Nothing Special   »   [go: up one dir, main page]

GB2079052A - Cooling bodies for semiconductors or the like - Google Patents

Cooling bodies for semiconductors or the like Download PDF

Info

Publication number
GB2079052A
GB2079052A GB8120125A GB8120125A GB2079052A GB 2079052 A GB2079052 A GB 2079052A GB 8120125 A GB8120125 A GB 8120125A GB 8120125 A GB8120125 A GB 8120125A GB 2079052 A GB2079052 A GB 2079052A
Authority
GB
United Kingdom
Prior art keywords
cooling
ribs
sectional
body according
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8120125A
Other versions
GB2079052B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcan Holdings Switzerland AG
Original Assignee
Alusuisse Holdings AG
Schweizerische Aluminium AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alusuisse Holdings AG, Schweizerische Aluminium AG filed Critical Alusuisse Holdings AG
Publication of GB2079052A publication Critical patent/GB2079052A/en
Application granted granted Critical
Publication of GB2079052B publication Critical patent/GB2079052B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/10Secondary fins, e.g. projections or recesses on main fins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A sectional insert 10 may be placed between each two adjacent longer fins 3 to give additional cooling surfaces and divide the spaces into four ducts 14, 15. A heat sink for a semiconductor device is provided with fins 3, 4 of different heights arranged alternately. <IMAGE>

Description

SPECIFICATION Cooling bodies for semiconductors or the like The invention relates to cooling bodies for semiconductors or the like, with cooling ribs upstanding substantially at right angles from a base plate.
The cooling ribs are usually arranged on the base plate in the form of a comb, and are of equal length. For obtaining a greatest possible cooling effect, efforts are generally made to accommodate a very large surface in the smallest possible space.
This requirement leads, among other things, to manufacturing problems, because the wish to accommodate large surface in small space is contrary to the technical possibilities of manufacture by pressing.
Attempts to form the cooling ribs tapered in cross-section have indeed brought good results from a manufacturing viewpoint, which however were not satisfactory from a point of view of efficiency, because instead of the greatest output of heat, by reason of the narrowness of the cross-section of the gaps the air velocity as at its least.
In view of these circumstances, the inventor set himself the objective, to develop a cooling body of the kind mentioned initially, which produces an optimum cooling operation, and on the other hand can be made without problems and also economically.
What leads to the solution of this task is that the cooling ribs are provided of at least two different heights, and ribs of different heights are arranged alternately. Moreover, it has appeared to be advantageous, to introduce a sectional insert between two neighbouring cooling ribs, and to fix it there. If desired a plurality of sectional inserts, arranged in neighbouring gaps between cooling ribs, are united into a constructional unit.
Preferably a sectional insert is introduced between two long cooling ribs, and is fixed by clamping to the short cooling rib lying between the said long ribs. For this purpose the short cooling ribs, in the neighbourhood of their tips, preferably have elements promoting friction. For example they may be corrugated.
Preferably, on the tips, flat or corrugated, of the short cooling ribs, the sectional insert is pushed on, and for this purpose has a clamping jaw. The sectional insert may support itself against the opposing flanks of the long cooling ribs by strut arms spreading out from its sectional body. The said two longitudinal cooling ribs and one short cooling rib, with the sectional insert, form at least two, and preferably four, chambers.
For increase of the cooling effect, transverse ribs may extend from the sectional body of the sectional insert, transversely to the longithese ribs may be one half the length of the strut arms. Thus the transverse ribs extend into the chambers mentioned above, without engaging the flanks of the long cooling ribs.
It has proved to be advantageous to form the sectional insert with a clamping head, with an insert slot between two strut arms.
Thanks to the measures stated above, the flow conditions are significantly improved, by the special shape of the cooling body with substantially reduced rib proportion.
The cooling body according to the invention thus has ribs of different height, while the difference of height can be equalised by the clamped-on sectional inserts, which in turn have transverse ribs, and thus take part significantly in the cooling action. In this way, the rib proportion hitherto of 7.25 1 can be reduced to about 4 : 1. Furthermore, a significant improvement in manufacture is achieved; both the cooling body itself and also the sectional insert can be cut to length from extruded sections.
Further advantages, features and details of the invention appear from the following description of a preferred embodiment, with reference to the accompanying drawings, which show in: Figure 1: a cross-section through a part of a cooling body with sectional insert; Figure 2: a cross-section through a sectional insert.
A cooling body 1 has according to Fig. 1 a base plate 2 of thickness i of for example 1 5 mm, with cooling ribs 3, 4 extending from it of differing height a (for example 40 mm) and b (70 mm) respectively. The ribs have tapering cross sections and round rib tips 5, 6.
The base width d of the longer cooling ribs 3 3 amounts to 5 mm and is slightly greater than the base width e of the shorter cooling ribs 4. The width fat the tips 5 of the longer cooling ribs 3, 2.5 mm, is only slightly greater than the width g at the tips 6 of the shorter cooler ribs 4.
The rib height b of the longer cooling ribs 3 has a ratio to the clear spacing m between the ribs of about 3:1. The rib height a of the shorter cooling ribs 4 has a ratio to the spacing n indicated in Fig. 1 from a shorter rib to the adjacent longer rib of about 4:1. the base separation fbetween ribs measures about 7 mm.
The rib tips 6 can have corrugated surfaces, to give a better grip to a sectional insert 10, which can be pushed with a clamp-like head portion 11 onto the shorter cooling ribs 4 and then supports itself with strut arms 12, 13 against the flanks 9 of the longer cooling ribs 3. Thus four chambers 14, 15 arise within each valley between neighbouring longer colling ribs 3; inner chambers 14 are formed by the base plate 2, cooling ribs 3, 4, 3 and the strut arms 12 of the clamp-like formed by the tip zones of the longer cooling ribs 3, strut arms 1 3r and the body of the sectional insert 10.
From the step-like sectional body 20 of the sectional insert 10 there extend on both sides, transversely to its longitudinal axis M, transverse ribs 21 which can be of different height h and/or of the same height.
The two strut arms 12, 13 respectively of a strut arm pair are inclined each at the same angle t, w(Fig. 2) respectively, to the longitudinal axis M, while the strut arms 12 on the head portion 11 form a clamping slot 22. The strut arms 12, 13 on each side extend substantially parallel to one another.
The total length q of the cross section of the sectional insert 10 measures about 35 mm.

