GB2149980A - Packaging integrated circuits for connection to hybrid circuits - Google Patents
Packaging integrated circuits for connection to hybrid circuits Download PDFInfo
- Publication number
- GB2149980A GB2149980A GB08426926A GB8426926A GB2149980A GB 2149980 A GB2149980 A GB 2149980A GB 08426926 A GB08426926 A GB 08426926A GB 8426926 A GB8426926 A GB 8426926A GB 2149980 A GB2149980 A GB 2149980A
- Authority
- GB
- United Kingdom
- Prior art keywords
- arrangement
- electrical
- contacts
- array
- compliant material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
An electrical connection package is formed of a body of an electrically insulating resilient compliant material into which conductive pins (9,22) of a similar material are secured. The flexibility of the material enables electronic components (3) of differing sizes to be inserted into and readily removed from the package, and held firmly in the correct position. The arrangement is particularly suitable for mounting small semiconductor chip devices (3) on ceramic microcircuits (4,5). The compliant material may be silicone or fluoro-silicone rubber, with the pins being of such rubber in which gold powder is dispersed. The pins may be a force-fit in apertures of the insulating body. The body may be unitary (Fig. 3) or have a cap (10) (Fig. 2). <IMAGE>
Description
SPECIFICATION
Electrical interface arrangement
This invention relates to an electrical interface arrangement by means of which a very small electrical component can be held in position as part of an electrical circuit from which it can be readily extracted, if the need should arise, without damage either to itself or the circuit of which it forms a part. The invention is particularly suitable for providing electrical connection between very small complex integrated circuit components and larger circuits which are sometimes termed hybrid microcircuits the latter typically comprising a ceramic substrate carrying one or several layers of conductive interconnection tracks and other circuit components.
Typically, the integrated circuits are mounted in an "unpackaged" state on to the hybrid microcircuit; that is to say, the semiconductor chip, usually silicon which comprises an integrated circuit is not first mounted in its own hermetically sealed housing, but instead the chip is bonded directly to the surface of the hybrid microcircuit. Electrical connection is usually made by means of many individual fine gold wires bonded between corresponding terminal points on the integrated circuit and the hybrid microcircuit.
If it is desired to remove and replace an electrical component it is difficult to achieve without causing some damage, and in any event it is a time consuming and skilled task.
The present invention seeks to provide an improved electrical interface arrangement in which such difficulties are reduced.
According to this invention an electrical interface arrangement for an electrical device having an array of electrical terminal pads, includes a similar co-operating array of contacts each of which is formed of a resiliently deformable electrical conductive compliant material the contacts being embedded in an electrically insulating member which is formed of a resiliently deformable compliant material which also serves to locate the electrical device so as to align its terminal pads with the array of contacts, which are in the form of elongate members extending through the thickness of a portion of the insulating member so as to protrude from the opposing surfaces thereof.
Although the interface arrangement is very suitable for mounting semiconductor chips on to the ceramic substrate of a hybrid circuit its use is not confined to this purpose. A larger interface arrangement will represent a satisfactory way of forming electrical connections to larger, more conventional components.
The invention is further described by way of example with reference to the accompanying drawings, in which:
Figure 1 shows a plan perspective view of an interface arrangement in accordance with the invention,
Figure 2 shows a sectional view through such an arrangement, and
Figure 3 shows an alternative form of an electrical interface arrangement.
Referring to Figure 1 and 2, an electrical interface arrangement is mounted upon the upper surface of a hybrid microcircuit 2 (not shown in Figure 1) and contains a small electronic component in the form of an integrated circuit 3. The integrated circuit is typically a device which is generally termed an electrically programmable read only memory (EPROM). Such devices are becoming increasingly common and it is necessary to enter particular data into the memory region of such a device using a special instrument. The advantage of such a memory is that its contents can be readily and rapidly erased if it is desired to change the stored data. Subsequent to the erasure the new information is entered from one of the dedicated instruments which have been designed for this purpose.
Typically EPROM devices are used to store data which can form part of a software programme, and thus it may contain information which is not altered frequently and indeed may never be altered. However, a change in the software programme of the circuit of which the EPROM forms a part, necessitates the removal of the EPROM from that circuit so that it can be reprogrammed using the dedicated instrument referred to previously.
Instead of an EPROM the electronic component could be some other kind of device, such as a programmable logic array (PLA) which is an array of various logic gates which can be configured after manufacture, into a particular circuit function. This configuration is facilitated by being able to easily remove and replace the device using the interface arrangement of this invention.
