GB2077035B - Compressive semiconductor mount - Google Patents

Compressive semiconductor mount

Info

Publication number: GB2077035B
Authority: GB; United Kingdom
Prior art keywords: semiconductor mount; compressive semiconductor; compressive; mount; semiconductor
Prior art date: 1980-04-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB8112289A

Other versions

GB2077035A (en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

THERMAL ASS Inc

Original Assignee

THERMAL ASS Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-04-21

Filing date

1981-04-21

Publication date

1984-09-26

1981-04-21 Application filed by THERMAL ASS Inc filed Critical THERMAL ASS Inc

1981-12-09 Publication of GB2077035A publication Critical patent/GB2077035A/en

1984-09-26 Application granted granted Critical

1984-09-26 Publication of GB2077035B publication Critical patent/GB2077035B/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

GB8112289A 1980-04-21 1981-04-21 Compressive semiconductor mount Expired GB2077035B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US14286280A	1980-04-21	1980-04-21
US17182780A	1980-07-24	1980-07-24

Publications (2)

Publication Number	Publication Date
GB2077035A GB2077035A (en)	1981-12-09
GB2077035B true GB2077035B (en)	1984-09-26

Family

ID=26840495

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB8112289A Expired GB2077035B (en)	1980-04-21	1981-04-21	Compressive semiconductor mount

Country Status (3)

Country	Link
CA (1)	CA1175584A (en)
DE (1)	DE3115858A1 (en)
GB (1)	GB2077035B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4518983A (en) *	1982-10-22	1985-05-21	Westinghouse Electric Corp.	Assembly-heat sink for semiconductor devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH618290A5 (en) *	1977-08-16	1980-07-15	Bbc Brown Boveri & Cie	Semiconductor valve cooler with conducting elements for a coolant flow and use of these semiconductor valve coolers.

1981
- 1981-04-21 DE DE19813115858 patent/DE3115858A1/en not_active Ceased
- 1981-04-21 GB GB8112289A patent/GB2077035B/en not_active Expired
- 1981-04-21 CA CA000375778A patent/CA1175584A/en not_active Expired

Also Published As

Publication number	Publication date
CA1175584A (en)	1984-10-02
DE3115858A1 (en)	1982-05-13
GB2077035A (en)	1981-12-09

Publication	Publication Date	Title
JPS5759330A (en)	1982-04-09	Silicon structure
DE3163340D1 (en)	1984-06-07	Semiconductor device
JPS56105662A (en)	1981-08-22	Semiconductor device
GB8331916D0 (en)	1984-01-04	Semiconductor devices
EP0042489A3 (en)	1982-06-16	Semiconductor devices
GB8320110D0 (en)	1983-08-24	Wafer
GB8403595D0 (en)	1984-03-14	Semiconductor device
EP0055558A3 (en)	1983-10-05	Semiconductor device
JPS5712525A (en)	1982-01-22	Semiconductor element
GB2075257B (en)	1984-06-06	Semiconductor device manufacture
DE3173835D1 (en)	1986-03-27	Semiconductor devices
JPS56142668A (en)	1981-11-07	Semiconductor device
GB8329071D0 (en)	1983-12-07	Semiconductor
DE3161615D1 (en)	1984-01-19	Semiconductor device
DE3166929D1 (en)	1984-12-06	Semiconductor device
GB2089564B (en)	1985-11-20	Semiconductor device
DE3175373D1 (en)	1986-10-30	Semiconductor device
EP0048358A3 (en)	1982-11-10	Semiconductor device
GB2089567B (en)	1984-08-08	Semiconductor device manufacture
DE3162083D1 (en)	1984-03-08	Semiconductor device
JPS577159A (en)	1982-01-14	Semiconductor element
DE3174500D1 (en)	1986-06-05	Semiconductor device
DE3175783D1 (en)	1987-02-05	Semiconductor device
DE3174789D1 (en)	1986-07-10	Semiconductor device
GB8326563D0 (en)	1983-11-02	Semiconductor devices

Legal Events

Date	Code	Title	Description
1989-12-20	PCNP	Patent ceased through non-payment of renewal fee