GB2253182B - Device for encapsulating electronic components - Google Patents
Device for encapsulating electronic componentsInfo
- Publication number
- GB2253182B GB2253182B GB9109877A GB9109877A GB2253182B GB 2253182 B GB2253182 B GB 2253182B GB 9109877 A GB9109877 A GB 9109877A GB 9109877 A GB9109877 A GB 9109877A GB 2253182 B GB2253182 B GB 2253182B
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic components
- encapsulating electronic
- encapsulating
- components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/228—Injection plunger or ram: transfer molding type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Wrapping Of Specific Fragile Articles (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL9100339A NL193526C (en) | 1991-02-26 | 1991-02-26 | Device for encapsulating electronic parts with a plastic. |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9109877D0 GB9109877D0 (en) | 1991-07-03 |
GB2253182A GB2253182A (en) | 1992-09-02 |
GB2253182B true GB2253182B (en) | 1995-01-18 |
Family
ID=19858933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9109877A Expired - Fee Related GB2253182B (en) | 1991-02-26 | 1991-05-08 | Device for encapsulating electronic components |
Country Status (8)
Country | Link |
---|---|
US (1) | US5158780A (en) |
JP (1) | JP3182432B2 (en) |
KR (1) | KR0178402B1 (en) |
GB (1) | GB2253182B (en) |
HK (1) | HK126996A (en) |
MY (1) | MY107696A (en) |
NL (1) | NL193526C (en) |
TW (1) | TW198133B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2564707B2 (en) * | 1991-01-09 | 1996-12-18 | ローム株式会社 | Multi-type molding method and molding apparatus for molding part in lead frame for electronic component |
NL9101558A (en) * | 1991-09-16 | 1993-04-16 | Amco Hi Tech Bv | DEVICE FOR INSERTING A PLASTIC MATERIAL INTO A DIE CAVITY. |
KR940007754Y1 (en) * | 1991-11-14 | 1994-10-24 | 금성일렉트론 주식회사 | Preheaterless manual transfer mold die structure |
JP2931715B2 (en) * | 1992-05-12 | 1999-08-09 | 三菱電機株式会社 | Resin sealing method, resin sealing device, and gas spring |
NL9202253A (en) * | 1992-12-23 | 1994-07-18 | Asm Fico Tooling | System for dosed advancement and selection of cylindrical pellets for lead frame sheathing devices. |
US5460502A (en) * | 1993-09-15 | 1995-10-24 | Majercak; Michael L. | Plunger apparatus used in a resin molding device for encapsulating electronic components |
US5478226A (en) * | 1994-04-20 | 1995-12-26 | Fierkens; Richard H. J. | Automatic plunger apparatus for use in forming encapsulated semiconductor chips |
JP2701766B2 (en) * | 1995-01-27 | 1998-01-21 | 日本電気株式会社 | Lead frame for semiconductor device and mold device using the same |
US5851559A (en) * | 1995-10-31 | 1998-12-22 | Motorola, Inc. | Transfer molding press |
US5925384A (en) * | 1997-04-25 | 1999-07-20 | Micron Technology, Inc. | Manual pellet loader for Boschman automolds |
US7177696B1 (en) | 1999-06-09 | 2007-02-13 | H & P Medical Research, Inc. | Multiple selectable field/current-voltage pads having individually powered and controlled cells |
CN100515717C (en) * | 1999-12-16 | 2009-07-22 | 第一精工株式会社 | Resin packaging method |
KR100455386B1 (en) * | 2002-05-07 | 2004-11-06 | 삼성전자주식회사 | Molding apparatus of molding plurality of semiconductor devices in same time |
US20120076888A1 (en) * | 2010-09-28 | 2012-03-29 | Cheng Uei Precision Industry Co., Ltd. | Mould with the contact prepressing and positioning function |
NL2010252C2 (en) * | 2013-02-06 | 2014-08-07 | Boschman Tech Bv | Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. |
US11227779B2 (en) * | 2017-09-12 | 2022-01-18 | Asm Technology Singapore Pte Ltd | Apparatus and method for processing a semiconductor device |
JP7203715B2 (en) * | 2019-12-06 | 2023-01-13 | Towa株式会社 | RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT |
