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GB201905322D0 - Precision machining apparatus - Google Patents

Precision machining apparatus

Info

Publication number
GB201905322D0
GB201905322D0 GBGB1905322.2A GB201905322A GB201905322D0 GB 201905322 D0 GB201905322 D0 GB 201905322D0 GB 201905322 A GB201905322 A GB 201905322A GB 201905322 D0 GB201905322 D0 GB 201905322D0
Authority
GB
United Kingdom
Prior art keywords
machining apparatus
precision machining
precision
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1905322.2A
Other versions
GB2583099A (en
GB2583099B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tannlin Technology Ltd
Original Assignee
Tannlin Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tannlin Technology Ltd filed Critical Tannlin Technology Ltd
Priority to GB1905322.2A priority Critical patent/GB2583099B/en
Publication of GB201905322D0 publication Critical patent/GB201905322D0/en
Priority to PCT/GB2020/050887 priority patent/WO2020212687A1/en
Publication of GB2583099A publication Critical patent/GB2583099A/en
Application granted granted Critical
Publication of GB2583099B publication Critical patent/GB2583099B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0823Devices involving rotation of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
GB1905322.2A 2019-04-15 2019-04-15 Precision laser machining apparatus Active GB2583099B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1905322.2A GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus
PCT/GB2020/050887 WO2020212687A1 (en) 2019-04-15 2020-04-02 Precision machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1905322.2A GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus

Publications (3)

Publication Number Publication Date
GB201905322D0 true GB201905322D0 (en) 2019-05-29
GB2583099A GB2583099A (en) 2020-10-21
GB2583099B GB2583099B (en) 2023-12-27

Family

ID=66809973

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1905322.2A Active GB2583099B (en) 2019-04-15 2019-04-15 Precision laser machining apparatus

Country Status (2)

Country Link
GB (1) GB2583099B (en)
WO (1) WO2020212687A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230234164A1 (en) * 2022-01-27 2023-07-27 Ii-Vi Delaware, Inc. Polycrystalline diamond (pcd) laser lapping machine
CN114654085B (en) * 2022-04-16 2024-02-06 绍兴豪春纺织科技有限公司 A support structure for the nickel mesh of a laser mesh making machine

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114287B4 (en) * 2011-09-26 2016-08-04 Keming Du Equipment for the precise, high-speed processing of substrates, in particular of thin substrates with high-performance ultrafast pulsed lasers
JP5902540B2 (en) * 2012-04-02 2016-04-13 株式会社ディスコ Laser processing method and laser processing apparatus
GB201306156D0 (en) * 2013-04-05 2013-05-22 Tannlin Group Ltd Laser Cutting Machine
CN204524545U (en) * 2015-04-17 2015-08-05 温州大学 A kind of laser process machine processing spiral path

Also Published As

Publication number Publication date
WO2020212687A1 (en) 2020-10-22
GB2583099A (en) 2020-10-21
GB2583099B (en) 2023-12-27

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