The hybrid microcircuit 2 is of a kind of circuit which is becoming increasingly common. It comprises, in essence, a ceramic substrate 4 which carries a number of layers 5 of interconnection tracks. The interconnection tracks typically consist of gold or copper which are separated by thin layers of electrically insulating glass, but these layers are indicated diagramatically in the drawings by the single layer 5. In this way very large and complex circuits can be realised in a very permanent and economical manner. Although in terms of circuit functions the circuits may be regarded as being large they are physically very small typically not more than a few centimetres square.When the hybrid microcircuit has been manufactured to completion it is mounted in its own package which is hermetically sealed and which is provided with terminals which enable the circuit to be interconnected with other larger circuits as required. It is because it is necessary to encapsulate the hybrid microcircuit as a whole that the individual integrated circuit 3 can be mounted in an unpackaged form. A typical dimension for an electronic component such as an integrated circuit 3 EPROM is 180 X 10-3 inches wide, 240 x 10-3 inches high and 10 X 10-3 inches thick. It will be appreciated therefore that such a device is extremely small and difficult to handle.
The integrated circuit 3 is secured to the hybrid microcircuit 2 by means of the electrical interface arrangement 1 which consists essentially of a housing 6 formed of a resiliently deformable compliant material, for example rubber, or an elastomer such as a silicone or fluoro-silicone rubber. The housing 6 is formed of an elastomer which is an insulating material and it is shaped in the form of an open rectangular container having walls 7 which locate the outer perimeter of the integrated circuit 3. In practice, the nominal dimensions of the integrated circuit 3 will vary markedly, due to manufacturing tolerances on the origin of the source of supply.
The compliance of the elastomer permits the interface arrangement to accept components whose physical dimensions vary over quite a wide range and typically a range of up to 15% linear dimensions is quite acceptable.
The integrated circuit 3 contains small contact pads 8 on its lower surface. These pads are arranged in a regular array around the perimeter of the underside and serve to make electrical connection with the integrated circuit itself. These contact pads co-operate with an array of contact pins 9 which extend through the base of the housing 6 so as to protrude slightly at each end and make electrical contact to the conductive tracks at the layer 5 on the surface of the hybrid microcircuit. These conductive pins 9 are also formed of an elastomer, but in this case a conductive material. Such materials are readily available and can be manufactured to finely determined tolerances.
The elastomer of which the housing is formed is a homogenous material, and a suitable material is that produced by Dow Corning under the name Silastic type E, which is a room temperature vulcanizing silicone rubber.
It is initially a pourable fluid, which is reduced to low pressure to remove air from it, and is poured into a mould to set. The elastomer of which the pins 9 are formed can be the same basic material, but to which is added a quantity of very fine conductive metallic powder e.g. gold, before the fluid rubber is de-aerated. Uniform distribution of the powder is achieved by agitating the fluid ultrasonically.
It is then poured into suitable moulds where it sets into the required shapes. The use of such a material gives good compliance properties, and also electrically conductive properties which are not dependent on the direction in which the pins are distorted in use.
As an elastomer is a resiliently deformable material with bulk compliance properties it is possible to manufacture the pins so that they have a nominal diameter which is slightly larger than the holes which are initially formed in the housing 6. Thus, when the pins are pressed into these apertures, they are retained firmly in position by the force which is exerted upon them due to the resilience of the elastomer.
The electronic component is held firmly in position by means of a top cap 10 (omitted in
Figure 1) which has an outer rim 11 which snaps over a protruding lip 12 at the top of the housing 6. This snap action secures the cap 10 firmly in a position in which its underside surface bears firmly against the top of the electronic component, thereby urging the contact pads 8 into good electrical connection with the conductive pins 9. The diameters of the pins 9 are chosen so as to permit a certain degree of positional mismatch with the conductive pads 8 so as to accommodate variations in physical sizes of the electronic component.
The housing 6 is attached to the surface of the microcircuit 2 by means of an adhesive, although a mechanical clamp could be used.
The lower protruding ends of the pins 9 are thereby held in pressure contact with the conductive tracks on the upper surface of the microcircuit 2.
It will be appreciated that an electronic component 3 can be readily inserted into the interface arrangement and subsequently removed without causing any damage either to itself or to the hybrid circuit on which it is mounted. The task is a simple one and does not require any excessive time or skill on the part of an operator. In addition, the physical dimensions of the interface arrangement are not very much greater than those of the electronic component itself and are certainly very much less than the normal package in which individual integrated circuits are provided when each is mounted in an individual hermetically sealed container.