NL2028010B1 (en) * | 2021-04-19 | 2022-10-31 | Boschman Tech Bv | Rotor Core Manufacturing Method, and rotor core molding system therefore |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB841494A (en) * | 1957-09-04 | 1960-07-13 | Colin Macbeth | Plastic moulding and metal die casting machines |
EP0070320A1 (en) * | 1981-01-26 | 1983-01-26 | Dai-Ichi Seiko Co. Ltd. | Sealing and molding machine |
GB2189182A (en) * | 1986-04-11 | 1987-10-21 | Michio Osada | Multiple plunger injection moulding apparatus |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5850582B2 (en) * | 1979-08-24 | 1983-11-11 | 道男 長田 | Semiconductor encapsulation molding method and mold equipment |
JPS5886315U (en) * | 1981-12-07 | 1983-06-11 | 坂東 一雄 | Mold equipment for semiconductor resin encapsulation molding |
JPH0628873B2 (en) * | 1984-03-02 | 1994-04-20 | 日新電機株式会社 | Small transfer molding machine |
JPS6174343A (en) * | 1984-09-19 | 1986-04-16 | Nec Corp | Transfer mold forming device for semiconductor resin sealing |
US4655274A (en) * | 1984-10-26 | 1987-04-07 | Ube Industries, Ltd. | Horizontal mold clamping and vertical injection type die cast machine |
US4723899A (en) * | 1984-11-12 | 1988-02-09 | Michio Osada | Molding apparatus for enclosing semiconductor chips with resin |
JPS61177218A (en) * | 1985-02-01 | 1986-08-08 | Hitachi Ltd | Multi-plunger type transfer molding machine |
NL8501393A (en) * | 1985-05-14 | 1986-12-01 | Arbo Handel Ontwikkeling | DEVICE FOR ENCLOSING A NUMBER OF ELECTRONIC COMPONENTS AT THE SAME TIME. |
JPS62195135A (en) * | 1986-02-21 | 1987-08-27 | Nec Corp | Resin sealing device for semiconductor |
JPS62264483A (en) * | 1986-05-10 | 1987-11-17 | Sony Corp | Automatic image sending device |
JPS63115710A (en) * | 1986-11-04 | 1988-05-20 | Matsushita Electric Ind Co Ltd | Plunger equipment of sealed mold |
US4915607A (en) * | 1987-09-30 | 1990-04-10 | Texas Instruments Incorporated | Lead frame assembly for an integrated circuit molding system |
JPH01105716A (en) * | 1987-10-20 | 1989-04-24 | Matsushita Electric Ind Co Ltd | Resin sealing device |
JPH06174343A (en) * | 1992-12-03 | 1994-06-24 | Hitachi Ltd | Defrosting cycle for refrigeration units |
JPH06287318A (en) * | 1993-04-01 | 1994-10-11 | Sekisui Chem Co Ltd | Production of fibrous composite sheet |
-
1991
- 1991-02-26 NL NL9100339A patent/NL193526C/en not_active IP Right Cessation
- 1991-03-01 TW TW080101645A patent/TW198133B/zh active
- 1991-05-08 GB GB9109877A patent/GB2253182B/en not_active Expired - Fee Related
- 1991-05-15 KR KR1019910007831A patent/KR0178402B1/en not_active IP Right Cessation
- 1991-05-16 MY MYPI91000821A patent/MY107696A/en unknown
- 1991-06-04 US US07/710,268 patent/US5158780A/en not_active Expired - Fee Related
- 1991-07-26 JP JP20886591A patent/JP3182432B2/en not_active Expired - Fee Related
-
1996
- 1996-07-18 HK HK126996A patent/HK126996A/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB841494A (en) * | 1957-09-04 | 1960-07-13 | Colin Macbeth | Plastic moulding and metal die casting machines |
EP0070320A1 (en) * | 1981-01-26 | 1983-01-26 | Dai-Ichi Seiko Co. Ltd. | Sealing and molding machine |
GB2189182A (en) * | 1986-04-11 | 1987-10-21 | Michio Osada | Multiple plunger injection moulding apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP3182432B2 (en) | 2001-07-03 |
KR920016212A (en) | 1992-09-24 |
NL193526B (en) | 1999-09-01 |
KR0178402B1 (en) | 1999-05-15 |
GB9109877D0 (en) | 1991-07-03 |
NL193526C (en) | 2000-01-04 |
TW198133B (en) | 1993-01-11 |
GB2253182A (en) | 1992-09-02 |
MY107696A (en) | 1996-05-30 |
JPH04279413A (en) | 1992-10-05 |
HK126996A (en) | 1996-07-26 |
US5158780A (en) | 1992-10-27 |
NL9100339A (en) | 1992-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20030508 |