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GB2253182B - Device for encapsulating electronic components - Google Patents

Device for encapsulating electronic components

Info

Publication number
GB2253182B
GB2253182B GB9109877A GB9109877A GB2253182B GB 2253182 B GB2253182 B GB 2253182B GB 9109877 A GB9109877 A GB 9109877A GB 9109877 A GB9109877 A GB 9109877A GB 2253182 B GB2253182 B GB 2253182B
Authority
GB
United Kingdom
Prior art keywords
electronic components
encapsulating electronic
encapsulating
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9109877A
Other versions
GB9109877D0 (en
GB2253182A (en
Inventor
Josephus Johannes Mar Schraven
Maarten Hoekstra
Kruijff Marinus Bart Jan De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boschman Technologies BV
Original Assignee
Boschman Technologies BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Technologies BV filed Critical Boschman Technologies BV
Publication of GB9109877D0 publication Critical patent/GB9109877D0/en
Publication of GB2253182A publication Critical patent/GB2253182A/en
Application granted granted Critical
Publication of GB2253182B publication Critical patent/GB2253182B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228Injection plunger or ram: transfer molding type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Wrapping Of Specific Fragile Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
GB9109877A 1991-02-26 1991-05-08 Device for encapsulating electronic components Expired - Fee Related GB2253182B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9100339A NL193526C (en) 1991-02-26 1991-02-26 Device for encapsulating electronic parts with a plastic.

Publications (3)

Publication Number Publication Date
GB9109877D0 GB9109877D0 (en) 1991-07-03
GB2253182A GB2253182A (en) 1992-09-02
GB2253182B true GB2253182B (en) 1995-01-18

Family

ID=19858933

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9109877A Expired - Fee Related GB2253182B (en) 1991-02-26 1991-05-08 Device for encapsulating electronic components

Country Status (8)

Country Link
US (1) US5158780A (en)
JP (1) JP3182432B2 (en)
KR (1) KR0178402B1 (en)
GB (1) GB2253182B (en)
HK (1) HK126996A (en)
MY (1) MY107696A (en)
NL (1) NL193526C (en)
TW (1) TW198133B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2564707B2 (en) * 1991-01-09 1996-12-18 ローム株式会社 Multi-type molding method and molding apparatus for molding part in lead frame for electronic component
NL9101558A (en) * 1991-09-16 1993-04-16 Amco Hi Tech Bv DEVICE FOR INSERTING A PLASTIC MATERIAL INTO A DIE CAVITY.
KR940007754Y1 (en) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 Preheaterless manual transfer mold die structure
JP2931715B2 (en) * 1992-05-12 1999-08-09 三菱電機株式会社 Resin sealing method, resin sealing device, and gas spring
NL9202253A (en) * 1992-12-23 1994-07-18 Asm Fico Tooling System for dosed advancement and selection of cylindrical pellets for lead frame sheathing devices.
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5478226A (en) * 1994-04-20 1995-12-26 Fierkens; Richard H. J. Automatic plunger apparatus for use in forming encapsulated semiconductor chips
JP2701766B2 (en) * 1995-01-27 1998-01-21 日本電気株式会社 Lead frame for semiconductor device and mold device using the same
US5851559A (en) * 1995-10-31 1998-12-22 Motorola, Inc. Transfer molding press
US5925384A (en) * 1997-04-25 1999-07-20 Micron Technology, Inc. Manual pellet loader for Boschman automolds
US7177696B1 (en) 1999-06-09 2007-02-13 H & P Medical Research, Inc. Multiple selectable field/current-voltage pads having individually powered and controlled cells
CN100515717C (en) * 1999-12-16 2009-07-22 第一精工株式会社 Resin packaging method
KR100455386B1 (en) * 2002-05-07 2004-11-06 삼성전자주식회사 Molding apparatus of molding plurality of semiconductor devices in same time
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
NL2010252C2 (en) * 2013-02-06 2014-08-07 Boschman Tech Bv Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
JP7203715B2 (en) * 2019-12-06 2023-01-13 Towa株式会社 RESIN MOLDING APPARATUS AND METHOD OF MANUFACTURING RESIN MOLDED PRODUCT
NL2028010B1 (en) * 2021-04-19 2022-10-31 Boschman Tech Bv Rotor Core Manufacturing Method, and rotor core molding system therefore

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB841494A (en) * 1957-09-04 1960-07-13 Colin Macbeth Plastic moulding and metal die casting machines
EP0070320A1 (en) * 1981-01-26 1983-01-26 Dai-Ichi Seiko Co. Ltd. Sealing and molding machine
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850582B2 (en) * 1979-08-24 1983-11-11 道男 長田 Semiconductor encapsulation molding method and mold equipment
JPS5886315U (en) * 1981-12-07 1983-06-11 坂東 一雄 Mold equipment for semiconductor resin encapsulation molding
JPH0628873B2 (en) * 1984-03-02 1994-04-20 日新電機株式会社 Small transfer molding machine
JPS6174343A (en) * 1984-09-19 1986-04-16 Nec Corp Transfer mold forming device for semiconductor resin sealing
US4655274A (en) * 1984-10-26 1987-04-07 Ube Industries, Ltd. Horizontal mold clamping and vertical injection type die cast machine
US4723899A (en) * 1984-11-12 1988-02-09 Michio Osada Molding apparatus for enclosing semiconductor chips with resin
JPS61177218A (en) * 1985-02-01 1986-08-08 Hitachi Ltd Multi-plunger type transfer molding machine
NL8501393A (en) * 1985-05-14 1986-12-01 Arbo Handel Ontwikkeling DEVICE FOR ENCLOSING A NUMBER OF ELECTRONIC COMPONENTS AT THE SAME TIME.
JPS62195135A (en) * 1986-02-21 1987-08-27 Nec Corp Resin sealing device for semiconductor
JPS62264483A (en) * 1986-05-10 1987-11-17 Sony Corp Automatic image sending device
JPS63115710A (en) * 1986-11-04 1988-05-20 Matsushita Electric Ind Co Ltd Plunger equipment of sealed mold
US4915607A (en) * 1987-09-30 1990-04-10 Texas Instruments Incorporated Lead frame assembly for an integrated circuit molding system
JPH01105716A (en) * 1987-10-20 1989-04-24 Matsushita Electric Ind Co Ltd Resin sealing device
JPH06174343A (en) * 1992-12-03 1994-06-24 Hitachi Ltd Defrosting cycle for refrigeration units
JPH06287318A (en) * 1993-04-01 1994-10-11 Sekisui Chem Co Ltd Production of fibrous composite sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB841494A (en) * 1957-09-04 1960-07-13 Colin Macbeth Plastic moulding and metal die casting machines
EP0070320A1 (en) * 1981-01-26 1983-01-26 Dai-Ichi Seiko Co. Ltd. Sealing and molding machine
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus

Also Published As

Publication number Publication date
JP3182432B2 (en) 2001-07-03
KR920016212A (en) 1992-09-24
NL193526B (en) 1999-09-01
KR0178402B1 (en) 1999-05-15
GB9109877D0 (en) 1991-07-03
NL193526C (en) 2000-01-04
TW198133B (en) 1993-01-11
GB2253182A (en) 1992-09-02
MY107696A (en) 1996-05-30
JPH04279413A (en) 1992-10-05
HK126996A (en) 1996-07-26
US5158780A (en) 1992-10-27
NL9100339A (en) 1992-09-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030508