An alternative form of electrical interface arrangement is illustrated in Figure 3 in which a housing 20 is formed of an electrically insulating elastomer material. It incorporates not only the base and side walls, but also a roof cap 21 which is formed integrally therewith. As before, individual conductive pins 22 are formed in the base of the housing 20 and their ends 23 protrude slightly above the internal floor surface so as to permit electrical contact with an array of surface pads on the underside of an electronic component. The pins 22 are composed of an electrically conductive elastomer. The electronic component, typically in the form of an integrated circuit chip, is passed through a slot opening 24 in one wall of the housing 20. The resilience of the materials involved enables the compo nents to be pushed into the housing fairly readily over the slightly raised ends 23 of the conducting pins 22 and also secures the circuit component firmly in position. It can however, readily be removed should the need arise, by means of a suitable tool such as nonconductive tweezers or pincers, or alternatively, an additional slot can be positioned in the wall opposite to slot opening 24 so that the component can be simply ejected.
Claims (8)
1. An electrical interface arrangement for an electrical device having an array of electrical terminal pads including a similar co-operating array of contacts each of which is formed of a resiliently deformable electrical conductive compliant material, the contacts being embedded in an electrically insulating member which is formed of a resiliently deformable compliant material which also serves to locate the electrical device so as to align its terminal pads with the array of contacts, which are in the form of elongate members extending through the thickness of a portion of the insulating member so as to protrude from opposing surfaces thereof.
2. An arrangement as claimed in claim 1 and wherein the insulating material comprises a base region from which wall regions extend to locate the electrical device.
3. An arrangement as claimed in claim 2 and wherein the contacts are positioned around the edges of the base region and take the form of elongate pins extending through the thickness of the base.
4. An arrangement as claimed in claim 1 2 or 3 and wherein means comprising resiliently deformable compliant material is positioned so as to urge said device against said array of contacts.
5. An arrangement as claimed in claim 4 and wherein said means comprises a roof portion formed integrally with said insulating material.
6. An arrangement as claimed in claim 4 and wherein said means comprises a detachable lid.
7. An arrangement as claimed in any of the preceding claims and wherein the compliant material is of a homogenous nature.
8. An arrangement substantially as illustrated in and described with reference to the accompanying drawings.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT84307904T ATE36212T1 (en) | 1983-11-15 | 1984-11-14 | ARRANGEMENT OF AN ELECTRICAL INTERFACE. |
| EP84307904A EP0145327B1 (en) | 1983-11-15 | 1984-11-14 | Electrical interface arrangement |
| DE8484307904T DE3473205D1 (en) | 1983-11-15 | 1984-11-14 | Electrical interface arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB838330391A GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8426926D0 GB8426926D0 (en) | 1984-11-28 |
| GB2149980A true GB2149980A (en) | 1985-06-19 |
| GB2149980B GB2149980B (en) | 1987-08-19 |
Family
ID=10551745
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB838330391A Pending GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
| GB08426926A Expired GB2149980B (en) | 1983-11-15 | 1984-10-24 | Packaging intergrated circuits for connection to hybrid circuits |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB838330391A Pending GB8330391D0 (en) | 1983-11-15 | 1983-11-15 | Electrical interface arrangement |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB8330391D0 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008868A (en) * | 1987-03-05 | 1991-04-16 | Seiko Epson Corporation | Structure for mounting an integrated circuit |
| GB2248979A (en) * | 1990-08-30 | 1992-04-22 | Shinetsu Polymer Co | Anisotropically electroconductive membrane. |
| US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
| US5369627A (en) * | 1987-07-21 | 1994-11-29 | Seiko Epson Corporation | Improvements in bearing and frame structure of a timepiece |