Claims (13)

1. A cooling body for semiconductors or the like, with cooling ribs upstanding substantially at right angles from a base plate, characterised in that the cooling ribs are provided of at least two different heights, and the ribs of different heights are arranged alternately.
2. A cooling body for semiconductors or the like, with cooing ribs upstanding substantially at right angles from a base plate, characterised in that a sectional insert is introduced and fixed between two neighbouring cooling ribs.
3. A cooling body according to claim 1 and claim 2, characterised in that a sectional insert is introduced between two long cooling ribs, and is fixed by clamping to the short cooling rib lying between the said long cooling ribs.
4. A cooling body according to claim 3, characterised in that the short cooling ribs are formed in the neighbourhood of their tips in a manner encouraging friction.
5. A cooling body according to any of claims 3 to 4. characterised in that a plurality of sectional inserts are united into a constructional unit.
6. A cooling body according to any of claims 3 to 5, characterised in that the sectional insert is supported against the opposing flanks of the said long cooling ribs by strut arms spreading out from its sectional body, and/or is provided with at least one clamping jaw.
7. A cooling body according to claim 6, characterised in that transverse ribs extend from the sectional body of the sectional insert, transversely to the longitudinal axis of the latter, and the length of these ribs is about half the length of the strut arms.
8. A cooling body according to claim 7, characterised in that the lengths of the transverse ribs on one sectional insert face are different.
9. A cooling body according to any of claims 3 to 8, characterised in that the said two long cooling ribs and one short cooling rib, with the sectional insert, form at least two chambers.
10. A cooling body according to any of claims 3 to 9, characterised in that the sectional insert has a clamping head, with an insert slot between two strut arms.
11. A cooling body according to any of claims 1 to 10, characterised in that the height of the short cooling ribs measures about one third to one half of the height of the long cooling ribs.
12. A cooling body according to any of claims 1 to 11, characterised in that the height of the short cooling ribs has a ratio of about 4:1 to the clear width between it and the neighbouring long cooling ribs, and the height of the long cooling ribs has a ratio of about 3:1 to the clear width between these long cooling ribs.
13. A cooling body substantially as described with reference to Figs 1 and 2 of the accompanying drawings.
GB8120125A 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like Expired GB2079052B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (en) 1980-06-30 1980-06-30 Heat sinks for semiconductor components

