 | 2000-01-06 | Methods of forming semiconductor structures |
GB0213397A GB2373925B (en) | 2000-01-06 | 2001-01-08 | Methods of forming semiconductor structures |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0413750D0 GB0413750D0 (en) | 2004-07-21 |
GB2399945A GB2399945A (en) | 2004-09-29 |
GB2399945B true GB2399945B (en) | 2004-11-17 |
Family
ID=32929380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0413750A Expired - Fee Related GB2399945B (en) | 2000-01-06 | 2001-01-08 | Methods of forming semiconductor structures |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2399945B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5003375A (en) * | 1988-01-21 | 1991-03-26 | Seiko Epson Corporation | MIS type semiconductor integrated circuit device having a refractory metal gate electrode and refractory metal silicide film covering the gate electrode |
US5736455A (en) * | 1995-12-22 | 1998-04-07 | Micron Technology, Inc. | Method for passivating the sidewalls of a tungsten word line |
-
2001
- 2001-01-08 GB GB0413750A patent/GB2399945B/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5003375A (en) * | 1988-01-21 | 1991-03-26 | Seiko Epson Corporation | MIS type semiconductor integrated circuit device having a refractory metal gate electrode and refractory metal silicide film covering the gate electrode |
US5736455A (en) * | 1995-12-22 | 1998-04-07 | Micron Technology, Inc. | Method for passivating the sidewalls of a tungsten word line |
Also Published As
Publication number | Publication date |
---|---|
GB2399945A (en) | 2004-09-29 |
GB0413750D0 (en) | 2004-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20140108 |