| GB2280790A (en) * | 1993-08-03 | 1995-02-08 | Hewlett Packard Co | Demountable hybrid assemblies with microwave-bandwidth interconnects |
| US5416752A (en) * | 1987-07-21 | 1995-05-16 | Seiko Epson Corporation | Timepiece |
| US5526233A (en) * | 1991-12-19 | 1996-06-11 | Casio Computer Co., Ltd. | Adapter for integrated circuit device, and data transmission system using the same |
| US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
| US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
| WO1997022145A1 (en) * | 1995-12-14 | 1997-06-19 | Philips Electronics N.V. | Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device |
| EP1198001A2 (en) * | 1994-11-15 | 2002-04-17 | Formfactor, Inc. | Method of testing and mounting devices using a resilient contact structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100065963A1 (en) | 1995-05-26 | 2010-03-18 | Formfactor, Inc. | Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1287235A (en) * | 1970-05-04 | 1972-08-31 | Essex International Inc | Current control apparatus and methods of manufacture |
| GB1341037A (en) * | 1970-05-05 | 1973-12-19 | Int Computers Ltd | Electrical circuit assemblies and connectors therefor |
| GB2037497A (en) * | 1978-10-12 | 1980-07-09 | Shinetsu Polymer Co | Electrical connector |
| GB1587416A (en) * | 1977-09-01 | 1981-04-01 | Toray Industries | Anisotropically electroconductive sheets |
| GB2114821A (en) * | 1982-01-19 | 1983-08-24 | Plessey Co Plc | Semiconductor chip package carrier |
-
1983
- 1983-11-15 GB GB838330391A patent/GB8330391D0/en active Pending
-
1984
- 1984-10-24 GB GB08426926A patent/GB2149980B/en not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1287235A (en) * | 1970-05-04 | 1972-08-31 | Essex International Inc | Current control apparatus and methods of manufacture |
| GB1341037A (en) * | 1970-05-05 | 1973-12-19 | Int Computers Ltd | Electrical circuit assemblies and connectors therefor |
| GB1587416A (en) * | 1977-09-01 | 1981-04-01 | Toray Industries | Anisotropically electroconductive sheets |
| GB2037497A (en) * | 1978-10-12 | 1980-07-09 | Shinetsu Polymer Co | Electrical connector |
| GB2114821A (en) * | 1982-01-19 | 1983-08-24 | Plessey Co Plc | Semiconductor chip package carrier |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5262718A (en) * | 1985-08-05 | 1993-11-16 | Raychem Limited | Anisotropically electrically conductive article |
| US5008868A (en) * | 1987-03-05 | 1991-04-16 | Seiko Epson Corporation | Structure for mounting an integrated circuit |
| US5369627A (en) * | 1987-07-21 | 1994-11-29 | Seiko Epson Corporation | Improvements in bearing and frame structure of a timepiece |
| US5712831A (en) * | 1987-07-21 | 1998-01-27 | Seiko Epson Corporation | Timepiece |
| US5416752A (en) * | 1987-07-21 | 1995-05-16 | Seiko Epson Corporation | Timepiece |
| US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
| US5678287A (en) * | 1988-02-05 | 1997-10-21 | Raychem Limited | Uses of uniaxially electrically conductive articles |
| US5631447A (en) * | 1988-02-05 | 1997-05-20 | Raychem Limited | Uses of uniaxially electrically conductive articles |
| GB2248979A (en) * | 1990-08-30 | 1992-04-22 | Shinetsu Polymer Co | Anisotropically electroconductive membrane. |
| US5526233A (en) * | 1991-12-19 | 1996-06-11 | Casio Computer Co., Ltd. | Adapter for integrated circuit device, and data transmission system using the same |
| GB2280790A (en) * | 1993-08-03 | 1995-02-08 | Hewlett Packard Co | Demountable hybrid assemblies with microwave-bandwidth interconnects |
| GB2280790B (en) * | 1993-08-03 | 1997-08-27 | Hewlett Packard Co | Demountable hybrid assemblies with microwave-bandwidth interconnects |
| US5426405A (en) * | 1993-08-03 | 1995-06-20 | Hewlett-Packard Company | Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects |
| DE4417586A1 (en) * | 1993-08-03 | 1995-02-09 | Hewlett Packard Co | Family of removable hybrid assemblies of various sizes with microwave bandwidth connectors |
| EP1198001A2 (en) * | 1994-11-15 | 2002-04-17 | Formfactor, Inc. | Method of testing and mounting devices using a resilient contact structure |
| EP1198001A3 (en) * | 1994-11-15 | 2008-07-23 | FormFactor, Inc. | Method of testing and mounting devices using a resilient contact structure |
| WO1997022145A1 (en) * | 1995-12-14 | 1997-06-19 | Philips Electronics N.V. | Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8426926D0 (en) | 1984-11-28 |
| GB8330391D0 (en) | 1983-12-21 |
| GB2149980B (en) | 1987-08-19 |
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