Publications (2)

Publication Number Publication Date
GB2079052A true GB2079052A (en) 1982-01-13
GB2079052B GB2079052B (en) 1984-10-24

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8120125A Expired GB2079052B (en) 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like

Country Status (4)

Country Link
DE (1) DE3024748C2 (en)
FR (1) FR2485807A1 (en)
GB (1) GB2079052B (en)
SE (1) SE457584B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Heat sink with semiconductor switch
EP0483058A1 (en) * 1990-10-24 1992-04-29 Alusuisse-Lonza Services Ag Heat sink for semiconductor components
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
EP1628342A1 (en) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Heatsink and heatsink assembly
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (en) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen REFRIGERATOR BODY FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Heatsink
DE19806978B4 (en) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Cooling device for cooling by convection
DE102009037259B4 (en) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Arrangement with a cooling device and a power semiconductor module
DE102019107280A1 (en) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Cooling device for cooling a third-party object to be cooled

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (en) * 1969-11-25 1971-05-27 Leonhard Roesch Knitting loops and courses indicator
DE7913126U1 (en) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt HEAT SINK MADE OF EXTRUDED ALUMINUM FOR PERFORMANCE SEMICONDUCTORS

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8703604U1 (en) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Heat sink with semiconductor switch
EP0483058A1 (en) * 1990-10-24 1992-04-29 Alusuisse-Lonza Services Ag Heat sink for semiconductor components
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
EP1628342A1 (en) * 2004-08-16 2006-02-22 Dietmar Dr. Kern Heatsink and heatsink assembly
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Also Published As

Publication number Publication date
DE3024748C2 (en) 1986-09-04
SE8103779L (en) 1981-12-31
SE457584B (en) 1989-01-09
FR2485807A1 (en) 1981-12-31
FR2485807B3 (en) 1983-07-18
GB2079052B (en) 1984-10-24
DE3024748A1 (en) 1982-02-04

Similar Documents

Publication Publication Date Title
GB2079052A (en) Cooling bodies for semiconductors or the like
DK165272B (en) PROCEDURE FOR THE PREPARATION OF REFRIGERATORS
US6176304B1 (en) Heat sink
US5205353A (en) Heat exchanging member
US3901312A (en) Heat exchangers and method of making same
US3746086A (en) Heat exchangers
US6431263B2 (en) Heat exchanger with small-diameter refrigerant tubes
CN100352044C (en) Heat sink for semiconductor device, method of manufacturing the same, and tool for implementing the method
US6234246B1 (en) Heat exchanger for cooling semi-conductor components
BR9912985A (en) Method and apparatus for laminating a plurality of fins strips from heat exchangers
US3850236A (en) Heat exchangers
US5682948A (en) Heat exchanger for cooling semi-conductor elements or the like
US5435384A (en) Heat dissipating plate
US20060054311A1 (en) Heat sink device with independent parts
US4488593A (en) Heat exchanger
WO2000063631A3 (en) Corrugated fin and method of making
JP6867012B2 (en) heatsink
JPH06232300A (en) Radiator
JP3008204U (en) Heat sink for forced air cooling
JP2003179190A (en) Heat sink and its producing method
KR19990014819A (en) Heat sink and assembly method
EP0757220A1 (en) Radiating fins and method for manufacturing the same
SU1492493A1 (en) Heat-sink ,particularly, for cooling semiconductor devices
JPS6269096A (en) Heat exchanger
JPH09116055A (en) Heat sink device and manufacture of heat sink device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980630